CN106231874B - A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure - Google Patents
A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure Download PDFInfo
- Publication number
- CN106231874B CN106231874B CN201610729493.1A CN201610729493A CN106231874B CN 106231874 B CN106231874 B CN 106231874B CN 201610729493 A CN201610729493 A CN 201610729493A CN 106231874 B CN106231874 B CN 106231874B
- Authority
- CN
- China
- Prior art keywords
- radiator
- clay
- briquetting
- heat
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004927 clay Substances 0.000 claims abstract description 67
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 14
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
- B30B1/26—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by cams, eccentrics, or cranks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of radiator heat conducting gum mud operated pressing tool and board radiator structures, a radiator is only arranged in one board, the gap filling of each electronic component and radiator on board is realized using the heat-conducting glue clod of compacting, the heat-conducting daub operated pressing tool includes rack, being horizontally arranged in the rack has clay mold, the radiator location structure that the upper plane of the clay mold is equipped with the clay cavity for placing clay and is positioned for realizing radiator, the rack is equipped with the briquetting being pressed on radiator on clay mold and the briquetting lifting drive for driving briquetting lifting in the top of clay mold.The board radiator structure that the present invention uses can solve that problem is arranged due to the heat conducting element that the height different band of each electronic component is come, and corresponding heat-conducting daub operated pressing tool can meet clay thickness and shape need, ensure that heat-conducting daub suppresses quality.
Description
Technical field
The present invention relates to board heat dissipation technologys, and in particular to the presser of board radiator structure and radiator heat conducting gum mud
Tool.
Background technology
In the prior art, what is installed between board and radiator is heat conductive pad, commonly uses heat conductive pad installation method, is to use bullet
After producer is die cut, heat conductive pad is placed on to be needed on radiating element property heat conductive pad, using screw or spring catch by radiator
It fixes on circuit boards, to ensure that radiator keeps being in close contact with by radiating element by elastic conducting heat pad, and usually often
As soon as a heat dissipation element is required for installation radiator, a board to need to install multiple radiators.
Although the fixing means of screw is simple, but if multiple heat dissipation elements is needed to contact heat dissipation with a radiator simultaneously
When, often due to each element heights are different, the heat conductive pad of different-thickness need to be chosen, and the once not no heat conductive pad of proper height,
Cause board to deform often due to pressure is inconsistent, or by carrying out secondary machine to the plane of radiator, come solve by
The circuit board problem on deformation caused by heat conductive pad pressure is distinguished.Although spring catch fixed heat sink can be adjusted using spring force
Whole radiator height, but since each compressed height of spring difference can lead to radiator deflection, so as to cause radiator, heat conductive pad and
Heat dissipation element cannot be in close contact influence heat dissipation, and since there are fit clearances between resilient key and heat emission hole, lead to the installation side
Method is not suitable for using in vibration environment, will produce larger noise.
Invention content
The technical problems to be solved by the invention are just to provide a kind of radiator heat conducting gum mud operated pressing tool and board heat dissipation
Structure allows the electronic component on a board to share a radiator and radiates, together by designing board radiator structure
When, by dedicated heat-conducting daub operated pressing tool, the compacting problem of radiator heat conducting gum mud is solved, the compacting of heat-conducting daub is improved
Efficiency ensures compacting quality.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：A kind of radiator heat conducting gum mud operated pressing tool,
Being horizontally arranged including rack, in the rack has clay mold, and the upper plane of the clay mold is equipped with for placing clay
Clay cavity and the radiator location structure positioned for realizing radiator, the rack will be equipped in the top of clay mold to be dissipated
The briquetting that hot device is pressed on clay mold and the briquetting lifting drive for driving briquetting to lift.
Preferably, the radiator location structure is the radiator location hole for being set to plane on clay mold, described to dissipate
Hot device, which is equipped with, to be inserted into the fixed self-clinching standoff of board, the self-clinching standoff in radiator location hole.
Preferably, the briquetting lifting drive include fix and drive with briquetting briquetting lifting briquetting sliding block and
The guide rail that guiding briquetting sliding block slides up and down, the briquetting sliding block are connected with toggle.
Preferably, the rack is equipped with the briquetting guide rod that guiding briquetting slides up and down.
Preferably, the rack includes the bottom plate of bottom, and the clay mold is removably mounted on bottom plate.
Preferably, the bottom of the clay mold is equipped with several mold location holes, and the bottom plate is equipped with corresponding be inserted into
Mold location hole is to realize location guide that clay mold positions on bottom plate.
Preferably, the surface of the clay mold is equipped with teflon coatings or PET release papers.
In addition, the present invention also provides a kind of board radiator structure, including board and a corresponding radiator, the plate
Multiple electronic components for needing to radiate are arranged with, the radiator corresponds to each electronic component and is respectively equipped with heat-conducting glue clod, respectively
Realize the gap filling of board and radiator between electronic component and radiator by corresponding heat-conducting glue clod respectively.
Further, the height of each electronic component is different.
Further, the fixation between the board and radiator is realized by the self-clinching standoff of screw locking radiator.
A radiator is only arranged in the technical solution adopted by the present invention, a board, real using the heat-conducting glue clod of compacting
The gap filling for showing each electronic component and radiator on board can be solved due to the height different band of each electronic component
Problem is arranged in heat conducting element, therefore also simplifies radiator structure.Due to using heat-conducting daub as heat dissipation element and radiator it
Between heat-conducting medium, heat-conducting daub have good thermal conduction characteristic, pyroconductivity 8W/mk, with super softness characteristic, can
Be compressed to any thickness, after suppressing certain thickness can very little reaction force keep, avoid reaction force excessive
Board is caused to deform.
In addition, it is less for the optional type of heat-conducting daub thickness, and generally required from clay thickness reduction to appointed thickness
Larger pressure, so as to cause the technical barrier that the clay is difficult application, the present invention is suppressed using dedicated radiator heat conducting gum mud
Heat-conducting daub is positioned in the clay cavity of clay mold by tool, makes briquetting or more by the driving of lifting drive
It moves back and forth, when briquetting is located at bottom, radiator is pressed on clay mold by briquetting, and specific by clay cavity sets
Required thickness can be suppressed on a heat sink and be reached to clay by meter, to meet since the height of electronic component is different, cause
The different problem of heat-conducting glue clod thickness.And when briquetting is located at the top, it can be by the radiator suppressed and heat-conducting daub
It takes out, is convenient for subsequent installation.Therefore, clay compacting is more efficient, and can meet clay thickness and shape need, ensures to lead
Hot glue mud suppresses quality.
Description of the drawings
The invention will be further described with reference to the accompanying drawings and detailed description：
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is structural schematic diagram of the present invention in the case where not placing clay mold state；
Fig. 3 is the positive structure schematic of clay mold；
Fig. 4 is the structure schematic diagram of clay mold
Fig. 5 is the structural schematic diagram at the radiator back side.
Specific implementation mode
As depicted in figs. 1 and 2, a kind of radiator heat conducting gum mud operated pressing tool, including rack 1, level is put in the rack 1
It is equipped with clay mold 2, the upper plane of the clay mold is equipped with the radiator location structure positioned for realizing radiator 3, institute
Rack 1 is stated in the top of clay mold equipped with the briquetting 4 and drive briquetting lifting radiator 3 being pressed on clay mold
Briquetting lifting drive.
As shown in figure 3, the upper plane of the clay mold is equipped with the clay cavity 21 for placing clay.Clay cavity pair
It answers the electronic component-sized on board, be highly designed to be pressed into corresponding heat-conducting glue clod, therefore, clay cavity 21
Position, quantity, depth and area can be adjusted as needed, be wanted for meeting heat-conducting glue clod different-thickness and shape
It asks, heat-conducting daub is positioned in the clay cavity 21 of clay mold, is then applied pressure to radiator 3 by briquetting 4, is suppressed
Heat-conducting glue clod realizes the gap filling of board and radiator, can keep radiator and heat dissipation element intimate surface contact, and
Establish the heat transfer path of high-efficient low thermal resistance.
As shown in figure 4, the bottom of the clay mold be equipped with several mold location holes 23, rack include bottom plate and with bottom
The vertical supporting plate of plate.As shown in Fig. 2, the bottom plate is equipped with the corresponding mold location hole 23 that is inserted into realize that clay mold exists
The location guide 11 positioned on bottom plate.Clay mold 2 can be achieved on bottom plate in location guide 11 after being inserted into mold location hole 23
Positioning can realize the clay thickness to different demands by replacing clay mold 2 to realize the versatility of operated pressing tool
And the compacting of shape.
As shown in figure 3, the radiator location structure is the radiator location hole 22 for being set to plane on clay mold, such as
Shown in Fig. 5, the radiator 3 be equipped with the fixed self-clinching standoff 31 of board, it is fixed that the self-clinching standoff 31 is inserted into radiator
In the hole 22 of position.Self-clinching standoff 31 is used for ensureing radiator on circuit boards highly consistent, and coupling mechanism force is avoided to cause board to become greatly
Shape, while self-clinching standoff 32 is inserted into radiator location hole 22, for ensuring the reliable location between radiator and clay mold.
Since in compacting, change in shape is larger, and heat-conducting daub contacts simultaneously with clay mold and radiator, in order to enable heat-conducting glue
Mud fits closely on a heat sink rather than on clay mold, and clay die surface (including in clay cavity), which need to use, does not glue material
Expect teflon coatings, or additional increase PET release papers, it is ensured that the cohesive force of heat-conducting daub and clay mold is smaller, ensures pressure
Glue mud can be effectively peeled off from clay mold.
As shown in Figure 1, the briquetting lifting drive includes the briquetting sliding block for fixing and driving briquetting to lift with briquetting 4
6 and the guide rail 7 that slides up and down of guiding briquetting sliding block, the briquetting sliding block be connected with toggle.Wherein, guide rail is fixed
On supporting plate, guide rail is cylindric using cylindric guide sleeve, briquetting sliding block 6 in the present embodiment, sliding in cylindric guide sleeve
It is dynamic.The rack is equipped with the briquetting guide rod 5 that guiding briquetting slides up and down, and supporting plate is fixedly arranged above upper mounted plate in bottom plate,
Briquetting guide rod is cylindrical bar, and upper end is fixed on upper mounted plate, and lower end is fixed with bottom plate.Toggle includes 8 He of connecting rod
Crank 9, with the swing of crank 9, connecting rod drives briquetting sliding block 6 and briquetting 4, and is limited in the straight line of guide rail 7 and briquetting guide rod 5
Under pump, when briquetting is located at the top, the radiator suppressed and heat-conducting daub can be taken out, convenient for follow-up peace
Dress.It is first to coat the technical solution on a heat sink, then pressed and scraped relative to heat-conducting daub, it is not only less efficient and thick
Degree and uniformity are not easy to control.The radiator heat conducting gum mud operated pressing tool that the present invention uses, clay suppress more efficient, Ke Yiman
Sufficient clay thickness and shape need ensure that heat-conducting daub suppresses quality, required thickness and shape can be realized using General purpose jig
Shape, and it is easy to operate.
The present invention also provides a kind of board radiator structures, including board and a corresponding radiator, the board to set
There are multiple electronic components for needing to radiate, the radiator to correspond to each electronic component and be respectively equipped with heat-conducting glue clod, each electronics
Realize the gap filling of board and radiator between element and radiator by corresponding heat-conducting glue clod respectively.Heat-conducting daub is
One kind is using Heat Conduction Material and binding material as material of main part, using heat-conducting daub as leading between heat dissipation element and radiator
There is good thermal conduction characteristic, pyroconductivity 8W/mk, the characteristic with super softness to be compressible to for thermal medium, heat-conducting daub
Any thickness, after suppressing certain thickness can very little reaction force keep, avoid reaction force is excessive from leading to plate
Card deformation.Therefore, heat-conducting daub is equipped between board and radiator, for increasing heat transfer area, establishing high-efficient low thermal resistance
Heat transfer path.
Wherein, the height of each electronic component is different, can also be identical, highly not simultaneously as can pass through radiator
Heat-conducting daub operated pressing tool once suppresses the different heat-conducting glue clod of multiple thickness to meet multiple electronic components and radiator
Connection, therefore the advantages of can more embody the radiator structure and radiator heat conducting gum mud operated pressing tool.
In addition, the fixation between the board and radiator is realized by the self-clinching standoff of screw locking radiator.Pass through
Heat-conducting daub can be suppressed on a heat sink and reach required thickness by above-mentioned operated pressing tool.
Claims (7)
1. a kind of radiator heat conducting gum mud operated pressing tool, it is characterised in that：Being horizontally arranged including rack, in the rack has clay
Mold, the heat dissipation that the upper plane of the clay mold is equipped with the clay cavity for placing clay and is positioned for realizing radiator
Device location structure, the rack are equipped with briquetting and the drive being pressed on radiator on clay mold in the top of clay mold
The briquetting lifting drive of briquetting lifting.
2. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The radiator positioning
Structure is to be set to the radiator location hole of plane on clay mold, and the radiator is equipped with and the fixed spiral shell that presses of board
Column, the self-clinching standoff are inserted into radiator location hole.
3. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The briquetting lifting is driven
Dynamic device includes the guide rail fixed and driven the briquetting sliding block of briquetting lifting with briquetting and briquetting sliding block is guided to slide up and down, institute
It states briquetting sliding block and is connected with toggle.
4. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The rack is equipped with
The briquetting guide rod that guiding briquetting slides up and down.
5. a kind of radiator heat conducting gum mud operated pressing tool according to any one of claims 1 to 4, it is characterised in that：Institute
The bottom plate that rack includes bottom is stated, the clay mold is removably mounted on bottom plate.
6. a kind of radiator heat conducting gum mud operated pressing tool according to claim 5, it is characterised in that：The clay mold
Bottom is equipped with several mold location holes, and the bottom plate is equipped with the corresponding mold location hole that is inserted into realize clay mold the bottom of at
The location guide positioned on plate.
7. a kind of radiator heat conducting gum mud operated pressing tool according to claim 1, it is characterised in that：The clay mold
Surface is equipped with teflon coatings or PET release papers.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810175542.0A CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
| CN201610729493.1A CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610729493.1A CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810175542.0A Division CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106231874A CN106231874A (en) | 2016-12-14 |
| CN106231874B true CN106231874B (en) | 2018-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810175542.0A Active CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
| CN201610729493.1A Active CN106231874B (en) | 2016-08-26 | 2016-08-26 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810175542.0A Active CN108513495B (en) | 2016-08-26 | 2016-08-26 | A kind of board radiator heat conducting gum mud pressure setting |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793692A (en) * | 2016-12-21 | 2017-05-31 | 天津七二通信广播股份有限公司 | A kind of heat conduction mud loads frock and application method |
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN108772697A (en) * | 2018-07-27 | 2018-11-09 | 惠州市银宝山新实业有限公司 | Automobile adjustment seat knob assembling device |
| TWI795815B (en) * | 2021-06-18 | 2023-03-11 | 亞旭電腦股份有限公司 | Method for assembling heat dissipation device and heat dissipation device |
| CN113708331B (en) * | 2021-07-27 | 2022-11-22 | 河钢股份有限公司承德分公司 | Explosion-proof clay shaping device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108513495B (en) | 2019-07-16 |
| CN106231874A (en) | 2016-12-14 |
| CN108513495A (en) | 2018-09-07 |
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