TW200833470A - Polishing material having polishing particles and method for making the same - Google Patents

Polishing material having polishing particles and method for making the same

Info

Publication number
TW200833470A
TW200833470A TW96104133A TW96104133A TW200833470A TW 200833470 A TW200833470 A TW 200833470A TW 96104133 A TW96104133 A TW 96104133A TW 96104133 A TW96104133 A TW 96104133A TW 200833470 A TW200833470 A TW 200833470A
Authority
TW
Taiwan
Prior art keywords
polishing
particles
fiber material
polishing particles
making
Prior art date
Application number
TW96104133A
Other languages
Chinese (zh)
Other versions
TWI312307B (en
Inventor
Chung-Chih Feng
I-Peng Yao
Lyang-Gung Wang
Yung-Chang Hung
Chao-Yuan Tsai
Original Assignee
San Fang Chemical Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Fang Chemical Industry Co filed Critical San Fang Chemical Industry Co
Priority to TW96104133A priority Critical patent/TWI312307B/en
Publication of TW200833470A publication Critical patent/TW200833470A/en
Application granted granted Critical
Publication of TWI312307B publication Critical patent/TWI312307B/en

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention relates to a polishing material having polishing particles and method for making the same. The polishing material of the invention comprises a fiber material, a plurality of polishing particles and a high polymer elastic body. The fiber material has a plurality of fibers, and the fibers define a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The high polymer elastic body covers the fiber material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the fiber material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the fiber material provides effects for cleaning the small grinded pieces.
TW96104133A 2007-02-05 2007-02-05 Polishing material having polishing particles and method for making the same TWI312307B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96104133A TWI312307B (en) 2007-02-05 2007-02-05 Polishing material having polishing particles and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96104133A TWI312307B (en) 2007-02-05 2007-02-05 Polishing material having polishing particles and method for making the same

Publications (2)

Publication Number Publication Date
TW200833470A true TW200833470A (en) 2008-08-16
TWI312307B TWI312307B (en) 2009-07-21

Family

ID=44819151

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96104133A TWI312307B (en) 2007-02-05 2007-02-05 Polishing material having polishing particles and method for making the same

Country Status (1)

Country Link
TW (1) TWI312307B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI551396B (en) * 2013-10-03 2016-10-01 三芳化學工業股份有限公司 Polishing pad and method for making the same

Also Published As

Publication number Publication date
TWI312307B (en) 2009-07-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees