200829149 九、發明說明： 【發明所屬之技術領域】 本發明係涉及-種散熱模組，尤係涉及—種適合用於 便攜式電子裝置内對電子元件散熱的散熱模組。 【先前技術】 著中央處理器（Centrai pr〇cessing Unit，cpu )等電 子元件功率之不斷提南，散熱問題越來越受到人們重視， 在各類便攜式電子裝置比如筆記型電腦中更是如此。為在 有限之工間内南效地帶走系統產生之熱量，目前業界主要 採用由散熱片、熱管及散熱風扇所組成之散熱模組來對 CPU等電子元件進行散熱。該方式之熱傳導路徑為：哪 產生之熱她熱管傳到散熱片，再由散熱風扇產生之氣流 將傳至散熱片之熱量帶走。 如圖1AA® 1B所示為―習知用於筆記型電腦散熱之 散熱模組，該散熱模組包括一集熱塊11〇、一熱管12〇、一 風扇130及複數散熱片⑽。cpu所產生之熱量由集熱塊 110所收集後’經由熱管120傳送至散熱片謂，再由散熱 風扇130所產生之氣流與散熱片⑽發生熱交換以將熱量 散❹]外界環境中去。圖1B中箭頭⑽代表散熱風扇13〇 中乳流之方向，箭頭160代表氣流經過散熱片14〇後流出 之方向。從® 1B中可以看出，隨著散熱片⑽與散熱風扇 130之葉片之相對位置不同，散熱風扇13〇所產生之氣流 之方向與散熱片140間之夾角亦不相同。夾角越大時，氣 200829149 流與散熱片MO之間撞擊越嚴重，將在散熱片14〇之間形 成渦流現象，且散熱風扇130會由此而產生較大之噪立f 同時氣流與散熱片140碰撞時會有之動能損失1流 之速度會大幅降低，這樣會降低散制⑽與氣流間之熱 交換效率，從而降低散熱模組之散熱性能。 … 【發明内容】 有鑒於此，有必要提供一種可降低噪音之同時又具有 較佳散熱性能之散熱模組。 -種散麵組，包括-離心風扇、—鮮及—鰭片組， 該離心風扇包括-轉子，該離心風扇設有—出風口，該韓 片組設羚該出風口處且包括複數散熱片，該熱管包括一冷 凝段，其巾鱗散熱片沿與離心風扇之轉子之軸線平行^ 方向上下堆疊排列，且該等散熱片上開設有大致呈方形之 收容孔，雜管為騎狀且在靠近冷凝段之末端彎折形成 一折彎部，該熱管之冷凝段貼設於該鰭片組最外面之一散 熱片上，該折彎部收容於散熱片上所設之收容孔内。 -種散熱模組，包括-離心風扇、—集熱塊、一熱管 及-籍片組，該離心風扇包括—轉子，該離心風扇於一側 設有-出風口，該出風口具有一近風侧及一遠風側，該離 心風扇所產生之氣流先到達近風側，再到達遠風側，該孰 管包括-蒸發段及-冷凝段，該蒸發段連接在集熱塊上， 該韓片組包括複數堆疊設置之散熱片，其中該鰭片組之散 熱片沿與離心風扇之轉子之轴線平行之方向上下堆疊排列 於該出風口處’且於靠近近風側之一端設有大致呈方形之 7 200829149 收容孔，該熱管為扁平狀且在靠近冷凝段之末端彎折形成 一折彎部，該折彎部收容於所述收容孔内。 與習知技術相比，由於該散熱模組中散熱片之堆疊排 列方向與離心風扇之轉子之軸線平行，離心風扇所產生之 氣流可以較順暢地流過散熱片，可有效降低離心風扇在運 行時因氣流與散熱片發生碰撞而產生之噪音。同時，該扁 平狀之熱管之冷凝段貼設於鰭片組之最外面之散熱片上， 熱管與散熱片之接觸面積較大，且熱管在靠近冷凝段之末 端形成有一彎折段，該彎折段收容於散熱片上所設之收容 孔中，這樣設置可增加熱管與散熱片間之接觸面積，熱管 與散熱片間之換熱效率得到提高，提升散熱模組之散熱性 能。另外，熱管為扁平狀且散熱片上用於收容折彎部之收 容孔大致呈方形，使得兩者間之安裝較方便。 【實施方式】 圖2所示為本發明散熱模組2〇〇其中一較佳實施例， 該散熱模組200用於安裝在筆記型電腦等便攜式電子裝置 中以用來對其内部之發熱電子元件如中央處理器、顯卡 晶片等散熱。該散熱模組200包括一離心風扇2〇、一鰭片 組30、一熱管4〇及一集熱塊5〇。 該離心風扇20包括一殼體21及設於該殼體21内之一 轉子22，該轉子22可以繞著其轴線A做順時針轉動。該 殼體21之頂端開設# — _之進風Q 23，以供外界空氣 進入到離心風扇20内。該殼體21之侧向開設有一直線形 之出風口 24，該出風口 24具有一近風側—及一遠風侧 200829149 ‘ 勵。離心風扇20運轉時，轉子22繞軸線A做順時針轉動， . 離心風扇2G所產生之氣流經出風口 24向外流出時，氣流 先到達出風π 24之近風側24a，再到達出風口 24之遠風: 2物’且近風側2如所在區域之氣流之流量要較遠風側施 所在區域之氣流之流量大。 該鰭片組30設於離心風扇2〇之出風口 ％處，其包括 複數平行排列之散熱片31，該等散熱片31沿著與離=風 • f 20之轉子22之軸線A平行之方向上下堆疊排列。每一 散熱片31包括-矩形之本體311，該本體3ιι之兩 肖本體311之下侧彎折形成一折邊312，後-散熱片31之 折邊312與前-散熱片31之折邊312相互抵接，並在每兩 柿之放熱片31之間形成一供氣流流經之氣流通道阳。 該等散熱片31可以藉由焊接之方式固定在一起，亦可以在 =邊312上没置扣合結構，再由扣接之方式將散熱片μ固 &在一起。每一散熱片31在靠近出風口 24之近風侧施 馨 之一端設有一大致呈方形之收容孔314以用來收容熱管4〇 之一部分。所述散熱片31自收容孔灿之孔壁邊緣向本體 之下側延伸有-接觸部315，用來增加散熱片31與熱 管40之接觸面積。 ’ 該熱管40為扁平狀，其包括一蒸發段41及一冷凝段 該熱言40之蒸發段41與集熱塊5〇熱連接，其冷凝段 42貼吸於鰭片組3〇之上表面，並與位於該鰭片組最上 面之散熱片31藉由導熱膠或錫焊之方式固定在一起。該熱 笞40在罪近冷凝段42之末端處向熱管4〇之下側大致彎折 200829149 . 90°，從而形成一具有較小長度之折彎部43，該折彎部43 • 之長度大致與鰭片組30之高度相當。 該集熱塊50大致呈矩形，其由具高導熱係數之金屬材 料製成。本實施例中，集熱塊5〇由銅製成。該集熱塊5〇 大致沿對角方向設有一狹長之開槽51以收容熱管40之蒸 發段41。該開槽51之中間為一貫穿之通孔52，透過該通 孔52可使熱管40之蒸發段41與設於集熱塊50下方之電 馨 子元件（圖未示）相接觸’以提高兩者間之換熱效率，更 利於電子元件產生之熱量藉由熱管40快速地傳至鰭片組 30 ° 睛同時參照圖3，該散熱模組2〇〇組裝時，鰭片組30 設於離心風扇20之出風口 24處，熱管4〇之蒸發段41收 容於集熱塊50之開槽51内，並藉由導熱膠或錫焊之方式 將熱官40之蒸發段41與集熱塊5〇連接在一起。熱管4〇 之冷凝段42之折彎部43收容於散熱片31上所設之收容孔 314内並在收谷孔314内填充有焊錫等枯接劑，以使熱 6 40之折★部43與收容孔314之孔壁及接觸部315之間 接觸良好。同時，將熱管4〇之冷凝段42貼設於鰭片組3〇 之上表面，亚藉由導熱膠或錫焊之方式將熱管40之冷凝段 42與位於鰭片組3〇最上面之散熱片固定在一起。 該散熱柄組200用於筆記型電腦等電子裝置中散熱 7 ’集熱塊50貼設於電子元件上，電子元件所產生之熱量 猎由集熱塊5〇傳給鮮4〇或直接傳給婦W，再由孰管 4〇將熱量傳至鰭片組30之各散熱片Μ，最後由離心風扇 200829149 . 20產生之氣流吹拂各散熱片31並與散熱片31之間發生熱 交換，以最終將熱量散發到外界。 … 該散熱模組200中，由於鰭片組3〇之各散熱片31沿 平行於離心風扇20之轉子22之轴線Α排列於離心風扇2〇 之出風口 24處，離心風扇2〇所產生之氣流流經散熱片31 間之氣流通道313時，氣流與散熱片31間之碰撞較少，由 此而產生之噪音減小。該熱管4〇之冷凝段42貼設於鰭片 φ 組30之上表面，同時該冷凝段42末端之折彎部43穿設於 政熱片31之收容孔314 使熱管4〇之冷凝段42與散熱 片31間之接觸面積增加’從而提高熱管4〇與散熱片μ間 讀触率，提舰熱麵續雛能。概熱模組 200中’熱管40為扁平狀’同時熱管4〇之冷凝段42與籍 片、、且30最上^之散熱片31之間採用導熱朦或錫烊之方式 連接在-起，故熱管40之冷凝段42與散刻31間之接觸 面積大且接觸良好，兩者間之傳熱效率高，進一步提升散 • 熱模組200之散熱性能。散熱片31上用於收容冷凝段π 之折彎部43之收容孔314大致呈方形，在將熱管4〇與散 熱片31藉由導熱膠或錫桿之方式固定在-起時，敎管4〇 之折彎部43在收容孔314内不會發生轉動，故製造安裝較 方便。散熱片31上所設收容孔314之接觸部315，進一步 ~加散刻31與冷凝段42之折·_43間之接觸面積。 該散熱模組200中，散熱片31上之收容孔314設於散 :片靠近出風口 24之近風侧⑽之一端，熱管4〇將熱 里傳至散熱片31上時，散熱片S1靠近出風口 Μ之近風側 11 200829149 ， 之一端之溫度要較散熱片31之另一端之溫度高。同 ^ 牯離〜風扇20之出風口 24之近風側24a區域之流量較 遂風側2物區域之流量大，故這樣設置可使離心風扇20所 產生之氣流得到充分之利用。 該散熱模組200中，散熱片31上之收容孔314亦還可 設於散熱片31上之其他位置。如圖4所示為本發明另一實 ，例之散熱核|且2〇0a之叙裝示意圖，該散熱且2恤中， 鲁政”、、片31a上之收容孔居中設置，熱管他之冷凝段♦ 之折，部43a收容於散熱片31a之收容孔内。冷凝段仏 之折4部43a與散熱片31a發生熱交換時，熱量可以由散 熱片31a之中間同時向兩端傳送，傳熱效果亦較好。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申凊。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 _ 【圖式簡單說明】 圖1A係一習知之散熱裝置之立體示意圖。 圖1B係圖1A中之散熱裝置之流場示意圖。 圖2係本發明散熱模組其中一較佳實施例之分解示竞 圖。 ^ 圖3係圖2所示散熱模組之組裝示意圖。 圖4係本發明散熱模組之另一實施例之組裝示意圖。 【主要元件符號說明】 <本發明> 12 200829149 散熱模組 200、200a 離心風扇 20 殼體 21 轉子 22 進風口 23 出風口 24 近風侧 24a 遠風侧 24b 籍片組 30 散熱片 31、31a 本體 311 折邊 312 氣流通道 313 收容孔 314 接觸部 315 教管 40、40a 蒸發段 41 冷凝段 42、42a 折彎部 43、43a 集熱塊 50 開槽 51 通孔 52 軸線 A <習知> 集熱塊 110 熱管 120 風扇 130 散熱片 140 箭頭 150 、 160 13BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module suitable for use in heat dissipation of electronic components in a portable electronic device. [Prior Art] The power of electronic components such as the central processing unit (Cpu) continues to increase, and the heat dissipation problem has received more and more attention. This is especially true in various portable electronic devices such as notebook computers. In order to remove the heat generated by the system in the south of the limited work space, the heat dissipation module consisting of a heat sink, a heat pipe and a cooling fan is mainly used in the industry to dissipate heat from electronic components such as a CPU. The heat conduction path of this method is: which generates heat, the heat pipe is transmitted to the heat sink, and the air flow generated by the heat dissipation fan takes away the heat transferred to the heat sink. As shown in Fig. 1AA®1B, a heat dissipation module for a notebook computer is disclosed. The heat dissipation module includes a heat collecting block 11〇, a heat pipe 12〇, a fan 130, and a plurality of heat sinks (10). The heat generated by the cpu is collected by the heat collecting block 110 and transmitted to the heat sink via the heat pipe 120, and the air flow generated by the heat radiating fan 130 exchanges heat with the heat sink (10) to dissipate heat into the external environment. The arrow (10) in Fig. 1B represents the direction of the milk flow in the heat radiating fan 13A, and the arrow 160 represents the direction in which the airflow flows out after passing through the fins 14. As can be seen from the ® 1B, as the relative positions of the fins (10) and the blades of the heat dissipating fan 130 are different, the angle between the direction of the airflow generated by the heat dissipating fan 13 and the fins 140 is also different. The larger the angle is, the more severe the impact between the gas 200829149 flow and the heat sink MO will be, and a vortex phenomenon will be formed between the heat sink 14〇, and the heat dissipation fan 130 will generate a large noise f at the same time, the air flow and the heat sink When the 140 collision occurs, the speed of the kinetic energy loss will be greatly reduced. This will reduce the heat exchange efficiency between the bulk (10) and the airflow, thereby reducing the heat dissipation performance of the heat dissipation module. [Invention] In view of the above, it is necessary to provide a heat dissipation module which can reduce noise while having better heat dissipation performance. - a type of surface layer comprising: a centrifugal fan, a fresh and a fin group, the centrifugal fan comprising a rotor, the centrifugal fan being provided with an air outlet, the Korean group being provided with an air outlet at the air outlet and comprising a plurality of heat sinks The heat pipe comprises a condensation section, and the towel fins are arranged one above another in a direction parallel to the axis of the rotor of the centrifugal fan, and the heat sinks are provided with a substantially square receiving hole, and the miscellaneous tubes are riding and close to each other. The end of the condensation section is bent to form a bent portion, and the condensation section of the heat pipe is attached to one of the outermost fins of the fin set, and the bent portion is received in the receiving hole provided in the heat sink. a heat dissipation module comprising: a centrifugal fan, a heat collecting block, a heat pipe and a film set, the centrifugal fan comprising a rotor, the centrifugal fan having an air outlet on one side, the air outlet having a near wind On the side and a far wind side, the airflow generated by the centrifugal fan first reaches the near wind side and then reaches the far wind side, and the manifold includes an evaporation section and a condensation section, and the evaporation section is connected to the heat collecting block. The chip set includes a plurality of stacked heat sinks, wherein the fins of the fin set are stacked on the air outlet in a direction parallel to the axis of the rotor of the centrifugal fan and are disposed substantially at one end of the near wind side. The square is 7200829149. The heat pipe is flat and bent at an end near the condensation section to form a bent portion, and the bent portion is received in the receiving hole. Compared with the prior art, since the stacking direction of the heat sink in the heat dissipation module is parallel to the axis of the rotor of the centrifugal fan, the airflow generated by the centrifugal fan can smoothly flow through the heat sink, which can effectively reduce the operation of the centrifugal fan. The noise generated by the collision of the airflow with the heat sink. At the same time, the condensation section of the flat heat pipe is attached to the outermost heat sink of the fin group, the contact area of the heat pipe and the heat sink is large, and the heat pipe forms a bending section near the end of the condensation section, and the bending is formed. The segment is received in the receiving hole provided on the heat sink, so that the contact area between the heat pipe and the heat sink is increased, the heat exchange efficiency between the heat pipe and the heat sink is improved, and the heat dissipation performance of the heat dissipation module is improved. In addition, the heat pipe is flat and the receiving hole for receiving the bent portion on the heat sink is substantially square, so that the installation between the two is convenient. [Embodiment] FIG. 2 shows a preferred embodiment of a heat dissipation module 2 of the present invention. The heat dissipation module 200 is used for mounting in a portable electronic device such as a notebook computer for heating electronic components therein. Components such as central processing units, graphics chips, etc. dissipate heat. The heat dissipation module 200 includes a centrifugal fan 2〇, a fin set 30, a heat pipe 4〇, and a heat collecting block 5〇. The centrifugal fan 20 includes a housing 21 and a rotor 22 disposed within the housing 21, the rotor 22 being rotatable about its axis A for clockwise rotation. The top end of the casing 21 is provided with an inlet air Q 23 for the outside air to enter the centrifugal fan 20. A lateral air outlet 24 is formed laterally of the housing 21, and the air outlet 24 has a near wind side - and a far wind side 200829149. When the centrifugal fan 20 is in operation, the rotor 22 rotates clockwise around the axis A. When the airflow generated by the centrifugal fan 2G flows out through the air outlet 24, the airflow first reaches the near-wind side 24a of the wind π 24 and then reaches the air outlet. The wind of 24: 2 things' and the near-wind side 2, such as the flow of the airflow in the area, is larger than the flow of the airflow in the area where the wind side is applied. The fin set 30 is disposed at the air outlet port % of the centrifugal fan 2, and includes a plurality of fins 31 arranged in parallel, and the fins 31 are parallel to the axis A of the rotor 22 from the wind = f 20 Stacked up and down. Each of the heat sinks 31 includes a rectangular body 311. The lower side of the body 3 311 is bent to form a folded edge 312, and the folded edge 312 of the rear heat sink 31 and the folded edge 312 of the front heat sink 31 are formed. Abutting each other, and forming a gas passage passage for the airflow through between the heat release sheets 31 of each of the two persimmons. The heat sinks 31 may be fixed together by welding, or the snap-fit structure may be omitted on the = side 312, and the heat sinks may be solidified & combined together by fastening. Each of the fins 31 is provided with a substantially square receiving hole 314 at one end of the near-wind side of the air outlet 24 for receiving a part of the heat pipe 4'. The heat sink 31 has a contact portion 315 extending from the edge of the hole wall of the receiving hole toward the lower side of the body for increasing the contact area between the heat sink 31 and the heat pipe 40. The heat pipe 40 is flat, and includes an evaporation section 41 and a condensation section. The evaporation section 41 of the heat 40 is thermally connected to the heat collecting block 5, and the condensation section 42 is attached to the upper surface of the fin group 3. And being fixed together with the heat sink 31 located at the uppermost portion of the fin group by means of thermal conductive glue or soldering. The enthalpy 40 is bent substantially at the end of the near-condensing section 42 toward the lower side of the heat pipe 4〇 by 200829149.90°, thereby forming a bent portion 43 having a smaller length, and the length of the bent portion 43 is substantially It is equivalent to the height of the fin set 30. The heat collecting block 50 is substantially rectangular and is made of a metal material having a high thermal conductivity. In this embodiment, the heat collecting block 5 is made of copper. The heat collecting block 5 is provided with an elongated slot 51 substantially in the diagonal direction to receive the evaporation section 41 of the heat pipe 40. The middle of the slot 51 is a through hole 52 through which the evaporation section 41 of the heat pipe 40 is brought into contact with an electrosonic element (not shown) disposed under the heat collecting block 50 to increase two The heat exchange efficiency between the two components is more favorable for the heat generated by the electronic components to be quickly transmitted to the fin group by the heat pipe 40. At the same time, referring to FIG. 3, when the heat dissipation module 2 is assembled, the fin group 30 is set in the centrifuge. At the air outlet 24 of the fan 20, the evaporation section 41 of the heat pipe 4 is received in the slot 51 of the heat collecting block 50, and the evaporation section 41 and the heat collecting block 5 of the heat official 40 are thermally or rubber-welded. 〇 Connected together. The bent portion 43 of the condensation section 42 of the heat pipe 4 is received in the receiving hole 314 provided in the heat sink 31, and is filled with a soldering agent or the like in the valley hole 314 to make the heat of the heat 40 40 The contact between the hole wall of the receiving hole 314 and the contact portion 315 is good. At the same time, the condensation section 42 of the heat pipe 4 is attached to the upper surface of the fin group 3, and the condensation section 42 of the heat pipe 40 and the heat dissipation at the top of the fin group 3 are thermally transferred by means of thermal conductive glue or soldering. The pieces are fixed together. The heat dissipation handle set 200 is used for heat dissipation in an electronic device such as a notebook computer. The heat collector block 50 is attached to the electronic component, and the heat generated by the electronic component is transmitted from the heat collector block 5 to the fresh heat exchanger 5 or directly to the electronic device. The female W, and then the heat is transferred to the heat sinks of the fin group 30 by the manifold 4, and finally the airflow generated by the centrifugal fan 200829149.20 blows the heat sink 31 and exchanges heat with the heat sink 31 to The heat is finally released to the outside world. In the heat dissipation module 200, since the fins 31 of the fin group 3 are arranged along the axis parallel to the rotor 22 of the centrifugal fan 20 at the air outlet 24 of the centrifugal fan 2, the centrifugal fan 2 is generated. When the airflow flows through the airflow path 313 between the fins 31, the collision between the airflow and the fins 31 is less, and the noise generated thereby is reduced. The condensation section 42 of the heat pipe 4 is attached to the upper surface of the fin φ group 30, and the bent portion 43 at the end of the condensation section 42 is disposed through the receiving hole 314 of the heat regulating sheet 31 to condense the heat pipe 4 The contact area with the heat sink 31 is increased to increase the reading rate between the heat pipe 4 and the heat sink μ, and the hot surface of the ship can be maintained. In the heat-generating module 200, the heat pipe 40 is flat, and the condensation section 42 of the heat pipe 4 is connected to the film, and the heat sink 31 of the top 30 is connected by heat conduction or tin-bismuth. The contact area between the condensation section 42 and the scatter 31 of the heat pipe 40 is large and the contact is good, and the heat transfer efficiency between the two is high, thereby further improving the heat dissipation performance of the heat dissipation module 200. The receiving hole 314 of the heat sink 31 for receiving the bent portion 43 of the condensation section π is substantially square. When the heat pipe 4 and the heat sink 31 are fixed by the heat conductive glue or the tin rod, the manifold 4 Since the bent portion 43 does not rotate in the receiving hole 314, it is convenient to manufacture and install. The contact portion 315 of the receiving hole 314 provided in the heat sink 31 further increases the contact area between the groove 31 and the fold _43 of the condensing section 42. In the heat dissipation module 200, the receiving hole 314 of the heat sink 31 is disposed at one end of the airflow side (10) of the air outlet 24, and the heat pipe 4 is close to the heat sink 31 when the heat pipe 4 is transferred to the heat sink 31. The wind side of the air outlet is 11200829149, and the temperature at one end is higher than the temperature at the other end of the heat sink 31. The flow rate in the area near the wind side 24a of the air outlet 24 of the fan 20 is larger than the flow rate in the area 2a on the hurricane side, so that the airflow generated by the centrifugal fan 20 can be fully utilized. In the heat dissipation module 200, the receiving hole 314 of the heat sink 31 can also be disposed at other positions on the heat sink 31. FIG. 4 is a schematic diagram of the heat dissipation core of the present invention and the description of the 2〇0a. In the heat dissipation and the 2 shirts, the accommodating holes on the Lu Zheng and the 31a are centered, and the heat pipe is used. The portion of the condensation section ♦ is folded, and the portion 43a is received in the receiving hole of the fin 31a. When the folded portion 43a of the condensation section is heat-exchanged with the fin 31a, heat can be transferred from the middle of the fin 31a to both ends simultaneously. In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are Equivalent modifications or variations in accordance with the spirit of the present invention are intended to be included in the following claims. _ [Simple Description of the Drawings] Figure 1A is a perspective view of a conventional heat sink. Figure 1B is the heat dissipation of Figure 1A. Figure 2 is an exploded view of a preferred embodiment of the heat dissipation module of the present invention. Figure 3 is an assembled view of the heat dissipation module of Figure 2. Figure 4 is a schematic diagram of the heat dissipation module of the present invention. A schematic view of the assembly of another embodiment. Description of main components and symbols] <present invention> 12 200829149 heat dissipation module 200, 200a centrifugal fan 20 housing 21 rotor 22 air inlet 23 air outlet 24 wind side 24a wind side 24b chip group 30 heat sink 31, 31a Main body 311 Folding edge 312 Air flow passage 313 Receiving hole 314 Contact portion 315 Teaching pipe 40, 40a Evaporating section 41 Condensing section 42, 42a Bending part 43, 43a Heat collecting block 50 Slot 51 Through hole 52 Axis A < Heat collector block 110 heat pipe 120 fan 130 heat sink 140 arrow 150, 160 13