CN204339540U - A kind of resin copper dish abrasive disk - Google Patents
A kind of resin copper dish abrasive disk Download PDFInfo
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- CN204339540U CN204339540U CN201420827332.2U CN201420827332U CN204339540U CN 204339540 U CN204339540 U CN 204339540U CN 201420827332 U CN201420827332 U CN 201420827332U CN 204339540 U CN204339540 U CN 204339540U
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- diamond wheel
- copper dish
- resin copper
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Abstract
The utility model relates to wafer processing apparatus field, discloses a kind of resin copper dish abrasive disk, comprises ceramic disk, the ceramic disk back side is provided with handle, and ceramic disk front is evenly provided with multiple diamond wheel, wherein, diamond wheel is round sheet, and the diameter of diamond wheel is 10-50mm, 50-400 order selected by diamond wheel, and the outer face of described diamond wheel at grade, to ensure the flatness of resin copper dish, the utility model structure is simple, easy to operate, and improves operating efficiency.
Description
Technical field
The utility model relates to wafer fab technical field, particularly relates to a kind of resin copper dish abrasive disk.
Background technology
Sapphire wafer worked copper throwing processing procedure needs to use resin copper dish to add diamond grinding liquid and carries out surface grinding to wafer.Need on resin copper dish, slot to promote Liquid diamond in process to contact with the effective of wafer, thus ensure wafer grinding remove speed.Along with the wearing and tearing of groove, removing speed can reduce gradually, affects working (machining) efficiency, and may wear to and to a certain degree need afterwards again to slot, and causes the waste of resin copper dish.
Utility model content
The purpose of this utility model is to provide a kind of sapphire wafer abrasive disk, is enhanced productivity and increase the surface roughness of resin copper dish by the utility model.
The technical scheme that the utility model solves the problem is:
A kind of resin copper dish abrasive disk, comprise ceramic disk, the described ceramic disk back side is provided with handle, and ceramic disk front is evenly provided with multiple diamond wheel;
On the basis of technique scheme, the utility model can also do following improvement,
Further, described diamond wheel is round sheet, and the diameter of diamond wheel is 10-50mm;
Further, 50-400 order selected by described diamond wheel;
Further, the outer face of described diamond wheel at grade;
In process, need the surface roughness ensureing resin copper dish, such guarantee diamond also rests on resin copper dish, prior art is the pattern using lathe tool rut, but this Measures compare is loaded down with trivial details, also needs to carry out lathe tool processing to resin copper dish, lose time; After adopting the utility model, if when finding to remove rate reduction, directly can be processed resin copper dish by diamond wheel of the present utility model, improve the surface roughness of resin copper dish, fast fairly simple, shorten the time suspending processing, improve operating efficiency;
The beneficial effects of the utility model are: what the utility model can be fast processes resin copper dish, can not have an impact to the speed of sapphire wafer processing; The utility model structure is simple, and easy to operate, operating efficiency is high.
Accompanying drawing explanation
Fig. 1 is the front view of a kind of resin copper dish abrasive disk described in the utility model specific embodiment;
Fig. 2 is the rearview of a kind of resin copper dish abrasive disk described in the utility model specific embodiment;
In accompanying drawing, the list of parts representated by each label is as follows:
1, ceramic disk, 2, handle, 3, diamond wheel.
Detailed description of the invention
Be described principle of the present utility model and feature below in conjunction with accompanying drawing, example, only for explaining the utility model, is not intended to limit scope of the present utility model.
A kind of resin copper dish abrasive disk, comprise ceramic disk 1, described ceramic disk 1 back side is provided with handle 2, and ceramic disk 1 front is evenly provided with multiple diamond wheel 3;
Wherein said diamond wheel 3 is round sheet, and the diameter of diamond wheel 3 is 10-50mm, and 50-400 order selected by described diamond wheel 3, and at grade, the flatness of resin copper dish processed is like this higher in the outer face of described diamond wheel 3;
In process, if when finding to remove rate reduction, directly can be processed resin copper dish by diamond wheel of the present utility model, improve the surface roughness of resin copper dish, fast fairly simple, shorten the time suspending processing, improve operating efficiency, and can not have an impact to the speed of sapphire wafer processing; The utility model structure is simple, and easy to operate, operating efficiency is high;
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (4)
1. a resin copper dish abrasive disk, is characterized in that, comprise ceramic disk, and the described ceramic disk back side is provided with handle, and ceramic disk front is evenly provided with multiple diamond wheel.
2. a kind of resin copper dish abrasive disk according to claim 1, it is characterized in that, described diamond wheel is round sheet, and the diameter of diamond wheel is 10-50mm.
3. a kind of resin copper dish abrasive disk according to claim 2, is characterized in that, 50-400 order selected by described diamond wheel.
4. a kind of resin copper dish abrasive disk according to claim 3, it is characterized in that, the outer face of described diamond wheel at grade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420827332.2U CN204339540U (en) | 2014-12-23 | 2014-12-23 | A kind of resin copper dish abrasive disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420827332.2U CN204339540U (en) | 2014-12-23 | 2014-12-23 | A kind of resin copper dish abrasive disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204339540U true CN204339540U (en) | 2015-05-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420827332.2U Active CN204339540U (en) | 2014-12-23 | 2014-12-23 | A kind of resin copper dish abrasive disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204339540U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080535A1 (en) | 2015-11-10 | 2017-05-18 | Vysoké Učení Technické V Brně | Method and device for surface machining of rotary components |
-
2014
- 2014-12-23 CN CN201420827332.2U patent/CN204339540U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080535A1 (en) | 2015-11-10 | 2017-05-18 | Vysoké Učení Technické V Brně | Method and device for surface machining of rotary components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |