TW200822265A - Machining apparatus and semiconductor strip machining system using the same - Google Patents

Machining apparatus and semiconductor strip machining system using the same Download PDF

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Publication number
TW200822265A
TW200822265A TW096137734A TW96137734A TW200822265A TW 200822265 A TW200822265 A TW 200822265A TW 096137734 A TW096137734 A TW 096137734A TW 96137734 A TW96137734 A TW 96137734A TW 200822265 A TW200822265 A TW 200822265A
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Taiwan
Prior art keywords
semiconductor
cutting
unit
feed
unloading
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TW096137734A
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Chinese (zh)
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TWI364087B (en
Inventor
Ik-Kyun Na
Hyun-Gyun Jung
Woong-Hwan Youn
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Hanmi Semiconductor Co Ltd
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Priority claimed from KR1020060098091A external-priority patent/KR20080032413A/en
Priority claimed from KR1020060128282A external-priority patent/KR100814890B1/en
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of TW200822265A publication Critical patent/TW200822265A/en
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Publication of TWI364087B publication Critical patent/TWI364087B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/30—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor to form contours, i.e. curved surfaces, irrespective of the method of working used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A machining apparatus and a semiconductor strip machining system are disclosed. The machining apparatus includes a chuck table unit including a pair of chuck tables simultaneously movable in an X-axis direction while being individually movable in an Y-axis direction; and a cutting unit for machining articles respectively seated on the chuck tables.

Description

200822265 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種半導體加工設備，尤其係關於一種在 體切割處理㈣醉導畴狀成為齡料報職之加工惠 備以及使用該加工設備之半導體帶加工系統。 " 【先前技術】 通常情況下，半導體加工處理係包含加工（湖）處理以及 餘處理二=工處理中，係於—塊石夕晶之上設計—積體電路， :4成半‘體^。在魏處理巾，係在半導體晶片上附加 半，序地執行絲焊處理或锡焊處理 焊處理用以形成^藉‘:其中，執行絲烊處理或錫 ^ 亭+ν體日日片與引線框架電性連接， _處理係使用樹脂材料，例如環氧樹月旨。 =體帶透過固定於央盤台上的—特定拾取器送往切 處理細立之彻封裝。為了執杜述 你配備有一丰導體加工設備。 列問2習吨術的·做法健存有諸多缺陷，_是存在下 片。系狀^切财置僅僅包含—刀 對半導體帶進行切％ Ζ"直線切利半導體帶以外’無法沿曲線 丁刀士因此，習知的半導體帶加工系統無法應對 200822265 不同的作業狀況。 而且，在習知技術中，當半導體帶沒有被置於夾盤台上理想 位置而被切割裝置切割時，會由於沒有可以自動校正帶偏移之裝 置而產生殘品。 【發明内容】 鑒於以上所述之問題，本發明之—目的在於提供—種加工設 備以及-種使用該加工設備之半導體帶加工系統，該加工設備具 有可以沿曲線進行切割處理的切割裝置。 本!X明之另-目的在於提供一種加工設備以及一種使用該加 :設備之半導體帶加工⑽，該加玉設備係可對夾盤台上半導體 代位置進痛測，並依據所檢卿之位置對切難置之位 行校正。 在本發明之—方面中，-加工設備係包含：-夹盤台單元， 該夹盤台單元係包含―對夾盤台，此對越台可在Y軸方向上單 獨進行移動並同時可在X軸方向上移動；以及-切割單元，係用 以對_於夾盤台上的工件分別進行加工。 ’、 元’該夾盤台單元係包含四個失 在本發明之另—方面中，一加工設備係包含：-夾盤台單 盤台，係可在γ軸方向上單獨進 以 加 行移動朗时在X财向上_紐嫌相單元，传用 對固定於第-及第三夾盤么 私」早7"係用 犬皿口或弟二及第四夾盤台上之工件進行 200822265 該加工設備可進—步包含··一舰單元，該傳感單元係用以 獲取各工件之位置，並傳送該資訊至相關聯之切割單元，兮傳戌 單兀係包含一視頻獲取器（vision)，係用以獲取表示各工件位置 之資訊，以及-視麵取n軌道，個以使上述視賴取器沿該 ^ 軌道進行移動。 σ σ 11 上述夹盤台單元可包含··夾盤台，係用以支撐半導體帶，一 第-饋送構件’用於在X軸方向上饋送夹盤台，以及_第二饋送 構件’用於在γ轴方向上饋送爽盤台 、 其中，各夾盤台均可旋轉360度。 上述夾盤台單元也可包含：夾盤台，係用以支撐半導體帶， :垂直驅動器，係用以使該趋台垂直移動，以及—水平驅動器， 係用以使該夾盤台水平地移動。 在本發明之另—方面中，—半導體帶加I系統絲含：一裝 載部，_幽_個轉卿；—_部係包含上述加工設 咖，係树對半嶋加工完成之後接收所生成的 丰V體封裝；以及一饋送部 敌邋駚 甘笋Β Μ 賴t取+導體"或轉體封裝， 並饋达至裝載部、切割部或卸载部。 一發明之另—方面中，—半導體帶加工系統係包含：-第200822265 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a semiconductor processing apparatus, and more particularly to an in-process cutting process (4), a drunk-leading domain-like processing service, and the use of the processing equipment Semiconductor tape processing system. " [Prior Art] Under normal circumstances, the semiconductor processing system includes processing (lake) processing and residual processing two = processing, which is designed on the top of the block - the integrated circuit, : 4 in half ^. In the Wei treatment towel, the semiconductor wafer is attached with a half, and the wire bonding treatment or the soldering treatment is sequentially performed to form a soldering process: wherein the wire coating treatment or the tin wire kiosk + ν body day piece and the lead wire are performed The frame is electrically connected, and the treatment is made of a resin material such as an epoxy resin. = The body belt is sent to the cutting unit through a specific pick-up that is fixed to the center table. In order to perform your business, you are equipped with a conductor processing equipment. There are many shortcomings in the practice of the syllabus. The _ is the existence of the next film. The system has only included the knife to cut the semiconductor tape. Ζ"Beyond the line of the Chery semiconductor tape, it is impossible to follow the curve. Therefore, the conventional semiconductor tape processing system cannot cope with the different operating conditions of 200822265. Moreover, in the prior art, when the semiconductor tape is not cut at the desired position on the chuck table and is cut by the cutting device, the residue may be generated because there is no means for automatically correcting the tape offset. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a processing apparatus and a semiconductor tape processing system using the processing apparatus, the processing apparatus having a cutting apparatus which can perform a cutting process along a curved line. This! The purpose of the other is to provide a processing device and a semiconductor tape processing (10) using the device: the jade device can measure the position of the semiconductor on the chuck table, and according to the position of the inspector Correct the position of the difficult position. In an aspect of the invention, the processing apparatus comprises: a chuck table unit, the chuck table unit comprising a pair of chuck tables, the pair of crosspieces being individually movable in the Y-axis direction and simultaneously Moving in the X-axis direction; and - the cutting unit is used to machine the workpieces on the chuck table separately. ', yuan' the chuck table unit contains four losses in the other aspect of the invention, a processing equipment includes: - a chuck table single disk table, can be separately moved in the γ axis direction to move Lang Shi in the X Cai up _ 嫌 嫌 单元 , , , , 纽 纽 纽 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定The processing equipment can further include a ship unit for acquiring the position of each workpiece and transmitting the information to the associated cutting unit, and the 兮 戌 包含 system includes a video acquirer (vision ) is used to obtain information indicating the position of each workpiece, and - the view surface takes n tracks, so that the above-mentioned viewfinder moves along the ^ track. σ σ 11 The above chuck stage unit may include a chuck table for supporting the semiconductor tape, a first feed member 'for feeding the chuck table in the X-axis direction, and a second feed member 'for The refresher table is fed in the γ-axis direction, wherein each of the chuck tables can be rotated 360 degrees. The chuck unit may also include: a chuck table for supporting the semiconductor strip, a vertical drive for vertically moving the platform, and a horizontal driver for moving the chuck table horizontally . In another aspect of the present invention, the semiconductor strip plus I system filament comprises: a loading portion, a _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The V body package; and a feed part of the enemy 邋駚 Β 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取 取In another aspect of the invention, the semiconductor tape processing system comprises: -

接收複_轉體帶；—包含有加備 弟一切割部；一第一卸載部， 卜 又1胥I 後之半_··—#、、， 接收在第—域部中加工完成 -页’一貝运部，用於拾取半導體帶並饋送其至第一裝 200822265 載部、第一切割部、或第一卸載部；一第二裝載部，用於接收從 第一卸載部卸載之半導體帶；一第二切割部，係包含一其上放置 有半導體帶之旋轉台，及一第二切割單元用於加工半導體帶使其 成為半導體封裝；一檢測部，用於檢測在第二切割部中所加工完 成之半導體封裝是否存在缺陷；一第二卸載部，用於接收經過檢 測部檢測後之半導體封裝；以及一傳送器，用於在第一卸載部與 第二卸載部之間饋送半導體帶。 第一切割部之切割單元係可包含一鐳射切割裝置。第二切割 單元係可包含有一刀片。 第一切割部可進一步包含一傳感單元，用於獲取關於半導體 帶位於各夾盤台上的位置之資訊。該第一切割部可接收來自該傳 感單元之資訊，並對第一切割部之切割單元對半導體帶之加工位 置進行校準。 第二切割部係可包含：旋轉台，在該旋轉台上放置有半導體 帶，並且該旋轉台可在旋轉時在γ軸方向上進行移動；以及一刀 片，係可圍繞旋轉台在Y軸方向上移動。 在本發明之又一方面中，一半導體帶加工系統係包含：一裝 載部，係用以接收複數個半導體帶；上述之加工設備；一清洗/乾 燥部，係用以清洗並乾燥半導體帶加工完成後所生成之半導體封 裝；一檢測部，用於檢測經過清洗與乾燥後之半導體封裝是否存 在缺陷；一卸載部，用於接收完成檢測之半導體封裝；以及一饋 200822265 送部’用於拾取轉體帶或轉體封裝，並饋送所拾取之 帶或半導體雜絲辦、加^備、清洗辆部、檢測部或卸 該裝載部係可包含··-裝餘，胁堆疊轉體帶； 裝置，用於傳送裝載盒；—第—轉向執道，用於轉動透過傳送裝 置所饋送之半導體帶；以及—推進器，用於饋送輯盒中所堆疊 之半導體帶至第-轉向軌道。該卸載部係可包含：—第二轉向= 道’用於接收並轉動經過切割且透過饋送部所饋送之半導體帶； -卸載盒，胁堆疊經勒割之半導體帶；_傳送裝置，用:傳 送卸載盒；以及-夾持ϋ，用於傳送第二轉向軌道上所堆疊之經 過切割的半導體帶至卸載盒。 【實施方式】 以下，將結合圖示部份對本發明之一種加工設備及一種半導 體贡加工系統的較佳實施例作詳細說明。 「第1圖」為該半導體帶加工系統之第一實施例之示意圖。「第 1圖」中所不出之半導體帶加工系統係包含：_裝載部卿，係甩 以接收即將被加工的工件，並裝載該工件於一裝載台中；一切割 4 300 ’制以對裝載後的工件進行加工；—卸載冑係用以接 收經過加:n後之工件，並卸載經過加錢之卫件至該加工系統平 台之外部；一饋送部200，係用以饋送裝載後的工件至裝載部丨⑻、 切割部300以及卸載部4〇〇。 200822265 上述裝載部100係包含複數個裝載盒1〇2。各裝載盒中， 依照卡帶盒之形式擺放需要進行加工之複數個半導體帶％。當 然，各裝載盒102中只能擺放一個半導體帶ss。 上述裝載部100同時包含一第一傳送裝置1〇4,係用以逐一饋 达裝載盒102 ’該第一傳送裝置謝可以應用各種驅動系統，較佳 之狀況中’該第-傳送裝置顺可以應用帶式驅動系統。 在第-傳送裝置104之-端設置一裝載器1〇5。該裝載器包含 推進》。106該推進态係用以透過在一端推進半導體帶％， 從而[地移驗由第—傳钱置1G4縣的輯盒⑽中所擺 放之半導體帶SS，並使得半導體帶ss逐—地安置於第一轉向軌 道112上，下文將對第一轉向執道112加以詳述。 裝載器105還包含一第一夾持器110。該第-夾持器110設置 於裝載盒102之-端，以使其正對上述推進器鹰。因此，當推進 器106朝向第-轉向軌道112推進半導體帶％之一邊時，:第〆 夹持器m獲得並料半導體帶ss之另—邊，從而能财便地饋 送半導體帶SS。 机裝載器1G5還包含—第—轉向執道112。該第—轉向執道 叹置於上述推進器.與第—夾持請間之移動路徑中。該第 一轉向執道112包含一對可進行細度轉向。該第-轉向軌道112 ^上可放置半導體帶SS並使其轉向，進而改變半導體帶ss之移 動方向。 200822265 設置饋送部，使其與裝载部腦之間呈正交。饋送部· 係用以饋送半導體帶SS自裝裁部謂至卸载部铜。該饋送部· 係包含-饋送執道2〇2。在饋送執道逝上配置第一拾取器綱 以及第二拾取H施’使得二者可沿饋送軌道搬進行移動。 田然’為了改變第-轉向軌道m上處於固定狀態之半導體 f SS之私動方向’第一拾取g 2G4以及第二拾取$施是可轉動 的。 〜較佳地，於饋送執道202上，鄰近於裝載部100之處配置該 第才。取為204。在此種狀況中，第一拾取器2〇4可輕易地拾取一 半導體帶SS並饋送該半導體帶SS至夾盤台304，後文將對夾盤 台304進行描述。 —車乂U也’於饋达執道2〇2上，鄰近於卸載部·之處配置該 第+取206。在此種狀況+，第二拾取器2〇6可輕易地拾取一 半導體帶ss並饋送該半導體帶SS至卸載部楊。 用於加工半導體帶88之切割部300被設置於饋送軌道搬中 心部分之下方。 切moo係包含夾盤台單元3〇2，該夾盤台單元搬可在X 、 方向上做水平移動。將要進行加工之一個或多個半導體帶 =皮口疋於夾盤台單元3()2之上表面上。該切割部·還包含一 "1單元320 ’其用於在半導體帶ss上之一點對一條半導體帶進 /于 &者&著半導體帶ss上之-直線或曲線對-條半導體帶 12 200822265 進行加工。該切割單元32〇能夠對其自身之χ轴、γ轴以及θ角 之位置進行校正。該切割部勤進—步包含一傳感單元330，係用 以獲取將被泣之半導體帶ss位置之資減發送_所得之位 置資訊至切割單元320 ’以使切割單元32G之加工位置得以校正。 ‘依照上述結構’該切割部構成了—半導體封裝加工裝置。 • 賴’該半導體封裝加4置可作為-件加：!·裝置而非用 「於半導體帶SS之加工裝置。例如，該半導體封裝加工裝置可用於 在工件上形成某種標記。 如「第1圖」所示出，夹盤台單元3〇2係包含夾盤台3〇4，各 夾盤台304 在一半導鮮ss之下對其進行支樓，以及，一夹 盤台饋送器310用以對夾盤台3〇4進行饋送。 在透過切割單元320進行加工作業時，各夾盤台3〇4用於在 -半導體帶SS之下對其進行支撐。下文將對切割單元32G進行之 加工作業加以詳述。本領域之技術人員應當意識到該夾盤台3〇4 可具有任意結構。 夾盤台饋送裔310係包含··一第一饋送構件312,係用以在χ '輛方向饋送夾盤台304 ;以及-第二饋送構件314，係用以在γ轴 方向饋送夾盤台304 〇 配置第二饋送構件314與饋送軌道202呈正交。該第二饋送 構件314用於在γ軸方向上饋送夹盤台304，且只要該構件可移 動夾盤台304，則其可具有任意構造。該第二饋送構件314可包含 13 200822265 呈平行配置之若干饋送構件。在本實施例中，第二讀送構件 包含四個饋送構件，即，一一號第二饋送構件3l4a，二號第二饋 送構件3Mb’ -二號第二饋送構件以及一四號第二饋送構件 314d。在此情況下，第二饋送構件314可配置包含於其内部的一 •螺絲以及一螺栓，以便構成第二饋送構件314之全部饋送構件可 、 同時活動。 配置第-饋送構件312與第二饋送構件314呈正交。該第一 饋送構件312肖於在X軸方向饋送第二饋送構件314。透過第一 饋运構件312，構成第二饋送構件314之各饋送構件可同時活動。 切割單元320配置於第二饋送構件314之一侧，並位於第二 饋送構件314之上。該切割單元32〇用於對位於各缝纟綱之 上的半導體帶SS進行加工。 就該切割單元320而言，可應用各種切割裝置。在「第厂圖 所示出之實施例中’該切割單元32G包含一雷射切縣置。囉 如「第15圖」中所不出之實施例，該切割單元32〇可包含一刀片 上述雷射切割裝置包含一安裝於雷射切割器尖端之頭部（阳 圖中未示出）。綱部係配置成可於透桃含於該飾切割裝置冲 之控制器對該頭部之X軸、γ轴以及θ肖位置進行控制之條件1 進行移動。該雷射切割裝置係用以對「第9圖」中所示之半_ 帶ss進行加工’該加工可如「第10圖」至「第12圖」中所= 著曲線及直線進行。當,然’該雷射切雜置可對半導體帶％進^ 14 200822265 切割以使之成為獨立的半導體封裝sp。 各種切割裝置皆可用於上述操作。故而，「第丨圖」中示出之 切割單元320包含兩個切割單元，即，一第一切割單元施，以 及一第二切割單元320b。 設置第-切割單元32Ga與-第二切割單元3勘於第二饋送 構件314之上。如「第丨圖」中所示出，第一切割單元施與一 第二切割單元32Gb分別設置於二號第二舰齡现與四號第 二饋送構件314d之上’誠然’第―_單元島與第二切割單 元320b也可以分別設置於一號第二績送構件31知與三號第二饋 送構件314c之上。 、 在第二饋送構件314上之-侧設置一傳感單元33〇。 該傳感單元330包含-視頻獲取器332，該視頻獲取器说 用以對安裝於夹盤台304上之半導體帶ss之位置進行檢測，其 中該夾盤台304與第二饋送構件314相連接。該視麵取器说 對半導體φ SS植置舫檢測’並魏所制狀健資訊至雷 射切割裝置之控制器（附圖中未示出），進而在光束發射方向上^ 雷射切割裝置之頭部進行調節。 於切割部300下方切割單元32G之所在位置設置一廢料盒 350。透過廢料之重力、該廢料盒35()被作為加工作業期間所丢^ 廢料之排放通道。、 於第二饋送構# 314之上設置一視頻獲取器執道334,該視頻 15 200822265 獲取器軌道334正交於第二饋送構件314且平行於第—饋送構件 312。並且，視頻獲取器332可沿視頻獲取器軌道進行移動。 於饋送部上與裝載部勘之相對端設置卸載部 载部侧包含複數個卸载盒搬。於各喊盒搬中，擺放智加工 ‘後之半導體㈣。當然各卸載盒搬中只可擺放一個轉體帶沾 • 卸載部4〇0進-步包含一第二傳送裝置姻，用以逐個饋送各 喊盒402，該第二傳送裝置姻可應用各種驅動系統，較佳地， 第二傳送裝置404可應用一帶式驅動系統。 〜於第二傳送裝置404之-端設置一卸載器。該卸载器包含— 弗二轉向執道4丨2，該軌道設置於第二拾取器观移動執道之1 方。第二轉向執道412包含一對可做度旋轉之執道。第二 =軌道412上可放置半導體帶SS，並且該執道係用以旋轉轉 WSS以改變其運動方向。 、 料峨術進-步包含以第二夾持器414。該第二夹持器^ ^位於第二轉向執道412之半導體帶ss —端進行拾取，並麵 半導體帶SS至卸載器410之卸载盒4〇2之一側。 八配置卸載器_之目的在於：t蝴完成，即半導體帶％被 ;;為獨立半導贿斜，該㈣^彻拾取上_詩導體辭 迎饋送該獨立半導體封裝至卸载部400。 ， 統 以下’依據上述本發明第-麵實_之半導體帶加工系 對其運行方式加以詳述。： 16 200822265 如「第2圖」中所示出’當於卸载盒術中安裳 SS時’第-傳魏置傳送卸載盒術至推進器娜。、▼ 當該卸載盒402與該推進器1〇6之運動方向一 器106開始運行。隨著推進哭 以推進 丁旭者推進裔106運行，半導體帶s 轉向軌道112。 ^ 當該半導體帶SS移向第一轉向執道112時，第一夾持器11〇 拾取半導體帶SS上與推進器廳相對之一端，並向第一轉向執道 112推進上述轉體帶ss。由此，透過推職·與第一失持器 110之合作，半導體帶SS被安裝於第—轉向執道112之上。 半導體帶SS被安裝於第一轉向執道112之上以後，第一轉向 執道112轉動半導體帶ss贿之與夾盤台綱裝置對準，如「第 3圖」中所示出。如此便使得半導體帶ss被安裝於一個爽盤台綱 之上。 當上述第一轉向執道112轉動時，第一才合取器2〇4沿饋送執 道202移動，並拾取被安放於一個夾盤台3〇4上之半導體帶％。 隨後，第一拾取器204將半導體帶SS安裝於夾盤台304之上，其 中，夾盤台304位於二號第二饋送構件314b或四號第二饋送構件 314d之上。而後，第一拾取器2〇4以相同方式將另一半導體帶％ 安裝於夾盤台304之上。當然，第一拾取器204將半導體帶SS安 裝在位於一號第二饋送構件314a或三號第二饋送構件314c上的 夾盤台304之上。當第一拾取器2〇4將半導體帶ss安裝於分別與 17 200822265 二號第二饋送構件314b和四號第二饋送構件314d相耦合夾盤台 304之上時’夾盤台304沿第二饋送構件314之相關饋送饋送構件 沿Y轴運動。 當夾盤台304沿第二饋送構件314沿Y轴方向運動時，二者 經過傳感單元330。此時，傳感單元330之視頻獲取器332獲取關 於半導體帶SS位於運動中每一夾盤台上位置之資訊，並將該資訊 送往切割單元320之控制器。 該位置資訊係透過傳感單元33〇之視頻獲取器332對半導體 ▼ SS上某位置上特定標記之位置進行檢測而獲取。基於上述位置 資訊，可以確定半導體帶SS之位置。 在接收到上述資訊後，控制器基於該資訊對切割單元320頭 部之位置進行校準。在此種狀況中，如「第4圖」中所示出，由 於構成切割單元之第一切割單元32Ga與第二切割單元现分別 位於一遽第二饋送構件314b與四號第二饋送構件贿之上，傳 感早凡330對與二號第二饋送構件鳩以及四號第二饋送構件 ⑽相輕合夹盤台3〇4上所安裝半導體帶％之位置進行檢測。 同時’如「第5圖」中所示出，在對位於二號第二饋送構件 314b與四號第二饋送構件314d上之半導體帶SS進行加工時，在 一號第二婦314a齡絲二槪餅314e之Receiving a complex _ swivel belt; containing a cutting portion of the preparation of the younger brother; a first unloading portion, a half after the 胥I 胥 I _··—#,, receiving the processing in the first domain portion - page a bumper for picking up the semiconductor tape and feeding it to the first package 200822265 carrier, the first cutting portion, or the first unloading portion; a second loading portion for receiving the semiconductor unloaded from the first unloading portion a second cutting portion comprising a rotating table on which a semiconductor strip is placed, and a second cutting unit for processing the semiconductor strip to form a semiconductor package; and a detecting portion for detecting the second cutting portion Whether the semiconductor package processed in the middle has defects; a second unloading portion for receiving the semiconductor package after being detected by the detecting portion; and a transmitter for feeding the semiconductor between the first unloading portion and the second unloading portion band. The cutting unit of the first cutting portion may comprise a laser cutting device. The second cutting unit can include a blade. The first cutting portion may further comprise a sensing unit for obtaining information about the position of the semiconductor strip on each of the chuck stages. The first cutting portion can receive information from the sensing unit and align the processing position of the semiconductor strip with the cutting unit of the first cutting portion. The second cutting portion may include: a rotating table on which the semiconductor strip is placed, and the rotating table is movable in the γ-axis direction while rotating; and a blade that is rotatable around the rotating table in the Y-axis direction Move on. In still another aspect of the present invention, a semiconductor tape processing system includes: a loading portion for receiving a plurality of semiconductor strips; the processing device; and a cleaning/drying portion for cleaning and drying the semiconductor tape processing a semiconductor package formed after completion; a detecting portion for detecting whether there is a defect in the cleaned and dried semiconductor package; an unloading portion for receiving the semiconductor package for completing the inspection; and a feeding portion of the 200822265 sending portion for picking up The swivel belt or the swivel package, and feeding the picked tape or the semiconductor shred wire, adding, cleaning the vehicle, the detecting portion or unloading the loading portion may include a residual load, and the stacking and turning belt; Means for transporting the loading cassette; - a first steering path for rotating the semiconductor strip fed through the transport means; and - a pusher for feeding the stacked semiconductor strips in the cassette to the first steering track. The unloading portion may comprise: - a second steering = track 'for receiving and rotating the semiconductor strip fed through the feed and fed through the feed portion; - an unloading box, a stack of stripped semiconductor strips; - a transport device, with: Transfer the unloading cartridge; and - a clamping jaw for conveying the cut semiconductor strip stacked on the second steering track to the unloading cartridge. [Embodiment] Hereinafter, a preferred embodiment of a processing apparatus and a semiconductor processing system of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic view showing a first embodiment of the semiconductor tape processing system. The semiconductor tape processing system not shown in "1" includes: _ loading part, to receive the workpiece to be processed, and load the workpiece in a loading station; a cutting 4 300 ' to load The post workpiece is processed; the unloading tether is used to receive the workpiece after the addition of n: and the unloaded guard is unloaded to the outside of the processing system platform; a feeding portion 200 is used to feed the loaded workpiece The loading unit 丨 (8), the cutting unit 300, and the unloading unit 4〇〇. 200822265 The loading unit 100 includes a plurality of loading boxes 1〇2. In each of the loading cassettes, a plurality of semiconductor ribbons to be processed are placed in the form of a cassette. Of course, only one semiconductor strip ss can be placed in each of the loading cassettes 102. The loading unit 100 further includes a first conveying device 1〇4 for feeding the loading box 102 one by one. The first conveying device can apply various driving systems. In the preferred case, the first conveying device can be applied. Belt drive system. A loader 1〇5 is provided at the end of the first conveyor 104. This loader contains advancement. The propulsion state is used to push the semiconductor strip % at one end, so that the semiconductor strip SS placed in the box (10) of the 1G4 county by the first pass is placed, and the semiconductor strip ss is placed one by one. On the first steering track 112, the first steering lane 112 will be described in detail below. The loader 105 also includes a first gripper 110. The first gripper 110 is disposed at the end of the loading cassette 102 such that it faces the propeller eagle. Therefore, when the pusher 106 advances one side of the semiconductor strip % toward the first-steering track 112, the second gripper m obtains the other side of the parallel semiconductor strip ss, so that the semiconductor strip SS can be fed with ease. The machine loader 1G5 also includes a -th steering lane 112. The first-steering sigh is placed in the moving path between the above-mentioned propeller and the first-clamping. The first steering lane 112 includes a pair of fine-grained turns. The semiconductor track SS can be placed on the first steering track 112 and turned, thereby changing the moving direction of the semiconductor tape ss. 200822265 Set the feed section to be orthogonal to the loading section brain. The feeding portion is for feeding the semiconductor tape SS from the mounting portion to the unloading portion copper. The feeder includes a -feed channel 2〇2. The first picker and the second pick H are disposed on the elapsed call so that both can be moved along the feed track. Tian Ran's first pickup g 2G4 and second pickup $ are rotatable in order to change the direction of the private movement of the semiconductor f SS in the fixed state on the first steering track m. Preferably, the first node is disposed adjacent to the loading unit 100 on the feeding lane 202. Take 204. In this case, the first picker 2〇4 can easily pick up a semiconductor tape SS and feed the semiconductor tape SS to the chuck table 304, which will be described later. - The rut U is also placed on the feeder 2 〇 2, and the +1 is taken adjacent to the unloading section. In this case +, the second pickup 2〇6 can easily pick up a semiconductor tape ss and feed the semiconductor tape SS to the unloading portion yang. The cutting portion 300 for processing the semiconductor tape 88 is disposed below the center portion of the feed rail. The cut moo system includes a chuck table unit 3〇2, and the chuck table unit can be moved horizontally in the X direction. One or more semiconductor strips to be processed are placed on the upper surface of the chuck table unit 3 () 2 . The cutting portion further includes a "1 unit 320' for a point-to-semiconductor strip on the semiconductor strip ss-into && on the semiconductor strip ss - a straight line or a curved pair - strip semiconductor strip 12 200822265 Processing. The cutting unit 32 is capable of correcting the position of its own x-axis, γ-axis, and θ angle. The cutting unit includes a sensing unit 330 for obtaining the position information of the information of the semiconductor strip ss to be sent to the cutting unit 320' to correct the processing position of the cutting unit 32G. . The cutting portion according to the above structure constitutes a semiconductor package processing apparatus. • Lai's semiconductor package plus 4 can be used as a device: instead of "processing device for semiconductor tape SS. For example, the semiconductor package processing device can be used to form a certain mark on a workpiece. As shown in Fig. 1, the chuck table unit 3〇2 includes a chuck table 3〇4, each of which holds a branch under half of the fresh ss, and a chuck table feeder 310. Used to feed the chuck table 3〇4. When performing the machining operation through the cutting unit 320, each of the chuck stages 3〇4 is used to support it under the semiconductor strip SS. The machining operation performed by the cutting unit 32G will be described in detail below. Those skilled in the art will appreciate that the chuck table 3〇4 can have any configuration. The chuck table feeder 310 includes a first feeding member 312 for feeding the chuck table 304 in the direction of the vehicle; and a second feeding member 314 for feeding the chuck table in the γ-axis direction The 304 〇 configuration second feed member 314 is orthogonal to the feed track 202. The second feeding member 314 is for feeding the chuck table 304 in the γ-axis direction, and it may have any configuration as long as the member can move the chuck table 304. The second feed member 314 can include 13 200822265 a plurality of feed members arranged in parallel. In the present embodiment, the second reading member includes four feeding members, that is, a first feeding member 314a, a second feeding member 3Mb', a second feeding member, and a second feeding member Member 314d. In this case, the second feeding member 314 may configure a screw and a bolt included therein to allow all of the feeding members constituting the second feeding member 314 to be simultaneously movable. The first feed member 312 is disposed orthogonal to the second feed member 314. The first feeding member 312 feeds the second feeding member 314 in the X-axis direction. Through the first feeding member 312, the respective feeding members constituting the second feeding member 314 can be simultaneously moved. The cutting unit 320 is disposed on one side of the second feeding member 314 and above the second feeding member 314. The cutting unit 32 is for processing the semiconductor tape SS located on each of the slits. As far as the cutting unit 320 is concerned, various cutting devices can be applied. In the embodiment shown in the first plant diagram, the cutting unit 32G includes a laser cutting county. For example, in the embodiment not shown in FIG. 15, the cutting unit 32A may include a blade as described above. The laser cutting device includes a head mounted to the tip of the laser cutter (not shown in the front view). The skeleton is configured to be movable under conditions 1 for controlling the X-axis, the γ-axis, and the θ-axis position of the head by the controller included in the decorative cutting device. The laser cutting device is used to process the half-band ss shown in "Fig. 9". The processing can be performed as shown in "Fig. 10" to "12th". When the laser chip is cut, the semiconductor strip can be cut to make it a separate semiconductor package sp. Various cutting devices can be used for the above operations. Therefore, the cutting unit 320 shown in the "figure map" includes two cutting units, that is, a first cutting unit and a second cutting unit 320b. The first cutting unit 32Ga and the second cutting unit 3 are disposed above the second feeding member 314. As shown in the "figure diagram", the first cutting unit and a second cutting unit 32Gb are respectively disposed on the second second age member and the fourth fourth feeding member 314d. The island and the second cutting unit 320b may also be disposed on the second first feeding member 31 and the third feeding member 314c, respectively. A sensing unit 33 is disposed on the side of the second feeding member 314. The sensing unit 330 includes a video acquirer 332 for detecting the position of the semiconductor strip ss mounted on the chuck table 304, wherein the chuck table 304 is connected to the second feeding member 314. . The viewfinder is for detecting the semiconductor φ SS implant and detecting the information to the controller of the laser cutting device (not shown in the drawing), and then in the direction of beam emission, the laser cutting device The head is adjusted. A waste box 350 is disposed at a position where the cutting unit 32G is located below the cutting portion 300. Through the gravity of the waste, the waste box 35() is used as a discharge passage for the waste material lost during the processing operation. A video acquirer trajectory 334 is disposed over the second feed configuration 314, the video 15 200822265 acquirer track 334 being orthogonal to the second feed member 314 and parallel to the first feed member 312. And, the video acquirer 332 can move along the video acquirer track. The unloading portion is provided on the feeding portion opposite to the loading portion, and the loading portion side includes a plurality of unloading boxes. In each of the shouting boxes, the wisdom processing ‘the semiconductor (4) is placed. Of course, only one swivel belt can be placed in each unloading box. The unloading portion 4〇0-step includes a second transport device for feeding each shouting box 402 one by one. The drive system, preferably, the second conveyor 404 can be applied to a belt drive system. An unloader is disposed at the end of the second transmitting device 404. The unloader includes a two-way steering path 4丨2, and the track is disposed on one side of the second pickup device. The second steering lane 412 includes a pair of commands that can be rotated. The second = track 412 can be placed with a semiconductor strip SS, and the way to rotate the WSS to change its direction of motion. The step-by-step includes a second holder 414. The second holder is located at the end of the semiconductor strip ss of the second steering lane 412, and the semiconductor strip SS is attached to one side of the unloading cassette 4〇2 of the unloader 410. The purpose of the eight-configuration unloader is to: t-finish, that is, the semiconductor strip %;; for independent semi-transfer bribery, the (4) pick up the upper-speaker conductor to feed the individual semiconductor package to the unloading portion 400. The following is a detailed description of the operation of the semiconductor tape processing system according to the above-described first invention of the present invention. : 16 200822265 As shown in "Figure 2", when the SS is unloaded during the unloading of the box, the first transmission of the unloading box to the propeller Na. ▼ When the unloading box 402 and the direction of motion 106 of the propeller 1〇6 start running. With the advancement of crying to advance Ding Xu's advancement 106 operation, the semiconductor strip s turns to track 112. When the semiconductor strip SS moves toward the first steering lane 112, the first gripper 11 picks up one end of the semiconductor strip SS opposite to the propeller chamber, and advances the swivel strip ss toward the first steering lane 112. . Thus, the semiconductor strip SS is mounted on the first steering lane 112 by cooperation with the first disarming device 110. After the semiconductor strip SS is mounted on the first steering lane 112, the first steering lane 112 rotates the semiconductor strip ss to align with the chuck table device, as shown in "Fig. 3". This allows the semiconductor strip ss to be mounted on a refresher platform. When the first steering lane 112 is rotated, the first splicer 2 〇 4 moves along the feeding lane 202 and picks up the semiconductor ribbon % placed on a chuck table 3 〇 4. Subsequently, the first picker 204 mounts the semiconductor tape SS over the chuck table 304, wherein the chuck table 304 is located above the second feed member 314b or the second feed member 314d. Then, the first pickup 2〇4 mounts another semiconductor tape % on the chuck table 304 in the same manner. Of course, the first picker 204 mounts the semiconductor tape SS on the chuck table 304 located on the first feed member 314a or the second feed member 314c. When the first picker 2〇4 mounts the semiconductor strip ss on the chuck table 304 coupled with the 17 200822265 second feed member 314b and the fourth feed member 314d, respectively, the chuck chamber 304 is along the second The associated feed feed member of the feed member 314 moves along the Y axis. When the chuck table 304 is moved along the Y-axis direction along the second feeding member 314, both pass through the sensing unit 330. At this time, the video acquirer 332 of the sensing unit 330 acquires information on the position of the semiconductor strip SS on each chuck table in the motion, and sends the information to the controller of the cutting unit 320. The position information is acquired by the video acquirer 332 of the sensing unit 33 detecting the position of a specific mark at a position on the semiconductor ▼ SS. Based on the above position information, the position of the semiconductor strip SS can be determined. Upon receiving the above information, the controller calibrates the position of the head of the cutting unit 320 based on the information. In this case, as shown in "Fig. 4", since the first cutting unit 32Ga and the second cutting unit constituting the cutting unit are respectively located at the second feeding member 314b and the second feeding member of the fourth member Above, the sensor senses the position of the pair of semiconductor strips mounted on the chuck table 3〇4 with the second feed member 二 and the second feed member (10). At the same time, as shown in the "figure 5", when processing the semiconductor strip SS on the second feed member 314b and the second feed member 314d, the second female 314a silk two槪cake 314e

體帶SS。 文衣干T 之後’如「第6圖」中所示$ ’一號第二饋送構件咖與三 18 200822265 號第二饋送構件314e上的夾盤台向傳感單元33()之視頻獲取器執 道334下方之區域運動。由此，視頻獲取器说檢測到一號第二 饋送構件3Ma與三號第二饋送構件314e上炎盤台綱上所裝載 半導體帶SS之錄’從㈣爛單元之位置進行校準。 當對於二號第二魏構件3l4b與四鮮二舰齡遍上 夹盤台304上所裝载半導體帶ss之加工絲後，透過第一饋送構 件312，構成第二饋送構件3 i4之所有饋送構件向χ轴方向運動。 這使得-號第二觀構件314a與三號第二舰構件純上之失 盤台304分別被置於構成切割單元&◦的第一切割單元施與第 二切割單元320b之下。 由此，可以完成對於夾盤台304上半導體帶ss之切割。在 成對半導财SS之蝴後，透過失盤线送請 < 被送回其初始位置。 田王口P夾孤口 304被达回其初始位置後。第二拾取器挪 該第二拾取器施逐， 導體4 _二轉向軌道上钱所拾取之_帶％。 半導二=圖」中所示出 盤台取，第二轉向軌道412處™^ 當半導體帶SS被安裝於第二轉向執道412上時，第二夾相 14對輸帶SS娜取，_所♦轉體帶 19 200822265 載部400之卸載盒搬的一邊。當半導體帶％被安裝於卸载盒 402上時，第二傳送裝置4〇4使傳送器傳送半導體帶％至下—二 段。至此，加工過程完畢。 誠然，當在切割部300中完成加工之半導體帶SS之形式為半 $體封裝喊使’卸齡統可以設計為在社轉體騎sp單-中執行半導體帶SS之卸載。 "早70 下面’對本半導體帶加工系統之第二實施例進行描述。如r s 13圖」中所不出，該半導體帶祕包含n載部咖，係斥 =接收複數辦導體帶ss，以及H割部細。該第一切害 P 〇〇〇匕3夾盤台單元3002,該夾盤台單元3㈣包含爽盤合 4在該夾盤台3004上，半導體帶ss被逐個地安裝。夹盤台 3〇二可向X軸與γ轴兩個方向運動。第—切割部細還包含： 第切軎_m置，係用以對夾盤台3〇〇4上之半導體帶％進行曲 線和直線部分之加I。所述半導體帶加卫系統還包含：—第一卸 載部4000，係用以接收在第—切割部細中完成加工之半導體帶 、及第饋运部2000 ’係用以逐—拾取半導體帶％並逐 -饋送所拾取之半導體帶ss至第—切割部雇或第一卸载部 p。該半導體帶㈣統進—步包含：—第二裝載部讓，係 用以從第-域部侧触祕域之轉辭％。一第二切 割部32GG，辟二_侧包含-_台迎，半導體帶SS 將被逐-地安裝於上述旋轉台― 20 200822265 x軸方向上縣，—第二切雖置’物難置設計為可在x轴 方向上運動以逐一地加工半導體帶使其成為獨立的半導體封裝Body with SS. After the clothes T dry T, as shown in the "figure 6", the video receiver of the chuck-to-sensing unit 33 () on the second feeding member of the second feeding member 314e of the No. 18 200822265 The area movement below the 334. Thus, the video acquirer detects that the recording of the semiconductor tape SS loaded on the second plate member 3Ma and the third feeding member 314e on the third plate member 314e is calibrated from the position of the (four) defective unit. When the processed wire of the semiconductor tape ss loaded on the chuck table 304 is spread over the second second member 3l4b and the fourth fresh age, the first feeding member 312 is configured to constitute all the feeds of the second feeding member 3 i4. The member moves in the direction of the x-axis. This causes the second-view member 314a of the second-numbered member 314a and the second-stage member of the third-numbered ship member to be placed under the second cutting unit 320b, which constitutes the cutting unit & Thereby, the cutting of the semiconductor strip ss on the chuck table 304 can be completed. After the pair of semi-finished financial SS, it is sent back to its initial position through the lost line. Tian Wangkou P clip solitary mouth 304 was returned to its initial position. The second picker moves the second picker to perform the entrainment, and the conductor 4 _ two turns the _ band % of the money picked up by the track. When the semiconductor track SS is mounted on the second steering lane 412, the second phase 14 is taken to the tape SS, _ ♦ Swivel belt 19 200822265 One side of the unloading box of the carrier 400. When the semiconductor ribbon % is mounted on the unloading cartridge 402, the second conveyor 4〇4 causes the conveyor to transport the semiconductor ribbon % to the next to the second segment. At this point, the processing is complete. It is true that when the semiconductor strip SS finished in the cutting portion 300 is in the form of a half-package, the unloading can be designed to perform the unloading of the semiconductor strip SS in the spin-up. "Early 70> The second embodiment of the present semiconductor tape processing system will be described. As shown in the figure of r s 13 , the semiconductor tape contains n carrier coffee, repulsion = receiving a plurality of conductor strips ss, and H cutting portions. The first cutting P 〇〇〇匕 3 chuck unit 3002, the chuck table unit 3 (4) includes a sizzling plate 4 on the chuck table 3004, and the semiconductor strips ss are mounted one by one. The chuck table 3〇2 can move in both the X-axis and the γ-axis. The first cutting portion further includes: a first cutting 軎m is used to apply a curve I and a straight line portion to the semiconductor strip % on the chuck table 3〇〇4. The semiconductor belt securing system further includes: a first unloading portion 4000 for receiving a semiconductor strip finished in the first cutting portion and a feeding portion 2000' for picking up the semiconductor strip And feeding the picked semiconductor strip ss to the first cutting portion or the first unloading portion p. The semiconductor strip (4) integration step includes: - the second loading portion is used to transfer the % from the first domain to the secret domain. A second cutting portion 32GG, the second side includes -_台迎, the semiconductor strip SS will be installed one by one on the rotating table - 20 200822265 in the x-axis direction, the second cutting is difficult to design The semiconductor tape is processed one by one in order to be movable in the x-axis direction to be an independent semiconductor package

Sp i私測益5020 ’係用以檢測第二切割部32〇〇中加工好的半 導體封裝是否存在缺陷；—第二卸載部5_，制以接收在檢查 檢測器5020巾經過檢測的半導體封裝sp ;以及，一傳送器遍， 係用以在第—卸載部4_與第二輯部32G4之_送半導體帶 SS ° 該第一裝載部麵包含：複數個第-裝載盒職。在每個第 -裝載盒巾，可磁置複數辨導體帶ss。賴，_個半導體帶 SS只能放置於一個第一裝載盒1〇〇2中。 第-裝載部麵還包含：一第一傳送裝置脆，係用以逐一 地饋送第-錄盒臓。娜-傳送裝置刪可以使用各種驅動 系統。較佳地，第-傳送裝置聰使用—帶式驅動系統。 第-裝載器1005安置於第一傳送裝置之一端。第一襄载哭包 含：一第-推進器藤。該第一推進器觸6用於透過推進每:半 導體帶SS之-侧，逐-地移動第一傳送裝置腦移向第—推進 盗1006之第-裝載盒1002中所擺放的半導體帶％，藉以使半導 體帶SS逐一地被安裝於第一轉向執道1〇〇8之上。 第-裝載器1005還包含一第一夹持器1〇1〇。該第_夾持器 1010被設置於第-推進器聰對面。因此，當第一推進器^ 向第一轉向執道1008推進一半導體帶ss之一邊時，該第一夾持 21 200822265 ασ 1010屯取並牽引該半導體帶ss之另一邊，以使得該半導體帶 SS容易被饋送。 第衣载益1005還包括：第一轉向軌道1〇〇8。該第一轉向執 C 為苐推進裔1〇〇6的一條移動路徑。該第一轉向軌道1QQ8 包含·一對可旋轉360度之軌道。該第一轉向軌道1008上可放置 半導體帶ss，並可使該半導體帶ss旋轉，以便在其他方向上移 動該半導體帶SS。 第一饋送部2000與第一裝載部10〇〇正交設置。該第一饋送 部2000用於從第一裝載部1000逐一地饋送半導體帶SS至第一切 割部3000或第一卸載部4000。 第一饋送部2000包含：一第一饋送執道2002, 一第一拾取器 2004，該拾取器設置於第一饋送軌道2002之一端，如此該拾取器 便可沿第一饋送執道2002移動。 具體而言，第一拾取器2004可以設置於第一饋送軌道2〇〇2 上方與第一裝载部1000相鄰之處。第一拾取器2004逐一對半導 體帶SS進行拾取，並饋送其至夾盤台3004，後面將對該失盤台 3004做具體描述。 " 第二拾取器2006可以設置於第一饋送軌道2002上方。該第 二拾取器2006逐一地拾取初步切割之半導體帶ss，並饋所拾取 之半導體帶SS至第一卸載部4000。 第一切割部3000設置與第一饋送轨道2002中央部分之下 22 200822265 方。該第-切割部娜包含：-切割裝置。且該第—切割部遞 與第-較佳實施例帽述切割部_具有_之構造。因此，第 -切割部編之構成元件可參照「第旧」㈣__，灯 文不再贅述。 但是，該第—切辦3_用於沿雜無_轉體帶ss 進行切割。即，該第-切割部3_應用弧形刀片沿直線與曲線對 每-半導體帶ss難以加工之部分進行切割，而並非如「第ι〇圖」 中所示出之完全地對半導體帶SS進行切割。 第一卸载部4_配置於第-饋送執道雇上與第-裝載部 觸〇相對之-侧。該第-卸载部4_包含··複數 終—㈣盒彻巾，毅树__肋狀铸體帶ss。 以 =-個半導體帶ss只能擺放於一個卸載盒键之中。The Sp i private benefit 5020' is used to detect whether the processed semiconductor package in the second cutting portion 32 is defective; the second unloading portion 5_ is formed to receive the semiconductor package sp in the inspection detector 5020. And a transmitter pass for sending the semiconductor strip SS to the first unloading portion 4_ and the second portion 32G4. The first loading portion surface includes: a plurality of first-loading boxes. In each of the first-loading tissues, the plurality of conductor strips ss can be magnetically set. Lay, _ a semiconductor strip SS can only be placed in a first loading box 1〇〇2. The first loading surface further comprises: a first conveyor fragile for feeding the first recording cassette one by one. Various transmission systems can be used for the removal of the transmitter. Preferably, the first conveyor means a belt drive system. The first loader 1005 is disposed at one end of the first conveyor. The first 襄 哭 包 contains: a first - propeller vine. The first pusher contact 6 is configured to move the first conveyor to the side of the semiconductor strip SS, and move the first conveyor to the semiconductor strip of the first loading cassette 1002 of the first propulsion 1006. Therefore, the semiconductor strips SS are mounted one by one on the first steering lanes 1〇〇8. The first loader 1005 further includes a first holder 1〇1〇. The first holder 1010 is disposed opposite the first thruster. Therefore, when the first thruster advances one side of the semiconductor strip ss toward the first steering lane 1008, the first clamping 21 200822265 ασ 1010 extracts and pulls the other side of the semiconductor strip ss to make the semiconductor strip SS is easy to feed. The first garment load 1005 further includes: a first steering track 1〇〇8. The first steering C is a moving path of the 〇〇1〇〇6. The first steering track 1QQ8 includes a pair of orbits that can be rotated 360 degrees. A semiconductor strip ss can be placed on the first steering track 1008, and the semiconductor strip ss can be rotated to move the semiconductor strip SS in other directions. The first feeding portion 2000 is disposed orthogonal to the first loading portion 10A. The first feeding portion 2000 is for feeding the semiconductor tape SS one by one from the first loading portion 1000 to the first cutting portion 3000 or the first unloading portion 4000. The first feeding portion 2000 includes a first feeding path 2002, a first picker 2004, which is disposed at one end of the first feeding track 2002 so that the pickup can be moved along the first feeding path 2002. Specifically, the first picker 2004 may be disposed adjacent to the first loading portion 1000 above the first feeding track 2〇〇2. The first picker 2004 picks up a pair of semiconductor strips SS and feeds them to the chuck table 3004, which will be specifically described later. " The second picker 2006 may be disposed above the first feed track 2002. The second picker 2006 picks up the initially cut semiconductor strip ss one by one and feeds the picked semiconductor strip SS to the first unloading portion 4000. The first cutting portion 3000 is disposed below the central portion of the first feed track 2002 22 200822265. The first cutting portion contains: - a cutting device. Further, the first cutting portion and the first preferred embodiment have a configuration in which the cutting portion has a configuration. Therefore, the constituent elements of the first-cut section can refer to "the old" (four) __, and the lamp will not be described again. However, the first-cutting 3_ is used for cutting along the miscellaneous-transfer belt ss. That is, the first cutting portion 3_ applies a curved blade to cut a portion of each of the semiconductor strips ss which is difficult to process along a straight line and a curved line, instead of completely facing the semiconductor strip SS as shown in the "Fig. Cut. The first unloading portion 4_ is disposed on the side opposite to the first-loading portion of the first-loading portion. The first unloading portion 4_ includes a plurality of ends - (4) a box of a towel, a tree of y__ ribs with a ss. With =- a semiconductor strip ss can only be placed in a unloading box key.

_二#^4綱還包含.—第二傳送裝置4(K)4HXiM ^现彻2。該帛二傳送裂置可應用各種驅動系統。較佳 地’零二傳送裝置可翻帶式驅齡統。 弟卸载态4010配置於第一卸載部4〇〇〇之 載器4010 ,包含· 一筮一絲人士 乂罘卸 w 道4G12，職道設置於第二拾取 厂00"夕動路徑之下方。第二轉向軌道· 360度之軌道。該箆一喆人紅 對了疑轉 使該半導體^轉向軌道4012上可放置半導體帶SS，並可 %轉，以便改變該半導體帶SS之移動方向。 弟一卸載H 4_包含:—第二婦器權4。驾二失持器 23 200822265 4014拾取位於第二轉向贿上料導體帶％，並把所拾取 到的半導體帶SS裝於卸载盒4002中。 傳运器32〇2設置於第一卸載部4_與第二裝載部屬之 間。該傳送H迦詩從第―_部3_咖傳送經過預切割 • 之半導體帶SS至第二切割部3200。 .帛二鋪部遍設置於傳送器迦之—端。該第二裝載部 3204包含：複數個第二裝载盒3寫。在每一第二裝載盒遍中， 擺放有複數個經過預切割之半導體帶ss。#然，—個半導體帶％ 只能擺放於一個第二裝載盒32〇6之中。 贡 第二褒載部3204還包含：一第三傳送褒置32〇8，係用以逐一 ^饋送^輯盒屬。該第三傳钱置侧可顧各種驅制 統。私地’該第三傳钱置3繼可應用帶式驅動***。 第二裝載部3204包含：一第一奘恭 ο 含-第^ 該第二裝載器色 • SS之-侧，逐-地移動第三傳送裝置伽移 … 3210之坌-牡恭人wrv: 白弟—推進洽 之第-衣載i 32G6中所擺放的半導體帶％ 帶SS逐-地被安裝於-引入軌道咖之上。稭M使切谱 上述狀執道迎包含—_道。刻人軌道祕暫時_ 三拾取器遍之運動軌道上存放—半導體帶％，^在拜 器3216方便地拾取該半導體帶ss。 弟一拾卑 第二裝載器遞還包含—第三夾持器332 孩失持器332( 24 200822265 設置為與第二推進器相對。因此，當第二推進器遍向引 入執道3218推進該轉體帶％之―斜’第三夾制遍拾取 並推進該半導體帶SS之另一邊。 第-饋送# 3212與第二裝載部32〇4平行設置。第二饋送部 3212包含一第二镇送軌道3214。第三拾取器3216配置於第二饋 il軌C 3214上方以便可以沿第二饋送軌道3214移動。第三拾取 為遍逐個拾取半導體帶ss，並饋送該半導體帶％至下文要進 行描述之旋轉台3226。 "第二切割部3200配置於第二饋送部3212之中心部分。且該 弟二饋送部3212配置於第二切割部32〇〇之下方。第二切割部删 除了包含旋轉台3226之外，還包含一刀片單元3224。 刀片單it 3224在其-面配備有一刀片，係用以切割每一半導 體▼ SS。該刀片單元3224可包含—對刀片子單元。 透過對半導體帶SS進行切割使之成為具有理想尺寸之零 件，刀片單元3224把每一半導體帶ss加工成半導體封裳证。 旋轉台3226設置於第二切割部32〇〇之—側。該旋轉台娜 透過-電動機可做獨度旋轉。—夹盤台魏可設置於該旋轉台 3226之上。 夹盤台3230係用以在刀片單元现對半導體帶％進行_ 操作時在半導體帶SS下面對其進行夹持與支撐。正如本領域之技 *人員所體會’該夾盤台323G可具有任意結構。 25 200822265 尾科相（附圖中未不出）可配置於第— ,ν你土· 、弟—切割部3200之底部， 以便去除對半導體帶SS進行加 一 所產^ η, 使之成為半導體封裝SP過程中 m轉（晴㈣）替 =’=料頭可配置於苐二切割部_之_侧，以使廢 向杲一方向。 第四拾取器3232配置於第二餹换郫 —、、 弟爾N 3212之-侧，該拾取器 可/σ弟一饋送執道3214進行移動。兮莖 h 秒動该弟四拾取器3232用饋送位 於旋轉台上經過切割之半導體帶至第二卸載部獅。 清洗器/乾燥器迎配置於第四拾取器迎之運動路徑上。 該清洗器/乾聽迎係肋在完成^作紐騎自於第二切 割部32GG之半導體雜進行清洗並烘干。 第卸載4 5000包含一乾燥區（邮邮滅）5觀，係用以 ，底地乾燥經由第四拾取器迎饋送之半導體封裝SP。在檢測 态5020執行檢測操作之前，該乾燥區5⑽可在清洗器/乾燥器 3234執行清洗彳祕後完全去喊留於該半導體封裝之上的水 分0 第-卸載部5000包含··一第三饋送執道5〇〇4。一第五拾取器 5006設置於該第三镇勒隨5〇〇4之上並可沿該軌道進行移動。該 第五拾取H ·6贿對送在乾燥區遍中完全乾燥之半導體封 裝SP至一裝填區5008。在檢測之前，該裝填區5_暫時保存該 半導體封裝SP 〇 26 200822265 裝填區5008配置於第五拾取器5006移動路徑下方並處於該 路徑之一端。裝填區5008配置於與第三饋送執道5004正交的農 填區饋送執道5010之上，並可沿裝填區饋送執道5010進行移動。 第六拾取器5012配置於第三饋送軌道之一端，該第六拾取器 5012用於饋送經檢測器5020檢測後之半導體封裝SP至接收器 5022 ’下文將對該接收器5022進行描述。 第二卸載部5000還包含：一半導體封裝饋送部5〇14,該半導 體封裝饋送部5014與第三饋送執道5004平行且正交於裝填區饋 送執道5010。該半導體封裝饋送部5〇14包含··一半導體封裝饋送 執道50丨6 ’以及-半導體封裝拾取器漏，該轉體封裝拾取器 5018可沿半導體封裝饋送執道5〇16移動。 半導體封裝拾取器5018拾取半導體封裝，該半導體封裝放置 於沿裝填_送軌道测移動之裝填區5_内，進而，半導體 封衣1取益5018放置所拾取的半導體封裝於檢測器5㈣上方所 限疋之區域内。 依照用戶之要求，可以提供若干半導體封裝饋送部遍。 本實施射’提供了兩個半導體封裝饋送部㈣。檢測器5( 配置於半導體封裝拾取器測之—端下方。該檢測器漏用 對由半導體拾取H观所絲之料贿裝是骑在剌 構成第二卸载部5_之接收器聰包括：一接收盤 5024，係用以接收饋送檢測器5〇2〇之半導體封装；以及 27 200822265 可沿該執道進行移 盤架饋祕it 5026 ’侧以使接收盤架5〇24 動0 該接收盤架饋送軌道纖分別正交於第三饋送執道職以 及+導體雜舰執道遍，提供若干個接❹避。較佳 地，可以提供兩個或更多接收器5〇22。 兩個或更多接收器助之一可以作為一接收半導體㈣犯 之工間’其所接收之半導體封裝sp係由檢測器細確定為次品。 另外’其餘接收器避作為接收正品轉體封裝证之空間。 下面，依據本發日靖半物加工系統之第二實補之運行進 行描述。 在弟二實施例中，半導體帶加工系統之第一裝載部麵，第 一饋送部麵奴I卸載部4_之運財式赫在第一實施 财之運行方式姻。獻，第—切割部_之運行方式與第一 貫施例中切割部300之運行方式相同。 但是’如「第H)圖」中所示第—切_麵切割半導體帶 ^式不同於第-實施例中切割部勤之切割方式。半導體帶％ =-切副部3_切割後，被饋送至第—卸載部4_，並透過傳 故3202，被從帛-卸載部4〇〇〇饋送至第二裝載部纖。 番具體而言，傳送沿傳送器迦饋送之半導體帶至第三傳送裝 置遞，而後該半導體帶被放置於一個第二裝載盒3寫中。當兮 +導體帶娜则二職盒遍树，红傳送裝置傳送第二 28 200822265 裝載盒3206至弟二推進器UK)。 當第二裝載盒到達第二推進器3210時，第二推進器把第二裝 載盒32〇6之半導料推向第王拾㈣遍。接下來，第三爽持器 3220拾取轉體帶ss之—側，並舰該半導體帶ss i引入執道 3218。 當半導體帶ss達到引入軌道迎時，第三拾取器3216拾取 放置於引入軌道3218中之半導體冑ss，並沿第二饋送部迎之 第二饋送執道3214向轉台3226 _。而後，第三拾取器通 放置該半導體帶ss於旋轉台3226之夾盤台323〇上。 接下來母一刀片單元3224進行工作。每一刀片單元3224 可在與第二饋送軌道3214平行之方向上移動。依縣—刀片單元 3士224之運行方式，刀牌元迎柿半導體㈣進行切割之同 時在與第二饋送軌道3214平行之方向上移動。 由於旋轉台3226可以旋轉，位於旋轉台3226之夹盤台删 上之半導齡ss的所有部分都被蝴成轉體封裝处，如「第 U圖」與「第12圖」中所示。在旋轉台迎上被切割成之半導 體封裝SP被第四拾取器迎拾取，並被該第四拾取器迎饋送 至第二卸載部5〇〇〇〇 、主在由第四拾取器迎進行饋送同時，該半導體封裝sp經過 清洗器/乾聽3234。在闕清洗n/乾燥n 3234時，加工過程中 附著於半導體封裝sp上之雜質被完全地從半導體封裝犯上移王除。 29 200822265 經過清洗触絲，半物_ sp贼胁第二卸载部漏 之乾餘區5G02 t。而後，半導體封裝sp在乾燥區·中完全地 被乾燥。 第五拾取器篇對經完全乾燥之半導體封裝sp進行拾取， 而後饋送所拾取狀半導體封裝sp至裝填區觸。隨後，放置 於裝填區5008之半導體封震sp沿裝填區饋送執道$嶋進行饋 送0 半導體封裝拾取器5018對沿裝填區饋送執道5〇1〇進行饋送 之半導體縣sp進行拾取，而_賴半㈣封裝sp至檢測器 5020 P通後’由檢測盗5〇2〇檢測後的半導體封裝π沿半導體封 裝饋送軌道5016被饋送。同時，接收盤架篇沿接收盤架饋送 軌道5026被饋送。 經檢測H 5G2G檢測為正品之轉體封裝被放置於用於接收正 品之接收触細巾，同時，經制器漏檢測為次品之半導 體封裝被放置糊於接收次^之接收盤架5()24 +。 經過上述工序，依據第二實施例之半導體帶加工系統之工作 完畢。 下面，依據本發明對半導體加工系統之第三實施例之運進 行描述。 弟14圖」中所示，半導體帶加工系統包含：一裝载部 5〇〇，係用以接收複數個半導體帶，以及一切割部·。該切割二 30 200822265 包3 .—包含夾盤台704之夾盤台單元702，在該夹盤台7〇4 之上將逐放置半導體帶SS。該該夾盤台7〇4可沿X轴盘γ軸方 向移動。該切割部進—步包含：—蝴裝置，該切割裝置可 在移動過程中對放置於夹盤台704上之半導體帶SS進行加工，以 使其成為獨立半導體封裝sp。該半導體帶加工系統還包含：一产 =乾燥部㈣經加球之半導體難sp進行清洗與二 知900 ’係用以檢測清洗與乾燥之半導體封裝sp是否 、卸載部950 ’係帛以接收經檢測後之半導體封襄Sp . 以及，-饋送部_，係用以拾取半導體帶ss，並饋送盆至果載 部·或切割部700,拾取半導體封裝犯並饋送其至清洗/乾燥部 800 ’檢測部900或卸載部950。 裝載部卿&含複數個裝載盒5〇2。在每個裳載盒5〇2，可放 置複數個將被切割之轉體帶ss。當然，每一裝載盒搬 放置一個半導體帶SS。 匕 裝载部500還包含一傳送裝置5〇4，係用以逐—饋送裝載盒 5〇2。該傳送裝置504可以可應用各種驅動系統。較佳地，該傳送 裝置可應用帶式驅動系統。 裝載部5GG包含-裝載器5〇5。該裝载器5()5包含一推進器 5〇6。該推進器慨係用以透過推動每一轉體帶^之—側，: 透過傳送裝置5〇4向其移動之半導體帶ss放置於裝载盒5〇2之 尹’並使得該半導體帶SS被逐-放置於引入贿5ω之上。 200822265 纟載益505還包含—夾持器508。該夾持ϋ 508設置於推進器 506對面口此，¥推進器506向引入執道510推進半導體帶ss 之侧日π，夾持态508拾取並拉動半導體帶ss之另一侧。 裝載部500還進一步包含有引入執道51 〇。具體而言，該引入 .執道510被設置於一條移動路徑巾，其中推進器5〇6與夾持器5〇8 .可沿該移動路徑進行移動，或者，被設置於第一拾取器6〇4下方 該路徑之一側，其中包含於饋送部_之第-拾取器604可沿上 述路径進仃移動。第—拾取^ _將在下文進行詳述。在傳輸該 半導體帶ss至切割部之前，該引入執道51〇用於暫時存料 導體帶SS。 饋送部600配置於裝載部之一侧。該饋送部_包含一 饋送軌道602。第-拾取器6〇4配置於饋送軌道6〇2上並可沿該執 道進行移動。該第-拾取器6〇4對放置於引入執道si〇上之半導 體帶進行拾取，並放髓半導鮮於艇執道上，使得該半 導體帶可被饋送至夾盤台單元7〇8，下文將對炎盤台單元观進广 ， 詳述。 丁 同時，在饋送軌道602上提供一第二拾取器6〇6。該第二拾取 器606用於從切割部舰半導體封裝sp至清洗/乾燥部^。 下文將對切副部700以及清洗/乾燥部8〇〇進行詳述。 在饋达軌迢602上還提供了 一第三拾取器6〇8。該第三拾取器 608用於從清洗/乾燥部_饋送半導體封展sp至檢测部·。二 32 200822265 半‘體π SS進仃加工之切割部7〇〇被配置於饋送部600中心之下 u於切顺之中的失盤台單元观設置為可沿X轴盘 :ΓΓ。於夾盤台單元702之上表面放置複數個將被加-之半¥體^τ SS。包含於切割部7〇〇之中的夾盤台單元搬可在半 導體帶SS上之—點對其進行加工，或者沿半導體帶SS上之一直 線或曲線對其進行加工。切割單元72〇可在χ轴，γ轴以及θ角 位置對自身進行校準。該切割部·還包含—傳感單元㈣，係用 以獲取貝戒’該貧訊為即將被加工之半導體帶SS之位置，並將所 檢測到的資訊送至切割單元720，使得切割單元720之加工位置可 以得到校準。依據上述結構，該_部成為了—半導體封裝 加工裝置。 又 如「第14圖」中所示出’包含於夾盤台單元702中之夾盤台 彻=的每—細於在半導體帶ss下方支擇該半導體帶％。夹 盤台單元702還包含-夾盤台饋送器71〇，係用以饋送夾盤台静 每-夾盤台704用於在透過切割單元72〇對半導體帶％進行 加工時，在半導體帶SS下方夾持並支撐-半導體帶SS。下文將 對切。彳單元720之加工健進储述。任何熟胃相像技藝者可以 理解該夾盤台704可具有任意結構^ 夾盤台饋送器710包含：—第一饋送構件712，係甩以在χ 轴方向饋送夾盤台704 ;及-第二饋送構件714，係用以在γ轴方 33 200822265 向饋送夾盤台704。 二^構件714抛己置為正交於饋送軌if 602。該第二饋送 西番Γ4用於在γ軸方向饋送夹盤台爾。第一饋送構件712被 又己置為正交於第二饋送構件714。該第—饋送構件712，係用以在 X軸方向饋送第二饋送構件714。 Α第二饋送構件714可包含若干相互平行之饋送構件。在本實 %例中’第—饋雜件714包含喃舰構件，即，—號第二饋 达構件71如’二號第二饋送構件714b，三號第二饋送構件714c 以及四號第二饋送構件714d。 切割單元72〇設置於第二饋送構件714之上並位於第二饋 構件714 -端。該切割單元72〇用於對放置於每一夾盤纟期上 之半導體帶SS進行加工。 就切割單元720而言，可應用各種切割裝置。如「第J圖」 中所不，該切割單元72〇可包含一雷射切割裝置。同樣，如「第 15圖」中所示，該切割單元72〇可包含一刀片。 雷射切難置係包含-安裝於雷射切難置尖端之頭部（附 囷中未示出）。該頭部係配置成可在透過包含於該雷射切割裝置中 之控制讀該頭部之X軸、γ軸以及θ角位置進行控制之條件下 進行移動。該雷射切赚置麟對「第9圖」中所示之半導體帶 ss進行加工’該加工可如「第10圖」至「第12圖」中所示沿著 曲線及直線進行。當然，該雷射切割裝置可對半導體帶ss進行切 34 200822265 割以使之成為獨立的半導體封裝Sp。 可以應用若干個雷射切繼。所以如「第丨圖」中所示，該 切割單元720可包含兩個切割單元，即，—第―切割單元篇二 及一第二切割單元720b。 弟-切割單元施以及第二切割單元7通配置於第二饋送 構，714^上。如「第14圖」中所示出’第—切割單元7施以 及弟-切割單元720b可分別配置於一號第二饋送構件他鱼三 號第二饋送構件心之上，或者分別配置於二號第二饋送^ 714b與四號第二饋送構件714d之上。 傳感單元73G設置於第二舰構件Μ之上並位於第二饋送 構件714 -端。該傳感單元73〇包含一視頻獲取器说，該視頻庐 取器732用以對安裝於夹盤台7〇4上之半導體帶ss之位置進練 其中’該夾盤台.與第二饋送構件714相 視 取器732解瓣ss之峨_，峨所檢卿之位= ^至雷射切繼之控彻（_未示出），梅光束發射 向上對雷射切割裝置之頭部進行調節。 於第―饋讀件714之上設置—視麵取器7 顏 獲取器轨物正交於第二饋送構件 ^f34觀頻 71? 再仟714且+仃於第一饋送構件 於’視頻獲取請可沿視頻獲取器執道別進行移動。 例中，單元720而言’可以應用各種切割裝置。縣^ ’ 勒i單TC720健包含—雷射切難置。 35 200822265 雷射切難置包含-安裝於裝置㈣ 部係配置成可透過包含於对射切魏置中之控㈣對該頭= X軸、Y軸以及Θ角位置進行控制而得以進行位置校正 切割裝置用於對「第9圖」中所示之半導體帶ss進行加工:= 工可如「例」至「第12圖」中所示沿著曲線及直線進行。 廢料盒，可配置於切割單元72〇之底部，該廢料 於，透過廢料之重力，去除在切割部對半導體帶SS進行加I 使之成為半導體封裝SP⑽財職生之廢料。 清洗/乾燥部_配置於饋送部_之與裝載部5〇〇相對的— 側。該清洗/乾燥部麵包含一第—清洗器/乾燥器觀以及 清洗器/乾燥器811。 第一清洗器/乾燥器謝限定_清洗/乾燥區域搬。在該區域 中，經過切割後的半導體封裝sp被清洗並被乾燥。 、清洗後燥部_還包含一清洗台_。該清洗台綱係裝配 ^主」月洗口饋达軌道805進行移動，該清洗台饋送執道805 2在β洗/乾燥部_之縱向延伸。清洗台謝係用以在半導體封 ^位於清私綱上之情況下沿著清洗平台進行移動。在清洗 、之f夕動路控上配置有一空氣噴頭娜。該空氣喷頭廳係用 =向位於清洗台_上之半導體封I即上噴射空氣，從而去除附 體封裳证上表面之雜質。當然，該空氣喷頭806也可吹 U,、、、二氣，藉以乾燥清洗後之半導體封裝sp。 36 200822265 月先σ 804之移動路經中還配置了-水喷頭8〇8。該水噴頭 係用以向位於清洗台綱上半導體封裝sp喷射水去除 附者於轉體職SP上絲之㈣。 于、 =在洗台_之移動路徑中還配置了 —第—刷狀物_二#^4纲 also contains.—The second transfer device 4(K) 4HXiM ^ is now 2 . The second transmission split can be applied to various drive systems. Preferably, the zero-two transfer device can be turned over. The unloading state 4010 is disposed in the carrier 4010 of the first unloading unit 4, and includes a glimpse of the person 4 124, and the service road is disposed below the second picking factory 00" Second steering track · 360 degree track. The 箆 喆 喆 对 对 对 对 该 该 该 该 该 该 该 该 该 该 该 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 Brother unloading H 4_ contains: - second woman right 4. The driver's second lost device 23 200822265 4014 picks up the second conductor in the second steering bribe, and mounts the picked semiconductor strip SS in the unloading box 4002. The transport unit 32〇2 is disposed between the first unloading unit 4_ and the second loading unit. The transfer H. sin is transmitted from the _th portion 3_ coffee through the pre-cut semiconductor strip SS to the second dicing portion 3200. The second pavilion is placed at the end of the conveyor. The second loading unit 3204 includes a plurality of second loading cassettes 3 for writing. In each of the second loading cassette passes, a plurality of pre-cut semiconductor strips ss are placed. #然,—The semiconductor strip % can only be placed in a second loading box 32〇6. The second load portion 3204 further includes: a third transfer device 32〇8 for feeding the cassettes one by one. The third money transfer side can take care of various driving systems. Privately, the third money transfer 3 can be applied to the belt drive system. The second loading unit 3204 includes: a first 奘 ο 含 - 第 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 The younger brother--the semiconductor tape % placed in the i32G6 is equipped with the SS on the -to-orbital coffee. Straw M makes the cut spectrum. The engraved orbital secret temporarily _ three pickers are stored on the moving track - the semiconductor strip %, ^ conveniently picks up the semiconductor strip ss in the receiver 3216. The second picker of the second picker also includes a third gripper 332, the child loser 332 (24 200822265 is set to oppose the second pusher. Therefore, when the second pusher is introduced into the way 3218 to advance the The third clip of the swivel band % picks up and advances the other side of the semiconductor strip SS. The first feed #3212 is disposed in parallel with the second loading portion 32〇4. The second feed portion 3212 includes a second town The track 3214 is disposed. The third picker 3216 is disposed above the second feed il rail C 3214 so as to be movable along the second feed track 3214. The third pick is to pick up the semiconductor strip ss one by one, and feed the semiconductor strip % to the following The rotating table 3226 is described. The second cutting portion 3200 is disposed at a central portion of the second feeding portion 3212. The second feeding portion 3212 is disposed below the second cutting portion 32. The second cutting portion is deleted. In addition to the rotary table 3226, a blade unit 3224 is included. The blade unit single 3224 is provided with a blade on its face for cutting each semiconductor ▼ SS. The blade unit 3224 can include a pair of blade subunits. With SS The cutting unit is made into a part having a desired size, and the blade unit 3224 processes each semiconductor strip ss into a semiconductor package. The rotating table 3226 is disposed on the side of the second cutting portion 32. The rotating table can be transmitted through the motor. The sole rotation can be set on the rotary table 3226. The chuck table 3230 is used to clamp the semiconductor tape SS under the semiconductor device when the blade unit is currently operating on the semiconductor tape %. And the support. As the person skilled in the art realizes that the chuck table 323G can have any structure. 25 200822265 The tail phase phase (not shown in the drawing) can be configured in the first -, ν你土·, brother - cutting The bottom of the portion 3200, in order to remove the semiconductor strip SS to be added, so that it becomes a semiconductor package SP process, m turn (clear (four)) === the material head can be disposed on the side of the second cutting portion The fourth picker 3232 is disposed on the side of the second 餹 、 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Second move the young four picker 3232 with the feed on the rotary table The cut semiconductor is brought to the second unloading lion. The washer/dryer is placed on the moving path of the fourth picker. The washer/dry listening rib is completed in the second step. The 32GG semiconductor miscellaneous is cleaned and dried. The first unloading 4 5000 includes a drying zone (postal mailing), which is used to dry the bottom substrate and feed the semiconductor package SP via the fourth picker. Before the detecting operation, the drying zone 5 (10) can completely scream the moisture remaining on the semiconductor package after the cleaning/dryer 3234 performs the cleaning process. The first-unloading section 5000 includes a third feeding lane 5〇 〇 4. A fifth picker 5006 is disposed over the third bayer and is movable along the track. The fifth pick H. 6 bribes the semiconductor package SP that is completely dried in the drying zone to a loading area 5008. Prior to detection, the loading area 5_ temporarily holds the semiconductor package SP 〇 26 200822265 The loading area 5008 is disposed below the moving path of the fifth picker 5006 and at one end of the path. The loading area 5008 is disposed above the agricultural land feeding lane 5010 orthogonal to the third feeding lane 5004 and is movable along the loading area feeding lane 5010. The sixth picker 5012 is disposed at one end of a third feed track for feeding the semiconductor package SP detected by the detector 5020 to the receiver 5022'. The receiver 5022 will be described below. The second unloading portion 5000 further includes a semiconductor package feeding portion 514 that is parallel to the third feeding lane 5004 and orthogonal to the loading region feeding lane 5010. The semiconductor package feed portion 5A 14 includes a semiconductor package feed path 50丨6' and a semiconductor package pickup leak, which can be moved along the semiconductor package feed path 5〇16. The semiconductor package picker 5018 picks up the semiconductor package, and the semiconductor package is placed in the loading area 5_ which moves along the loading and unloading track. Further, the semiconductor package 1 takes advantage of the 5018 to place the picked semiconductor package above the detector 5 (four). Within the area of 疋. A number of semiconductor package feeds can be provided as desired by the user. This embodiment provides two semiconductor package feeds (4). The detector 5 (disposed under the end of the semiconductor package pick-up detector). The detector is used to collect the material from the semiconductor pick-up. a receiving tray 5024 for receiving a semiconductor package that feeds the detectors 5〇2〇; and 27 200822265 along which the shifting frame feeds it 5026' side to move the receiving trays 5〇24 to the receiving The shelf feed track fibers are orthogonal to the third feed dictator and the + conductor carrier, respectively, providing a number of access avoidance. Preferably, two or more receivers 5 〇 22 may be provided. One or more of the receivers can be used as a receiving semiconductor (4). The semiconductor package sp that it receives is finely determined by the detector as a defective product. In addition, the remaining receivers are protected as receiving genuine swivel package certificates. The following is a description of the operation of the second real complement of the Japanese semiconductor processing system. In the second embodiment, the first loading section of the semiconductor tape processing system, the first feeding section, the slave I unloading section 4_The operation of the financial formula in the first implementation The operating mode of the first-cutting section is the same as that of the cutting section 300 in the first embodiment. However, the first-cut-cut semiconductor strip is shown in the figure "H". The formula is different from the cutting method of the cutting portion in the first embodiment. After the semiconductor strip % = - the cut sub-section 3_ is cut, it is fed to the first unloading portion 4_, and is transmitted from the 帛-unloading portion 4 到 to the second loading portion through the ejector 3202. Specifically, the semiconductor tape fed along the conveyor is transferred to the third transfer device, and then the semiconductor tape is placed in a second load cassette 3 write. When 兮 + conductor belt Na then the second job box throughout the tree, the red conveyor transmits the second 28 200822265 load box 3206 to the second pusher UK). When the second loading cassette reaches the second pusher 3210, the second pusher pushes the half of the second loading cassette 32 〇 6 toward the king for four (four) passes. Next, the third holder 3220 picks up the side of the swivel belt ss, and the semiconductor strip ss i is introduced into the obstruction 3218. When the semiconductor strip ss reaches the lead-in rail, the third picker 3216 picks up the semiconductor 胄ss placed in the lead-in track 3218 and greets the second feed lane 3214 toward the turntable 3226_ along the second feed. Then, the third pickup passes the semiconductor strip ss on the chuck table 323 of the rotary table 3226. Next, the parent-blade unit 3224 operates. Each blade unit 3224 is movable in a direction parallel to the second feed track 3214. According to the operation mode of the county-blade unit 3 224, the knife plate welcoming the persimmon semiconductor (4) while cutting is moving in the direction parallel to the second feeding track 3214. Since the rotary table 3226 can be rotated, all portions of the semi-advanced ss which are located on the chuck table of the rotary table 3226 are spliced into the swivel package as shown in "U-picture" and "Fig. 12". The semiconductor package SP that is cut into the turntable is picked up by the fourth picker, and fed by the fourth picker to the second unloading portion 5, and the main pickup is fed by the fourth picker. At the same time, the semiconductor package sp passes through the washer/dry listener 3234. When the n/dry n 3234 is cleaned, the impurities adhering to the semiconductor package sp during the process are completely removed from the semiconductor package. 29 200822265 After cleaning the touch wire, the half object _ sp thief threatened the second unloading part of the dry area 5G02 t. Then, the semiconductor package sp is completely dried in the drying zone. The fifth picker picks up the completely dried semiconductor package sp and then feeds the picked-up semiconductor package sp to the fill area. Subsequently, the semiconductor sealing shock sp placed in the loading area 5008 is fed along the loading area. The semiconductor package picker 5018 picks up the semiconductor county sp which feeds the loading area 5〇1〇, and _ After the half (four) package sp is detected to the detector 5020, the semiconductor package π detected by the detection thief is fed along the semiconductor package feed track 5016. At the same time, the receiving tray articles are fed along the receiving tray feeding track 5026. The swivel package that has been tested to be genuine by H 5G2G is placed on the receiving touch towel for receiving the genuine product, and at the same time, the semiconductor package that is detected as defective by the device leak is placed on the receiving tray 5 of the receiving terminal ( ) 24 +. Through the above process, the operation of the semiconductor tape processing system according to the second embodiment is completed. Next, the operation of the third embodiment of the semiconductor processing system will be described in accordance with the present invention. As shown in FIG. 14 , the semiconductor tape processing system includes a loading unit 5 接收 for receiving a plurality of semiconductor strips and a cutting portion. The cutting two 30 200822265 package 3 - a chuck table unit 702 comprising a chuck table 704, on which the semiconductor strip SS will be placed one by one. The chuck table 7〇4 is movable in the γ-axis direction of the X-axis disk. The cutting portion further includes a butterfly device that processes the semiconductor tape SS placed on the chuck table 704 during movement to make it a separate semiconductor package sp. The semiconductor tape processing system further comprises: a production=drying section (4) cleaning by the ball-added semiconductor difficult sp and a second sensing 900' for detecting whether the semiconductor package sp of the cleaning and drying is unloaded 950' to receive the The detected semiconductor package Sp. and, - the feed portion _, is used to pick up the semiconductor tape ss, and feed the basin to the fruit carrier or the cutting portion 700, pick up the semiconductor package and feed it to the cleaning/drying portion 800' The detecting unit 900 or the unloading unit 950. Loading Department & contains a plurality of loading boxes 5〇2. In each of the carrying boxes 5〇2, a plurality of swivel belts ss to be cut can be placed. Of course, each loading cassette carries a semiconductor strip SS.装载 The loading unit 500 further includes a transport unit 5〇4 for feeding the loading cassettes 5〇2 one by one. The conveyor 504 can be applied to a variety of drive systems. Preferably, the conveyor device can apply a belt drive system. The loading portion 5GG includes a loader 5〇5. The loader 5() 5 includes a pusher 5〇6. The pusher is used to push the side of each of the swivel belts: the semiconductor strip ss moved toward the transfer device 5〇4 is placed in the loading box 5〇2, and the semiconductor strip SS Being placed on top of the introduction of bribes 5ω. 200822265 纟载益 505 also includes a holder 508. The clamping jaw 508 is disposed opposite the pusher 506. The pusher 506 pushes the side π of the semiconductor strip ss toward the lead-in 510. The gripping state 508 picks up and pulls the other side of the semiconductor strip ss. The loading portion 500 further includes an introduction lane 51. Specifically, the introduction lane 510 is disposed on a moving path towel, wherein the pusher 5〇6 and the gripper 5〇8 are movable along the moving path, or are disposed on the first picker 6 One side of the path below the crucible 4, the first pick-up 604 included in the feed portion _ can move along the above path. The first-pick ^ _ will be described in detail below. The introduction lane 51 is used to temporarily store the conductor strip SS before transferring the semiconductor strip ss to the cutting portion. The feeding unit 600 is disposed on one side of the loading unit. The feed section_ contains a feed track 602. The first picker 6〇4 is disposed on the feed track 6〇2 and is movable along the path. The first pick-up device 6〇4 picks up the semiconductor tape placed on the lead-in board, and semi-conducts the semi-conductor on the boat, so that the semiconductor strip can be fed to the chuck unit 7〇8, below The view of the Yanpantai unit will be extensive and detailed. At the same time, a second picker 6〇6 is provided on the feed track 602. The second picker 606 is used to cut the spoiler semiconductor package sp to the cleaning/drying section. The cutting sub-portion 700 and the cleaning/drying section 8A will be described in detail below. A third picker 6 〇 8 is also provided on the feed trajectory 602. The third picker 608 is for feeding the semiconductor sealing sp to the detecting portion from the cleaning/drying portion. 2 32 200822265 The semi-"body π SS entanglement cutting portion 7" is disposed below the center of the feeding portion 600. The detachment table unit view in the tangential setting is set to be along the X-axis disk: ΓΓ. A plurality of half-body ^τ SS to be added are placed on the upper surface of the chuck table unit 702. The chuck stage unit included in the cutting portion 7〇〇 can be processed at a point on the semiconductor strip SS or processed along a straight line or curve on the semiconductor strip SS. The cutting unit 72〇 calibrates itself at the x-axis, the γ-axis, and the θ-angle position. The cutting portion further includes a sensing unit (4) for acquiring a position of the semiconductor device SS to be processed, and sending the detected information to the cutting unit 720, so that the cutting unit 720 The machining position can be calibrated. According to the above configuration, the _ portion becomes a semiconductor package processing device. Further, as shown in "Fig. 14", the chuck included in the chuck stage unit 702 is thinner than the semiconductor strip ss. The chuck table unit 702 further includes a chuck table feeder 71 系 for feeding the chuck table static per-cup table 704 for processing the semiconductor tape % through the cutting unit 72, in the semiconductor strip SS The semiconductor strip SS is sandwiched and supported underneath. The following will be cut. The processing of the unit 720 is described as healthy. Any skilled stomach artisan will appreciate that the chuck table 704 can have any configuration. The chuck table feeder 710 includes: a first feed member 712 for feeding the chuck table 704 in the yaw axis direction; and - second Feed member 714 is used to feed chuck table 704 at gamma axis 33 200822265. The second member 714 is placed orthogonal to the feed track if 602. The second feed, the passus 4, is used to feed the chuck in the gamma axis direction. The first feed member 712 is again placed orthogonal to the second feed member 714. The first feeding member 712 is for feeding the second feeding member 714 in the X-axis direction. The second feed member 714 can include a plurality of feed members that are parallel to each other. In the present example, the 'first-feeder 714' includes a damper member, that is, the second feed member 71 such as the 'second second feed member 714b, the third feed member 714c, and the second and fourth number. Feed member 714d. The cutting unit 72 is disposed above the second feeding member 714 and at the end of the second feeding member 714-. The cutting unit 72 is for processing the semiconductor tape SS placed on each chuck cycle. As far as the cutting unit 720 is concerned, various cutting devices can be applied. As shown in "J-Picture", the cutting unit 72A may include a laser cutting device. Also, as shown in "Fig. 15", the cutting unit 72A may include a blade. The laser cut difficult to contain - mounted on the head of the laser cutting tip (not shown in the attached). The head portion is configured to be movable under the control of reading the X-axis, the γ-axis, and the θ-angle position of the head through the control included in the laser cutting device. The laser cuts the processing of the semiconductor strip ss shown in "Fig. 9". The processing can be performed along curves and lines as shown in "10th to 12th". Of course, the laser cutting device can cut the semiconductor strip ss to make it a separate semiconductor package Sp. Several laser cuts can be applied. Therefore, as shown in the "Figure", the cutting unit 720 can include two cutting units, i.e., a first cutting unit and a second cutting unit 720b. The cutting unit and the second cutting unit 7 are disposed on the second feed, 714. As shown in the "figure 14", the first cutting unit 7 and the cutting unit 720b may be respectively disposed on the second feeding member of the second feeding member No. 3, or respectively disposed on the second feeding member core. No. second feed ^ 714b and fourth number second feed member 714d. The sensing unit 73G is disposed above the second ship member and at the end of the second feed member 714. The sensing unit 73A includes a video capture device 732 for learning the position of the semiconductor tape ss mounted on the chuck table 7〇4, wherein the chuck table and the second feed The member 714 is 视 峨 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Adjustment. Set on top of the feed-reader 714 - the viewfinder 7 is positioned orthogonal to the second feed member ^f34, and then 仟 714 and + 仃 on the first feed member in the 'video capture, please You can move along the video acquirer. In the example, unit 720 can apply various cutting devices. County ^ ‘Lei single TC720 Jian contains—the laser is difficult to set. 35 200822265 Laser cut difficult to contain - mounted on the device (4) The system is configured to be positionally corrected by controlling the head = X axis, Y axis and corner position through the control contained in the pair of cuts (4) The cutting device is used to process the semiconductor strip ss shown in "Fig. 9": = The work can be performed along the curve and the line as shown in "Example" to "12th". The waste box can be disposed at the bottom of the cutting unit 72, and the waste passes through the gravity of the waste to remove the semiconductor strip SS in the cutting portion to make it a scrap of the semiconductor package SP (10). The washing/drying portion is disposed on the side opposite to the loading portion 5' of the feeding portion. The cleaning/drying section includes a first washer/dryer view and a washer/dryer 811. The first washer/dryer is limited to _cleaning/drying area moving. In this region, the diced semiconductor package sp is cleaned and dried. After the cleaning, the drying section _ also includes a washing station _. The cleaning station is equipped with a main "month wash" feed track 805 for movement, and the wash station feed stop 8052 extends longitudinally of the beta wash/dry section. The cleaning station is used to move along the cleaning platform while the semiconductor package is on the clean platform. In the cleaning, the road is equipped with an air nozzle Na. The air jetting chamber uses the air to spray air onto the semiconductor seal I located on the cleaning station to remove impurities on the upper surface of the attached body. Of course, the air shower head 806 can also blow U, , , and two gases to dry the cleaned semiconductor package sp. 36 200822265 The first σ 804 mobile path is also equipped with a water sprinkler 8〇8. The water jet is used to remove the sprayed water from the semiconductor package sp on the cleaning station (4).于, = in the washing path _ the movement path is also configured - the first - brush

。該弟一刷狀物810係用以為清洗台綱上之半導體封裝SP 去除附者於其上表面之雜質。 在第-清洗ϋ/乾燥H 8G1之—側設置—第二清洗職燥器 一卩舰600之第二拾取器、608移動路徑之一侧並位於第 三拾取器·移動路徑下方。該第二清洗器/乾燥器8ιι係用以去 除附著於轉體封裝sp T絲之雜f。 該第二清洗器/乾燥器811包含一第二刷狀物812。該第二刷 狀物812係用以為清洗台8〇4上由第三拾取器饋送之半導體封裝 SP去除附著於其下表面之雜質。 該第二清洗器/乾燥器811還包含一空氣噴嘴813肖一水喷嘴 814，並藉以去除附著於半導體封裝sp下表面之雜質。 於清洗/乾燥部8GG -側設置有―乾燥區（_中未示出）， 即，該乾燥區位於饋送部600之第三拾取器_的移動軌道之一 侧。該乾燥區係用以徹底清除殘留於半導體封裝sp上且未被清洗 /乾燥部800清除之雜質。 設置-檢測部_於饋送部_的第三拾取器_之移動路 徑之-侧。該檢測部900包含：-第-檢測器914，係用以檢測切 37 200822265 割後半導體封裝sp之上表面，以及第二檢測器906，係用以檢測 切割後半導體封裝SP之下表面。 檢測部900還包含一檢測台饋送執道9〇8，該執道配置於饋送 執道602下方且在與其正交之方向上延伸。該檢測部9〇〇進一步 包含一檢測台910,該檢測台910可沿檢測台饋送執道9〇8進行移 動。該檢測部900可放置半導體封裝SP，並沿檢測台饋送執道‘ 饋送該半導體封裝SP。 於檢測台饋送軌道9G8之上設置—監測器第—檢測器饋送軌 道912，該執道在與檢測台饋送執道9〇8正交之方向上延伸。配置 第-檢測器914，使其可在監測器第一檢測器饋送執道912上移 動。該第一檢測器、914係用以檢測位於檢測台91〇 ±之半導體封 裝SP是否存在缺陷。下文將對第二檢測器.進行詳細描述。 於仏泰卩_之-側設置—卸載部95()。該卸載部⑽包含一 卸載器饋送執道松，該執道沿與第一檢測器饋送軌道912平行之 方向延伸。該卸載部950還包含一半導體封震拾取器、954以及一 卸載拾取器956，二者皆可沿該卸載器饋送執道松進行移動。 半導财裝拾取1 954對在檢測台⑽完成檢測之半導體封 裝sp進行拾取，並放置所拾取之半導體封裝sp於輔助台⑽上， 下文將對輔助σ 958進行詳細描述。卸載拾取器956對由第二檢 測器906酬完畢之半導體封裝sp進行拾取，並放置所拾取 導體封裝SP於卸_㈣之魏器烟上。 38 200822265 輔助台958配置於半導體封裝拾取㈣祝與卸载拾取器州 之移動路徑上。該輔助台958係用以暫時存放經第—檢測哭州 檢測後的半導體封裝SP。 〇 第二檢測器906配置於輔助台958之一側。該第二檢 係用以對蝴，_ 914制後鄉崎之下表妓否 存在缺陷進行檢測。 接收器％〇配置於卸载拾取器956路徑了方且平行於辅助台 958。接收器96G中所限定之—空間翻以接收經檢測部_所檢 測之半導體封裝SP。 可以供應轩個魏!！_。雛地，供應兩個接收器_。 即二，卸载部950可包含·· 一接收器_，係用以接收檢測部· 確〜為人扣之半導體封裝sp ’以及另一接收器_，係用以接收 檢測部9GG確認為正品之半導體縣SP。 、同卸載拾取器執道％2用於饋送沿卸載饋送軌道移動之 「載^取„„ 956。具體來說，該卸載拾取器軌道被配置為正交 於卸載_送執道952 ’這樣，該卸載拾取器軌道962便可以沿卸 、貝軌道952移動。該卸載拾取器956可沿卸載拾取器執道 962移動。 绝就疋况’該卸載拾取器956既可以沿卸載器饋送執道952 在X軸方向上運動，又可以沿卸載拾取器執道962在丫轴方向上 移動。 39 200822265 本發明對加^導體帶之第三實施例進行描述。 虽-料體帶被安置於裝載部500之襄載盒502 傳送裝置504可使裝載盒5〇2 盥Π推進益506移動。當裳载盒502 ;=之移動方向對準時，推進器— 進态506之運行，半導體帶ss 器執道605。 破—拾取器_之第一拾取 當半導體帶SS向第—拾取_ 6G5移動時，第—夾持哭 篇拾取半導體帶ss上與推進請相對之一側，并向 錄道推進該半導體帶ss。即，半導體帶ss透過推進器5〇6口盘 弟-夹持器5〇8之合作被放置與第一拾取器執道6〇5上。 當半導體帶ss被放置與第一拾取器執道6〇5上時，第一於取 器6〇4沿饋送部_之第-饋送軌道_多動之切割部7〇〇。_ 弟一拾取器_抵達切割部時，切割部7〇〇之夾盤台观被 放置於第一拾取器604之下。 一之後，第-拾取器6G4放置其所拾取之半導體帶％於爽盤台 早疋702之夾盤台704上，另一半導體帶％被置於失盤台單元 7〇2之另一夾盤台观上。當半導體帶ss以上述方式被置ς夹盤 台早疋702上時’相關置夾盤台7〇4沿第二饋送構件714於 上移動、早田 當失盤台704沿第二饋送構件714於γ軸上移動時，該爽盤 口 7〇4經過傳感單TL 73〇。此時’傳感單元別之視頻獲取器⑽ 200822265 獲取半導體帶位於每-夾盤台704上位置之資訊，并發送該資訊 至切割單元720之控制器。 在接收到上述貧訊後，控制器對切割單元72〇頭部之位置進 行校準。在此情況中，傳感單元73〇對夾盤台7〇4上半導體帶％ 之位置進行檢測，如「第14圖」中所示出，由於構成切割單元第 -與第一蝴單元分別位於二號第二觀構件與四號第二饋 送構件7Hd上方，所以夾盤台7〇4與二號第二饋送構件鳩以 及四號第二饋送構件714d相耦合。 田對位於一旎第一饋送構件714b與四號第二饋送構件 之夾盤台上方的半導體帶ss所進行之切割工序完成時，夹盤台 704沿第-饋送構件712在χ軸方向上移動。而後，一號第= 运構件71½與三號第二舰構件7Me之鍾台被置於切割 720之下方。 干几 至此，在所有夾盤台704上對半導體帶SS的切割進行完畢。 半導體帶SS之切割工序完成後，夹盤台704透過夾盤台饋送 态回到其初始位置。 當所有夹盤台704 _其初始位置時，第二拾取器齡向夹 =台嫌7〇4上方之區域移動，以便向第—清洗器/乾燥_饋送半 SS。隨後’該第二拾取器6〇6拾取經切割後導穿 並放置該半導體封裝於清洗台綱上。 衣 當半導體封顧放置於清洗台8G4時，該清洗台,向清洗/ 41 200822265 乾燥區域8〇2移動。首先，該清洗台綱經過空 去除附著於半導體封裝仰上之雜質。之後，兮、/ 6，错以 喷頭職，藉以透過水對半導體封裝SP進行=Q綱經過水 同時，當第一刷狀物810沿清洗台804之 沿半導體封裝之上表面移動時，該第 、祕即， 導體封裝Wf。 除附著於半 當清洗台綱經過第-刷狀物810時，該清洗台 過水喷頭齡細透過撕半難進辟洗。而射气: 綱再次經過空氣喷頭_，藉以對該半導體封裝進行清洗與月乾燥口。 在清洗台804經過第一清洗器/乾燥器咖後，清洗台购回 到其初始位置。此時，第三拾取器移動至清洗台_之上的 輯。此時，第三拾取1 608運動至清洗台綱上方。隨後，該 第三拾取器_拾取半導體封裝並向第二清洗器/乾燥器811移 動。其:’該第三拾取器608沿饋送軌道6〇2進行移動。在此過 程中，第三拾取器608順序經過第二刷狀物812，空氣喷嘴813 以及水噴嘴814 〇 同時’透過第二清洗器/乾燥器811，半導體封裝81>上之水分 被完全去除。 接下來，第三拾取器608放置該半導體封裝於檢測台91〇上。 當該半導體封裝被放置於檢測台910上時，該檢測台910沿 才双測口饋送執道908移動至第一檢測器914下方之區域。同時， 42 200822265 該第一檢測器914確定放置於檢測台910上的半導體封裝之上表 面是否存在缺陷，並同時沿第一檢測器饋送執道912移動。 在經過第-檢測器914之後，該清洗台_回到其初始位置。 接下來，放置半導體封裝拾取器954拾取清洗纟綱上之半導體 封裝’並在沿卸載器饋送軌道952移動同時饋送該半導體封裝至 輔助台958。 、 當半導體輔助被放置於輔助台958時，域拾取器祝拾取 放置於輔助台958上之半導體封裝並沿卸載器饋送執道952移 動之後該卸載拾取益956沿卸载拾取器軌道％ 檢測器906。 壯該第二檢測器9〇6對經由卸载拾取器牧所拾取至半導體隹 表面進行檢測，藉以確定是料導體之下表面否存名 。然後，該卸載拾取器956沿卸 、、 送該半導體封叙 被放^經由第二檢測^ _物有良晴之半導體封裝 定正品之接收器%。中’此外經由第二檢測_確 中一良子質量之半導體封裝被放置於用於次品之接收器96〇 二;伽明對加工半導體帶之第四實施例進行描述。 圖 乐圖」中所示出對加工半導研器夕〜— 中所示出之半導體帶加工㈣Λ人之相貫施例。「第15 糸、、先包含··—裝載部6100 ,係用以 43 200822265 接收將被加I之工件，並於賴階縣_轉；—购 係用以對職載之王魏行加工； ° 用以清洗賴干加經工叙I件。，湖㈣帽，係 上述裳載部侧包含細目賴盒缝。在每—裝載盒觀 中，依照卡帶盒之形式擺放需要進 ♦ 仃加工之稷數個半導體帶ss。 “、、、’各衣載盒6102中只能擺放—個半導體帶防。 上述裝載部6100還包含一傳送裳置刪，係用以逐一地饋送 第一裝载盒6102。該傳送裳置61〇4可以使用各種驅動系統。較佳 地，傳送裝置6104使用-帶式驅動系統。 一裝载器61Ό5設置於傳送襄置⑽之一端。該裝載器包祕 含一推進器⑽6。該推進器⑽係用以透過在—端推進半導體帶 SS ’從而逐一地移動經由傳送裝置6104送來的裝載盒鑛中所 擺放之半導體帶SS，並使得轉體帶％逐—地安引入執道 6112上。下文將對該引入執道6112做詳細描述。 _裳載益61〇5還包含一夾持器611〇。夾持器611〇被設置於裝 載；6102且與推進器_6相對之一端。因此，當推進器向引入 執道6112推進半導體帶ss之一端時，該夹持器隱拾取並拉動 該半‘體▼ ss之另一端，以使得該半導體帶ss可被輕鬆第饋送。 該裝載态6105還包含一引入執道6112。該引入執道6112被 設置為推進器6106與夾持器6110之移動路徑。該引入執道6112 包含一對執道。該引入執道6112之上可放置一半導體帶ss。 44 200822265 饋送部6200设置為正父與裝載部6100。該饋送部6200係用 以從該裝載部6100饋送半導體帶SS至清洗/乾燥部6400。饋送部 6200包含一饋送軌道6202。第一拾取器6204以及第二拾取器6206 設置與該饋送執道6202上方，以便二者可沿該執道進行移動。 • 較佳地，第一拾取器6204配置與饋送執道62〇2上方與裝載 • °卩6100相鄰處。在該種情況下，第一拾取器6204可輕鬆地對半 導體帶ss騎拾取，並舰辭導體帶ss至下文將加以詳述之 夾盤台6304。 較佳地，第二拾取器6206配置與饋送執道6202上方與清洗/ 乾：^ 6400相鄰處。在該種情況下，第二拾取器6施可輕鬆地 對半導體帶SS進行拾取，並饋送該半導體帶ss至清洗/乾燥部 6400 〇 對各轉體帶SS進行加玉之蝴部漏被設置於饋送執道 6202中央部分之下方。 切割部6300包含夾盤台單元6302，該夾盤台單元6302係可 、=動守在γ軸方向上做水平移動。將要進行加工之一條或多條 SS係固疋於夾盤台單元6302之上表面。該切割部63〇〇 ΓΌ切割單元6320，係用以沿著半導體帶SS上之一直線對 &半‘體I SS進行加工。該蝴單元⑽^係可在X軸方向上 、夕動。勒割部6300進一步包含一傳感單元 6330，係甩以獲取將 卫之轉體帶SS位置之纽並發送侧所得之位置資訊至 45 200822265 夾盤台單元6302及切割單元6320，以使切割單元632〇之加工位 置得以校正。依照上述結構，該切割部構成了一半導體封裝加工 裝置。 誠然，該半導體封裝加工裝置可作為一工件加工裝置而並非 用於半導體帶SS之加工。例如，該加工裝置可用於在一工件上形 成某種標記。 如「第15圖」示出’夾盤台單元63〇2包含夾盤台63〇4，各 夾盤台6304係、用以在一半導體帶^之下對其進行支擇，以及一 夾盤台饋送器6306用以對失盤台63〇4進行饋送。 在透過切』單元6320進行加工作業時，各夾盤台6綱係用 以料體帶ss之下對其進行域。下絲對糊單元咖 f 丁之加工作業加以詳述。本領域之技術人員應當意識到該夾盤 台6304可具有任意結構。 站古夹j口饋㉞6310包含：—第—饋送構件6312,係用以在χ 和 弟—饋迗構件6314，係用以在γ軸方 :二来盤'紙以及多個轉咖 構件63^Μ饋讀件6314配置4正交於舰軌道62G2。第二饋送 件6312細以在¥軸方向上饋送該夾盤台6304，第一饋送構 件6312配置為正交於該筮_ 〃 乐謂运構 用於在χ舳太 、μ —貝迗構件6314。第一饋送構件6312 於在Χ軸方向上饋送第二饋送構件6314。 46 200822265 —第二饋送構件6314可包含若干個平行設置之讀送構件。在本 貫施例中’第二饋送構件6314包含四麵送構件，即，一號第二 饋送構件6314a，二號第二错择堪丛 饋讀件6314b，三號第二饋送構件 6314c以及四號第二饋送構件63i4d。 為每-夾盤台63G4設置轉_件6315，_動構件⑽用 於轉動該夾盤台6304。由於切割單元卿是固定的，所以在切巧 單元綱運行過程中，每一轉動構件6315使與之相關的夹盤台 6304相對與蝴單元632〇進行_。透職方式，可使半導體帶 被加工成各種形狀。 切割單元6320被設置於第二饋送構件6314上方。該切割單 元632〇用於對位於每-夾盤台63〇4上之半導體帶ss進行加工。 對於該切割單元6320而言，可以應用各種切割裝置。在「第 Μ圖」中所示出之本實施例中，該切割單元632〇可包含一刀片。 該刀片用於沿直線對半導體帶％進行加工，如「第u圖」 乂及第12圖」中所不出。誠然，該半導體帶％可被加工成半 導體封裝SP 〇 在第15圖」所示出之實施例中，可應用若干刀片，其中， 兩對刀>1分別應用於第-切割單S 63施與第二切割單元63施。 第一切割單元6320a以及弟二切割單元632〇b設置於第二饋 送齡6314之上方。如「第15圖」所示出，第-切割單元632〇a M及第二切割單元6320b可分別設置於-號第二饋送構件6314a 47 200822265 以及三號第二饋送構件6314c上方，或分別設置於二號第二饋送 構件6314b以及四號第二饋送構件6314d上方。 傳感單元6330設置於第二饋送構件6314上方並位於該第二 饋送構件6314之一端。 該傳感單兀6330包含-視頻獲取器啦，該視頻獲取器6332 用以對安裝於鐘台顯上之铸體帶％之位置進行檢測，其 中，該夾盤台6304與第二饋送構件6314相連接。該視頻獲取器 6332對轉體冑SS之位i進行檢測，並發送所檢測到之位置資 訊至雷射切職置之控㈣（附財未示出），從輯相關爽盤台 6304之Y軸以及θ角位置進行調節，並對相關刀片之χ轴位置進 扞調笳。 I頁獲取執道6334設置於第二饋送構件6314之上，該 視麵取ϋ贿6334正交於第二舰構件㈣且平行於第一 ^ 6312 〇 , 6332 63；4 進行移動。 =洗/乾燥部6400設置於第二拾取器娜之移動路徑上。兮 用於/主貝。一乾燥區6500設置於清洗/乾燥部6400之一側， 用於在_麵部剛讀作絲後，細半 水分等之雜質。^上如 下面，依據本發明之第四實施例對具有上述配置之半導體帶 48 200822265 加工系統進行描述。 當裝載盒_2於推進器嶋至移動方向對準後，該推進哭 6應開始運行。伴隨推進器祕之運行，半導體帶％被移動至 引入執道6112。 當半導體帶SS向引入執道6112移動時，夹持器όη〇拾取半 導體帶SS上於推進器6106相對之一侧，並向引入執道仙推進 該半導體Φ SS。即，伴隨推進器6106以及夹持器611〇之合作， 半導體帶SS被安置於引入執道6112内。 當該半導體帶SS被安置於引入軌道6112内時，第一拾取器 6204沿饋送執道6202移動並拾取安置於引入軌道6112内之半導 體帶SS。該第一拾取器6204放置所拾取之半導體帶^於夾盤台 6304之上，該夾盤台63〇4設置於二號第二饋送構件631413或四號 第二饋送構件6314d上。而後，該第一拾取器6204以相同方式放 置另一半導體帶SS於另一夾盤台6304之上，該另一夾盤台6304 也設置於二號第二饋送構件6314b或四號第二饋送構件6314d 上。誠然，第一拾取器6204也可放置所拾取之半導體帶SS於設 置於一號第二饋送構件6314a或三號第二饋送構件6314c之夾盤 台6304上。 49 200822265 當半導體帶ss被分別安置於與二號第二饋送構件6314b以及 四號第二饋送構件6314d相耦合之夾盤台63〇4之上時，兩個夾盤 台分別沿相應的饋送構件在γ軸上移動。 當夾盤台6304沿Y軸方向進行移動時，兩個缝台經過傳感 單兀633G。此時，傳感單％ 633〇之視頻獲取器㈣獲取關於半 導體帶SS位於運動中每-夾盤台上位置之資訊，並將該資訊送往 切割單元6320之控制器。 該位置貝5fl係透過傳感單凡633〇之視頻獲取器Μ%對半導 體帶SS上某位置上特定標記之位置進行檢測而獲取。基於上述位 置資訊，可以確定半導體帶％之位置。 當接收的上述資訊之後，根據所接收到之資訊該控制器對於 切割單元6320趋#德置叹刀Μ職行校正。在此種狀 況中，如「第15圖」所示出，由於切割單元卿設置於二號第 與四除_件咖之上，所以該傳感 6314d卜Γ衣於一號弟二鎮送構件631扑與四號第二饋送構件 6314d上之夾盤台63G4之位置進行檢測。 同打，當對位於二號第二饋送構件6 一 件6314d上之半導體帶SSiw ”四㈣-饋携 於一梦第一於禮 T 口工時’其他半導體帶％被放置 饋运構件_與三號第二饋送構件6314c上。 6314::位:一諕弟一饋运構件63l4b與四號第二饋送構件 半恤SS板㈣，細：細件㈣ 50 200822265 之各饋达構件同時透過第一饋送構件6312沿X軸進行移動。由 此，一號第二饋送構件6314a與三號第二饋送構件631扣之夾盤 台6304被置於切割單元6320下方。 同樣地，如「第15圖」所示出，透過相關轉動構件6315之 轉動’夾盤台6304上之半導體帶SS被切割成理想之形狀。 在上述方式中，全部夾盤台6304之上的半導體帶％被加工 成半導體_。在對解導鮮ss所進行之_完成之後，夾盤 台6304透過夹盤台饋送器6310被送回初始位置。 當全部夾盤台6304被送回初始位置之後，第二拾取器62〇6 沿饋送執道6202被送至夾盤台雜上方至區域。隨後，該第二 拾取裔6206拾取該半導體封| sp,並饋送其至清洗/乾燥部 6400 〇 在清洗/乾燥部6400中，該半導體封裝sp被清洗並乾燥。透 過叹置於清洗/乾燥部6400 -侧至乾燥1 65〇〇，殘留於該半導體 封裝上之水分被徹底清除。 以下，將依據本發明對第五實施例之半導體帶加工系統之結 果進行詳細描述。 如「第16圖」所示出，該半導體帶加工系統主要包含：一裝 载4 7100 ’係用以裝載半導體帶；一切割_ 73〇〇，係用以把半導 體帶切割絲導體魏域部7_，侧以域該半導體封 衣’以及’-饋送部7200，係用以向裝載部71〇〇以及切割部〇 饋送半導體帶以及向卸載部7400饋送半導體封裝。 $1 200822265 衣載口P 7100包含複數個裝载盒7搬。各裝載盒7观中，依 ”、、卡^之形式紐需要進行加卫之複數辨導體帶。當然， 各裝載盒7102中只能擺放_辨_帶ss。 、人衣載4 71GG還包含-第_傳送裝置7刚。係用以逐一饋送裝 .載凰7102 ’該第一傳送裝置7104可以應用各種驅動系統，較佳 、地該第傳送裝置谓4可以應用帶式驅動系統。 於第-傳运裝置7104之-侧設置一推進器71〇6。該推進器 用於透過在&推進半導體帶％，從而逐一地移動經由第一 傳ϋ衣置71〇4送來的裝載盒？1〇2中所擺放之半導體帶^，並使 料導體帶SS逐-地安置於[拾㈣執道讓上，下文將對 第一拾取器軌道7206加以詳述。 於裝載部7ΐοο之-端設置一饋送部72〇〇。該饋送部72〇〇包 含一饋魏ϋ： 7202以及-第-拾取n 72()4，鱗—拾取器施 被設置為可沿舦概·進行_。職—拾取器7綱逐一 $拾取裝載於裝載部誦中之半導體帶ss，並饋送上述半導體 • ▼ SS至夾盤台7316，下文將對該夾盤台7316進行詳述。 • 該第一拾取器7204包含一第一拾取器軌道7206。該第一拾取 裔執道7206包含-對軌道。當第一拾取器72〇4進行移動時，第 一拾取器執道7206用於放置半導體帶。 第一拾取器7204還包含一第一夾持器72〇8。該第一夾持哭 7208被設置於推進器雇對面。因此，當推進器7祕向第一： 52 200822265 取器執道7206推進一半導體帶％之一側時，該第一夾持器72㈨ 拾取並牽引該半導體帶SS之另一側。 該第一拾取器7204還包含一傳感單元7210。該傳感單元721〇 用於獲取夾盤台7316上半導體帶SS位置之資訊並傳送偵測所得 位置貧訊至切割部7300。下文將對夾盤台7316進行詳細描述。 切割部7300設置於饋送軌道72〇2中央部分之下方。該切割 部7300包含一夾盤台饋送軌道73〇2，該軌道設置為正交於饋送軌 道 7202。 夾盤台單元7304被安裝於夾盤台饋送執道7302之上，這 樣該夾盤台單元7304便可沿該執道進行移動。該夾盤台單元73〇4 包含至少一個夾盤台7316。該夾盤台7316透過夾盤台單元73〇4 被饋送。該夾盤台單元7304還包含一驅動體系（body ) 7306。該 驅動體系7306包含一水平驅動器7308以及一垂直驅動器7310。 該水平驅動器乃08包含一驅動器（如：馬達），用於沿夾盤台讀 送軌道7302水平地移動夾盤台7316。誠然，該水平驅動器73〇8 可設置為能沿夾盤台饋送執道7302在X軸與Y軸兩個方向上移 動夾盤台7316 〇 該垂直驅動器7310包含一垂直滑軌7312。該垂直滑執7312 用於使夾盤台7316在其上垂直移動。相似地，水平驅動器 也包含一垂直驅動器7310。該垂直驅動器7310用於使夾盤台7316 在其上垂直移動。 53 200822265 至少一個支撐台7314配置於垂直滑軌7312之一端，以便其 正交於該垂直滑執7312。該支撐台7314可是夾盤台7316放置於 其上。該支撐台7314可接收垂直驅動器7310,並沿垂直滑軌7312 垂直地進行移動。 在透過切割單元7318進行加工作業時，各夾盤台7316用於 在一半導體帶ss之下對其進行支樓。下文將對切割單元7318進 行之加工作業加以詳述。本領域之技術人員應當意識到該夾盤台 7316可具有任意結構。 可透過一個支撐台7314對若干個夾盤台7316進行支撐。在 本發明所示出之實施例中，兩個夾盤台7316平行第放置於支撐台 7314之上，這樣便可於切割單元7318之數量相匹配，下文將對該 切割單元7318進行詳細描述。 如第17圖」所示出，可以設置一對夾盤台饋送執道。 在這種情況下’可以設置—對趙台單元7綱，使其可分別沿上 =條夾盤台饋送執道73G2進行雜。如上所述，可賜止失盤 口單το 7304在夾盤台之垂直移動中發生相互干擾。為了方便描 述’下文只給出一個切割單元7318。 节切割單元7318配置於夾盤台單元73〇4之上方的一條移動路 徑中’在該路徑延伸方向上，夾盤台單元7期沿夾盤台饋送軌道 7302移動。該蝴單元7318用於蝴位於夾盤台7316之上的 導體帶’峻之絲铸體魏。 54 200822265 對於切割單it測而言，可以翻各種切割裝置。該切割單 兀7318可僅僅包含一雷射切割裝置。同樣，該切割單元測還 可包含-雷射切割裝置以及—刀片。下文僅對包含—雷射切割裝 置之切割單S 7318進行贿。該魏蝴健&含絲於其頂部 之頭部7320。透聽含於該訪_裝置巾之㈣㈣該頭部 7320之X軸、γ軸以及θ角位置進行控制。如「㈣圖」所示 出，該雷射切職置用於沿直線以及轉對半導體帶％進行加 工0 可以應用多個雷射切割裝置，在本實施例中，由於兩個夹盤 台7316平行設置，較佳地應用了兩個雷射切割裝置。 於饋送執道7202上與裝載部71〇〇之相對端設置卸載部 7400。該卸載冑漏&含複數個卸載± 74()2。於各㈣盒糧 中，擺放經加工後之半導體帶ss。當然各卸載盒74〇2中只可擺 放一個半導體帶SS〇 月匕 卸載部7400還包含-第二傳送農置濯，用以逐個饋送各卸 載^7402 ’該第二傳職置·可應用各種驅動系統，較佳地， 該第一傳送裝置7404可應用一帶式驅動系統。 於饋送部72GG之饋送軌道7202上方設置—第二拾取哭。藉 以^取並舨加碰之轉_裝。对二絲錄道^包^ 一第二拾取器執道7214。第二拾取器軌道7214包含一對轨道。該 第二拾取1佩7214鎌在冑沐取!！ 7212鶴触中，在半 55 200822265 導體帶下方對其進行支撐。 一第二失持ϋ而設置於第二拾取雜道心上方。兮 -夾持器咖聽放置錄第二拾取錄道7214 體* 於一卸載盒7402中。 干_體絜 加以=:依據本發明對第五實施例中半導體帶加工系統之運行 當一半導體帶SS被安裳於裳載部之裝載盒雇時， 讀置7104運轉，借以使得該裝载盒彻2運動至第一推進哭 7娜。當該賴盒與第—推進器鳩對準時，第—推進器^ 運轉，，借贱得該裝載盒71G2運動至第—拾取錄道雇。 #該轉體帶SS向第—拾取錄道72G6獅時，第一夾持 ^施拾取轉辭SS上絲—推妓7廳姆之—端，並向 弟-拾取器執道72G6拉動該半導體帶ss。即，透過第一推進哭 雇以及第-夹持器聊之協作，半導體帶％被安置於第一二 取器執道7206上。 口 當半導體帶SS被安置於第一拾取器執道72〇6上時，第一拾 二器7204沿饋送部7200之饋送執道·運動至切割部測噙 γ拾取器7204接近該切割部730〇時，該切割部73〇〇之夹盤： 單元7304被置於第一拾取器72〇4之下方。 隨後，第一拾取器7204放置該半導體帶於夹盤台單元7304 中。當該半導體帶被放置於夾盤台單元7姻_時，第一拾取器 56 200822265 7204之傳感單元721〇被置於夾盤台單元73〇4之下方。 傳感單元7210獲取半導體帶88與夾盤台7316間位置關係之 資訊’並傳送其所獲之資訊至切割部7300。 在接收到上述資訊後，切割部7300根據該資訊對切割單元 7318之頭部732〇之位置進行校準。之後，該夾盤台單元73〇4沿 夾盤台讀送軌道7301運動至切割單元7318下方之一區域。 當夾盤台單元7304位於切割單元7318下方之一區域時，該 切割單元7318於夾盤台單元73〇4之上切割該半導體帶。在半導 體▼切副完畢後，該夾盤台單元73〇4沿夾盤台饋送執道73〇2回 到其初始位置。 虽該夾盤台單元7304回到其初始位置時，第二拾取器7212 運動至夾盤台7316上方一區域。隨後，該第二拾取器7212拾取 加工後至之轉體帶ss，並放置該半導體帶ss於第二拾取器執 道 7214。 口口 當半導體帶SS被放置第二拾取器執道 7214時，第二夾持3 观推動該半導體帶ss使其進入一卸載盒74〇2。當該半導體1 =被置於-卸載盒中時，第二傳送裝置7姻傳送該半㉟ π SS至下-Ρ皆段。由此，依據本發明之半導體帶加工夕_ 作業完畢。^ ^ ^ ^ ^ ^ ^ <加_ 雖然本發明以前述之較佳實施例揭露如上，铁 定本發明，任何孰習減Μ土 士 〜、並非用以朽 彳咖W目像技好，在不脫縣發敗精神和範擇 57 200822265 ur些許之更動觸飾’因此本㈣之專娜護範圍須視 本。兄月曰所附之申請專利範圍所界定者為準。 上述本發明之轉體帶加工系祕具有町功效： 、’由於該半^體^加工系統包含有—具有鐳射切割裝置 之切割單元’故其可辭導體帶進行加工使其成為具有任意形狀 之半導體封裝藉以滿足不同用戶之需求。 同時，由於辭導體帶加工系統另外包含有躲檢測夹盤台 上轉體帶位置之-傳感單S，故可以依據透過該傳感單元獲取 之資訊校準該切割單元之位置，藉以防止有缺陷之產品的產生， 進而提高了成品率。 【圖式簡單說明】 第1圖為本發明之半導體帶加工系統之第—實施例之結構示 意圖； 第2圖至第8圖為第1圖所示之系統進行連續作業之結構示 意圖； 第9獨為依照本發明將被加工之一半導體帶於加工前之狀離 的平面視圖； 〜 第10圖為第9圖所示之半導體帶的切割結構之第一實施例的 平面視圖； 第11圖為第9圖所示之半導體帶的切割結構之第二實施例的 平面視圖； 58 200822265 第12圖為第9圖所示之半導體帶的切割結構之第三實施例的 平面視圖； 第圖為本發明之半導體帶加工系統之第二實施例之結構示 意圖； 意圖； 第14圖為本發明之半導體帶加工系統之第三實施例之結構示 第15圖為本發明之半導體帶加I系統之第 意圖； 第16圖為本發明之半導體帶加工系統之 意圖；以及 四實施例之結構示 弟五實施例之結 構 不 帶加工系統之結構的正視圖 裝载部 裝載盒 第一傳送裝置 裝载器 推進器 第一夾持器 第一轉向軌道 饋送部 饋送轨道 第17圖為本發明之半導體 【主要元件符號說明】 100 、 6100 、 7100 102、502、6102、7102 104、1004、7104 105 、 6105 106 、 6106 、 7106 110、1010、7208 112、1008 200、600、6200、7200 202、602、6202、7202 59 200822265 204、604、6204、7204 206、606、6206、7212 300、700、6300、7300 302、3002、702、6302、7304 304、704、3230、7316、3004 310、710、6310 312、712、6312 314、714、6314 314a、714a、6314a 314b 、 714b 、 6314b 314c、714c、6314c 314d、714d、6314d 320、720、6320、7318 320a、720a、6320a 320b、720b、6320b 330、730、6330、7210 332, 732、6332 334 350、750 400、950、7400 第一拾取器 第二拾取器 切割部 夾盤台單元 夾盤台 夾盤台饋送器 第一饋送構件 第二饋送構件 一號第二饋送構件 二號第二饋送構件 三號第二饋送構件 四號第二饋送構件 切割單元 第一切割單元 第二切割單元 傳感單元 視頻獲取器 視頻獲取器執道 廢料盒 卸載部 卸載器 60 410 200822265 402、4002、7402 卸載盒 404、4004、7404 第二傳送裝置 412 、 4012 第二轉向軌道 414 、 4014 、 7216 弟二爽持為 500 裝載部 504 、 6104 傳送裝置 505 裝載器 506 推進器 508 、 6110 爽持裔 510 引入執道 SS 半導體帶 SP 半導體封裝 1000 第一裝載部 1002 第一裝載盒 1005 第一裝載器 1006 第一推進器 2000 第一饋送部 2002 第一饋送執道 2004 第一拾取器 2006 第二拾取器 3000 第一切割部 61 200822265 3200 3202 3204 3206 3208 3209 3210 3212 3214 3216、608 3218 、 6112 3220 3224 3226 3232 3234 4000 4002 4010 5000 5002 第二切割部 傳送器 第二裝載部 第二裝載盒 第三傳送裝置 第二裝載器 第二推進器 第二饋送部 第二饋送執道 第三拾取器 引入執道 弟二失持恭 刀片單元 旋轉台 第四拾取器 清洗器/乾燥器 第一卸載部 卸載盒 第一卸載器 第二卸載部 乾燥區 62 200822265 5004 第三饋送執道 5006 第五拾取器 5008 裝填區 5010 裝填區饋送執道 5012 第六拾取器 5014 半導體封裝饋送部 5016 半導體封裝饋送執道 5018 半導體封裝拾取器 5020 檢測器 5022、690、960 接收器 5024 接收盤架 5026 接收盤架饋送軌道 605 、 7206 第一拾取器執道 734 、 6334 視頻獲取器執道 800 、 6400 清洗/乾燥部 801 第一清洗器/乾燥器 802 清洗/乾燥區域 804 清洗台 805 清洗台饋送執道 806 空氣喷頭 808 水喷頭 63 200822265 810 第一刷狀物 811 第二清洗器q乞燥器 812 第二刷狀物 813 空氣喷嘴 814 水喷嘴 900 檢測部 906 第二檢測器 908 檢測台饋送執道 910 檢測台 912 第一檢測器饋送執道 914 第一檢測器 952 卸載器饋送軌道 954 半導體封裝拾取器 956 卸載拾取器 958 輔助台 962 卸載拾取器軌道 6315 轉動構件 6500 乾燥區 7214 第二拾取器執道 7302 夾盤台饋送執道 7306 驅動體系 64 200822265 7308 水平驅動器 7310 垂直驅動器 7312 垂直滑執 7320 頭部 65. The brush 810 is used to remove impurities attached to the upper surface of the semiconductor package SP on the cleaning stage. On the side of the first cleaning/drying H 8G1 - the second cleaning dryer is located on the side of one of the second pickers 608 of the ship 600 and below the third picking path. The second washer/dryer 8 ιι is used to remove the miscellaneous f attached to the spT package of the swivel package. The second washer/dryer 811 includes a second brush 812. The second brush 812 is for removing impurities attached to the lower surface of the semiconductor package SP fed by the third pickup on the cleaning stage 8〇4. The second washer/dryer 811 further includes an air nozzle 813, which is used to remove impurities attached to the lower surface of the semiconductor package sp. A "drying zone" (not shown) is provided on the cleaning/drying portion 8GG-side, that is, the drying zone is located on one side of the moving track of the third picker_ of the feeding portion 600. This drying zone serves to thoroughly remove impurities remaining on the semiconductor package sp and not removed by the cleaning/drying section 800. The setting-detecting portion_ is on the side of the moving path of the third pickup_ of the feeding portion_. The detecting portion 900 includes a - detector 914 for detecting the upper surface of the semiconductor package sp after cutting, and a second detector 906 for detecting the lower surface of the semiconductor package SP after cutting. The detecting portion 900 further includes a detecting station feeding lane 9〇8 which is disposed below the feeding lane 602 and extends in a direction orthogonal thereto. The detecting unit 9 further includes a detecting station 910 which is movable along the detecting station feeding lanes 9〇8. The detecting portion 900 can place the semiconductor package SP and feed the semiconductor package SP along the inspection station. Above the test stand feed track 9G8, a monitor-detector feed track 912 is provided which extends in a direction orthogonal to the test stand feed track 9〇8. The first detector 914 is configured to be movable on the monitor first detector feed stop 912. The first detector, 914 is for detecting the presence or absence of a defect in the semiconductor package SP located at the detection stage 91. The second detector will be described in detail below. The unloading section 95() is provided on the side of the 仏 卩 卩. The unloading portion (10) includes an unloader feed, which extends in a direction parallel to the first detector feed track 912. The unloading portion 950 also includes a semiconductor sealed pickup, 954, and an unloading picker 956, both of which are movable along the unloader feed. The semi-conductor pick-up picks up 1 954 for picking up the semiconductor package sp that has been tested at the inspection station (10), and places the picked semiconductor package sp on the auxiliary stage (10), which will be described in detail below. The unloading picker 956 picks up the semiconductor package sp that has been replenished by the second detector 906, and places the picked-up conductor package SP on the unloaded (4). 38 200822265 Auxiliary station 958 is configured on the semiconductor package pick-up (four) and on the moving path of the unloading picker state. The auxiliary station 958 is for temporarily storing the semiconductor package SP after the first detection of the crying state. 〇 The second detector 906 is disposed on one side of the auxiliary station 958. The second inspection system is used to detect defects in the appearance of the butterfly after the _ 914 system. The receiver %〇 is disposed on the path of the unloading picker 956 and is parallel to the auxiliary station 958. The space defined in the receiver 96G is turned over to receive the semiconductor package SP detected by the detecting portion. Can supply Xuan Wei!! _. The chick, supplying two receivers _. In other words, the unloading unit 950 may include a receiver _, which is configured to receive the semiconductor package sp' and the other receiver _, which are used for receiving the detection unit 9GG. Semiconductor County SP. And the unloading picker channel %2 is used to feed the "loading" 956 along the unloading feed track. Specifically, the unloading picker track is configured to be orthogonal to the unloading_delivery 952', The unloading picker track 962 can be moved along the unloading track 952. The unloading picker 956 can be moved along the unloading picker track 962. The unloading picker 956 can either be fed along the unloader 952. Moving in the X-axis direction, it is again possible to move in the direction of the x-axis along the unloading picker track 962. 39 200822265 The present invention describes a third embodiment of the conductor strip. Although the material strip is placed in the loading section The load box 502 of the load box 502 of 500 can move the load box 5〇2 盥Π advance 506. When the moving direction of the load box 502;= is aligned, the pusher-advance state 506 operates, the semiconductor strip ss implements Road 605. Breaking-pickup_first picking When the semiconductor strip SS moves toward the first pick-up _6G5, the first gripping crying picks up the semiconductor strip ss on the opposite side of the advancement, and advances the recording to the recording track Semiconductor strip ss. That is, the semiconductor strip ss through the push The cooperation of the 5th and 6th disc-clamps 5〇8 is placed on the first picker 6〇5. When the semiconductor strip ss is placed on the first picker 6〇5, The first picker 6〇4 is along the first-feed track_multi-moving cutting portion 7〇〇 of the feeding portion_. When the picker_ arrives at the cutting portion, the cutting portion 7 is placed on the chuck table After the first picker 604. After that, the first picker 6G4 places the semiconductor strip that it picks up on the chuck table 704 of the refresher 702, and the other semiconductor strip % is placed on the lost station. The other chuck table of the unit 7〇2 is viewed. When the semiconductor strip ss is placed on the chuck table 702 in the above manner, the associated chuck table 7〇4 moves up along the second feeding member 714, When the early field loss platform 704 moves along the gamma axis along the second feeding member 714, the refreshing port 7〇4 passes through the sensing single TL 73〇. At this time, the sensing unit other video acquirer (10) 200822265 obtains the semiconductor strip The information on the position of each chuck table 704, and sends the information to the controller of the cutting unit 720. After receiving the above-mentioned poor news, the controller pairs the cutting list The position of the head portion of the head is calibrated at 72. In this case, the sensing unit 73 检测 detects the position of the semiconductor strip % on the chuck table 7 〇 4, as shown in "Fig. 14", since the cutting unit is constructed The first and first butterfly units are respectively located above the second second member and the second feed member 7Hd, so that the chuck table 7〇4 is coupled to the second feed member No. 2 and the second feed member 714d. . When the cutting process performed on the semiconductor tape ss located above the chuck table of the first feeding member 714b and the fourth feeding member No. 4 is completed, the chuck table 704 moves in the z-axis direction along the first feeding member 712. . Then, the clock No. 1 of the No. 1 and the No. 3 of the second ship member 7Me is placed below the cutting 720. So far, the cutting of the semiconductor tape SS is completed on all the chuck tables 704. After the cutting process of the semiconductor tape SS is completed, the chuck table 704 is returned to its original position through the chuck table feed state. When all of the chuck tables 704 are in their initial positions, the second picker moves toward the area above the clamps 7 to 4 to feed the first washer/dry_half SS. Subsequently, the second pickup 6 6 picks up the cut-through guide and places the semiconductor package on the cleaning stage. When the semiconductor package is placed on the cleaning table 8G4, the cleaning station moves to the cleaning/41 200822265 drying area 8〇2. First, the cleaning stage is emptied to remove impurities attached to the upper surface of the semiconductor package. After that, 兮, / 6, wrong with the nozzle position, through the water to the semiconductor package SP = Q class through the water while the first brush 810 along the cleaning table 804 along the upper surface of the semiconductor package, the The first and the second, the conductor package Wf. In addition to being attached to the semi-washing stage, the cleaning stage of the water-repellent nozzle is difficult to pass through. And the ejaculation: the culvert again passes through the air nozzle _, thereby cleaning the semiconductor package and the monthly drying port. After the cleaning station 804 passes the first washer/dryer, the cleaning station is purchased back to its original position. At this time, the third pickup moves to the top of the cleaning table. At this time, the third pick 1 608 moves to the top of the washing table. Subsequently, the third picker_ picks up the semiconductor package and moves to the second washer/dryer 811. It: 'The third picker 608 moves along the feed track 6〇2. In this process, the third picker 608 sequentially passes through the second brush 812, the air nozzle 813 and the water nozzle 814 〇 simultaneously 'through the second washer/dryer 811, and the moisture on the semiconductor package 81> is completely removed. Next, the third picker 608 places the semiconductor package on the detection stage 91A. When the semiconductor package is placed on the inspection station 910, the inspection station 910 moves along the dual gauge feed 908 to the area below the first detector 914. At the same time, 42 200822265 the first detector 914 determines whether there is a defect on the surface of the semiconductor package placed on the inspection station 910 and simultaneously moves along the first detector feed lane 912. After passing through the first detector 914, the cleaning station _ returns to its initial position. Next, the semiconductor package picker 954 is placed to pick up the semiconductor package ' on the cleaning chip' and move along the unloader feed track 952 while feeding the semiconductor package to the auxiliary stage 958. When the semiconductor auxiliary is placed on the auxiliary station 958, the domain picker wishes to pick up the semiconductor package placed on the auxiliary stage 958 and move along the unloader feed track 952 after the unloading pick 956 along the unloading picker track % detector 906 . The second detector 9〇6 is detected by picking up the surface of the semiconductor wafer via the unloading picker, to determine whether the surface under the conductor is not named. Then, the unloading picker 956 unloads, and sends the semiconductor package to be discharged via the second detection device. In addition, the semiconductor package of the good quality is placed in the receiver 96 for the defective product via the second detection, and the fourth embodiment of the processing semiconductor strip is described by GM. The semiconductor strip processing (four) shown in Fig. Illustrated in the processing of the semi-conductor is shown in the figure. "The 15th 、, 、···································································································· In order to clean the Laijiajiagong, I have a piece of work. The lake (four) cap, which is on the side of the above-mentioned dressing, contains a box of seams. In each view of the loading box, it is required to be placed in the form of a cassette. A plurality of semiconductor strips ss. ",,,," can only be placed in each of the clothes-loading boxes 6102 - a semiconductor strip. The loading unit 6100 further includes a transfer tray for feeding the first loading cassette 6102 one by one. The transmission skirt 61〇4 can use various drive systems. Preferably, the conveyor 6104 uses a belt drive system. A loader 61Ό5 is disposed at one end of the transfer device (10). The loader package contains a pusher (10) 6. The pusher (10) is used to push the semiconductor strip SS' at the end to move the semiconductor strip SS placed in the loading cassette ore sent through the conveying device 6104 one by one, and to introduce the swivel belt % by way. On the road 6112. The introduction of the road 6112 will be described in detail below. _Shang Zaiyi 61〇5 also contains a gripper 611〇. The holder 611 is disposed at the loading; 6102 and opposite one end of the pusher_6. Therefore, when the pusher advances one end of the semiconductor strip ss toward the lead-in path 6112, the holder picks up and pulls the other end of the half-body ▼ ss so that the semiconductor strip ss can be easily fed. The load state 6105 also includes an incoming track 6112. The introduction lane 6112 is set as a moving path of the pusher 6106 and the gripper 6110. The referral road 6112 contains a pair of obscurities. A semiconductor strip ss can be placed over the lead-in circuit 6112. 44 200822265 The feeding unit 6200 is provided as a parent and a loading unit 6100. The feeding portion 6200 is for feeding the semiconductor tape SS from the loading portion 6100 to the cleaning/drying portion 6400. The feed portion 6200 includes a feed track 6202. The first picker 6204 and the second picker 6206 are disposed above the feed track 6202 so that both can move along the way. • Preferably, the first picker 6204 is disposed adjacent to the loading lane 62〇2 and adjacent to the loading • ° 6100. In this case, the first picker 6204 can easily pick up the semiconductor strip ss, and the conductor strips ss to the chuck table 6304 which will be described later in detail. Preferably, the second picker 6206 is disposed adjacent to the feed lane 6202 and the cleaning/drying: ^ 6400. In this case, the second pickup 6 can easily pick up the semiconductor tape SS, and feed the semiconductor tape ss to the cleaning/drying portion 6400, and the sliders of the respective swivel ribbons SS are set. Below the central portion of the feed lane 6202. The cutting portion 6300 includes a chuck table unit 6302 that is horizontally movable in the γ-axis direction. One or more SS systems to be processed are fixed to the upper surface of the chuck table unit 6302. The cutting portion 63 ΓΌ ΓΌ dicing unit 6320 is for processing the &semi-body I SS along a straight line on the semiconductor strip SS. The butterfly unit (10) can be moved in the X-axis direction. The cutting unit 6300 further includes a sensing unit 6330 for acquiring the position information of the SS position of the swivel swivel belt and transmitting the position information to the 45 200822265 chuck table unit 6302 and the cutting unit 6320 to make the cutting unit. The machining position of 632〇 was corrected. According to the above configuration, the cutting portion constitutes a semiconductor package processing apparatus. It is true that the semiconductor package processing apparatus can be used as a workpiece processing apparatus and not for the processing of the semiconductor strip SS. For example, the processing apparatus can be used to form a mark on a workpiece. As shown in Fig. 15, the chuck unit 63〇2 includes a chuck table 63〇4, and each chuck table 6304 is used to support a semiconductor tape and a chuck. The stage feeder 6306 is used to feed the lost table 63〇4. When the machining operation is performed by the cutting unit 6320, each of the chuck tables 6 is used to perform the field under the material belt ss. The lower wire is detailed for the processing of the paste unit. Those skilled in the art will appreciate that the chuck table 6304 can have any configuration. The station ancient folder j port feed 346310 comprises: a first feeding member 6312, which is used for the χ and —-feeding member 6314, for the γ-axis: two-disk 'paper and a plurality of coffee-making members 63 ^ The feedforward reader 6314 configuration 4 is orthogonal to the ship track 62G2. The second feeding member 6312 is thinned to feed the chuck table 6304 in the direction of the ¥ axis, and the first feeding member 6312 is configured to be orthogonal to the 筮 〃 运 music for the χ舳 、, μ 迗 迗 member 6314 . The first feeding member 6312 feeds the second feeding member 6314 in the z-axis direction. 46 200822265 - The second feed member 6314 can include a plurality of readout members disposed in parallel. In the present embodiment, the 'second feed member 6314 includes a four-sided feed member, that is, the second feed member No. 6314a, the second second wrong guide member 6314b, the third feed member 6314c and the fourth No. second feeding member 63i4d. A rotary member 6315 is provided for each chuck table 63G4, and the movable member (10) is used to rotate the chuck table 6304. Since the cutting unit is fixed, each of the rotating members 6315 causes the chuck table 6304 associated therewith to be _ with respect to the butterfly unit 632 在 during the operation of the cutting unit. The through-the-shelf method allows the semiconductor tape to be processed into various shapes. The cutting unit 6320 is disposed above the second feeding member 6314. The cutting unit 632 is used to process the semiconductor strip ss located on each of the chuck stages 63〇4. For the cutting unit 6320, various cutting devices can be applied. In the embodiment shown in the "figure map", the cutting unit 632 can include a blade. The blade is used to process the semiconductor ribbon % along a straight line, as shown in "Fig. u" and "12". It is true that the semiconductor strip % can be processed into a semiconductor package SP. In the embodiment shown in Fig. 15, a plurality of blades can be applied, wherein two pairs of knives > 1 are applied to the first-cut single S 63 It is applied with the second cutting unit 63. The first cutting unit 6320a and the second cutting unit 632〇b are disposed above the second feeding age 6314. As shown in FIG. 15, the first-cutting unit 632〇a M and the second cutting unit 6320b may be respectively disposed above the -number second feeding members 6314a 47 200822265 and the third feeding member 6314c, or separately. Above the second feed member 6314b and the second feed member 6314d. The sensing unit 6330 is disposed above the second feeding member 6314 and at one end of the second feeding member 6314. The sensing unit 6330 includes a video acquirer 6332 for detecting the position of the casting belt % installed on the clock head, wherein the chuck table 6304 and the second feeding member 6314 Connected. The video acquirer 6332 detects the position i of the swivel 胄 SS, and sends the detected position information to the control of the laser cut position (4) (not shown), and the Y of the related refreshing table 6304 The axis and the θ angular position are adjusted and the χ position of the relevant blade is adjusted. The I page acquisition lane 6334 is disposed above the second feed member 6314 which is orthogonal to the second ship member (4) and parallel to the first ^ 6312 〇 , 6332 63; 4 for movement. The washing/drying portion 6400 is disposed on the moving path of the second picker Na.兮 For / main shell. A drying zone 6500 is provided on one side of the washing/drying section 6400 for impurities such as fine moisture and the like after the _ face has just been read as a yarn. As described below, a semiconductor tape 48 200822265 processing system having the above configuration will be described in accordance with a fourth embodiment of the present invention. When the loading box 2 is aligned in the direction of movement of the pusher, the advance cry 6 should start running. With the operation of the propeller, the semiconductor strip % is moved to the lead 6112. When the semiconductor strip SS is moved toward the lead-in path 6112, the gripper όn picks up the semiconductor strip SS on the opposite side of the pusher 6106 and advances the semiconductor Φ SS toward the lead. That is, with the cooperation of the pusher 6106 and the holder 611, the semiconductor tape SS is placed in the introduction lane 6112. When the semiconductor strip SS is placed in the lead-in rail 6112, the first picker 6204 moves along the feed lane 6202 and picks up the semiconductor strip SS disposed in the lead-in rail 6112. The first picker 6204 places the picked semiconductor tape on the chuck table 6304, and the chuck table 63〇4 is disposed on the second number second feed member 631413 or the fourth number second feed member 6314d. Then, the first pickup 6204 places another semiconductor tape SS on the other chuck table 6304 in the same manner, and the other chuck table 6304 is also disposed on the second feed member 6314b or the second feed No. 4 On member 6314d. It is true that the first picker 6204 can also place the picked semiconductor tape SS on the chuck table 6304 provided on the first feed member 6314a or the second feed member 6314c. 49 200822265 When the semiconductor strips ss are respectively disposed on the chuck table 63〇4 coupled to the second feed member 6314b and the second feed member 6314d, the two chuck tables are respectively along the respective feed members Move on the γ axis. When the chuck table 6304 is moved in the Y-axis direction, the two slit stations pass through the sensing unit 633G. At this time, the video receiver (4) of the sensing unit % 633 obtains information about the position of the semiconductor strip SS on each chuck table in motion, and sends the information to the controller of the cutting unit 6320. The position 5fl is obtained by detecting the position of a specific mark on a position on the semiconductor strip SS through the sensor Μ% of the 633〇 video acquirer. Based on the above position information, the position of the semiconductor strip % can be determined. After receiving the above information, the controller calibrates the cutting unit 6320 according to the received information. In this case, as shown in "Fig. 15", since the cutting unit is placed on the second and fourth divisions, the sensor 6314d is sent to the first member of the second town. The position of the 631 flap and the chuck table 63G4 on the fourth feed member 6314d is detected. The same as the hit, when the semiconductor strip SSiw "four (four) - feed on the second feed member 6 of the second feed member 6 on the 6314d is carried in a dream first, the other semiconductor strip % is placed in the transport member _ and No. 3 on the second feeding member 6314c. 6314:: position: one brother-one feeder member 63l4b and the fourth member of the fourth feeding member half-shirt SS board (four), fine: fine pieces (four) 50 200822265 each of the feeding members simultaneously through the A feeding member 6312 is moved along the X-axis. Thereby, the first feeding member 6314a of the first feeding member 6314a and the third feeding member 631 are placed under the cutting unit 6320. Similarly, as shown in Fig. 15. As shown, the semiconductor strip SS on the chuck table 6304 which is rotated by the rotation of the associated rotating member 6315 is cut into a desired shape. In the above manner, the semiconductor ribbon % over all of the chuck stages 6304 is processed into a semiconductor_. After the completion of the unwinding of the fresh ss, the chuck table 6304 is returned to the initial position by the chuck table feeder 6310. After all of the chuck stages 6304 are returned to the initial position, the second picker 62 〇 6 is fed along the feed path 6202 to the area above the chuck table. Subsequently, the second pick-up 6206 picks up the semiconductor package | sp and feeds it to the cleaning/drying section 6400 〇 in the cleaning/drying section 6400, which is cleaned and dried. The water remaining on the semiconductor package is completely removed by sighing on the side of the cleaning/drying section 6400 to dryness of 65 〇〇. Hereinafter, the results of the semiconductor tape processing system of the fifth embodiment will be described in detail in accordance with the present invention. As shown in Fig. 16, the semiconductor tape processing system mainly comprises: a loading 4 7100 ' for loading a semiconductor strip; and a cutting _ 73 〇〇 for cutting a semiconductor strip with a wire conductor. 7_, the semiconductor sealing 'and'-feeding portion 7200 is used to feed the semiconductor tape to the loading portion 71 and the cutting portion 以及 and to feed the semiconductor package to the unloading portion 7400. $1 200822265 The clothesport P 7100 contains a plurality of loading boxes 7 to move. In each of the loading boxes 7, in the form of "," and "card", it is necessary to carry out the identification of the plurality of conductor strips. Of course, each loading box 7102 can only be placed in the _ discriminating_band ss. The first transmission device 7104 can be used to apply the various transmission systems. Preferably, the first transmission device 4 can apply a belt drive system. A pusher 71〇6 is disposed on the side of the first transport device 7104. The pusher is used to move the load cassette sent through the first transfer device 71〇4 one by one by pushing the semiconductor tape % at the & The semiconductor strips placed in 1〇2 are placed, and the material conductor strips SS are placed one by one on the [Pickup (four) obedience. The first picker rail 7206 will be described in detail below. On the loading section 7ΐοο- The end is provided with a feeding portion 72. The feeding portion 72 includes a feeding device: 7202 and - a - picking n 72 () 4, and the scale-pickup device is set to be performed along the line. - the pickup 7 is picked up one by one to pick up the semiconductor strip ss loaded in the loading section, and feeds the above semiconductors. The table 7316, which will be described in detail below. • The first picker 7204 includes a first picker track 7206. The first picking path 7206 includes a pair of tracks. When the first picker When the movement is 72〇4, the first picker lane 7206 is used to place the semiconductor strip. The first picker 7204 further includes a first gripper 72〇8. The first grip cry 7208 is set to be employed in the pusher Opposite, therefore, when the pusher 7 is secretly first: 52 200822265 The picker 7206 advances one side of a semiconductor strip %, the first gripper 72 (9) picks up and pulls the other side of the semiconductor strip SS. The first pick-up 7204 further includes a sensing unit 7210. The sensing unit 721 is configured to acquire the information of the position of the semiconductor strip SS on the chuck table 7316 and transmit the detected position information to the cutting portion 7300. The disk table 7316 is described in detail. The cutting portion 7300 is disposed below the central portion of the feed track 72A. The cutting portion 7300 includes a chuck table feed track 73A2 that is disposed orthogonal to the feed track 7202. The stage unit 7304 is mounted on the chuck table feed Above the road 7302, the chuck table unit 7304 can be moved along the way. The chuck table unit 73〇4 includes at least one chuck table 7316. The chuck table 7316 passes through the chuck table unit 73. The chuck unit 7304 further includes a drive body 7306. The drive system 7306 includes a horizontal driver 7308 and a vertical driver 7310. The horizontal driver 08 includes a driver (eg, a motor) for The chuck table 7316 is horizontally moved along the chuck table read track 7302. It is true that the horizontal drive 73〇8 can be configured to move the chuck table 7316 in both the X-axis and the Y-axis along the chuck table feed lane 7302. The vertical driver 7310 includes a vertical slide rail 7312. The vertical slip 7312 is used to move the chuck table 7316 vertically thereon. Similarly, the horizontal drive also includes a vertical drive 7310. The vertical drive 7310 is used to move the chuck table 7316 vertically thereon. 53 200822265 At least one support table 7314 is disposed at one end of the vertical slide rail 7312 so as to be orthogonal to the vertical slide 7312. The support table 7314 can be on which the chuck table 7316 is placed. The support table 7314 can receive the vertical drive 7310 and move vertically along the vertical slide 7312. When performing a processing operation through the cutting unit 7318, each of the chuck stages 7316 is used to carry out a branch under a semiconductor strip ss. The processing of the cutting unit 7318 will be described in detail below. Those skilled in the art will appreciate that the chuck table 7316 can have any configuration. A plurality of chuck stages 7316 can be supported by a support table 7314. In the illustrated embodiment of the invention, the two chuck stages 7316 are placed in parallel on the support table 7314 so that the number of cutting units 7318 can be matched, as will be described in more detail below. As shown in Fig. 17, a pair of chuck table feeding lanes can be provided. In this case, 'can be set' - to the Zhaotai unit 7 class, so that it can be performed separately along the upper = bar chucking station 73G2. As described above, it is possible to give a mutual interruption to the vertical movement of the chuck table το 7304 in the vertical movement of the chuck table. For convenience of description, only one cutting unit 7318 is given below. The section cutting unit 7318 is disposed in a moving path above the chuck table unit 73〇4. In the path extending direction, the chuck stage unit 7 moves along the chuck table feeding track 7302. The butterfly unit 7318 is used to slap the conductor strip of the wire on the chuck table 7316. 54 200822265 For cutting single-test, it is possible to turn various cutting devices. The cutting unit 7318 can include only one laser cutting device. Also, the cutting unit can include a - laser cutting device and a blade. Only the cutting list S 7318 containing the laser cutting device will be bribed below. The Wei Huajian & contains a head 7320 on top of it. The X-axis, the γ-axis, and the θ-angle position of the head 7320 included in the (4) and (4) of the access device are controlled. As shown in the "(4) diagram", the laser cutting service is used to process the semiconductor tape along the straight line and the turning. 0 A plurality of laser cutting devices can be applied. In this embodiment, two chuck tables 7316 are used. Parallel settings, preferably two laser cutting devices are applied. An unloading portion 7400 is provided on the opposite end of the feeding path 7202 from the loading portion 71A. The unloading leak & contains a plurality of unloading ± 74 () 2 . In each (4) box of grain, the processed semiconductor strip ss is placed. Of course, only one semiconductor strip SS can be placed in each of the unloading boxes 74〇2, and the second unloading unit 7400 further includes a second transfer farmer for feeding each unloading ^7402 'the second transfer position·applicable Various drive systems, preferably, the first conveyor 7404 can be applied to a belt drive system. A second picking cry is provided above the feeding track 7202 of the feeding portion 72GG. By taking ^ and 舨 舨 之 _ _ 。. For the second wire recording ^ package ^ a second picker road 7214. The second picker track 7214 includes a pair of tracks. The second pick 1 Pei 7214 镰 胄 胄 !!! The 7212 crane hits and supports it under the conductor belt in the half 55 200822265. A second misalignment is disposed above the second picking pass.兮 - The gripper is placed in the second pick-up track 7214 body* in a unloading box 7402. Dry _ body 絜 =: According to the present invention, the operation of the semiconductor tape processing system in the fifth embodiment is performed when a semiconductor tape SS is mounted on the loading box of the carrying portion, and the reading 7104 is operated, thereby making the loading Box Che 2 moves to the first to push to cry 7 Na. When the cartridge is aligned with the first pusher ,, the first pusher ^ is operated, and the load box 71G2 is moved to the first pick-up. #转转带SS to the first pick-up record 72G6 lion, the first grip ^ Shi pick the transfer of the SS on the silk - push the 7 Hall - the end, and the brother-picker 72G6 pull the semiconductor With ss. That is, through the cooperation of the first advance crying and the first-gripper chat, the semiconductor tape % is placed on the first two-passer road 7206. When the semiconductor tape SS is placed on the first picker path 72〇6, the first picker 7204 moves along the feeding portion 7200 to move to the cutting portion 噙γ picker 7204 to approach the cutting portion 730. At the time of 〇, the cutting portion 73 is chucked: the unit 7304 is placed below the first picker 72〇4. Subsequently, the first picker 7204 places the semiconductor tape in the chuck stage unit 7304. When the semiconductor strip is placed on the chuck stage unit 7, the sensing unit 721 of the first picker 56 200822265 7204 is placed below the chuck stage unit 73〇4. The sensing unit 7210 acquires the information 'the positional relationship between the semiconductor tape 88 and the chuck table 7316' and transmits the information obtained thereto to the cutting portion 7300. Upon receiving the above information, the cutting unit 7300 calibrates the position of the head 732 of the cutting unit 7318 based on the information. Thereafter, the chuck table unit 73A moves along the chuck table read rail 7301 to an area below the cutting unit 7318. When the chuck table unit 7304 is located in a region below the cutting unit 7318, the cutting unit 7318 cuts the semiconductor tape over the chuck table unit 73A4. After the semiconductor body ▼ is cut, the chuck table unit 73〇4 is returned to its initial position along the chuck table feed lane 73〇2. While the chuck table unit 7304 is returned to its initial position, the second picker 7212 moves to an area above the chuck table 7316. Subsequently, the second picker 7212 picks up the processed swivel tape ss and places the semiconductor tape ss on the second picker pass 7214. Port When the semiconductor tape SS is placed on the second picker path 7214, the second pinch 3 pushes the semiconductor tape ss into an unloading box 74〇2. When the semiconductor 1 = is placed in the unloading box, the second conveyor 7 transmits the half 35 π SS to the lower - Ρ section. Thus, the semiconductor tape processing according to the present invention is completed. ^ ^ ^ ^ ^ ^ ^ <Additional _ Although the present invention has been disclosed above in the preferred embodiment of the foregoing, it is determined that the invention is reduced in any way, and is not used to defeat the singer and the singer. Choose 57 200822265 ur a little more moving touches 'Therefore, the scope of this (four) special care must be seen. The scope of the patent application scope attached to the brother-in-law is subject to the definition. The above-mentioned swivel belt processing system of the present invention has the effect of the town: "Because the half-body processing system includes a cutting unit having a laser cutting device", the vocal conductor strip is processed to have an arbitrary shape. Semiconductor packages are used to meet the needs of different users. At the same time, since the conductor strip processing system additionally includes a sensing unit S for hiding the position of the swivel belt on the chuck table, the position of the cutting unit can be calibrated according to the information obtained through the sensing unit, thereby preventing the defect. The production of the product, which in turn increases the yield. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of a first embodiment of a semiconductor tape processing system of the present invention; and FIGS. 2 to 8 are schematic structural views of a system for performing continuous operation according to FIG. 1; A plan view of a semiconductor which is processed before being processed in accordance with the present invention; FIG. 10 is a plan view showing a first embodiment of the cutting structure of the semiconductor strip shown in FIG. 9; Fig. 12 is a plan view showing a third embodiment of the cutting structure of the semiconductor strip shown in Fig. 9; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 14 is a structural view showing a third embodiment of a semiconductor tape processing system of the present invention. FIG. 15 is a semiconductor tape plus I system of the present invention. 16 is a view of the semiconductor tape processing system of the present invention; and the structure of the fourth embodiment shows the structure of the fifth embodiment without the processing system. a conveyor loader thruster first gripper first steering track feed section feed track FIG. 17 is a semiconductor of the present invention [main component symbol description] 100, 6100, 7100 102, 502, 6102, 7102 104, 1004 , 7104 105 , 6105 106 , 6106 , 7106 110 , 1010 , 7208 112 , 1008 200 , 600 , 6200 , 7200 202 , 602 , 6202 , 7202 59 200822265 204 , 604 , 6204 , 7204 206 , 606 , 6206 , 7212 300 , 700, 6300, 7300 302, 3002, 702, 6302, 7304 304, 704, 3230, 7316, 3004 310, 710, 6310 312, 712, 6312 314, 714, 6314 314a, 714a, 6314a 314b, 714b, 6314b 314c, 714c, 6314c 314d, 714d, 6314d 320, 720, 6320, 7318 320a, 720a, 6320a 320b, 720b, 6320b 330, 730, 6330, 7210 332, 732, 6332 334 350, 750 400, 950, 7400 first picker Second picker cutting portion chuck table unit chuck table chuck table feeder first feeding member second feeding member No. 1 second feeding member No. 2 second feeding member No. 3 second feeding member No. 4 second feeding member Cutting unit first cut Cutting unit second cutting unit sensing unit video acquirer video acquirer obsolete waste box unloading unit unloader 60 410 200822265 402, 4002, 7402 unloading box 404, 4004, 7404 second conveyor 412, 4012 second steering track 414 4014, 7216 Brothers 2 is 500 Loader 504, 6104 Transfer 505 Loader 506 Pusher 508, 6110 Cool 510 Introducing SS Semiconductor Strip SP Semiconductor Package 1000 First Loader 1002 First Load Box 1005 First loader 1006 first pusher 2000 first feed portion 2002 first feed channel 2004 first picker 2006 second picker 3000 first cut portion 61 200822265 3200 3202 3204 3206 3208 3209 3210 3212 3214 3216, 608 3218 , 6112 3220 3224 3226 3232 3234 4000 4002 4010 5000 5002 second cutting portion conveyor second loading portion second loading box third conveying device second loading device second pushing device second feeding portion second feeding way third picking Introduced the disciples, the two lost, the Knife blade unit, the rotary table, the fourth picker, the washer/dryer An unloader unloading box first unloader second unloading section drying zone 62 200822265 5004 third feeding channel 5006 fifth picker 5008 loading area 5010 loading area feeding channel 5012 sixth pickup 5014 semiconductor package feeding part 5016 semiconductor package Feed Channel 5018 Semiconductor Package Picker 5020 Detector 5022, 690, 960 Receiver 5024 Receive Shelf 5026 Receive Shelf Feed Track 605, 7206 First Picker Cue 734, 6334 Video Acquirer Road 800, 6400 Cleaning / Drying section 801 First washer/dryer 802 Cleaning/drying area 804 Cleaning station 805 Cleaning station feeding channel 806 Air head 808 Water head 63 200822265 810 First brush 811 Second washer q dryer 812 Second Brush 813 Air Nozzle 814 Water Nozzle 900 Detection Section 906 Second Detector 908 Detection Station Feed Channel 910 Detection Table 912 First Detector Feed Erosion 914 First Detector 952 Unloader Feed Track 954 Semiconductor Package Pickup 956 Unloading Picker 958 Auxiliary Table 962 Unloading Picker Track 6315 Rotating Structure 6500 Drying Zone 7214 Second Picker Road 7302 Chuck Table Feeding Road 7306 Drive System 64 200822265 7308 Horizontal Drive 7310 Vertical Drive 7312 Vertical Slip 7320 Head 65

Claims (1)

200822265 十、申請專利範圍： 1· 一種加工設備，係包含： 失盤台單元，係包含兩個可單獨地沿γ軸移動並可同時 沿X軸移動之夾盤台；以及 、 一切割單元，係用以分別對固定於夾盤台上之卫件進行加 • 種加工设備，係包含： 、—失盤台單元，係包含四個可單獨地沿γ轴移動並可同時 沿X軸移動之夾盤台；以及 兩個切割單元，係用以對固定於第-及第三夾盤台上之工 件進行加卫或_定於第二及第四缝台上之工件^亍加工 ^申請專利細第1項或第2項所述之加卫設備，係進-步包200822265 X. Patent application scope: 1. A processing equipment, comprising: a loss table unit, comprising two chuck tables which can be moved separately along the γ axis and can be moved along the X axis at the same time; and a cutting unit, It is used to separately add processing equipment to the guards fixed on the chuck table. The system includes: - a loss table unit, which includes four units that can be separately moved along the γ axis and can be moved along the X axis at the same time. a chucking table; and two cutting units for reinforcing the workpieces fixed on the first and third chuck tables or for the workpieces on the second and fourth seaming stations Patented item 1 or 2 of the escort equipment, is a step-by-step package 4· ▲仏測單元係用以獲取各工件位置之資訊，並發送該資 訊至相關的切割單元，該檢測單元係包含：—視頻獲取器，係 用以獲取各工件之位置資訊，以及一視頻獲取器轨道，係甩以 使該視頻獲取器沿著該視頻獲取器執道運動。 如申請專利範圍第1 台單元係包含： 項或第2項所述之加玉設備，其中該炎盤 所述各夾盤台，係用以支撐該半導體帶； 第饋C構件，係用以在χ車由方向上馈送所述各夹盤 台；以及 66 200822265 一第二饋職件’ _以在Y财向上饋送所述各炎盤 台 5. 如申請專利範圍第丨項或第2項所述之加工設備，其中各爽盤 台係可旋轉360度。 6. 如申請專利範圍第1項或第2項所述之加工設備，其中該失盤 台單元係包含： 所述各夾盤台，係用以支撐該半導體帶； 一垂直驅動11 ’係肋使所述各㈣台垂直移動；以及 一水平驅糖，_以使所述各缝台水平移動。 7· —種半導體帶加工系統，係包含： 一裝載部，係用以接收複數個半導體帶； 一切割部，係包含如申請專利範圍第1項或第2項所 加工設備； ^ 卸载部，係用以接收所述各半導體帶加 工 之半導體封裝； 完畢後所生成 並^^送部’係用以拾取所述各半導體帶或該半導體封裝， 之料體帶辭紐雜线钱部、該切割部 8. 一種铸體帶加m係包含： 第—襞载部’係用以接收複數個半導體帶. ★ 1割部，係包含有如中請專利範圍帛i項或第2項 67 200822265 所述之加工設備； 一第一卸载部，係用以接收在該第一 之所述各半導體帶； ㈣部中加工完畢後 一饋送部’伽以拾取所述各半導體帶，並饋送所拾取之 半導體帶至該第-裝載部、該第一切割部或該第一卸載部. 各料t裝載部’係用以接收從該第一卸載部所卸載之所述 所、t、各:;，係包含·—旋轉台’係在該旋轉台上放置 所述各丰導體帶，以及一第二切 1 體帶進行加工使之成為半时封I;'、収對所述各半導 一檢測部，伽讀測在該第二蝴部中加 體封裝是否存在缺陷； 玍成之+V 封裝載部，係用以接收經過該檢測部檢測後之半導體 傳送态，係用以在該第一卸载部 送所述各半導體帶。 丨，、知—喊部之間饋 9. 如^請專利朗第8項所述之半導體帶加m㈣第— 切副部之切割單域包含—靖切割n ” 元係包含一刀片。 並且該弟二切割單 10. 如申請專利範圍第8項所述之半導體帶加工***，其中 該第-切割部進-步包含—傳感單元，伽叫取該半導 68 200822265 體帶位於各夾盤台上的位置之資訊；以及 該第-切割部係用以接收來自該傳感單元之資訊，並且對 該第-切割部之切割單元對該半導體帶之加工位置進行校準。 H.如申請專纖圍第8項所述之轉體帶加1_，其中該第二 切割部係包含： 該旋轉台，在織射上放置麵述各半導鮮，並且該 旋轉台可在旋轉時在γ軸方向上進行移動；以及 一刀片’係可圍繞該旋轉台在丫轴方向上移動。 12· 一半導體帶加工系統，係包含： 裝載部，係用以接收複數個半導體帶· 如申請專利細第1項或第2項所述I加工設備； -清洗/絲部’係用崎洗及乾騎述各轉體帶經加工 後所生成之半導體封裝； —檢測部，伽以檢酿清域乾燥後之轉體 存在缺陷； 一域部’侧以接收經過檢測之半導體封裝，·以及 ，一饋送部’係用以拾取所述各半導體帶或半導體封裝，並 ^所拾取之错歸或轉體解姻輯部、該加工設 脊該清洗/乾燥部、該檢測部或該卸载部。 13·如申請專利範圍第7 之 部係包含： 體抑工糸統，其中該裝載 69 200822265 衣载盒，係用以堆疊所述各半導體帶； -傳送裝置，制崎送絲餘； 述各:轉動透過該傳送裝置所〜 帶至娜謝物繼各半導趙 其中’該卸載部係包含： 送部過切― 2载盒，係用以堆疊經過切割之所述各半導體帶； 傳运裳置，係用以傳送該卸载倉；以及 -夾持器，係用以傳送該第二轉 割的所述各铸畴卸載盒。 ㉞之經過切4· ▲ The measurement unit is used to obtain the information of each workpiece position, and send the information to the relevant cutting unit. The detection unit includes: a video acquirer for acquiring position information of each workpiece, and a video The acquirer track is tuned to cause the video acquirer to move along the video acquirer. The first unit of the patent application scope includes: the jade device according to the item or the item 2, wherein the chuck table is used to support the semiconductor strip; and the feeding C member is used for Feeding the chuck tables in the direction of the brakes; and 66 200822265 a second feed member ' _ to feed the respective disk trays in the Y financial direction. 5. If the patent application is the second item or the second item The processing apparatus, wherein each of the refreshing tables is rotatable by 360 degrees. 6. The processing apparatus of claim 1 or 2, wherein the loss table unit comprises: the chuck stations for supporting the semiconductor strip; and a vertical drive 11' rib The four (four) stages are vertically moved; and a horizontally driven sugar is moved to cause the respective sewing stations to move horizontally. A semiconductor strip processing system comprising: a loading portion for receiving a plurality of semiconductor strips; a cutting portion comprising a processing device as claimed in claim 1 or 2; And a semiconductor package for processing the semiconductor strips; and the generated portion is used to pick up the semiconductor strips or the semiconductor package, and the material body has a word line Cutting portion 8. A casting belt plus m system includes: a first-stage carrier portion for receiving a plurality of semiconductor strips. ★ 1 cutting portion, which includes a patent scope 帛i item or a second item 67 200822265 a processing device; a first unloading portion for receiving the semiconductor strips in the first portion; after processing in the (four) portion, a feeding portion 'gathering to pick up the semiconductor strips and feeding the picked ones The semiconductor is brought to the first loading portion, the first cutting portion or the first unloading portion. The material t loading portion ' is for receiving the unloading, the t, and the: from the first unloading portion; The system contains a rotating table that is attached to the The plurality of conductive conductor strips are placed on the stage, and a second cut 1 body strip is processed to be a half-time seal I; ', the semi-conductive ones are received, and the gamma is read in the second mat Whether the medium package is defective or not; the +V package carrier is configured to receive the semiconductor transfer state detected by the detecting portion, and is configured to send the semiconductor strips at the first unloading portion.丨,,知—, 喊 部 9 9 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体The semiconductor tape processing system of claim 8, wherein the first cutting portion further comprises a sensing unit, and the gamma is called the semiconductive 68 200822265 body belt is located in each chuck Information of the position on the stage; and the first cutting portion is configured to receive information from the sensing unit, and the cutting unit of the first cutting portion aligns the processing position of the semiconductor strip. The swivel belt of the item 8 is added to the first section, wherein the second cutting section comprises: the rotating table, the semi-conducting surface is placed on the woven fabric, and the rotating table can be rotated on the γ axis. Moving in the direction; and a blade' is movable around the rotating table in the direction of the x-axis. 12. A semiconductor tape processing system comprising: a loading portion for receiving a plurality of semiconductor strips I processing according to item 1 or item 2 - cleaning / wire section is a semiconductor package produced by processing each of the swivel belts after the soaking and dry riding; - the detecting part, the gamma is used to detect defects in the swath after drying in the clear field; 'Side to receive the tested semiconductor package, and a feed portion' for picking up the respective semiconductor strips or semiconductor packages, and picking up the wrong or swivel solution portion, the processing ridge a cleaning/drying section, the detecting section or the unloading section. 13. The section of the seventh aspect of the patent application includes: a body-inhibiting system, wherein the loading 69 200822265 is used to stack the semiconductor strips. - Transfer device, sakisaki wire feed; Description: Rotate through the conveyor device ~ Take the Na Xie object followed by each semi-guided Zhao where 'the unloading department contains: the delivery part overcut - 2 boxes, used The stacked semiconductor strips are stacked; the transporting skirts are used to transport the unloading bins; and the holders are used to transport the second ingot-cutting domain unloading boxes. Cut through
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