200830963 a e九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電路板之焊接夾具，更詳而言 之，係有關於一種用以夾裝電路板之之夾具。 【先前技術】 _ 一般印刷電路板係在其上插裝各式電子元件後，然後 —進行焊接’而該電子元件為使其能穩固且緊密貼靠在電路 籲板的表面，係在電路板上插裝該電子元件後，夾裝在一焊 接夾具上，使該電子元件得以緊密貼靠在電路板上，然後 進行焊接作業。 … 請參閱第1圖，習知的焊接夹具，係於一底座u的 一側邊上方樞設有一壓板12，使該底座u與壓板12之 間形成一夾置空間13,以於該夾置空間13中夾置一電路 板14,於該電路板14上業已插裝完成複數電子元件丨4卜 該電子元件係如電容、電阻、電感器、變壓器及電 哭 #等:並於該壓板12下方設有複數壓制件15’而該壓制; 15設置的位置係位於該些電子元件141的上方。 於操作時係先將該壓板12向上掀開，然後將該電路 板14平放在該底座的預定位置上，再裝該壓板a蓋上， 由於該壓板12底面的壓制件15係相對於該電路板=4上 的電子元件141，而可藉由該壓制件15將該電子元件ΐ4ι 穩固壓制在電路板14上，使該電子元件141緊密靠在該 電路板14的表面上，以避免該電子元件141與電路板14 之間產生過大的間隙，導致該電子元件141於焊接後產生 110079 5 200830963 鬆動的情況。 淮該壓板1 2係單邊樞設於該底座1 1的一侧邊，該壓 板12盍壓在該電路板上方時，越接近樞設端的電子元 件141先接觸到該壓制件15，而越遠離該樞設端的電子 元件141越晚接觸到該壓制件1 &，即該壓制件15與電子 兀件141之間存在著夾角，使該些壓制件15並非同步接 •觸該些電子元件141;簡言之，即該壓制件15並非垂直 籲壓觸在該些電子元件141的頂部，如此一來，即導致該些 電:兀件141產生傾斜的情況，使該些電子元件141無法 僅密貼靠在該電路板14的表面上，進而導致該些電子元 件141於焊接後產生鬆動的情況。 土凊參閱帛2A及2B圖，尤其對於一些體積較大，且海 罪近樞接處的電子元件，如電感器、變壓器或電連接器 4 ’於該壓板12向下壓靠時，越先接觸到該些壓制件 ⑼如土第2A圖所示）’而在該壓板12底面之壓制件^全 罪在該些電子％件141的頂部後，最先被該壓制件 15接觸到的大體穑雷； 此電子元m 生側向推力f’使該 Γ 板14之間產生間隙g或偏移，如 此即產生上述之缺失。 因此’如何開發一種用以將該電子 路板上的焊接类且，、鹿么$ 7 - 丨卞系在電 ^^^ /、避免電子70件與電路板之間產生間 隙使該％子元件緊密貼靠在 決之課題。 貝為目别亟待解 【發明内容】 110079 6 200830963 - 鑒於上述習知技術之缺點，本發明之主要目的係在於 提供一種電路板之焊接夾具，得緊密將電子元件壓靠在電 路板表面以避免產生間隙或偏移。 i 本發明之另一目的係在於提供一種電路板之烊接夾 具，得避免電子元件於焊接後產生鬆動。 為達上述及其他相關之目的，本發明即提供一種電路 ，板之焊接夾具，係用以在電路板上夾裝電子元件，該焊接 夹具係包括：底座；活動板，係樞設於該底座上方，使該 底座與活動板之間形成一夾置空間，用以夾裝該具有電子 疋件之電路板；壓板，係滑動設於該活動板上方，於該壓 板設有複數壓制件，且該壓制件係穿過活動板而伸入夾置 二間垂直壓罪在該電路板上之電子元件頂部；以及定位 模組，係設於該活動板侧邊，用以定位該壓板。 依上述之構造，本發明復包括複數導桿，係設該活動 板上方，並穿過該壓板，使該壓板藉由該導桿以上下滑 鲁動，並於該導桿上套設一導套，且該導套並固定在該壓板 上，俾使該壓板穩定上下滑動；復包括有係為彈簧之第一 彈性70件，係設於該導桿上，並位於該壓板與活動板之 間，使該壓板於向下滑動後回位。 該定位模組係於一座體中設有一伸縮件，於該座體與 伸縮件之間設有一係為彈簧之第二彈性元件，使該壓板向 下移動後，該伸縮件之一端向外退出後回位壓靠在該壓板 的邊緣上以定位該壓板。 該伸縮件位於該壓板邊緣之一端具有一斜面，且該伸 110079 7 200830963 =件位相對於該斜面之—端具有—推壓部，藉由抽拉該推 部使該伸縮件具有斜面之-端脫離該壓板邊緣，用以釋 放該壓板，並使該Μ板藉由該第—彈性^件回位上昇。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a welding jig for a circuit board, and more particularly to a jig for clamping a circuit board. [Prior Art] _ Generally, a printed circuit board is mounted with various electronic components thereon, and then - for soldering, and the electronic component is mounted on the circuit board so that it can be firmly and closely attached to the surface of the circuit board. After the electronic component is inserted, it is clamped on a soldering fixture, so that the electronic component is closely attached to the circuit board, and then soldering work is performed. Referring to FIG. 1 , a conventional welding fixture is provided with a pressing plate 12 disposed above one side of a base u to form an interposed space 13 between the base u and the pressing plate 12 for the clamping. A circuit board 14 is interposed in the space 13, and the plurality of electronic components are mounted on the circuit board 14 such as a capacitor, a resistor, an inductor, a transformer, and an electric crying #: A plurality of pressing members 15' are provided below and the pressing; 15 is disposed above the electronic components 141. In operation, the platen 12 is first opened upward, and then the circuit board 14 is laid flat at a predetermined position of the base, and then the platen a is mounted thereon, because the pressing member 15 of the bottom surface of the pressing plate 12 is opposite to the The electronic component 141 on the circuit board=4, and the electronic component ΐ4ι can be firmly pressed on the circuit board 14 by the pressing member 15, so that the electronic component 141 is closely placed on the surface of the circuit board 14 to avoid the An excessive gap is created between the electronic component 141 and the circuit board 14, resulting in a situation in which the electronic component 141 is loose after 110079 5 200830963 is soldered. The pressing plate 12 is unilaterally disposed on one side of the base 11. When the pressing plate 12 is pressed over the circuit board, the electronic component 141 closer to the pivoting end first contacts the pressing member 15, and the more The later the electronic component 141 away from the pivoting end contacts the pressing member 1 & that is, there is an angle between the pressing member 15 and the electronic component 141, so that the pressing members 15 are not synchronously connected to the electronic components. 141; in short, the pressing member 15 is not vertically pressed against the top of the electronic components 141, thus causing the electricity: the 141 member 135 is tilted, so that the electronic components 141 cannot be It is only close to the surface of the circuit board 14, which causes the electronic components 141 to become loose after soldering. Refer to Figures 2A and 2B for soils, especially for some electronic components with large volume and near-coupling, such as inductors, transformers or electrical connectors 4', when the pressure plate 12 is pressed down, the first Contacting the pressing members (9) as shown in FIG. 2A of the soil) and the pressing member on the bottom surface of the pressing plate 12 is completely sinned at the top of the electronic components 141, and is first contacted by the pressing member 15 The electronic element m generates a lateral gap thrust f' which causes a gap g or offset between the rafts 14, thus causing the above-mentioned missing. Therefore, 'how to develop a kind of soldering type on the electronic circuit board, and the deer is $7 - 丨卞 ^ ^ ^ ^, to avoid the gap between the electronic 70 and the circuit board to make the % sub-element Closely related to the issue of decision-making. In order to avoid the disadvantages of the above-mentioned prior art, the main object of the present invention is to provide a soldering fixture for a circuit board, which is to tightly press the electronic component against the surface of the circuit board to avoid Create gaps or offsets. Another object of the present invention is to provide a splicing clip for a circuit board that avoids loosening of the electronic component after soldering. In order to achieve the above and other related purposes, the present invention provides a circuit, a soldering fixture for a board for clamping an electronic component on a circuit board, the soldering fixture comprising: a base; a movable plate pivotally mounted on the base a clamping space is formed between the base and the movable plate for clamping the circuit board with the electronic component; the pressure plate is slidably disposed above the movable plate, and the pressing plate is provided with a plurality of pressing members, and The pressing member passes through the movable plate and protrudes into the top of the electronic component sandwiching the two vertical plates on the circuit board; and the positioning module is disposed on the side of the movable plate for positioning the pressure plate. According to the above configuration, the present invention includes a plurality of guide rods, which are disposed above the movable plate and pass through the pressure plate, so that the pressure plate slides downwardly by the guide rod, and a guide sleeve is sleeved on the guide rod. And the guide sleeve is fixed on the pressure plate, so that the pressure plate is stably slid up and down; the first elastic 70 member which is a spring is attached to the guide rod and located between the pressure plate and the movable plate , the platen is returned to the position after sliding down. The positioning module is provided with a telescopic member in the body, and a second elastic element which is a spring is arranged between the seat body and the telescopic member, so that one end of the telescopic member is outwardly removed after the pressing plate is moved downward A rear return is pressed against the edge of the platen to position the platen. The telescopic member has a slope at one end of the edge of the platen, and the extension 110079 7 200830963=the position of the member has a pressing portion with respect to the end of the inclined surface, and the telescopic member has a beveled end by pulling the pushing portion Disengaging the edge of the pressure plate to release the pressure plate and causing the slab to rise by the first elastic member.
產生間隙或偏移而無法緊密貼靠在電路板表面之缺失。 【實施方式】 ' 相較於習知技術，本發明之電路板之焊接夹呈，係先 將具有電子元狀電路板放置在❹上方，然後放下該活 動板，之後將該壓板向下推，使該壓板底面之壓制件垂直 向下接觸在該些電子元件的頂部，如此—來即可使該壓制 件同步接觸該些電子元件，使該些電子元件緊密貼靠在電 路板上，以避免習知之焊接夾具於該壓板向下壓靠時因接 觸時間不-’產生侧向推力導致該電子元件與電路板之間 一以下係藉由特定具體實例說明本發明之實施方式，熟 悉此技勢之人士可由本說明書所揭示之内容輕易地觀察 本發明之其他優點與功效。 明參閱弟3Α及3Β圖’係為本發明之電路板之焊接夾 具之侧視示意圖；該焊接夾具2係用以在電路板3上夾裝 電子元件31 ’該焊接夾具2係包括：一底座21; 一樞設 於該底座21上方之活動板22，而在該底座21與活動板 2 2之間形成有一夾置空間2 3，用以夾裝該具有電子元件 31之笔路板3，一滑動設於該活動板22上方之壓板24， 於該活動板22上方設有複數導桿25，且在該導桿25上 套δ又有一導套251並固定在該壓板24上，俾使該壓板24 穩定上下滑動，又於該導桿25上且位於該壓板24與活動 110079 8 200830963 •板22之間設有一係為彈簧之第一彈性元件252，使該壓 板24於向下滑動後藉由該第一彈性元件252回位，又於 該壓板24設有複數壓制件26，且該壓制件26係穿過活 動板22而伸入夾置空間23垂直壓靠在該電路板3上之電 子元件31頂部；以及設於該活動板22侧邊之定位模組 27，係用以定位該壓板24。 < 該定位模組27係於一座體271中設有一伸縮件 ⑩272，於該座體271與伸縮件272之間設有一係為彈簧之 第二彈性元件273;且該伸縮件272位於該壓板24邊緣 之一端具有一斜面272a，得藉由該伸縮件272具有斜面 272a之一端壓靠在壓板24邊緣上，以定位該壓板24，於 該伸縮件272位相對於該斜面272a之一端具有一推壓部 272b，藉由抽拉該推壓部272b，使該伸縮件272具有斜 面272a之一端脫離該壓板24邊緣，用以釋放該壓板2心 並使該壓板藉由該第一彈性元件252回位上昇。 ⑩ 由上述構造，將該電路板3夾裝在該焊接夾具2之夾 ^空間23巾的步驟，先確定該活動才反22位於開啟的狀 悲，然後將該具有電子元件31之電路板3放置於該底座 21之預定位置上，接著放下該活動板22，使該活動板 2於該電路板3之上方；再推壓該壓板24，使該壓板24 藉由忒V杯25以垂直穩定地向下滑動，以使位於該壓板 24底邛之壓制件26 一致地接觸在該電路板3上之電子元 牛31頂邛，而該壓板24向下推壓時，由於該壓板％之 迻緣的下部係靠在該伸縮件272之斜面27%上，俾可藉 110079 9 200830963 _由斜面作用以將該伸縮件272向外推，當該壓板24之邊 緣的下部越過斜面272a最底部時，該伸縮件272藉由第 二彈性元件273之彈力回位，使該伸縮件272之斜面272a 之下部罪在該壓板24邊緣的上部，俾將該壓板24定位在 下壓的狀態，使該壓板24底部之壓制件26定位壓住該電 路板3上的該些電子元件，且該些壓制件別係垂直向下 ，接觸在電子元件31頂部，而不會產生侧向推力，使該些 _鲁電子tl件31得以緊密接觸在該電路板3的表面上，以避 免產生間隙或偏移的狀況，而可利於後續進行焊接製程， 進而可避免該些電子元件31產生鬆動的情況；因此，得 以免除習知構造之缺失。 當完成焊接製程後，欲取下該電路板3時，得藉由該 推壓部272b以將該伸縮件272向外拉出，使該伸縮件m 之斜面272a的下部脫離該壓板24邊緣，而可釋放該壓板 24，此時該壓板24|j由該第—彈性元件况回位上昇， ♦俾使該壓板24底部之壓制件26不再壓靠在該電路板3 表面上的電子元件31;最後，再將該活動板22向上掀 開，即可取出該完成焊接製程之電路板3。 綜上可知’本發明之電路板之焊接夾具，該麈板係垂 直滑動設於該活動板上，使該具有電子元件之電路板放置 在底座上方後，放下該活動板，再將該壓板向下推，使該 壓板底面之壓制件垂直向下接觸在該些電子元件的頂 部，俾使該壓制件同步接觸該些電子元件，以將該些電子 兀件緊密貼靠在電路板上，俾可避免習知之焊接夹具於該 110079 10 200830963 „壓板向下壓靠時因接鏑眭μ τA gap or offset is created that does not fit snugly against the surface of the board. [Embodiment] As compared with the prior art, the soldering clip of the circuit board of the present invention is such that an electronic circuit board is placed above the crucible, and then the movable panel is lowered, and then the pressing plate is pushed down. The pressing member on the bottom surface of the pressing plate is vertically contacted on the top of the electronic components, so that the pressing member can synchronously contact the electronic components, so that the electronic components are closely attached to the circuit board to avoid The welding fixture of the prior art is not suitable for the contact time when the pressing plate is pressed down. The generation of the lateral thrust causes the electronic component and the circuit board to describe the embodiment of the present invention by a specific specific example. Other advantages and effects of the present invention can be readily observed by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a side view of a welding jig of a circuit board of the present invention; the welding jig 2 is for clamping an electronic component 31 on a circuit board 3. The welding jig 2 includes: a base 21; a movable panel 22 pivotally disposed above the base 21, and an interposing space 23 formed between the base 21 and the movable panel 22 for clamping the pen board 3 having the electronic component 31, a sliding plate 24 disposed above the movable plate 22, a plurality of guiding rods 25 are disposed above the movable plate 22, and a guiding sleeve 251 is further disposed on the guiding rod 25 and fixed on the pressing plate 24, so that The pressure plate 24 is stably slid up and down, and a first spring element 252 is disposed on the guide rod 25 between the pressure plate 24 and the movable 110079 8 200830963 • the plate 22, so that the pressure plate 24 slides downward. The first elastic member 252 is returned to the position, and the pressing plate 24 is further provided with a plurality of pressing members 26, and the pressing member 26 is inserted through the movable plate 22 and protrudes into the clamping space 23 to be vertically pressed against the circuit board 3. The top of the electronic component 31; and the positioning module 27 disposed on the side of the movable panel 22, The platen 24 is positioned. < The positioning module 27 is provided with a telescopic member 10272 in the body 271, and a second elastic member 273 which is a spring is disposed between the seat body 271 and the telescopic member 272; and the telescopic member 272 is located on the pressing plate One end of the edge of the 24 has a slope 272a. The end of the platen 24 is pressed against the edge of the platen 24 by the extension member 272 to position the platen 24. The extension 272 has a push with respect to one end of the slope 272a. The pressing portion 272b pulls the pressing portion 272b so that one end of the telescopic member 272 having the inclined surface 272a is separated from the edge of the pressing plate 24 for releasing the core of the pressing plate 2 and the pressing plate is returned by the first elastic member 252. The bit is rising. 10, in the above configuration, the step of clamping the circuit board 3 in the clamping space 23 of the welding jig 2, first determining that the activity is reversed, and then the circuit board 3 having the electronic component 31 Placed on the predetermined position of the base 21, then the lower movable plate 22 is lowered to make the movable plate 2 above the circuit board 3; then the pressing plate 24 is pushed to make the pressing plate 24 vertically stabilized by the V-cup 25 The ground slides downward so that the pressing member 26 located at the bottom of the pressing plate 24 uniformly contacts the top of the electronic bull 31 on the circuit board 3, and when the pressing plate 24 is pushed downward, due to the movement of the pressing plate The lower portion of the rim rests on 27% of the slope of the telescopic member 272, and can be pushed outward by the inclined surface by 110079 9 200830963 _ when the lower portion of the edge of the pressure plate 24 passes over the bottom of the inclined surface 272a. The telescopic member 272 is returned by the elastic force of the second elastic member 273, so that the lower portion of the inclined surface 272a of the telescopic member 272 is placed on the upper portion of the edge of the pressing plate 24, and the pressing plate 24 is positioned in the depressed state, so that the pressing plate is pressed. The bottom portion 24 of the pressing member 26 is positioned and pressed against the circuit board 3 Electronic components, and the pressing members are vertically downwardly contacted on the top of the electronic component 31 without lateral thrust, so that the electronic components tl 31 are in close contact with the surface of the circuit board 3. In order to avoid the occurrence of gaps or offsets, the welding process can be facilitated, and the electronic components 31 can be prevented from being loosened; therefore, the lack of the conventional structure can be avoided. After the soldering process is completed, when the circuit board 3 is to be removed, the pressing portion 272b is used to pull the telescopic member 272 outward, so that the lower portion of the inclined surface 272a of the telescopic member m is separated from the edge of the pressing plate 24. The pressure plate 24 can be released, and the pressure plate 24|j is raised by the first elastic element, so that the pressing member 26 at the bottom of the pressure plate 24 is no longer pressed against the electronic component on the surface of the circuit board 3. 31. Finally, the movable panel 22 is further opened to take out the circuit board 3 for completing the soldering process. In summary, the welding jig of the circuit board of the present invention is vertically slidably disposed on the movable plate, so that the circuit board with the electronic component is placed above the base, the movable plate is lowered, and the pressing plate is then directed Pushing down, the pressing member of the bottom surface of the pressing plate is vertically contacted on the top of the electronic components, so that the pressing member synchronously contacts the electronic components to closely abut the electronic components on the circuit board, It can avoid the conventional welding fixture on the 110079 10 200830963 „ when the pressure plate is pressed down due to the connection 镝眭μ τ
電路板表面之缺失。 產生側向推力導致該電 5移而無法緊密貼靠在The missing surface of the board. Producing lateral thrust causes the electricity to move and cannot be placed close to
效修飾或改變， 仍應由後述之申請專利範圍所涵蓋。 胃【圖式簡單說明】 弟1圖係為習知電路板之焊接夾具的侧視示意圖； 第2Α圖係為習知電路板之焊接夹具的壓制件接觸在 電子元件頂部之示意圖； 第2Β圖係為習知電路板之焊接夾具的壓制件接觸在 電子元件頂部後產生侧向推力之示意圖； 第3Α圖係為本發明之電路板之焊接夾具的活動件與 壓板蓋在電路板上的侧視示意圖；以及 -第3Β圖係為本發明之電路板之焊接夾具的壓板底面 疋制件垂直接觸電路板上電子元件的侧視示意圖。 【主要元件符號說明】 11、21底座 12 ' 24壓板 13、23夾置空間 14 ' 3 電路板 、31電子元件 11 110079 200830963 15、26 壓制件 2 焊接夾具 22 活動板 251 導套 252 第一彈性元件 25 導桿 27 定位模組 271 座體 272 伸縮件 272a 斜面 272b 推壓部 273 第二彈性元件 f 侧向推力Modifications or changes shall be covered by the scope of the patent application described later. Stomach [Simple diagram of the drawing] The brother 1 is a side view of the welding fixture of the conventional circuit board; the second drawing is a schematic diagram of the pressing of the welding fixture of the conventional circuit board on the top of the electronic component; The schematic diagram of the pressing force of the welding fixture of the conventional circuit board contacting the top of the electronic component to generate the lateral thrust; the third drawing is the side of the movable part of the welding fixture of the circuit board of the invention and the side of the pressure plate cover on the circuit board The schematic view; and - the third diagram is a side view of the bottom surface of the pressure plate of the welding fixture of the circuit board of the present invention, which vertically contacts the electronic components on the circuit board. [Main component symbol description] 11, 21 base 12 '24 pressure plate 13, 23 clamping space 14 ' 3 circuit board, 31 electronic components 11 110079 200830963 15, 26 extrusion 2 welding fixture 22 movable plate 251 guide sleeve 252 first elastic Element 25 Guide rod 27 Positioning module 271 Seat body 272 Telescopic element 272a Inclined surface 272b Pushing part 273 Second elastic element f Lateral thrust