TW200821355A - Poly(arylene ether) composition, method and article - Google Patents

Poly(arylene ether) composition, method and article Download PDF

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TW200821355A
TW200821355A TW96131713A TW96131713A TW200821355A TW 200821355 A TW200821355 A TW 200821355A TW 96131713 A TW96131713 A TW 96131713A TW 96131713 A TW96131713 A TW 96131713A TW 200821355 A TW200821355 A TW 200821355A
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composition
poly
ether
weight
epoxy resin
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TW96131713A
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TWI422644B (en
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Hua Guo
Edward N Peters
Erik R Delsman
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Gen Electric
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Priority claimed from US11/532,135 external-priority patent/US20080071035A1/en
Priority claimed from US11/532,146 external-priority patent/US20080071036A1/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A curable composition includes an epoxy resin and a bifunctional poly(arylene ether) having an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. After curing, the composition exhibits markedly improved impact strength relative to a corresponding composition prepared from monofunctional poly(arylene ether). The composition is particularly useful for preparing electronic laminates, prepregs, and circuit boards.

Description

200821355 九、發明說明: 【先前技術】 環氧樹脂為被使用於極多種應用中古 <回性能材料,包括 保護性塗料、黏著劑、電子層板(譬如用於制&命 X , ;衣k龟腦電路板 =)、地板與铺面應用、玻璃纖維補㈣件及汽車零件(包 括葉片彈簧、泵及電器組件)。以環氧樹脂之經熟化形式, 其係提供期望之性質,包括對其他材料之良好黏著性、對 腐餘與化學品之優越抵抗性、高抗張強度及良好電阻。與 使用環氧樹脂有關聯之兩項挑戰是經熟化環氧樹脂之脆 度,及必須將許多可熟化環氧組合物加熱至足以製備與接 合及使彼等成形,但不至於使彼等過早地熟化。 關於環氧樹脂之脆度問題,已知添加聚(㈣基謎)至環 乳樹脂中會增加經熟化組合物之Μ。例如,頒予Hallgren 等人之美國專利4,912,172係描述一種組合物,其包含具有數 目平均分子量至少約聊之聚苯醚,與環氧基材料選自 包括雙紛化合物之至少一種多縮水甘油鍵,該多縮水甘油 醚具有每分子平均至多一個脂族經基,及主要量之多縮水 甘油醚與車乂 J里之至少一種芳基單縮水甘油基鍵類及非雙 酚性多環氧基化合物之組合。但是,需要相對較高溫度, 以形成聚苯醚與環氧樹脂之均勻混合物。 作為另項貫例,頒予Tracy等人之美國專利5,834,565係描 述種、、且口物’其包含具有數目平均分子量為每莫耳小於 ^克之水苯喊,與可為環氧樹脂之熱固性樹脂。聚苯醚 係顯不在可熟化組合物中之經改良溶解度。但是,在使此 123165 200821355 不如以較高分子量聚苯醚 等組合物熟化時所獲得之產物並 所製成者一樣具韌性。 作為又另一項實例,頒予Davis等 卞八 < 果國專利7,022,777 B2係描述一種組合物’其包含聚(伸芳基醚)、熱固性樹脂、 韋刃化劑及胺熟化劑。但是’高溫似乎料使聚料溶解所 需要。因此’在實例1與2中,可孰於 τ 』热化組合物係部份藉由在 160°C下添加聚(伸芳基鱗)至環氢谢日匕你 ;衣乳树月日與聚乙烯醇縮丁醛之200821355 Nine, invention description: [Prior Art] Epoxy resin is used in a variety of applications in the Middle Ages &Back; performance materials, including protective coatings, adhesives, electronic laminates (such as used in the production & life X; k Turtle brain circuit board =), floor and paving applications, fiberglass (four) parts and automotive parts (including leaf springs, pumps and electrical components). In the matured form of the epoxy resin, it provides desirable properties including good adhesion to other materials, superior resistance to corrosion and chemicals, high tensile strength and good electrical resistance. Two of the challenges associated with the use of epoxy resins are the brittleness of the cured epoxy resin, and many of the matured epoxy compositions must be heated enough to make and join and shape them, but not to have them Early ripening. Regarding the brittleness of the epoxy resin, it is known that the addition of poly((tetra)-based mystery) to the cyclic latex resin increases the enthalpy of the aged composition. For example, U.S. Patent No. 4,912,172 to Hallgren et al., which is incorporated herein by reference, which is incorporated herein by reference in its entirety in its entirety in its entirety in its entirety the entire disclosure the disclosure the disclosure of The polyglycidyl ether has an average of at most one aliphatic radical per molecule, and a major amount of polyglycidyl ether and at least one aryl monoglycidyl linkage and non-bisphenolic polyepoxy in the ruthenium J A combination of base compounds. However, relatively high temperatures are required to form a homogeneous mixture of polyphenylene ether and epoxy resin. U.S. Patent No. 5,834,565, to the name of U.S. Patent No. 5,834,565, the disclosure of which is incorporated herein by reference in its entirety in its entire entire entire entire entire entire entire entire entire disclosure . The polyphenylene ether exhibits improved solubility in the curable composition. However, the product obtained when the 123165 200821355 is not as mature as the composition of the higher molecular weight polyphenylene ether is as flexible as the one produced. As yet another example, Davis et al., et al., U.S. Patent 7,022,777 B2, describes a composition which comprises a poly(aryl ether), a thermosetting resin, a sizing agent, and an amine curing agent. But 'high temperatures seem to be needed to dissolve the polymer. Therefore, in Examples 1 and 2, the composition of the heating composition can be partially increased by adding poly(extended aryl scales) to the hydrogen ring at 160 ° C; Polyvinyl butyral

摻合物中而製成。 因此,包含聚(伸彡基喊)與環氧樹月旨之已知▼熟化組合 物係顯示在製備㈣性與經熟化產物勃性之間呈現交換。 當採用高分子量聚(伸芳基醚)時’經熟化產物係極具韌性, 但需要高溫以使聚(伸芳基⑷溶解於環氧樹脂中。另一方 面,當採用低分子量聚(伸芳基…時,可使聚(伸芳基鍵) 在較低溫度下溶解於環氧樹财,但於經熟化產物中發現 韌性上之較小改良。 仍然需要可熟化環氧組合物’其可在低溫下加工處理, 而於热化後又極端地韌性(較不具脆性)。 【發明内容】 上述及其他缺點係藉由—種可熟化組合物而被減輕,該 組合物包含··環氧樹脂;冑官能性聚(伸芳基_),在氯仿 中於25 C下度ϊ,具有本性黏度為每克約〇 〇3至約〇·2公合; =有效使環氧樹脂熟化量之熟化促進劑;I中熟化後之組 口物係顯不無切口 Izod衝擊強度至少5%大於具有單官能性 ♦(伸芳基醚)之相應組合物,其中無切口 衝擊強度係於 123165 200821355 25C下,根據ASTMD4812度量。 項具體實施例為可熟化組合物,其包含:環氧樹脂; 雙“&性聚(伸芳基醚),在氯仿中,於25。。下度量,具有本 性黏度為每克_3至約0·2公合,·有效使環氧樹脂熟化量 之熟化促進劑;選用之約2至約5〇重量百分比之填料,以組 :物,總重量為基準;及選用之添加劑,選自染料、顏料、 著色d、抗氧化劑、熱安定劑、光安定劑、增塑劑、潤滑 ^ /瓜動改質劑、滴液阻滯劑、阻燃劑、結塊防止劑、抗 f電劑、流動促進劑、加工助劑、基材黏著劑、脫模劑、 韌化劑、低分佈形態添加劑、應力緩和添加劑及其組合; 其中熟化後之組合物係顯示無切口 Iz〇d衝擊強度至少5%大 於具有單g能性聚(伸芳基醚)之相應組合物,其中無切口 Izod衝擊強度係於25。〇下根據ASTM m812度量。 另一項具體實施例為可熟化組合物,其包含:雙酚A二 縮水甘油基醚環氧樹脂;雙官能性聚(伸芳基醚),在氯仿Made from the blend. Thus, the known compounding system comprising poly(extension) and epoxy tree is shown to exhibit an exchange between the preparation (tetra) and the ripening product. When high molecular weight poly(alkylene ether) is used, the cured product is extremely tough, but high temperature is required to dissolve the poly(aryl) (4) in the epoxy resin. On the other hand, when low molecular weight poly(stretch) is used In the case of an aryl group, a poly(arylene bond) can be dissolved in an epoxy resin at a lower temperature, but a minor improvement in toughness is found in the cured product. There is still a need for a curable epoxy composition. It can be processed at a low temperature and is extremely tough (less brittle) after heating. SUMMARY OF THE INVENTION The above and other disadvantages are alleviated by a curable composition comprising a ring Oxygen resin; 胄 functional poly(arylene), ϊ in chloroform at 25 C, with a natural viscosity of about 3 to about 〇 2 gram per gram; = effective curing of epoxy resin The ripening accelerator; the ripened group of I in the ripened Izod impact strength of at least 5% is greater than the corresponding composition having a monofunctional ♦ (aryl ether), wherein the non-notched impact strength is at 123165 200821355 Under 25C, measured according to ASTM D4812. For example, a curable composition comprising: an epoxy resin; a double "& poly(extended aryl ether), in chloroform, at 25 Å, having a viscosity of from _3 to about 0 per gram. 2 public, · curing agent for effectively curing the epoxy resin; about 2 to about 5 weight percent of the filler is selected, based on the group: total weight; and the selected additive is selected from the group consisting of dyes and pigments , coloring d, antioxidants, thermal stabilizers, light stabilizers, plasticizers, lubrication ^ / melon modifiers, drop retarders, flame retardants, agglomeration inhibitors, anti-electric agents, flow promotion Agent, processing aid, substrate adhesive, mold release agent, toughening agent, low-distribution form additive, stress relieving additive and combinations thereof; wherein the matured composition exhibits no-insert Iz〇d impact strength of at least 5% greater than A corresponding composition having a single g-energetic poly(aryl ether) wherein the uncut Izod impact strength is at 25. The underarm is measured according to ASTM m812. Another specific embodiment is a curable composition comprising: Phenol A diglycidyl ether epoxy resin; bifunctional poly(aryl) Ether) in chloroform

其中各存在之X係獨立為1至約20 ;及有效使環氧樹脂熟化 量之熟化促進劑;其中熟化後之組合物係顯示無切口 Iz〇d 衝擊強度5至約50%大於具有單官能性聚(伸芳基醚)之相應 123165 200821355 、、且s物其中無切口 Izod衝擊強度係於25°C下根據ASTM D4812度量。 另一項具體實施例為可熟化組合物,其包含:雙酚A二 縮水甘油基醚環氧樹脂;雙官能性聚(伸芳基醚),在氯仿 中’於25°C下度量,具有本性黏度為每克約〇〇3至約〇·2公Each of the X-forms present independently is from 1 to about 20; and a curing accelerator effective to cure the epoxy resin; wherein the aged composition exhibits no-cut Iz〇d impact strength of 5 to about 50% greater than monofunctional Corresponding 123165 200821355 of the poly(triaryl ether), and the sig-free Izod impact strength of the sigma was measured at 25 ° C according to ASTM D4812. Another embodiment is a curable composition comprising: bisphenol A diglycidyl ether epoxy resin; a bifunctional poly(aryl ether), measured in chloroform at 25 ° C, The viscosity of the nature is about 〇〇3 to about 〇·2 gram per gram.

其中各存在之X係獨立為丨至約2〇 ;有效使環氧樹脂熟化量 之熟化促進劑;選用之約2至約5〇重量百分比之填料,以組 合物之總重量為基準;及選用之添加劑,選自染料、顏料、 著色劑、抗氧化劑、熱安定劑、光安定劑、增塑劑、潤滑 劑、流動改質劑、滴液阻滞劑、阻燃劑、結塊防止劑、抗 靜電劑、流動促進劑、加工助劑、基材黏著劑、脫模劑、 韌化劑、低分佈形態添加劑、應力緩和添加劑及其組合; 其中熟化後之組合物係顯示無切口 Iz〇d衝擊強度5至約5〇〇/〇 大於具有單官能性聚(伸芳基醚)之相應組合物,其中無切 口 Izod衝擊強度係於25°C下根據ASTMD4812度量。 另一項具體實施例為可熟化組合物,其包含:約6〇至約 90重量份數之雙齡A二縮水甘油基醚環氧樹脂;約1〇至約 40重s伤數之雙官能性聚(伸芳基醚),在氯仿中,於下 度S ’具有本性黏度為每克約〇 〇6至約0.12公合,其中聚(伸 123165 200821355Each of the X groups present independently is about 2 〇; a curing accelerator effective to make the epoxy resin ripening amount; about 2 to about 5 重量% by weight of the filler is selected, based on the total weight of the composition; The additive is selected from the group consisting of dyes, pigments, colorants, antioxidants, thermal stabilizers, light stabilizers, plasticizers, lubricants, flow modifiers, drop retarders, flame retardants, agglomeration inhibitors, Antistatic agent, flow promoter, processing aid, substrate adhesive, mold release agent, toughening agent, low distribution form additive, stress relieving additive and combinations thereof; wherein the matured composition shows no cut Iz〇d The impact strength of 5 to about 5 Å/〇 is greater than the corresponding composition having a monofunctional poly(arylene ether) wherein the uncut Izod impact strength is measured at 25 ° C according to ASTM D4812. Another embodiment is a curable composition comprising: from about 6 Torr to about 90 parts by weight of a two-year old A diglycidyl ether epoxy resin; a bifunctional from about 1 Torr to about 40 s s. Poly((aryl ether)), in chloroform, has a natural viscosity of about 6 to about 0.12 gram per gram in the lower S', where poly(Extension 123165 200821355

Γ3 )=Γ3)=

Η CH3Η CH3

其中各存在之χ係獨立為i至約2〇;及約〇·5至約ι〇重量份數 之乙醯基丙酮酸鋁其中所有重量份數係以鹏重量份 數全部環氧樹脂與雙官能性聚(伸芳基醚)為基準;其中雙 酚Α二縮水甘油基醚環氧樹脂與雙官能性聚(伸芳基醚)於 25至65 C下係以單相存在;其中可熟化組合物於25。〇下係具 有黏度低於或等於10,000厘泊;其中熟化後之組合物係顯示 無切口 Izod衝擊強度5至約5〇%大於具有單官能性聚(伸芳 基醚)之相應組合物,其令無切口 Iz〇d衝擊強度係於251下 根據ASTM D4812度量;且其中熟化後之組合物係顯示切口 Izod衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之 相應組合物,其中切口izod衝擊強度係於25。〇下根據astm D256度量。 另一項具體實施例為組合物,其包.含··約6〇至約9〇重量 份數之雙酚A 一縮水甘油基醚環氧樹脂;約1〇至約仞重量 份數之雙官能性聚(伸芳基醚),在氯仿中,於25。〇下度量, 具有本性黏度為每克約〇·〇6至約0J2公合,其中聚(伸芳美 醚)係具有以下結構 1 123165 -10- 200821355Each of the lanthanum is independently from i to about 2 〇; and about 5 to about ι 重量 parts by weight of aluminum acetyl acetonate, wherein all parts by weight are in parts by weight of the total epoxy resin and double Based on a functional poly(alkylene ether); wherein the bisphenol quinone diglycidyl ether epoxy resin and the bifunctional poly(arylene ether) are present in a single phase at 25 to 65 C; The composition is at 25. The underarm has a viscosity of less than or equal to 10,000 centipoise; wherein the aged composition exhibits a non-notched Izod impact strength of from 5 to about 5 % by weight greater than a corresponding composition having a monofunctional poly(aryl ether), The non-notched Iz〇d impact strength is measured at 251 according to ASTM D4812; and wherein the aged composition exhibits a cut Izod impact strength of from 5 to about 30% greater than a corresponding combination of monofunctional poly(strandyl ether) The incision izod impact strength is at 25. His Majesty is measured according to the astm D256. Another embodiment is a composition comprising from about 6 to about 9 parts by weight of bisphenol A monoglycidyl ether epoxy resin; from about 1 Torr to about 仞 by weight Functional poly(alkylene ether) in chloroform at 25. The underarm measurement has a natural viscosity of about 〇·〇6 to about 0J2, and the poly(strife) has the following structure: 1 123165 -10- 200821355

’、人。此丨土 ♦ 方I醚)為基準;其中熟 化後之組合物係顯示無切口 Iz〇d衝擊強度5至約腦大於具 有早官能性聚(伸芳基鱗)之相應組合物,其中無切口編衝 擊強度係於25°C下根據ASTM D4812度量;且其中熟化後之 組合物係顯示切口 Izod衝擊強度5至約3〇%大於具有單官能 ι±聚(伸芳基醚)之相應組合物,其中切口 衝擊強度係於 25°C下根據ASTM D256度量。 另一項具體實施例為可熟化組合物,其包含··約6〇至約 90重里份數之雙酴a二縮水甘油基醚環氧樹脂;約至約 40重量份數之雙官能性聚(伸芳基醚),在氯仿中,於乃它下 度量,具有本性黏度為每克約〇·〇6公合,其中聚(伸芳基醚) 123165 -11 - 200821355 係具有以下結構',people. The alumina ♦ square I ether) is used as a reference; wherein the matured composition exhibits an incision-free Iz〇d impact strength of 5 to about a brain greater than a corresponding composition having an early functional poly(arylene-based scale), wherein no incision The impact strength is measured at 25 ° C according to ASTM D4812; and wherein the aged composition exhibits a cut Izod impact strength of 5 to about 3 % by weight greater than a corresponding composition having a monofunctional i-type (polyaryl ether) Where the notched impact strength is measured at 25 ° C according to ASTM D256. Another embodiment is a curable composition comprising from about 6 Torr to about 90 parts by weight of biguanide diglycidyl ether epoxy resin; from about 40 parts by weight of bifunctional poly (Aryl ether), measured in chloroform, under the ruthenium, has a natural viscosity of about 6 gram per gram, wherein poly(strandyl ether) 123165 -11 - 200821355 has the following structure

之乙醯基丙酮酸鋁(III);其中雙酚A二縮水甘油基醚環氧樹 脂與雙官能性聚(伸芳基醚)於25至65°C下係以單相存在;其 中所有重量份數係以1〇〇重量份數全部環氧樹脂與雙官能 性聚(伸芳基鱗)為基準;其中熟化後之組合物係顯示無切 口 Izod衝擊強度5至約50%大於具有單官能性聚(伸芳基醚) 之相應組合物,其中無切口 Izod衝擊強度係於25〇c下根據 ASTM D4812度量;且其中熟化後之組合物係顯示切口 衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之相應 組合物,其中切口Izod衝擊強度係於25它下根據astm D256 度量。 另一項具體實施例為可熟化組合物,其包含··約6〇至約 90重量份數之雙酚A二縮水甘油基醚環氧樹脂;約1〇至約 40重量份數之雙官能性聚(伸芳基醚),在氯仿中,於25。〇下 度量,具有本性黏度為每克約0.09公合,其中聚(伸芳基鱗) 係具有以下結構 123165 -12- 200821355Aluminum (III) acetyl phthalate; wherein the bisphenol A diglycidyl ether epoxy resin and the bifunctional poly(aryl ether) are present in a single phase at 25 to 65 ° C; The number of parts is based on 1 part by weight of all epoxy resin and bifunctional poly(arylene based scale); wherein the aged composition shows no incision Izod impact strength of 5 to about 50% greater than monofunctional a corresponding composition of a poly(n-aryl ether) wherein the uncut Izod impact strength is measured at 25 ° C according to ASTM D4812; and wherein the aged composition exhibits a notched impact strength of from 5 to about 30% greater than having a single A corresponding composition of a functional poly(arylene ether) wherein the notched Izod impact strength is at 25 Measured according to astm D256. Another embodiment is a curable composition comprising from about 6 Torr to about 90 parts by weight of bisphenol A diglycidyl ether epoxy resin; from about 1 Torr to about 40 parts by weight bifunctional Poly((aryl ether)), in chloroform, at 25. The underarm measurement has a natural viscosity of about 0.09 metric gram per gram, of which the poly(extension aryl scale) has the following structure 123165 -12- 200821355

其中各存在之X係獨立為i至約2〇 ;及約〇·5至約1〇重量份數 , 之乙醯基丙酮酸鋁(III);其中雙酚人二縮水甘油基醚環氧樹 V 脂與雙官能性聚(伸芳基醚)於25至65°c下係以單相存在;其 _ 中所有重蓋伤數係以1〇〇重量份數全部環氧樹脂與雙官能 性聚(伸芳基醚)為基準;其中熟化後之組合物係顯示無切 口 Izod衝擊強度5至約5〇%大於具有單官能性聚(伸芳基醚) 之相應組合物,其中無切口 Iz〇d衝擊強度係於25<t下根據 ASTM D4812度量;且其中熟化後之組合物係顯示切口 衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之相廡 組合物,其中切口Izod衝擊強度係於25。(:下根據ASTM D256 度量。 • 另一項具體實施例為可熟化組合物,其包含:約6〇至約 90重量份數之雙酚A二縮水甘油基醚環氧樹脂;約川至約 40重量份數之雙官能性聚(伸芳基醚),在氯仿中,於25。〇下 , 度量’具有本性黏度為每克約〇·12公合,其中聚(伸芳基醚) 係具有以下結構Each of the X groups present independently is from i to about 2 Å; and from about 5 to about 1 part by weight, the aluminum (III) acetyl phthalate; wherein the bisphenol diglycidyl ether epoxy tree V fat and bifunctional poly(aryl ether) are present as a single phase at 25 to 65 ° C; all of the heavy-coverages in _ are all epoxy resin and bifunctional in 1 part by weight The poly(arylene ether) is used as a reference; wherein the aged composition exhibits a non-cut Izod impact strength of 5 to about 5 % by weight, and a corresponding composition having a monofunctional poly(aryl ether), wherein no slit Iz The 〇d impact strength is measured according to ASTM D4812 at 25<t; and wherein the aged composition exhibits a notched impact strength of from 5 to about 30% greater than a phase composition having a monofunctional poly(arylene ether), The impact Izod impact strength is at 25. (: Lower according to ASTM D256. • Another specific embodiment is a curable composition comprising: from about 6 〇 to about 90 parts by weight of bisphenol A diglycidyl ether epoxy resin; about Chuan to about 40 parts by weight of the difunctional poly(aryl ether) in chloroform at 25 〇, measured as having a viscosity of about 12 Å per gram, wherein the poly(aryl ether) system Has the following structure

123165 -13- 200821355 其中各存在之x係獨立為1至約20 ;及約〇·5至約1〇重量份數 之乙醯基丙酮酸鋁(ΙΠ);其中雙酚八二縮水甘油基醚環氧樹 脂與雙官能性聚(伸芳基醚)於25至65°C下係以單相存在;其 中所有重量份數係以1〇〇重量份數全部環氧樹脂與雙官能 性聚(伸芳基醚)為基準;其中熟化後之組合物係顯示無切 口 Izod衝擊強度5至約5〇%大於具有單官能性聚(伸芳基醚) 之相應組合物,其中無切口 Izod衝擊強度係於25£>c下根據 ASTM D4812度量;且其中熟化後之組合物係顯示切口 衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之相應 組合物,其中切口Iz〇d衝擊強度係於25〇c下根據astmd256 rfr θ 度ϊ 〇 另一項具體實施例為一種製備可熟化組合物之方法,其 包括:將環氧樹脂,在氯仿中於25°C下度量具有本性黏度 為每克約0.03至約〇·2公合之雙官能性聚(伸芳基_),及有效 使環氧樹脂熟化量之熟化促進劑摻合;其中熟化後之組合 物係顯示無切口 Izod衝擊強度至少5%大於具有單官能性聚 (伸芳基醚)之相應組合物,其中無切口 Iz〇d衝擊強度係於b °C下根據ASTM D4812度量。 其他具體實施例,包括經由使可熟化組合物熟化而製成 之經熟化組合物,及包含該經熟化組合物之物件,係詳細 地描述於下文。 發明詳述 本案發明人已進行關於可熟化聚(伸芳基醚)組合物之研 九,以努力突破在可熟化組合物中之聚(伸芳基醚)溶解度 123165 -14- 200821355 對所形成經熟化樹脂韋刃度之先前限制。在此研究過程中, I案發日月人已發現利料有特定經基官能基與肖定分子量 之聚(伸芳基醚)樹脂,聚(伸芳基醚)在可熟化組合物中之溶 解度可經改良,而不會犧牲熟化後組合物中之韌度。或者, • 熟化後組合物之韌度可經改良,而不會犧牲聚(伸芳基醚) . 纟可熟化組合物中之溶解度。目此,一項具體實施例為可 熟化組合物,其包含:環氧樹脂;雙官能性聚(伸芳基醚), • 在氯仿中,於25°C下度量,具有本性黏度為每克約0.03至約 〇·2公合,及有效使環氧樹脂熟化量之熟化促進劑;其中熟 化後之組合物係顯示無切口 Izod衝擊強度至少5%大於具有 單官能性聚(伸芳基醚)之相應組合物,其中無切口 Iz〇d衝擊 強度係於25°C下根據ASTM D4812度量。 關於個別聚(伸芳基醚)分子,,,雙官能性,,一詞係意謂該 分子包含兩個酚性羥基。關於聚(伸芳基醚)樹脂,,,雙官能 性” 一詞係意謂該樹脂包含每聚(伸芳基醚)分子平均約Μ 馨至約2.4個酚性羥基。在一些具體實施例中,雙官能性聚(伸 芳基醚)係包含每聚(伸芳基醚)分子平均約u至約2·2個酚 性羥基。 如上述’热化後之組合物係顯示無切口 Iz〇d衝擊強度至 ~ 少5%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25 C下根據ASTM D4812度量。廉明 瞭的是’”具有單官能性聚(伸芳基醚)之相應組合物”係指 製自可熟化組合物之相應經熟化組合物,其中相同本性黏 度之單官能性聚(伸芳基醚)係用以取代雙官能性聚(伸芳基 123165 -15· 200821355 醚)。在一些具體實施例中,無切口 Iz〇d衝擊強度係為5至 約50%大於具有單官能性聚(伸芳基醚)之相應組合物。關於 個別聚(伸芳基醚)分子,"單官能性,,一詞係意謂該分子包 含一個紛性經基。關於聚(伸芳基醚)樹脂,"單官能性”一 詞係意謂該樹脂包含每聚(伸芳基醚)分子平均約〇·8至約 1 ·2個紛性經基。123165 -13- 200821355 wherein each x is independently from 1 to about 20; and from about 5 to about 1 part by weight of aluminum acetylacetonate (ruthenium); wherein bisphenol octahydroglycidyl ether The epoxy resin and the bifunctional poly(arylene ether) are present in a single phase at 25 to 65 ° C; wherein all parts by weight are all epoxy resin and bifunctional poly(1 part by weight) Based on the aryl ether); wherein the aged composition exhibits a non-cut Izod impact strength of 5 to about 5 % by weight greater than a corresponding composition having a monofunctional poly(aryl ether), wherein the non-cut Izod impact strength The formula is based on ASTM D4812; and wherein the aged composition exhibits a notched impact strength of from 5 to about 30% greater than a corresponding composition having a monofunctional poly(aryl ether), wherein the incision Iz 〇d impact strength is at 25 〇c according to astmd256 rfr θ degree 〇 〇 another specific embodiment is a method for preparing a curable composition, which comprises: measuring epoxy resin in chloroform at 25 ° C Bifunctional with a natural viscosity of from about 0.03 to about 〇·2 gram per gram (Extension aryl group), and a curing accelerator which effectively makes the epoxy resin ripening amount; wherein the aged composition exhibits a non-cut Izod impact strength of at least 5% greater than having a monofunctional poly(strandyl ether) Corresponding compositions wherein the non-notched Iz〇d impact strength is measured at b ° C according to ASTM D4812. Other embodiments, including cured compositions made by ripening the curable composition, and articles comprising the aged composition, are described in detail below. DETAILED DESCRIPTION OF THE INVENTION The inventors of the present invention have conducted research on a composition of a curable poly(alkylene ether) composition in an effort to break through the solubility of poly(arylene ether) in a curable composition of 123165 -14-200821355. The previous limitation of the cured resin to the edge. In the course of this research, I have discovered that the material has a poly(alkylene ether) resin with a specific base functional group and a stereo molecular weight, and a poly(aryl ether) in the curable composition. Solubility can be modified without sacrificing toughness in the composition after curing. Alternatively, • the toughness of the composition after aging can be modified without sacrificing the poly(extended aryl ether). The solubility of the mash can be cured. To this end, a specific embodiment is a curable composition comprising: an epoxy resin; a bifunctional poly(aryl ether), • measured in chloroform at 25 ° C, having a native viscosity of gram per gram. a curing accelerator of about 0.03 to about 〇·2, and an effective curing amount of the epoxy resin; wherein the aged composition exhibits a non-notched Izod impact strength of at least 5% greater than having a monofunctional poly(aryl ether) Corresponding compositions wherein the non-notched Iz〇d impact strength is measured at 25 ° C according to ASTM D4812. With respect to the individual poly(n-aryl ether) molecule, the term "bifunctional" means that the molecule contains two phenolic hydroxyl groups. With respect to poly(alkylene ether) resin, the term "bifunctional" means that the resin comprises from about to about 2.6 phenolic hydroxyl groups per poly(alkylene ether) molecule. In some embodiments The difunctional poly(aryl ether) system comprises from about u to about 2.2 phenolic hydroxyl groups per poly(aryl ether) molecule. As described above, the 'heated composition shows no nick Iz 〇d impact strength to ~ 5% less than the corresponding composition with monofunctional poly(aryl ether), wherein the non-cut Izod impact strength is measured according to ASTM D4812 at 25 C. The honesty is ''has a single A corresponding composition of a functional poly((aryl ether)) refers to a corresponding matured composition made from a curable composition, wherein a monofunctional poly(aryl ether) of the same inherent viscosity is used to replace the difunctional Sexual poly(extended aryl group 123165 -15·200821355 ether). In some embodiments, the non-notched Iz〇d impact strength is from 5 to about 50% greater than the corresponding combination of monofunctional poly(strandyl ether) For individual poly(aryl ether) molecules, "monofunctional The term "sex" means that the molecule contains a heterogeneous radical. With regard to poly(arylene ether) resins, the term "monofunctional" means that the resin contains each poly(aryl ether) molecule. On average, about 8 to about 1 · 2 divergent bases.

切口 Iz〇d衝擊強度亦經改良。例如,在一些具體實施例 中,熟化後之組合物係顯示切口 Izod衝擊強度至少大於 、具有單官能性聚(伸芳基醚)之相應組合物,其中切口hd衝 擊強度係於坑下根據ASTMD256度量。在一些具體實施例 中切口1zod衝擊強度係為5至約30%大於具有單官能性聚 (伸芳基醚)之相應組合物。 多種環氧樹脂係適心可熟化組合物。環氧樹脂在室溫 下可為固體。因此,在一此且俨脊 二具體貫施例中,環氧樹脂係具 可根據顯 卜壯4 於何生自松脂製品之樹脂軟化點,藉由環 舁球裝置之標準試驗方法”测^ ^ ^ ^ ^ ^ ^ 體或軟化固體。因此,在_二;:=室溫下可為液 具有軟化點低於25t。 ^例中’環氧樹脂係 脂包括例如脂族環氧樹脂(包括新戊二醇之 广水甘油基醚)、環脂族環氧樹脂、㈣·α環 子雜 乳樹脂L環氧樹脂、 :: :㈣氧樹脂、多官能性環氡樹脂、㈣ 基本二減物、2'縮水甘油基縮水甘油苯 123165 -16 - 200821355 型裱氧樹脂、多芳族樹脂型環氧樹脂及其組合。環氧樹脂 叮為單體性、养聚合或其組合。在一些具體實施例中,環 氧樹脂包括雙酚A二縮水甘油基醚環氧樹脂。The impact strength of the incision Iz〇d was also improved. For example, in some embodiments, the aged composition exhibits a shear Izod impact strength at least greater than a corresponding composition having a monofunctional poly(aryl ether) wherein the incision hd impact strength is under the pit according to ASTM D256 measure. In some embodiments, the cut 1zod impact strength is from 5 to about 30% greater than the corresponding composition having a monofunctional poly(aryl ether). A variety of epoxy resins are suitable for curing the composition. The epoxy resin can be a solid at room temperature. Therefore, in one specific embodiment of the ridged ridge, the epoxy resin system can be measured according to the softening point of the resin of the rosin product according to the strength of the resin, by the standard test method of the ring ball device. ^ ^ ^ ^ ^ ^ Body or soften the solid. Therefore, at room temperature, the liquid may have a softening point of less than 25t. ^In the case of 'epoxy resin', including, for example, aliphatic epoxy resin (including Neoglycol diol polyglycidyl ether), cycloaliphatic epoxy resin, (tetra)·α-ring heteronuclear resin L epoxy resin, :: (IV) oxy resin, polyfunctional cyclic oxime resin, (iv) basic two reduction , 2' glycidyl glycidyl benzene 123165 -16 - 200821355 type oxygenated resin, polyaromatic resin type epoxy resin and combinations thereof. The epoxy resin is monomeric, polymerized or a combination thereof. In an embodiment, the epoxy resin comprises bisphenol A diglycidyl ether epoxy resin.

除了裱氧樹脂以外,可熟化組合物包含雙官能性聚(伸芳 基醚)。適當雙官能性聚(伸芳基醚)包括具有以下結構者In addition to the oxime resin, the curable composition comprises a bifunctional poly(strandyl ether). Suitable difunctional poly(alkylene ether) includes those having the following structure

二中各存在之Ql與Q2係獨立為氫、鹵素、未經取代或經^ 代之C! 2烴基,其附帶條件是該烴基不為三級烴基 CrC12烴基硫基、Cl_Cl2烴基氧基或C2_Ci2齒基煙基氧基 其中至少兩個碳原子係使_素與氧原子分隔;各存在之 係獨立為1至為100 ;且L具有以下結構Each of Q1 and Q2 existing in the two is independently hydrogen, halogen, unsubstituted or substituted C! 2 hydrocarbon group, with the proviso that the hydrocarbon group is not a tertiary hydrocarbon group CrC12 hydrocarbon group thio group, Cl_Cl2 hydrocarbon group oxy group or C2_Ci2 a dentinoyloxy group in which at least two carbon atoms are separated from an oxygen atom; each existing system is independently from 1 to 100; and L has the following structure

Rl R2 R2 RiRl R2 R2 Ri

Rl R2 ^ 其中各存在之R4R2係獨立為氫、幽素二 代之Ci-c12烴基’其附帶條件是該烴基不為三級煙: 基硫基、Ci_Ci2烴基氧基或 其中至少兩個碳原子係使㈣氧原子分隔;2為0二基 γ具有一種結構,選自 〆 123165 -17- 200821355 R3 Ο-,-]sj- 0 II S II 0 || 0 II R4 I —C—- II ~,—C-'‘ II ,-—s- II » S —及一 1 —c— O R5 其中各存在之R3係獨立選自氫與Μ。烴基,且各存在之 ^與R係獨立選自氫與Ci_Ci2煙基(包括例如CrQ環烧基與 本基)’或R4與R5係共同地形成伸烧基(例如&4與^可共 同地形成正·伸戊基(意即:五亞甲基(偶阳碑呢呵·))。Rl R2 ^ wherein each R4R2 is independently hydrogen, and the Ci-c12 hydrocarbyl group of the second generation is accompanied by the fact that the hydrocarbyl group is not a tertiary fumes: a thiol group, a Ci_Ci2 hydrocarbyloxy group or at least two carbon atoms thereof Separating (iv) oxygen atoms; 2 is 0 diyl γ has a structure selected from 〆123165 -17- 200821355 R3 Ο-,-]sj- 0 II S II 0 || 0 II R4 I —C—- II ~ , -C-'' II , --s- II » S - and -1 - c - O R5 wherein each of the R3 groups present is independently selected from the group consisting of hydrogen and helium. a hydrocarbon group, and each of the R and R groups independently selected from hydrogen and a Ci_Ci2 smoky group (including, for example, a CrQ cycloalkyl group and a benzyl group) or a R4 and R5 system together form a stretching group (for example, &4 and ^ can be used together The formation of the positive and extended pentyl (meaning: penta methylene (even Yang monument)).

在一些具體實施例中,雙官能性聚(伸芳基⑽)係具有以 下結構In some embodiments, the bifunctional poly(aryl(10)) has the following structure

其中Q為甲基;各存在之〇2备 係獨立為氫或甲基;各存在2 R1與R2係獨立為氫、齒辛、未铖跑你―^ 谷孖在< m… 取代或經取代之c「ci2烴基 c .Γ ^ ^ 、 馮一級烴基、ci-c12烴基硫基、 1 12、工土軋基或C2-C12_基煙基氧美 、 .^ 基其中至少兩個碳^ 子係使齒素與氧原子分隔 A . H . ^ K,、R各獨立為氫或CVC0 丞,且各存在之乂係獨立為i 在一些具體實施例中 下結構 ’雙官能性聚(伸芳基醚)係具有以Wherein Q is a methyl group; each of the existing oxime 2 is independently hydrogen or methyl; each of the 2 R1 and R2 systems is independently hydrogen, tooth xin, and 铖 铖 ——^ 谷 孖 in < m... Substituting c "ci2 hydrocarbyl c. Γ ^ ^, von primary hydrocarbon, ci-c12 hydrocarbylthio, 1 12, working soil rolling or C2-C12_based nicotinyloxy, . The daughter system separates the dentate from the oxygen atom by A. H . ^ K, R is independently hydrogen or CVC0 丞, and each existing lanthanide is independently i. In some embodiments, the lower structure 'bifunctional poly(extension) An aryl ether)

123165 -18- 200821355 其中各存在之X係獨立為1至約20。 雙g旎性聚(伸芳基醚)可例如藉由單羥酚與二羥酚之氧 化共聚合作用製成。適當單羥酚類包括例如2,6_二甲酚、 2,3,6-二甲酚等,及其混合物。適當二羥酚包括例如w,_ 四甲基·4,4,·雙酚、2,2-雙(3-甲基冰羥苯基)丙烷、2,2_雙(3,5-二 甲基斗羥苯基)丙烷、U•雙(4_羥苯基)甲烷、u•雙(4_羥苯基) 乙烧、2,2-雙(4-羥苯基)丙烷2,2-雙(4-羥苯基)丁烷、2,2_雙…輕 苯基)辛烷、U-雙(4·羥苯基)丙烷、u-雙(4·羥苯基 >正_丁烷、 雙(4-备本基)本基甲.烧、1,1_雙(4_經基各甲基苯基)環己烧、1 ι_ 雙(4-經基-3,5-一甲基苯基)環戊烧、ι,ι_雙(4·經基_3,5-二甲基苯 基)環己烧、1,1-雙(4-羥基-3-甲基苯基)環庚烷、1,1_雙(4_羥基 -3,5-二甲基苯基)環庚烷、込丨—雙(4_羥基甲基苯基)環辛烧、 U-雙(4-羥基-3,5-二甲基苯基)環辛烷、1,1_雙(4_羥基-3_甲基苯 基)環壬烷、11,1·雙(4-羥基·3>二曱基苯基)環壬烷、以-雙⑷ 羥基-3-曱基苯基)環癸烷' U,(4_羥基_3,5_二甲基苯基)環癸 烧、1,1-雙(4-經基-3-甲基苯基)環Ί--烧、1,1-雙(4-經基-3,5-二 曱基苯基)環十一烷、1,1-雙(4-羥基-3-甲基苯基)環十二烷、 雙(4-經基-3,5-二甲基苯基)環十二烧、i,i-雙(4-經基《3-第三_丁 基苯基)丙烷、2,2-雙(4-羥基-2,6-二甲基苯基)丙烷2,2_雙(4·經基 -3->臭笨基)丙烧、1,1_雙(4-經苯基)環戊烧、1,1_雙(4_經苯基)環 己烷及其混合物。在一些具體實施例中,雙官能性聚(伸芳 基醚)係藉由2,6-二曱酚與2,2·雙(3,5_二甲基斗羥苯基)丙燒之 氧化共聚合作用製成。 在一些具體實施例中,雙官能性聚(伸芳基醚)包含聚石夕 123165 •19- 200821355 氧燒鏈段。例如,雔官α 構 「 又生聚(伸芳基醚)可具有以下結 Q1 〇2 Γ . -π123165 -18- 200821355 Each of the X systems present is independently from 1 to about 20. The di-g-functional poly(aryl ether) can be produced, for example, by oxidative copolymerization of a monohydric phenol and a dihydric phenol. Suitable monohydric phenols include, for example, 2,6-xylenol, 2,3,6-xylenol, and the like, and mixtures thereof. Suitable dihydric phenols include, for example, w, _ tetramethyl 4,4, bisphenol, 2,2-bis(3-methylglacial phenyl)propane, 2,2 bis (3,5-dimethyl Base hydroxyphenyl)propane, U•bis(4-hydroxyphenyl)methane, u•bis(4-hydroxyphenyl)ethene, 2,2-bis(4-hydroxyphenyl)propane 2,2- Bis(4-hydroxyphenyl)butane, 2,2-bis...light phenyl)octane, U-bis(4-hydroxyphenyl)propane, u-bis(4-hydroxyphenyl)> Alkane, bis(4-substituent), benzyl, pyroline, 1,1 bis (4-cyanomethylphenyl) cyclohexan, 1 ι_bis (4-carbyl-3, 5-- Methylphenyl)cyclopentane, ι,ι_bis(4·trans3_5,5-dimethylphenyl)cyclohexene, 1,1-bis(4-hydroxy-3-methylphenyl) Cycloheptane, 1,1_bis(4-hydroxy-3,5-dimethylphenyl)cycloheptane, fluorene-bis(4-hydroxymethylphenyl)cyclooctane, U-double ( 4-hydroxy-3,5-dimethylphenyl)cyclooctane, 1,1-bis(4-hydroxy-3-methylphenyl)cyclodecane, 11,1·bis (4-hydroxy·3&gt Di-nonylphenyl)cyclodecane,-bis(4)hydroxy-3-indolylphenyl)cyclodecane 'U, (4-hydroxy-3,5-dimethylphenyl) oxime, 1 , 1-double 4-Phenyl-3-methylphenyl)cycloindole--sinter, 1,1-bis(4-carbyl-3,5-diamidinophenyl)cycloundecane, 1,1-double ( 4-hydroxy-3-methylphenyl)cyclododecane, bis(4-carbyl-3,5-dimethylphenyl)cyclododecan, i,i-bis (4-carbyl "3 -T-butylphenyl)propane, 2,2-bis(4-hydroxy-2,6-dimethylphenyl)propane 2,2_bis(4.ylamino-3-> stinky base Acetone, 1,1 bis (4-phenyl) cyclopentane, 1,1 bis (4-phenyl) cyclohexane and mixtures thereof. In some embodiments, the difunctional poly(arylene ether) is oxidized by 2,6-dioxanol and 2,2·bis(3,5-dimethylidene hydroxyphenyl)propane. Made by copolymerization. In some embodiments, the difunctional poly(triaryl ether) comprises a polysulfide segment of the polygalena 123165 • 19-200821355. For example, the 雔 α α structure "also produces poly( aryl ether) can have the following knot Q1 〇 2 Γ . -π

=存在之州係獨立為氫、.素、未經取:或經取 cr::,其附帶條件是該烴基不為三級烴基、 1中至…4 Cl_Cl2_氧朞或。2-。12鹵基烴基氧基, 兩個碳原子係使,素與氧原子分隔;各存在 係獨「立為1至約耽且A具有以下結構= The state of existence is independent of hydrogen, .., untaken: or taken by cr::, with the proviso that the hydrocarbon group is not a tertiary hydrocarbon group, 1 medium to ... 4 Cl_Cl2_ oxygen period or. 2-. 12 halohydrocarbyloxy group, two carbon atom system, the selenium is separated from the oxygen atom; each exists in the system "is 1 to about 耽 and A has the following structure

(CH2)m(CH2)m

其:各存在之於㈣及❻心獨立為氫乂^煙基或 Y 12画基^基’·其中各存在之則系獨立為0, 1,2, 3, 4, 5或 6’且其中各存在之¥1與¥2及¥3與^系獨立為氫、^12煙 土 Cl_Cl2烴基氧基或鹵素;且其中n為5至約200。在一些 。體A例中’各存在之Ql為甲基,#中各存在之^為氯 〆4 /、中各存在之Y1為甲氧基,其中各存在之Y2與γ3 及Y4為氫,各存在之以與尺7及圮與妒為甲基,各存在之m 為約1〇至約1〇〇。具有内部聚石夕氧炫鍵段之聚(伸 芳基醚)可例如藉由單羥酚與酚封端聚矽氧烷之氧化共聚 123165 -20- 200821355 泛作用製成。盼封 一 物二封端之聚石夕氧烷與:石夕氧烧本身可藉由在石夕烷基氫化 成,該化合物鐾如星有種化合物間之氫石夕烧化反應而製 香酚。 有知族碳-碳雙鍵與酚性羥基兩者之丁 人""I、又“"生聚(伸芳基醚)可涵蓋-範圍之比例 9QI旦 /、體只靶例中,可熟化組合物包含約30至約 99重s份數之環氧 取^ # 、丨曰”、力1至約70重量份數之雙官能性 :方基ϋ) ’其中所有重量份數係以伽重量份數全部環 乳_與雙官能时(伸芳基醚)為基準。在l些具體實施 财,可歧組合物包·含約6Q至㈣重量份歎環氧樹脂 ㈣1 旦0至約4〇重量份數之雙官能性聚(伸芳基醚P ^ 里伤數係以100重!份數全部環氧樹脂與雙官能性聚 (伸芳基醚)為基準。 除了環氧樹脂與聚(伸芳基醚)以外,可熟化組合物包含 有效使環氧樹脂熟化量之熟化促進劑。適當熟化促進劑包 例如/曰伏陽離子性热化觸媒、紛性硬化劑、胺硬化劑、 脂族或芳族叛酸類之銅⑼鹽、脂族或芳㈣酸類之銘㈣ 鹽、床二酮酸銅(II)、尽二酮酸鋁(111)、環脂族羧酸酐類(譬 如%己烷-1,2-二羧酐)、三氟化硼-三甲胺複合物及其組合。 在些具體實施例中,熟化促進劑為潛伏陽離子性熟化 觸媒,選自二芳基錤鹽、膦酸酯類、磺酸酯類、羧酸酯類、 科歐亞烷基化合物、芊基锍鹽、苄基吡錠鹽、苄基銨鹽、 異啰銼鹽及其組合。例如,熟化促進劑可為包含具有以下 、、、。構^--方基鎖鹽之潛伏^離子性熟化觸媒 123165 -21- 200821355 [(R10)(rii)i1+x- 其中R1。與R"各獨立為。 個選自Μ。烷基 二&方族烴基’视情況被… ΐι·<:2〇烷氣基、硝知 取代;且其中χ-為 及虱基之單價基團 進劑為包含具有以下蛀# —,、體貝施例中,熟化促 化觸媒 方土之潛伏陽離子性熟 LVAV A^iA)irSbF6'It: each exists in (4) and the heart is independent of hydrogen 乂 ^ 烟 base or Y 12 base ^ base '· each of which is independent of 0, 1, 2, 3, 4, 5 or 6' and Each of the existing ¥1 and ¥2 and ¥3 and ^ are independently hydrogen, ^12 tobacco Cl_Cl2 hydrocarbyloxy or halogen; and wherein n is from 5 to about 200. In some. In the case of the body A, each of Q1 is a methyl group, and each of the # is a chloropurine 4 /, and each of the Y1 is a methoxy group, wherein each of Y2 and γ3 and Y4 are hydrogen, each of which exists And m and 圮 and 妒 are methyl, each m is from about 1 〇 to about 1 〇〇. The poly(extension aryl ether) having an internal polyoxo-oxygen bond can be produced, for example, by oxidative copolymerization of a monohydric phenol with a phenol-terminated polyoxyalkylene 123165 -20-200821355. It is desirable to seal a compound and a two-capped polyoxetane and: the ascorbic acid itself can be formed by hydrogenation in a sulphuric acid alkyl group, such as a star-based compound . There are both the carbon-carbon double bond and the phenolic hydroxyl group of the genus, and the "" aryl aryl ether can cover the ratio of the range of 9QI Dan /, only in the target The curable composition comprises from about 30 to about 99 parts by weight of the epoxy group, 丨曰", from 1 to about 70 parts by weight of the difunctional: square ϋ) "all of the parts by weight" The total amount of ring milk in gamma parts by weight is based on the difunctional (arylene ether). In some specific implementations, the disintegratable composition package contains about 6Q to (4) parts by weight of the epoxy resin (4) 1 denier to 4 parts by weight of the bifunctional poly(strylene ether P ^ 伤 injury number system) Based on 100 parts by weight of all epoxy resin and bifunctional poly(alkylene ether). In addition to epoxy resin and poly(aryl ether), the curable composition contains an effective amount of epoxy resin curing. A curing accelerator. Suitable curing accelerators include, for example, a ruthenium cationic thermal catalyst, a chelating hardener, an amine hardener, a copper (9) salt of an aliphatic or aromatic tickacid, an aliphatic or aromatic acid. (iv) Salt, copper (II) diketonate, aluminum (111), cycloaliphatic carboxylic anhydride (such as % hexane-1,2-dicarboxylic anhydride), boron trifluoride-trimethylamine complex And a combination thereof. In some embodiments, the curing accelerator is a latent cationic ripening catalyst selected from the group consisting of diarylsulfonium salts, phosphonates, sulfonates, carboxylates, and ketanes. a base compound, a mercapto phosphonium salt, a benzyl pyridinium salt, a benzyl ammonium salt, an isoindole salt, and combinations thereof. For example, the curing accelerator may be a inclusion The following, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,烷基. Alkyl bis & aryl hydrocarbon group 'as appropriate... ΐι·<: 2 decane gas group, nitrate-known substitution; and wherein χ- and 虱 group of monovalent group of the agent are included to have the following 蛀# -,, in the body shell example, the latent cationic LVAV A^iA) irSbF6'

其中R1 G與Rl 1各獨 w 蜀為C6-C14早價芳族烴基 個選自(VC20烷美、r _r w Θ 优㈡况被1至4 "1 2〇、元虱基、硝基及氯基之單價基團 取代。在一些具體實施例 、 熱化促進劑為包含六氟銻酸 -辛乳基本基苯基錤之潛伏陽離子性熟化觸媒。 在一些具體實施例中,熟化促進劑包括乙酿基丙酮酸銘 (III) 〇 热化促進劑可包括酚性硬化劑。適當酚性硬化劑包括例 如酚醛清漆型酚樹脂、芳烷基型酚樹脂、二環戊二烯型酚 樹脂、經萜烯改質.之酚樹脂、聯苯基型酚樹脂、雙酚類、 二本甲烧型紛樹脂及其組合。 熟化促進劑可包括胺硬化劑。適當胺硬化劑包括例如異 樹根皮酮二胺、三乙四胺、二乙三胺、胺基乙基六氫吡畊、 1,2-與1,3_二胺基丙烷、2,2-二甲基丙二胺、1,4·二胺基丁烷、 1,6-二胺基己烷、ι,7-二胺基庚烷、1,8_二胺基辛烷、ι,9-二胺 基壬烷、1,12-二胺基十二烷、4-氮七亞甲基二胺、N,N,-雙(3-胺基丙基)丁烷-1,4-二胺、環己烷二胺、二氰二胺、二醯胺 二苯甲烧、二醯胺二苯基磧酸(胺加成物)、4,4L亞甲基二苯 123165 •22- 200821355Wherein R1 G and Rl 1 are each a single w 蜀 is a C6-C14 early-valent aromatic hydrocarbon group selected from (VC20 alkyl, r _r w Θ excellent (b) condition is 1 to 4 "1 2 〇, 虱 虱, nitro And a monovalent group of a chloro group substituted. In some embodiments, the heating promoter is a latent cationic aging catalyst comprising hexafluoroantimonic acid-octyl aryl phenyl hydrazine. In some embodiments, aging promotes The agent includes ethyl acetylpyruvate (III). The heating accelerator may include a phenolic hardener. Suitable phenolic hardeners include, for example, novolak type phenol resin, aralkyl type phenol resin, dicyclopentadiene type phenol. a phenol resin, a biphenyl type phenol resin, a bisphenol type, a bisphenol type resin, and a combination thereof. The curing accelerator may include an amine hardener. Suitable amine hardeners include, for example, Root ketone diamine, triethylenetetramine, diethylenetriamine, aminoethylhexahydropyrazine, 1,2- and 1,3-diaminopropane, 2,2-dimethylpropanediamine , 1,4·Diaminobutane, 1,6-diaminohexane, iota, 7-diaminoheptane, 1,8-diaminooctane, iota, 9-diaminodecane 1,12-diamine Dodecane, 4-nitroheptamethylenediamine, N,N,-bis(3-aminopropyl)butane-1,4-diamine, cyclohexanediamine, dicyandiamide, Diamine benzophenone, diammonium diphenyl decanoic acid (amine adduct), 4,4L methylene diphenyl 123165 • 22- 200821355

胺、二乙基甲苯二胺、間-苯二胺、三聚氰胺甲醛、四乙五 胺、3-二乙胺基丙胺、3,3^亞胺基雙丙胺、2、4-雙(對-胺基 苄基)苯胺、四乙五胺、3-二乙胺基丙胺、2,2,4·與2,4,4-三甲 基己二胺、1,2-與1,3-二胺基環己烷、1,4-二胺基·3,6-二乙基環 己烷、1,2-二胺基斗乙基環己烷、1,4-二胺基-3,6-二乙基環己 烷、1-環己基-3,4-亞胺基-環己烷、二胺基二環己基甲烧、 4,4’-二胺基二環己基丙烷、2,2-雙(4-胺基環己基)丙烷、3,3,· 二甲基-4,4’-二胺基二環己基曱烷、3-胺基-1-環己烷胺基丙 烷、1,3-與1,4-雙(胺基甲基)環己烷、間-與對-二曱苯二胺及 其混合物。 熟化促進劑之量係依熟化促進劑之類型,以及其他樹脂 成份之身分與量而定。例如,當熟化促進劑為潛伏陽離子 性熟化觸媒時,其可以每100重量份數之環氧樹脂約〇1至約 1〇重量份數之量使用。作為另一項實例’當熟化促進劑為 尽二酮酸銅(II)或鋁(m)時,其可以每1〇〇重量份數之環氧樹 脂約1至10重量份數之量使用。 除了環氧樹脂、聚(伸芳基醚)及熟化促進劑以外,可 化組合物可視情況進一步包含約2至約50重量百分比之 料,以組合物之總重量為基準。在此範圍内,填料量可 於或等於40重量百分比,或低於或等於3()重量百分比, 低於或等於百分比,或低於或等於⑺重量百分比 在:些具體實施例中,可熟化組合物係、不含任何故意添 ,、枓。在一些具體實施例中’可熟化組合物係不含盈 微粒子填料。 …、 123165 -23- 200821355 組合物可視情況進—牛 ^ 步包含一或多種 顏料、著色劑、抗氧化劑、熱安定劑:’」選自染料、 潤滑劑、流動改質劑、嘀% ^ π 疋劑、增塑劑、 蜊/商液阻滯劑、阻婵劑、沾仏 抗靜電劑、流動促進劑 π塊防止劑、 物化劑、低分佈形態添加 者“杈劑、 月J應刀緩和添加劑 i 。 -項具體實施例為可熟化組合物:厂 又“,ΐϋ(伸方基喊),在氯仿巾,於25〇c下度、 性黏度為每克約〇.〇3至約〇2公合Ί ” +钟儿7口 w + ’欢使^乳樹脂熟化量 之无、化促進诏,·選用之約2至約5〇重 里曰刀比之填料,以組 合物之總重量為基準;;5 ;登田+、夭Λ +丨 ^ 及、用之冰加劑,選自染料、顏料、 著色劑、抗氧化劑、熱安定劑、光安定劑、增塑劑、潤滑 劑、流動改質劑'滴液阻滞劑'阻燃劑、結塊防止劑、抗 靜電劑、流動促進劑、加工助劑、基材黏著劑、脫模劑、 韌化劑、低分佈形態添加劑、應力緩和添加劑及其組合; 其中熟化後之組合物係顯示無切口 Iz〇d衝擊強度至少5%大 於具有單官能性聚(伸芳基醚)之相應組合物,其中無切口 Izod衝擊強度係於25°C下根據ASTM D4812度量。 一項具體實施例為可熟化組合物,其包含:雙酚A二縮 水甘油基醚環氧樹脂;雙官能性聚(伸芳基醚),在氯仿中, 於25°C下度量,具有本性黏度為每克約〇·〇3至約〇·2公合,其 中聚(伸芳基醚)係具有以下結構 123165 -24- 200821355Amine, diethyltoluenediamine, m-phenylenediamine, melamine formaldehyde, tetraethylenepentamine, 3-diethylaminopropylamine, 3,3^iminodipropylamine, 2,4-bis(p-amine) Benzyl)aniline, tetraethylenepentamine, 3-diethylaminopropylamine, 2,2,4· and 2,4,4-trimethylhexamethylenediamine, 1,2-and 1,3-diamine Cyclohexane, 1,4-diamino-3,6-diethylcyclohexane, 1,2-diamino-t-ethylcyclohexane, 1,4-diamino-3,6- Diethylcyclohexane, 1-cyclohexyl-3,4-imino-cyclohexane, diaminodicyclohexylmethane, 4,4'-diaminodicyclohexylpropane, 2,2- Bis(4-aminocyclohexyl)propane, 3,3,-dimethyl-4,4'-diaminodicyclohexyldecane, 3-amino-1-cyclohexaneaminopropane, 1, 3- and 1,4-bis(aminomethyl)cyclohexane, m- and p-diphenylene diamine, and mixtures thereof. The amount of curing accelerator depends on the type of curing accelerator and the identity and amount of other resin components. For example, when the curing accelerator is a latent cationic ripening catalyst, it may be used in an amount of from about 1 to about 1 part by weight per 100 parts by weight of the epoxy resin. As another example, when the curing accelerator is copper (II) or aluminum (m), it may be used in an amount of about 1 to 10 parts by weight per 1 part by weight of the epoxy resin. In addition to the epoxy resin, the poly(aryl ether), and the curing accelerator, the composition may optionally further comprise from about 2 to about 50 weight percent based on the total weight of the composition. Within this range, the amount of filler may be at or equal to 40 weight percent, or less than or equal to 3 () weight percent, less than or equal to a percentage, or less than or equal to (7) weight percent. In some embodiments, the ripening can be achieved. The composition system, without any intentional addition, 枓. In some embodiments, the 'curable composition' is free of the particulate filler. ..., 123165 -23- 200821355 The composition may be taken as a condition - the calf step contains one or more pigments, colorants, antioxidants, thermal stabilizers: '" selected from dyes, lubricants, flow modifiers, 嘀% ^ π Tanning agent, plasticizer, bismuth/commercial liquid retarder, anti-caries agent, anti-static agent, flow promoter π block preventive agent, physicochemical agent, low-distribution form added “sputum agent, month J should be moderated Additive i - The specific embodiment is a curable composition: the factory is ", ΐϋ (extended square shouting), in chloroform towel, at 25 ° C, the viscosity is about 〇. 〇 3 to about 〇 2 公合Ί ” + 钟儿 7 口 w + '欢欢^ The amount of milk resin is not ripened, promotes 诏, · Use about 2 to about 5 〇 曰 比 比 比 比 , , , , , , , , , , , , Benchmark;; 5; Dengtian+, 夭Λ+丨^ and, ice additive, selected from dyes, pigments, colorants, antioxidants, thermal stabilizers, light stabilizers, plasticizers, lubricants, fluids Modifier 'dropping blocker' flame retardant, agglomeration inhibitor, antistatic agent, flow promoter, processing aid, substrate adhesive a release agent, a toughening agent, a low-distribution form additive, a stress relieving additive, and combinations thereof; wherein the aged composition exhibits a non-notched Iz〇d impact strength of at least 5% greater than having a monofunctional poly(strandyl ether) A corresponding composition wherein the uncut Izod impact strength is measured at 25 ° C according to ASTM D4812. One specific embodiment is a curable composition comprising: bisphenol A diglycidyl ether epoxy; bifunctional Poly(arylene ether), measured in chloroform at 25 ° C, has a natural viscosity of from about 〇·〇3 to about 〇·2 of the total, wherein the poly( extended aryl ether) has the following Structure 123165 -24- 200821355

里之热化促進劑;其中熟化後之組合物係顯示無切口 iz〇d 衝擊強度5至約50%大於具有單官能性聚(伸芳基醚)之相應 組合物,其中無切口 Iz〇d衝擊強度係於25t:下根據astm D4812度量。 一項具體實施例為可熟化組合物,其包含:雙酚A二縮 水甘油基醚環氧樹脂;雙官能性聚(伸芳基醚),在氯仿中, ; 下度里具有本性黏度為每克約〇·〇3至約〇·2公合,其 中聚(伸芳基醚)係具有以下結構a heating accelerator; wherein the aged composition exhibits an incision iz〇d impact strength of 5 to about 50% greater than a corresponding composition having a monofunctional poly(arylene ether), wherein no incision Iz〇d The impact strength is measured at 25t: according to astm D4812. A specific embodiment is a curable composition comprising: bisphenol A diglycidyl ether epoxy resin; bifunctional poly(aryl ether) in chloroform; lower intrinsic viscosity per克约〇·〇3 to about 〇·2 communal, wherein poly(strandyl ether) has the following structure

子在之Χ係獨立為1至約20 ;有效使環氧樹脂熟化量 、足進蜊,選用之約2至約50重量百分比之填料,以組 物之…重里為基準;及選用之添加劑,選自染料、 著色劍、杆* " ^长柷虱化劑、熱安定劑、光安定劑、增塑劑、潤滑 ☆恭^動改貝劑、滴液阻滯劑、阻燃劑、結塊防止劑 '抗 靜包刈流動促進劑、加工助劑、基材黏著劑、脫模劑、 韌化劑、低八此… -刀佈形恶添加劑、應力缓和添加劑及直組人· 123165 -25- 200821355 "中热化後之組否物係顯示無切口 Iz〇d衝擊強度5至約$咖 大於具有單g此性聚(伸芳基醚)之相應組合物,其中無切 口 Izod衝擊強度係於25。(:下根據ASTM D4812度量。 一項具體實施例為可熟化組合物,其包含:約60至約90 重莖份數之雙酚A二縮水甘油基醚環氧樹脂;約1〇至約4〇 重量份數之雙官能性聚(伸芳基醚),在氯仿中,於25t:下度The sub-system is independently from 1 to about 20; effective to make the amount of epoxy resin matured, enough to be used, about 2 to about 50% by weight of the filler, based on the weight of the group; and the additives selected, Selected from dyes, tinted swords, rods * " ^ long sputum, heat stabilizer, light stabilizer, plasticizer, lubrication ☆ 恭 改 change agent, drop blocker, flame retardant, knot Block preventive agent anti-static bag flow improver, processing aid, substrate adhesive, mold release agent, toughening agent, low eight... - knife-shaped evil additive, stress relieving additive and direct group · 123165 - 25-200821355 "The group after neutralization shows no impact Iz〇d impact strength 5 to about $500 is greater than the corresponding composition with a single g of this poly(extended aryl ether), without the incision Izod impact The strength is at 25. (: Measured according to ASTM D4812. One specific embodiment is a curable composition comprising: from about 60 to about 90 parts by weight of bisphenol A diglycidyl ether epoxy resin; from about 1 Torr to about 4 〇 part by weight of difunctional poly(arylene ether) in chloroform at 25t:

虿,具有本性黏度為每克約〇 〇6至約〇12公合,其中聚(伸芳 基醚)係具有以下結構虿, having a natural viscosity of from about 〇6 to about 公12 gram per gram, wherein the poly(extended aryl ether) has the following structure

其中各存在之X係獨立為i至約2〇 ;及約〇·5至約1〇重量份數 之乙醯基丙酮酸鋁(ΙΠ);其中所有重量份數係以1〇〇重量份 數全部環氧樹脂與雙官能性聚(伸芳基醚)為基準;其中雙 酚Α二縮水甘油基醚環氧樹脂與官能性聚(伸芳基醚)於^ 至65 C下(意即在整個25至65°C範圍内)係以單相存在;其中 可熟化組合物於25°C下具有黏度低於或等於1〇,〇〇〇厘泊;其 中熟化後之組合物係顯示無切口 Izod衝擊強度5至約5〇%大 於具有單官能性聚(伸芳基醚)之相應組合物,其中無切口 Izod衝擊強度係於25°C下根據ASTMD4812度量;且其中熟化 後之組合物係顯示切口 120(1衝擊強度5至約3〇%大於具有單 官能性聚(伸芳基醚)之相應組合物,其中切口 12〇4衝擊強度 係於25°C下根據ASTM D256度量。 123165 -26 - 200821355 一項具體實施例為可熟化組合物,其包含:約60至約90 重ΐ份數之雙齡A 一縮水甘油基醚環氧樹脂;約至約4〇 重量份數之雙官能性聚(伸芳基醚),在氯仿中,於25它下度 量,具有本性黏度為每克約〇·〇6至約0.12公合,其中聚(伸芳 基醚)係具有以下結構Each of the X groups present independently is from i to about 2 Å; and from about 5 to about 1 part by weight of aluminum acetoxypyruvate (ΙΠ); wherein all parts by weight are in parts by weight Based on all epoxy resins and bifunctional poly(aryl ether); bisphenol quinone diglycidyl ether epoxy resin and functional poly(aryl ether) at ^65 C (meaning The entire 25 to 65 ° C range exists as a single phase; wherein the curable composition has a viscosity of less than or equal to 1 〇, 〇〇〇 centipoise at 25 ° C; wherein the aged composition shows no nicking Izod impact strength 5 to about 5 % is greater than the corresponding composition having a monofunctional poly(aryl ether) wherein the non-cut Izod impact strength is measured at 25 ° C according to ASTM D4812; and wherein the aged composition is The slit 120 is shown (1 impact strength 5 to about 3% by weight is greater than the corresponding composition having a monofunctional poly(aryl ether) wherein the notch 12〇4 impact strength is measured at 25 ° C according to ASTM D256. 123165 - 26 - 200821355 A specific embodiment is a curable composition comprising: from about 60 to about 90 parts A two-year-old A-glycidyl ether epoxy resin; about to about 4 parts by weight of a difunctional poly(arylene ether), measured in chloroform at 25, having a native viscosity of about gram per gram 〇·〇6 to about 0.12 metric, wherein poly(arylene ether) has the following structure

之乙醯基丙酮酸鋁(III);選用之約2〇至約1〇〇重量份數百分 比之填料;及選用之添加劑,選自染料、顏料、著色劑、 抗氧化劑、熱安定劑、光安定劑、增塑劑、潤滑劑、流動 改質劑、滴液阻滯劑、阻燃劑、結塊防止劑、抗靜電劑、 流動促進劑、加工助劑、基材黏著劑、脫模劑、韌化劑、 低分佈形態添加劑、應力緩和添加劑及其組合;其中雙酚 A二縮水甘油基醚環氧樹脂與官能性聚(伸芳基醚)於2 $至 65 C下(意即在整個25至65°C範圍内)係以單相存在;其中所 有重量份數係以1〇〇重量份數全部環氧樹脂與雙官能性聚 (伸芳基醚)為基準;其中熟化後之組合物係顯示無切口 k〇d 衝擊強度5至約50%大於具有單官能性聚(伸芳基醚)之相應 組合物’其中無切口 Izod衝擊強度係於抑下根據astm D4812度量,·且其中熟化後之組合物係顯示切口㈣衝擊強 度5至約3〇%大於具有單官能性聚(伸芳基醚)之相應組合 123165 -27- 200821355 物’其中切口 Izod衝擊強度係於25°C下根據ASTMm56度量。 一項具體實施例為可熟化組合物,其包含:約6〇至約9〇 重量份數之雙酚A二縮水甘油基醚環氧樹脂;約1〇至約4〇 重里伤數之雙g此性聚(伸芳基鍵),在氯仿中,於2^°c下度 畺’具有本性黏度為每克約〇·〇6公合,其中聚(伸芳基醚)係 .具有以下結構Aluminum (III) acetyl phthalate; selected from about 2 〇 to about 1 重量% by weight of the filler; and selected additives selected from the group consisting of dyes, pigments, colorants, antioxidants, thermal stabilizers, light Stabilizer, plasticizer, lubricant, flow modifier, drip retarder, flame retardant, agglomeration inhibitor, antistatic agent, flow promoter, processing aid, substrate adhesive, release agent , toughening agent, low-distribution form additive, stress relieving additive, and combinations thereof; wherein bisphenol A diglycidyl ether epoxy resin and functional poly(aryl ether) are from 2 $ to 65 C (meaning Whole in the range of 25 to 65 ° C) in a single phase; wherein all parts by weight are based on 1 part by weight of all epoxy resin and bifunctional poly(arylene ether); The composition shows no incision k〇d impact strength 5 to about 50% greater than the corresponding composition having a monofunctional poly(aryl ether), wherein the non-notched Izod impact strength is determined according to astm D4812, and The composition after curing shows the incision (4) impact strength 5 to about 3〇% is greater than the corresponding combination of monofunctional poly(arylene ether) 123165 -27- 200821355 where the incision Izod impact strength is measured at 25 ° C according to ASTM m56. A specific embodiment is a curable composition comprising: from about 6 to about 9 parts by weight of bisphenol A diglycidyl ether epoxy resin; from about 1 Torr to about 4 angstroms This kind of poly(extension aryl bond), in chloroform, at 2 ° °c 畺 'has a natural viscosity of about 6 gram per gram, 聚 伸 aryl ether) has the following structure

其中各存在之X係獨立為1至約20 ;及約〇·5至約1〇重量份數 之乙醯基丙酮酸鋁(III);其中雙酚人二縮水甘油基醚環氧樹 脂與官能性聚(伸芳基醚)於25至65°C下係以單相存在;其中 所有重里伤數係以100重量份數全部環氧樹脂與雙官能性 聚(伸芳基醚)為基準;其中熟化後之組合物係顯示無切口 Izod衝擊強度5至約50%大於具有單官能性聚(伸芳基醚)之 相應組合物,其中無切口 Izod衝擊強度係於25χ:下根據 ASTM D4812度量;且其中熟化後之組合物係顯示切口 衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之相應 組合物,其中切口Iz〇d衝擊強度係於25它下根據astm Μ% 度量。 另一項具體實施例為可熟化組合物,其包含··約6〇至約 9〇重量份數之雙酚A二縮水甘油基醚環氧樹脂;約⑺至約 4〇重量份數之雙官能性聚(伸芳基醚),在氯仿中,於巧它下 123165 -28- 200821355 度量,具有本性黏度為每克約0.09公合,其中聚(伸芳基醚) 係具有以下結構Each of the X groups independently is from 1 to about 20; and from about 5 to about 1 part by weight of aluminum (III) ethyl acetylacetonate; wherein the bisphenol human diglycidyl ether epoxy resin and functional groups The poly(arylene ether) is present as a single phase at 25 to 65 ° C; wherein all the weight loss is based on 100 parts by weight of the total epoxy resin and the bifunctional poly(arylene ether); Wherein the aged composition exhibits a non-notched Izod impact strength of from 5 to about 50% greater than a corresponding composition having a monofunctional poly(aryl ether) wherein the non-cut Izod impact strength is at 25 Å: measured according to ASTM D4812 And wherein the aged composition exhibits a notched impact strength of from 5 to about 30% greater than a corresponding composition having a monofunctional poly(aryl ether), wherein the incision Iz〇d impact strength is at 25 under it according to astm Μ % metric. Another embodiment is a curable composition comprising from about 6 to about 9 parts by weight of bisphenol A diglycidyl ether epoxy resin; from about (7) to about 4 parts by weight Functional poly((aryl ether)), in chloroform, as measured by 123165 -28-200821355, having a viscosity of about 0.09 Å per gram, wherein the poly(aryl ether) has the following structure

其中各存在之X係獨立為1至約20 ;及約〇·5至約1〇重量份數 之乙醯基丙酮酸鋁(III);其中雙酚Α二縮水甘油基醚環氧樹 脂與官能性聚(伸芳基醚)於25至65°C下係以單相存在;其中 所有重量份數係以100重量份數全部環氧樹脂與雙官能性 聚(伸芳基醚)為基準;其中熟化後之組合物係顯示無切口 Izod衝擊強度5至約50%大於具有單官能性聚(伸芳基醚)之 相應組合物,其中無切口 Izod衝擊強度係於25。〇下根據 ASTM D4812度量;且其中熟化後之組合物係顯示切口 k〇d 衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之相應 組合物,其中切口 Izod衝擊強度係於25t下根據ASTM D256 度量。 另一項具體實施例為可熟化組合物,其包含:約6〇至約 9〇重量份數之雙酚A二縮水甘油基醚環氧樹脂;約」〇至約 4〇重量份數之雙官能性聚(伸芳基醚),在氯仿中,於下 度量’具有本性黏度為每克約〇.12公合,其中聚(伸芳基⑹ 係具有以下結構 123165 •29· 200821355Each of the X groups present independently is from 1 to about 20; and from about 5 to about 1 part by weight of aluminum (III) ethyl acetylacetonate; wherein the bisphenol bis diglycidyl ether epoxy resin and functional groups The poly(arylene ether) is present as a single phase at 25 to 65 ° C; wherein all parts by weight are based on 100 parts by weight of all epoxy resin and bifunctional poly(arylene ether); The composition after curing shows a non-notched Izod impact strength of 5 to about 50% greater than a corresponding composition having a monofunctional poly(aryl ether) wherein the uncut Izod impact strength is at 25. The underarm is measured according to ASTM D4812; and wherein the aged composition exhibits a notch k〇d impact strength of 5 to about 30% greater than a corresponding composition having a monofunctional poly(aryl ether), wherein the incision Izod impact strength is Measured according to ASTM D256 at 25t. Another embodiment is a curable composition comprising: from about 6 to about 9 parts by weight of bisphenol A diglycidyl ether epoxy resin; from about 〇 to about 4 parts by weight Functional poly((aryl ether)), in chloroform, measured as having a viscosity of about 1212.12 gram per gram, wherein poly(aryl) (6) has the following structure 123165 •29· 200821355

之乙醯基丙酮酸鋁(m);其中雙酚A二縮水甘油基醚環氧樹 脂與官能性聚(伸芳基醚)於25至65。〇下係以單相存在;其中 所有重量份數係以1〇〇重量份數全部環氧樹脂與雙官能性 聚(伸芳基醚)為基準;其中熟化後之組合物係顯示無切口 Izod衝擊強度5至約50%大於具有單官能性聚(伸芳基醚)之 相應組合物,其中無切口 Izod衝擊強度係於25°C下根據 ASTM D4812度量;且其中熟化後之組合物係顯示切口 iz〇d 衝擊強度5至約30%大於具有單官能性聚(伸芳基醚)之相應 組合物,其中切口Izod衝擊強度係於25。〇下根據ASTM m56 度量。 一項具體實施例為一種製備可熟化組合物之方法,其包 括··將環氧樹脂、在氯仿中於25艺下度量具有本性黏度為 每克約0.03至約〇·2公合之雙官能性聚(伸芳基醚)及有效使 環氧樹脂熟化量之熟化促進劑摻合;其中熟化後之組合物 係顯示無切口 Izod衝擊強度至少5%大於具有單官能性聚 (伸芳基醚)之相應組合物,其中無切口 Iz〇d衝擊強度係於% C下根據ASTM D4812度量。在一些具體實施例中,此組合 物包括藉由加熱至低於或等於1〇{rc之溫度,形成包含環氧 樹脂與雙官能性聚(伸芳基醚)之單相。 123165 -30- 200821355 200821355The aluminum acetylacetonate (m); wherein the bisphenol A diglycidyl ether epoxy resin and the functional poly(aryl ether) are between 25 and 65. The underarm is present as a single phase; all parts by weight are based on 1 part by weight of all epoxy resin and bifunctional poly(arylene ether); wherein the aged composition shows no-cut Izod The impact strength is from 5 to about 50% greater than the corresponding composition having a monofunctional poly(aryl ether) wherein the non-cut Izod impact strength is measured at 25 ° C according to ASTM D4812; and wherein the aged composition is shown The incision iz〇d has an impact strength of from 5 to about 30% greater than the corresponding composition having a monofunctional poly(aryl ether) wherein the incision Izod impact strength is at 25. Your arm is measured according to ASTM m56. A specific embodiment is a method of preparing a curable composition comprising: an epoxy resin having a viscosities of from about 0.03 to about 〇2 gram per gram in chloroform at 25 degrees a poly (n-aryl ether) and a curing accelerator effective to make the epoxy resin ripening amount; wherein the aged composition exhibits a non-notched Izod impact strength of at least 5% greater than having a monofunctional poly(aryl ether) Corresponding compositions wherein the non-notched Iz〇d impact strength is measured at % C according to ASTM D4812. In some embodiments, the composition comprises forming a single phase comprising an epoxy resin and a difunctional poly(strandyl ether) by heating to a temperature of less than or equal to 1 Torr. 123165 -30- 200821355 200821355

適=使可熟化組合㈣化之條件係M因素而定, 、、衣氧树月曰之身分與濃度,及熟化促進劑之身分與量。 適當热化條件可包括曝露至約12〇至約25叱之溫度,歷經約 刀鐘至約24小時之時間。在上述時間範圍内,熟化溫度 :為至少約15(TC,或至少約就,或至少約以叱。如下文 員施例中所证貫,熟化可在不同溫度下,於一系列之兩個 ^夕個v驟中進仃。熟諸熱固性樹脂技藝者係能夠測定適 田热化tr'件,無需過度實驗。在一些具體實施例中,組合 物可、經部份熟化。但是,本文對"經熟化組合物”或,,熟化^ 組合物”性質之指冑,一般係指實質上經充分熟化之組合 物。熟諳熱塑性樹脂技藝者可測定試樣是否實質上經充分 熟化,無需過度實驗。例如,吾人可藉示差掃描切法: 析試樣,以尋找分析期間所發生其他熟化之放熱指標。實 質上經充分熟化之試樣將在此種分析中顯示極少或無 埶。 …、Appropriate = The conditions for the ripening combination (4) are determined by the M factor, the identity and concentration of the moon, and the identity and quantity of the curing accelerator. Suitable heating conditions can include exposure to a temperature of from about 12 Torr to about 25 Torr over a period of from about knives to about 24 hours. In the above time range, the curing temperature is at least about 15 (TC, or at least about, or at least about 叱. As evidenced by the following example, the ripening can be at different temperatures, in a series of two ^ In the case of a thermosetting resin, the skilled person can determine the suitable heating element, without undue experimentation. In some embodiments, the composition can be partially cured. However, this article refers to &quot The term "cooking composition" or "curing composition" refers to a composition which is substantially fully cured. The skilled thermoplastic resin artist can determine whether the sample is substantially fully matured without undue experimentation. For example, we can use the differential scanning method to analyze the sample to find other indicators of heat generation during the analysis. The substantially fully matured sample will show little or no flaw in this analysis.

本發明係延伸至使任何上述組合物熟化時所獲得之經熟 化組合物。本發明亦延伸至包含此種經熟化組合物之物 件。經熟化組合物係特別適用於製造電子層板、預浸潰體 及電路板。該組合物亦可使用於消音物、包封物、結構複 合物、粉末與液體塗料及高溫黏著劑中。 设 【實施方式】 本發明係藉下述非限制性實例進一步說明。 實例1-10,比較實例M2 將十個說明使用雙官能性低分子量聚(伸芳基醚類)於環 123165 -31 - 200821355 乳樹脂中之發明實例,與七個說明使用單官能性低分子量 聚(伸芳基醚類)於環氧樹脂中之比較實例,四個說明使用 無官能性低分子量聚(伸芳基醚類)於環氧樹脂中之比較實 例,及一個僅使用環氧樹脂之比較實例作比較。雙酚A二 縮水甘油基_(,,BPA環氧基,,)係以DER 332環氧樹脂得自D〇w 化學公司。二種雙官能性聚(伸芳基醚)樹脂係被稱為"ppE, 〇·12, biM·’’、’’PPE,〇.〇9, bi趾”及 TPE,0.06, bi&l·",其中 ία ”〇.〇9”及"0.06”係指樹脂之本性黏度,以每克之公合數表示。 兩、種單官能性聚(伸芳基醚)樹脂係被稱為"ppE,〇 m〇n〇fid,, 與’’PPE,0.12 monofid·”,而無官能性㈣酐封端之樹脂係被稱 為丨,PPE,0.06 nonfkl·’’。 雙g忐性聚(伸芳基鱗)樹脂係藉由2,6_二甲齡與2,2_雙卩,5_ 二甲基斗羥基)丙烷之氧化共聚合作用製成,以形成具有所 要本性黏度與每分子大約兩個羥基之共聚物。關於此方法 之詳細程序係描述於2005年12月2〇日提出申請之美國專利 申請案序號11/298,182中。 單B能性聚(伸芳基醚)樹脂係藉由2,6_二甲酚之均聚合作 用製成,以形成具有所要本性黏度與每分子大約一個羥基 之聚(2,6_二甲基-1,4-伸苯基醚)。 無官能性”(經醋酸酯封端)聚(伸芳基醚)係藉由用於製 備每克0.06公合(公合/克)單官能性聚(伸芳基醚)之相同方 法製成,惟產物聚(2,6-二甲基-i,4-伸苯基醚)之羥基係經由與 醋酸酐於4·(二甲胺基风啶觸媒存在下反應,而被醋酸酯封 端’如下述。在80°C下,使單官能性0·06公合/克聚(2,6_二甲 123165 -32 - 200821355 基-1,4-伸苯基醚)(1500克)溶於1100克曱苯中,並添加3〇克 4-(二甲胺基风啶與300克醋酸酐。於攪拌6小時後,使溶液 冷卻,並在甲醇中藉沉澱作用單離樹脂C,且乾燥。 本性黏度係於25°C下,在氯仿中,於已在i25°C及真空下 經乾燥1小時之聚(伸芳基醚)試樣上度量。 - 分子量分佈係藉由凝膠滲透層析(GPC)測定。層析系統係 • 包括Agilent系列noo系統,包括恒定組成泵、自動取樣器、 恒温管柱隔室及多波長偵測器。溶離溶劑為氯仿,每百萬 •伤重1比具有50份二-正-丁基胺。試樣溶液係經由使〇 〇1克、 試樣溶於20毫升氯仿中而製成,使用甲苯(每升〇 25毫升) 作為内部標記物。於GPC分析之前,使試樣溶液經過Gdman 〇·45微量注射濾器過濾;未進行其他試樣製備。注射體積為 50微升,並將溶離劑流率設定在1毫升/分鐘下。將兩個串 聯連接之聚合體實驗室GPC管柱(Phenogel 5微米線性(2),300 X 7.80耄米)使用於試樣之分離。偵測波長係被設定在28〇毫微 0 米下。使用具有整合GPC數據分析軟體之Agilent chemStati〇n 獲取並處理數據。將分子量分佈結果以聚苯乙烯標準物校 準。其結果係以”Mn(AMU),,與”MW(AMU)"作報告,而無任何 修正。 . 玻螭轉移溫度(Ts)係藉由動態機械分析(DMA),使用PerkinThe present invention extends to a cured composition obtained when the above composition is matured. The invention also extends to articles comprising such aged compositions. The cured composition is particularly useful in the manufacture of electronic laminates, prepregs, and circuit boards. The compositions can also be used in silencers, encapsulants, structural composites, powder and liquid coatings, and high temperature adhesives. [Embodiment] The present invention is further illustrated by the following non-limiting examples. Examples 1-10, Comparative Example M2 Ten examples of the invention using bifunctional low molecular weight poly(aryl ethers) in the ring 123165 -31 - 200821355 milk resin, and seven instructions using monofunctional low molecular weight Comparative examples of poly(arylene ethers) in epoxy resins, four examples of comparisons using non-functional low molecular weight poly(aryl ethers) in epoxy resins, and one using only epoxy resins Comparison examples are compared. Bisphenol A diglycidyl _ (,, BPA epoxy, 、) was obtained from D〇w Chemical Co., Ltd. as DER 332 epoxy resin. The two bifunctional poly(aryl ether) resins are called "ppE, 〇·12, biM·', ''PPE, 〇.〇9, bi toe' and TPE, 0.06, bi&l ·", where ία ”.〇9” and "0.06” refer to the inherent viscosity of the resin, expressed in gram of gram. Two kinds of monofunctional poly(aryl ether) resins are called "ppE, 〇m〇n〇fid, and ''PPE, 0.12 monofid·', and no functional (tetra) anhydride-terminated resin It is called 丨, PPE, 0.06 nonfkl·''. The double g 聚 poly (extended aryl scale) resin is made of 2,6_dimethyl and 2,2_biguanide, 5-dimethyl hydroxy Oxidative copolymerization of propane to form a copolymer having a desired viscosity and about two hydroxyl groups per molecule. The detailed procedure for this method is described in the U.S. Patent Application filed on Dec. 2, 2005. No. 11/298,182. The mono-B energy poly((aryl ether) resin is prepared by homopolymerization of 2,6-xylenol to form a desired viscosity and about one hydroxyl group per molecule. Poly(2,6-dimethyl-1,4-phenylene ether). Non-functional" (acetate-terminated) poly(arylene ether) is used to prepare 0.06 metric gram per gram ( The same method as the monofunctional poly(arylene ether), but the hydroxy group of the product poly(2,6-dimethyl-i,4-phenylene ether) is via acetic acid The reaction is carried out in the presence of a dimethylamine-based aerane catalyst, and is blocked by an acetate as follows. At 80 ° C, a monofunctionality of 0·06 com / gram of poly (2, 6 _ A 123165 -32 - 200821355 keto-1,4-phenylene ether) (1500 g) was dissolved in 1100 g of toluene, and 3 g of 4-(dimethylamine anthracene and 300 g of acetic anhydride were added. After stirring for 6 hours, the solution was allowed to cool, and the mixture was separated from the resin C by precipitation in methanol, and dried. The inherent viscosity was dried at 25 ° C in chloroform at i25 ° C under vacuum for 1 hour. Measurements on poly(arylene ether) samples. - Molecular weight distribution is determined by gel permeation chromatography (GPC). Chromatography system • Includes Agilent series noo system, including constant composition pump, autosampler, thermostat The column compartment and multi-wavelength detector. The solvent is chloroform, and there are 50 parts of di-n-butylamine per million weight loss. The sample solution is dissolved in 1 gram of sample. Made with 20 ml of chloroform, using toluene (25 ml per liter) as an internal marker. The sample solution was passed through Gdman 〇·45 micro before GPC analysis. Injection filter filtration; no other sample preparation was performed. The injection volume was 50 μl and the eluent flow rate was set at 1 mL/min. Two polymer lab GPC columns connected in series (Phenogel 5 micron linear) (2), 300 X 7.80 )m) used for sample separation. The detection wavelength is set at 28 〇 nanometer 0 m. Data is acquired and processed using Agilent chemStati〇n with integrated GPC data analysis software. The molecular weight distribution results were calibrated with polystyrene standards. The results were reported as "Mn(AMU), and "MW(AMU)" without any correction. The glass transition temperature (Ts) is based on dynamic mechanical analysis (DMA) using Perkin

ElmerDMA7e儀器與5°C/分鐘之加熱速率測定。 鬈(伸芳基醚)係藉由質子核磁共振光譜學(1H NMR)分 析,以測定絕對數目平均分子量,與羥基末端基之濃度(以 每百萬份重量比之份數表示)。内部單位(包含2,6_二甲基 123165 •33· 200821355 -1,4-伸苯基醚單位、衍生自3,3’,5,5f-四甲基-4,4’-雙酚之二價基 團及衍生自2,2-雙(3,5-二曱基-4-羥基)丙烷之二價單位)與末 端單位(包含2,6-二甲基-1-羥基-苯-4-基單位、2,6-二甲基-苯-1-基單位、衍生自2,2-雙(3,5-二甲基-4-羥基)丙烷之單價酚性單 位及衍生自2,6-二甲酚與二丁基胺觸媒之單價二丁基胺取 代之酚性基團)之相對量,係藉由將有關聯之共振積分,且 對會導致共振之質子數作調整而測得。然後,以内部單位 與總末端單位之相對量為基礎,計算數目平均分子量之 值。羥端基含量之值係以末端酚性基團及總末端與内部單 位之相對量為基礎計算而得。羥基(OH)含量之值係以每百 萬份重量比之份數(ppm)表示,其中經基係被指定為每莫耳 分子量17克。”官能基度”為每分子聚(伸芳基醚)之羥基平 均數目。官能基度係根據下式計算而得 官能基度=2*莫耳OH-末端基/(所有末端基之莫耳) 其中”莫耳OH-末端基”為羥基末端基之莫耳數,而”所有末 端基之莫耳”為所有末端基之莫耳數,其包括羥基末端基及 所謂"尾部基團n,其在此情況中為2,6-二甲基苯基。 聚(伸芳基醚)性質係摘述於表1中。關於無官能性樹脂之 零官能基度值係以50 ppm之羥基含量上限為基準,藉由 Fourier變換紅外線光譜學(FTIR),以2,6-二甲酚標準物測定。 表1 PPE,0.12, bifid· PPE,0.09, bifxl. PPE,0.06, bifid. IV (公合/克) 0.116 0.087 0.067 Mn(AMU) 1921 1198 799 123165 -34- 200821355 MW(AMU) 4378 2477 1690 Mw/Mn 2.28 2.07 2.12 Tg(°c ) 147.8 115.8 99.6 絕對Mn 2747 1551 1183 羥基含量(ppm) 11900 21800 28200 官能基度 1.9 1.91 1.92 表1 (續) PPE,0.12, monofxl. PPE,0.06, monofxl. PPE, 0.06, nonfid. IV (公合/克) 0.124 0.062 .064 Mn(AMU) 1964 886 — MW(AMU) 5148 1873 — Mw/Mn 2.62 2.11 — \ ig、。) 157.9 95.9 — 絕對Μη 2294 1133 — 羥基含量(ppm) 8400 16000 -- 官能基度 1.12 1.05 0The Elmer DMA7e instrument was measured with a heating rate of 5 ° C / min. Anthracene (arylene ether) was analyzed by proton nuclear magnetic resonance spectroscopy (1H NMR) to determine the absolute number average molecular weight and the concentration of the hydroxyl end group (expressed in parts per million by weight). Internal unit (containing 2,6-dimethyl 123165 •33· 200821355 -1,4-phenylene ether unit, derived from 3,3',5,5f-tetramethyl-4,4'-bisphenol a divalent group and a divalent unit derived from 2,2-bis(3,5-dimercapto-4-hydroxy)propane) and a terminal unit (containing 2,6-dimethyl-1-hydroxy-benzene- 4-based units, 2,6-dimethyl-phenyl-1-yl units, monovalent phenolic units derived from 2,2-bis(3,5-dimethyl-4-hydroxy)propane and derived from 2 The relative amount of the monovalent dibutylamine substituted phenolic group of 6-xylenol and dibutylamine catalyst is determined by integrating the associated resonance and adjusting the number of protons that cause resonance. And measured. Then, based on the relative amounts of internal units and total end units, the value of the number average molecular weight is calculated. The value of the hydroxyl end group content is calculated based on the relative amount of the terminal phenolic group and the total terminal and internal units. The value of the hydroxyl (OH) content is expressed in parts per million by weight (ppm), wherein the basis is specified to be 17 g per mole of molecular weight. The "functionality" is the average number of hydroxyl groups per molecule of poly(arylene ether). The functional group is calculated according to the following formula: the degree of functional group = 2 * mo OH - terminal group / (mole of all terminal groups) wherein "mol OH - terminal group" is the molar number of the hydroxyl terminal group, and "Mole of all terminal groups" is the molar number of all terminal groups including a hydroxyl end group and a so-called "tail group n, which in this case is 2,6-dimethylphenyl. The poly(n-aryl ether) properties are summarized in Table 1. The zero-functionality value of the non-functional resin was determined by Fourier transform infrared spectroscopy (FTIR) using a 2,6-xylenol standard based on the upper limit of the hydroxyl group content of 50 ppm. Table 1 PPE, 0.12, bifid· PPE, 0.09, bifxl. PPE, 0.06, bifid. IV (common/gram) 0.116 0.087 0.067 Mn(AMU) 1921 1198 799 123165 -34- 200821355 MW(AMU) 4378 2477 1690 Mw /Mn 2.28 2.07 2.12 Tg(°c ) 147.8 115.8 99.6 Absolute Mn 2747 1551 1183 Hydroxyl content (ppm) 11900 21800 28200 Functionality 1.9 1.91 1.92 Table 1 (continued) PPE, 0.12, monofxl. PPE, 0.06, monofxl. PPE , 0.06, nonfid. IV (common/gram) 0.124 0.062 .064 Mn(AMU) 1964 886 — MW(AMU) 5148 1873 — Mw/Mn 2.62 2.11 — \ ig. 157.9 95.9 — Absolute Μη 2294 1133 — Hydroxyl content (ppm) 8400 16000 -- Functionality 1.12 1.05 0

所有可熟化組合物均在90°C下,經由使聚(伸芳基醚),若 具有時,溶於BPA環氧樹脂中而製成。接著添加熟化促進 劑,乙醯基丙酮酸鋁(得自Acros有機物質,目錄編號 AC19697),並充分地混合。使混合物在100°C及7.4千巴斯卡 (kPa)下脫氣,然後倒入已被預熱至100°C之模具中。將經充 填之模具置於150°C下之烘箱中90分鐘。然後,將烘箱溫度 增加至175°C。於60分鐘後,將溫度增加至200°C。於另外60 分鐘後,將烘箱温度增加至220°C。於另外60分鐘後,將烘 箱關閉,並使模具在烘箱内部冷卻過夜至室溫。將經熟化 板塊自模具移除,並切成待測試樣。試樣厚度為3.175毫米 (1/8英吋)。切割機式樣為以158189 MK-100瓷磚鋸得自MK金 123165 -35- 200821355 剛石產物公司之金剛石輪潤濕鋸子。刀片為ΜΚ-225,25.4 公分(i〇英忖)直徑金剛石刀片,具有厚度為1.27毫米_英 子)為使&著切剎邊緣之任何碎片降至最低,當切割時, 係將試樣置於塑膠或木材背襯材料上。所有組合物均摘述 於表2中,其中所有成份量均以重量份數(Pbw)表示。 密度係根據ASTMD792-00,方法a,在水中,於23〇c下度 量。 熱撓曲度值,以攝氏度數表示,係根據ASTM D 648-06, 方法B,使用〇·45耳萬巴斯卡力,在具有寬度為〗^公分(〇.5 央吋)與深度為3.175毫米(〇·ΐ25英吋)之試樣上自動地度 量。浸潰媒質為矽氧流體。試驗係經由將最初在2;rc溫度 下之次潰媒質,於每分鐘2。〇之速率下加熱而進行。 無切口 Izod衝擊強度值,以每米之焦耳數(J/m)表示,係於 23 C下,根據ASTM D 4812·06,使用具有寬度為j 27公分(〇 5 英吋)與厚度為3.175毫米(0.125英吋)之試樣度量。試樣係切 割自上述模製棒塊。所使用之裝置具有含〇9〇7千克(2磅)擊 鍵之擺錘。 切口 Izod衝擊強度係根據ASTMd 256-〇6,方法Α,於23。〇 下,使用0·907千克(2.00磅)擊鎚度量,且試樣具有切口,以 致最初L27公分(0.5英吋)深度之至少公分(〇·4英吋)仍然 留在切口下方。試樣係於切凹口後,在23〇c下經調理24小 時。 介電常數("Dk")值與散逸因數("Df")值,係於23t:下,根據 ASTM D 150-98(2004)度量。試樣為矩形柱,具有尺寸5公分χ 5 123165 -36 - 200821355 公分x 3.175毫米。試樣係於測試前在23°c及50%相對濕度下 經調理最少十二小時。度量電池為Hewlett-Packard阻抗材料分 析器4291B型,且具有尺寸27.5公分寬X 9.5公分高X 20.5公分 深。電極為Hewlett-Packard 16453A型,且直徑為7毫米。當施 加DC電壓至介電材料時,度量係使用掃描一範圍頻率之電 > 容方法進行。外加電壓在1 MHz至1 Ghz之頻率範圍下為0.2 Λ mV (rms)至IV (rms)。在表2中,介電常數與散逸因數值係在 頻率為100百萬赫茲、500百萬赫茲及1十億赫茲下作報告。 ® 性質值係摘述於表2中。All of the curable compositions were prepared at 90 ° C by dissolving the poly(aryl ether), if present, in a BPA epoxy resin. Next, a curing accelerator, aluminum acetylacetonate (available from Acros organic material, catalog number AC19697) was added and thoroughly mixed. The mixture was degassed at 100 ° C and 7.4 thousand Bass (kPa) and then poured into a mold which had been preheated to 100 ° C. The filled mold was placed in an oven at 150 ° C for 90 minutes. Then, the oven temperature was increased to 175 °C. After 60 minutes, the temperature was increased to 200 °C. After an additional 60 minutes, the oven temperature was increased to 220 °C. After an additional 60 minutes, the oven was closed and the mold was allowed to cool inside the oven overnight to room temperature. The matured plate is removed from the mold and cut into samples to be tested. The sample thickness is 3.175 mm (1/8 inch). The cutter was modeled from 158189 MK-100 tile saw from MK Gold 123165 -35- 200821355 Rhombus Products' diamond wheel wetting saw. The blade is a ΜΚ-225, 25.4 cm (i〇 inch) diameter diamond blade with a thickness of 1.27 mm _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ On plastic or wood backing materials. All compositions are summarized in Table 2, in which all ingredients are expressed in parts by weight (Pbw). Density is measured in water at 23 ° C according to ASTM D792-00, Method a. The value of the heat deflection, expressed in degrees Celsius, is in accordance with ASTM D 648-06, Method B, using 〇·45 Å, and has a width of 〖^ cm (〇.5 吋) and depth The sample was automatically measured on a sample of 3.175 mm (〇·ΐ25 inches). The impregnating medium is a helium oxygen fluid. The test was performed at a temperature of 2 at a temperature of 2; rc at a rate of 2 per minute. The heating is carried out at a rate of 〇. No-cut Izod impact strength value, expressed in joules per meter (J/m), at 23 C, according to ASTM D 4812·06, having a width of 27 cm (〇5 吋) and a thickness of 3.175 Sample measurement in millimeters (0.125 inch). The sample was cut from the molded rod block described above. The device used has a pendulum containing 〇9〇7 kg (2 lb) keystrokes. The incision Izod impact strength is according to ASTMd 256-〇6, Method Α, at 23. Under the crucible, a 0.907 kg (2.00 lb) hammer was used and the specimen had a cut so that at least the centimeter (〇4 inch) of the initial L27 cm (0.5 inch) depth remained below the incision. The sample was placed in a notch and conditioned at 23 ° C for 24 hours. The dielectric constant ("Dk") value and the dissipation factor ("Df") value are measured at 23t: according to ASTM D 150-98 (2004). The sample is a rectangular column with dimensions of 5 cm χ 5 123165 -36 - 200821355 cm x 3.175 mm. The samples were conditioned for at least 12 hours at 23 ° C and 50% relative humidity prior to testing. The measuring cell was a Hewlett-Packard impedance material analyzer type 4291B and had a size of 27.5 cm wide X 9.5 cm high X 20.5 cm deep. The electrode was of the Hewlett-Packard Model 16453A and was 7 mm in diameter. When a DC voltage is applied to the dielectric material, the measurement is performed using an electrical > method of scanning a range of frequencies. The applied voltage is 0.2 Λ mV (rms) to IV (rms) over the frequency range of 1 MHz to 1 Ghz. In Table 2, the dielectric constant and the dissipation factor values are reported at frequencies of 100 megahertz, 500 megahertz, and 1 billion Hz. The property values are summarized in Table 2.

123165 -37- 200821355123165 -37- 200821355

<N< 1比較實例4 1 〇 〇 〇 ο ο ο ΙΟ (Ν 1.1570 (N 〇\ 5 r-H 48.5 2.872 2.810 2.769 | 0.011 0.011 0.010 實例3 〇 〇 〇 ο ο ο CN | 1.1811 | r-H (Ν ν〇 τ-Η 1 218 1 53.4 2.861 2.797 2.754 0.011 0.011 0.009 比較實例3 § 〇 〇 ο ο ο (Ν | 1.1587 | τ—1 芝 00 (N τ—H 44.2 2.910 2.837 2.805 0.012 0.011 0.011 實例2 § 〇 〇 ο ο ο (Ν 1.1674 Η 47.4 2.913 2.821 2.787 0.011 0.011 0.010 比較實例2 〇 〇 T-H 〇 ο ο ο (Ν 1.1698 τ-Η ΟΝ 寸 r-H 38.3 2.940 2.867 2.850 0.013 0.012 0.012 實例1 〇 〇 〇 ο ο ο (Ν | 1.1785 I 寸 〇 r-^ 41.2 2.933 2.853 2.824 0.013 | 0.012 0.012 比較實例1 〇 ?—4 〇 〇 〇 ο ο ο ΙΤι 1.1883 00 τ-Η r-H 34.7 2.96 2.90 2.89 0.014 0.013 0.013 組合物 BPA環氧基 PPE? 0,12, bifxl. PPE,0.12, monofkl. PPE,0.06, bifkl· § ο S r\ Ο Ρη § ο Μ Ρη Ρη ΡΡΕ,0.09, bifkl. 乙酸基丙嗣酸在呂 性質 密度(克/立方公分) Β Η° HDT @0.45 MPa (°C ) 無切口 Izod (J/m) 切口 Izod (J/m) Dk@100 MHz Dk@500 MHz Dk@l GHz Df@100 MHz Df@500 MHz Df@l GHz 123165 -38- 200821355<N< 1 Comparative Example 4 1 〇〇〇ο ο ο ΙΟ (Ν 1.1570 (N 〇\ 5 rH 48.5 2.872 2.810 2.769 | 0.011 0.011 0.010 Example 3 〇〇〇ο ο ο CN | 1.1811 | rH (Ν ν〇 τ-Η 1 218 1 53.4 2.861 2.797 2.754 0.011 0.011 0.009 Comparative Example 3 § 〇〇ο ο ο (Ν | 1.1587 | τ—1 芝00 00 (N τ—H 44.2 2.910 2.837 2.805 0.012 0.011 0.011 Example 2 § 〇〇ο ο ο Ν 674 674 674 674 674 674 674 674 674 1.1785 I inch 〇r-^ 41.2 2.933 2.853 2.824 0.013 | 0.012 0.012 Comparative Example 1 〇?—4 〇〇〇ο ο ο ΙΤι 1.1883 00 τ-Η rH 34.7 2.96 2.90 2.89 0.014 0.013 0.013 Composition BPA epoxy PPE? 0,12, bifxl. PPE,0.12,monofkl. PPE,0.06, bifkl· § ο S r\ Ο Ρη § ο Μ Ρη Ρη ΡΡΕ,0.09, bifkl. Acetylpropionic acid density in gram/gram centimeter ) Β Η° HDT @0.4 5 MPa (°C) without slit Izod (J/m) slit Izod (J/m) Dk@100 MHz Dk@500 MHz Dk@l GHz Df@100 MHz Df@500 MHz Df@l GHz 123165 -38- 200821355

ί) ί 比較 實例12 § 〇 〇 ο ο ο ο in (Ν I t 1 (Μ cn 17.7 I 1 2 1 I 1 1 1 1 1 比較 實例11 § 〇 〇 ο ο ο ο γ4 1 1.1549 1 j 1—Η 155.2 42.1 2.799 2.745 2.731 0.009 0.009 0.009 實例7 〇 〇 ο ο ο ο (Ν 11.14941 1 1 00 1 199.5 I 47.1 2.806 2.752 2.736 0.010 0.010 0.009 比較 實例10 〇 〇 〇 ο ο 沄 ο in (Ν i 1 1 oo m 113.2 29.1 I 1 1 I 1 1 1 1 1 1 1 比較 實例9 〇 〇 〇 ο 沄 ο ο (Ν 1 1.1615 I 1 1 145.1 40.5 2.852 2.800 2.780 0.010 0.010 0.010 實例6 〇 〇 〇 ο ο ο ο in <Ν 1,1581 1 1 \〇 r—< 169.1 45.0 2.846 2.790 2.768 0.011 0.011 0.010 比較 實例8 § 〇 〇 ο ο 宕 ο 04 1 1 I m 135.3 25.4 1 I 1 1 1 瞧 1 i 1 1 t 比較 實例7 § 〇 〇 ο 异 ο ο CN | 1.1692 | 1 1 T-H 125.4 1 < oo 2.893 2.826 2.801 0.011 0.011 0.011 實例5 § 〇 〇 异 ο ο ο (Ν | 1.1670 | 1 1 l—H t-H 143.5 41.6 2.875 | 2.817 2.786 0.012 0.012 0.011 比較 實例6 〇 〇 ο ο ο ο CN 1 1 1 1 r-H 147.8 18.9 I 1 1 1 1 1 1 I I 簾 1 雇 比較 實例5 〇 〇 ο ο Η Ο ο (Ν ! 1.1787 | 1 1 等 r—H 108.6 35.6 2.917 2.845 2.816 0.013 0.012 0.012 實例4 〇 〇 ο 1—Η ο ο ο (Ν 1.1784 1 1 1 147 121.4 38.1 2.904 2.840 2.807 0.013 0.013 0.012 組合物 BPA環氧基 ΡΙΈ,0,12, bifid. PPE,0.12, monofkl. 3 c\ Ο ω Ρ-. 〇Η ΡΡΕ,0.06, monofkl· 3 α § § ω ο. 〇4 ΡΡΕ,0.09, bifkl. 乙醯基丙酮酸铭 性質 密度(克/立方公分) P vs^ η" HDT @0.45 MPa (°C ) 無切口 Izod (J/m) 切口 Izod (J/m) Dk@100 MHz Dk@500 MHz Dk@l GHz Df@100 MHz Df@500 MHz Df@l GHz 123165 -39- 200821355 表2 (續)ί) ί Comparative Example 12 § 〇〇ο ο ο ο in (Ν I t 1 (Μ cn 17.7 I 1 2 1 I 1 1 1 1 1 Comparative Example 11 § 〇〇ο ο ο ο γ4 1 1.1549 1 j 1— Η 155.2 42.1 2.799 2.745 2.731 0.009 0.009 0.009 Example 7 〇〇ο ο ο ο (Ν 11.14941 1 1 00 1 199.5 I 47.1 2.806 2.752 2.736 0.010 0.010 0.009 Comparative Example 10 〇〇〇ο ο 沄ο in (Ν i 1 1 oo m 113.2 29.1 I 1 1 I 1 1 1 1 1 1 1 Comparative Example 9 〇〇〇ο 沄ο ο (Ν 1 1.1615 I 1 1 145.1 40.5 2.852 2.800 2.780 0.010 0.010 0.010 Example 6 〇〇〇ο ο ο ο in &lt ;Ν 1,1581 1 1 \〇r—< 169.1 45.0 2.846 2.790 2.768 0.011 0.011 0.010 Comparative Example 8 § 〇〇ο ο 宕ο 04 1 1 I m 135.3 25.4 1 I 1 1 1 瞧1 i 1 1 t Compare Example 7 § 〇〇ο异ο ο CN | 1.1692 | 1 1 TH 125.4 1 < oo 2.893 2.826 2.801 0.011 0.011 0.011 Example 5 § ο ο ο ο (Ν | 1.1670 | 1 1 l—H tH 143.5 41.6 2.875 2.817 2.786 0.012 0.012 0.011 Comparative Example 6 〇〇ο ο ο ο CN 1 1 1 1 r -H 147.8 18.9 I 1 1 1 1 1 1 II Curtain 1 Employment comparison example 5 〇〇ο ο Η Ο ο (Ν ! 1.1787 | 1 1 et r-H 108.6 35.6 2.917 2.845 2.816 0.013 0.012 0.012 Example 4 〇〇ο 1 —Η ο ο ο (Ν 1.1784 1 1 1 147 121.4 38.1 2.904 2.840 2.807 0.013 0.013 0.012 Composition BPA epoxy oxime, 0,12, bifid. PPE, 0.12, monofkl. 3 c\ Ο ω Ρ-. 〇Η ΡΡΕ,0.06, monofkl· 3 α § § ω ο. 〇4 ΡΡΕ,0.09, bifkl. Ethylpyruvate Intrinsic Density (g/cm ^ 3 ) P vs^ η" HDT @0.45 MPa (°C ) No slit Izod (J/m) incision Izod (J/m) Dk@100 MHz Dk@500 MHz Dk@l GHz Df@100 MHz Df@500 MHz Df@l GHz 123165 -39- 200821355 Table 2 (continued)

實例8 實例9 實例10 組合物 BPA環氧 90 80 70 PPE? 0.12, bifxl. 0 0 0 PPE5 0.12, monofxl. 0 0 0 PPE,0 06, bifid. 0 0 0 PPE? 0.06, monofxl. 0 0 0 PPE, 0.06? nonfxl. 0 0 0 PPE,0.09, bifkl· 10 20 30 乙醯基丙酮酸1呂 2.5 2.5 2.5 性質 密度(克/立方公分) 1.1772 1.1676 1.1568 Tg(°c ) 152 157 158 [email protected] MPa (°C ) 149 154 160 無切口 Izod (J/m) 147.7 186.4 209.2 切口 Izod (J/m) 39.5 45.4 49.5 Dk@100 MHz 2.94 2.92 2.89 Dk@500 MHz 2.87 2.85 2.83 Dk@l GHz 2.82 2.81 2.79 Df@100 MHz 0.012 0.012 0.011 Df@500 MHz 0.012 0.012 0.010 Df@l GHz 0.010 0.010 0.009 使用被保持恒定在0.12公合/克下之聚(伸芳基醚)本性黏 度,聚(伸芳基醚)類型(單官能性對雙官能性)與量(每100 重量份數全部環氧基與聚(伸芳基醚)之10, 20及30重量份 數)之作用,係從實例1-3與比較實例1-4之比較得到証實。 比較實例1含有未具有聚(伸芳基醚)之經熟化環氧樹脂。在 相等聚(伸芳基醚)含量下,數據顯示含具有0.12公合/克之 雙官能性聚(伸芳基醚)之環氧樹脂(實例1-3),係比使用單 123165 -40- 200821355 官能性聚(伸芳基醚類)製成之環氧樹脂(比較實例2_4)顯示 較佳性質。明確言之’無切口 Iz〇d衝擊強度係實質上且令 人意外地經改良,且顯著改良係在玻璃轉移溫度、熱撓曲 溫度、切口 Izod衝擊強度及介電常數中見及。此外,雙官 能性聚(伸芳基醚)之漸增含量係與在玻璃轉移溫度(Tg)、熱 撓曲溫度(HDT)、無切口與切口 Izod衝擊強度、介電常數(Dk) 及散逸因數(Df)上之改良有關聯。 _ 使用被保持恒定在0·〇6公合/克下之聚(伸芳基醚)本性黏 度,聚(伸芳基醚)類型(無官能性對單官能丨生對雙官能性) 與量(每100重量份數全部環氧基與聚(伸芳基醚)之1〇, 2〇, 3〇 及40重量份數)之作用,係從實例‘7與比較實例542之比較 得到註實。在相等聚(伸芳基醚)含量下,數據顯示含有〇〇6 雙官能性聚(伸芳基醚)之環氧樹脂組合物(實例4_7)係比使 用皁官能性聚(伸芳基醚類)製成之環氧樹脂組合物(比較 貫例5, 7, 9及11)顯示較佳性質,及比含有大於ι〇重量百分 _ t匕|官能性?炎(伸彡基峻類)之環氧樹脂、组合物(比較實例匕 10及12)顯著較佳之性質。明確言之,在含有雙官能性聚(伸 芳基醚)之實例4-7中,無切口 Iz〇d衝擊強度係實質上且令人 意外地經改良,且顯著改良係在玻璃轉移溫 •度及切口卿樹中見及。對於含有10, 2。或3:= 數聚(伸芳基趟)之試樣,介電常數係經改良(經降低)。此 外,漸增含量之雙官能性聚(伸芳基鍵)係伴隨著玻璃轉移 溫度、熱撓曲溫度、無切口與切口福衝擊強度、介電常 數及散逸因數上之改良。對照上而言,漸增含量之無官能 123165 -41 - 200821355 性=(伸芳基醚)係伴隨著降低之熱撓曲溫度。 實^’9及H)係說明具有_公合/克雙官能性聚(伸芳基 :):本發明組合物之組成與性質。漸增含量之雙官能性聚 方土醚)係伴隨著玻璃轉移溫度、熱撓曲溫度 口 與切口 _衝擊強度、介電常數及散逸因數上之改良、。 此書寫說㈣使㈣例以揭示本發明,包括最良好模 ^且亦使得任何熟諳此藝者㈣製造與㈣本 發明,可取得專利權範圍係藉由請求項界定,且可包括其 他對熟諳此藝者存在之實例。 盆 a ^ 項笳 如 、 種八他貫例係意欲在請求 二=其具有與請求項之字義上語文並無不同之 、、·。構要件% ’或若其包括具有與請求項之字義上語文益杂 質差異之相等結構要件時。 …、貝 所有引述之專利、專利申請 ▲ 文併於本文供…但是,若;申考資料均以其全 夂老眘祖“ 力本申5月案中之術語與所併入 多考貝财之術語牴觸或衝突時,則得 係優先於得自所併人參考資料之衝突術語。^ 於本文中所揭示之所有範圍均包玖 獨立地可與彼此合併。 U ’且此i終點係 術語·,一種&quot;與&quot;一個&quot;及”該&quot;,以及類似指示物 描述本發明之内文中(尤其是在下述請求項之内 传 欲被解釋為涵蓋單數與複數兩者,係 明顯地被内文牴觸。再者 彳指出,或 之術語,,第-個”、&quot;第二個&quot;;,並二“的是’於本文中 重要性,而是用以區別—種要件:另未表:任何順序、量或 仵與另-種。關於量所使用 123165 42- 200821355 之修飾用語’’約’’,係包含所述數值,且具有藉由内文所指 述之意義(例如其包含與特定量之度量有關聯之誤差程 度)。Example 8 Example 9 Example 10 Composition BPA Epoxy 90 80 70 PPE? 0.12, bifxl. 0 0 0 PPE5 0.12, monofxl. 0 0 0 PPE, 0 06, bifid. 0 0 0 PPE? 0.06, monofxl. 0 0 0 PPE, 0.06? nonfxl. 0 0 0 PPE, 0.09, bifkl· 10 20 30 Acetylpyruvate 1 L 2.5 2.5 2.5 Density of properties (g/cm ^ 3 ) 1.1772 1.1676 1.1568 Tg(°c ) 152 157 158 [email protected] MPa (°C) 149 154 160 No-cut Izod (J/m) 147.7 186.4 209.2 Notch Izod (J/m) 39.5 45.4 49.5 Dk@100 MHz 2.94 2.92 2.89 Dk@500 MHz 2.87 2.85 2.83 Dk@l GHz 2.82 2.81 2.79 Df@100 MHz 0.012 0.012 0.011 Df@500 MHz 0.012 0.012 0.010 Df@l GHz 0.010 0.010 0.009 Use of poly(extended aryl ether) intrinsic viscosity kept at 0.12 com / g, poly(strandyl ether) The effect of the type (monofunctional to difunctional) and amount (10, 20 and 30 parts by weight per 100 parts by weight of all epoxy groups and poly(alkylene ether)) is from Examples 1-3 and A comparison of Comparative Examples 1-4 was confirmed. Comparative Example 1 contained a cured epoxy resin which did not have a poly(arylene ether). At an equivalent poly(aryl ether) content, the data shows an epoxy resin (Example 1-3) containing a difunctional poly(aryl ether) having 0.12 metric/g, which is more than the use of a single 123165-40- 200821355 An epoxy resin made of a functional poly(aryl ether) (Comparative Example 2_4) showed preferable properties. Specifically, the 'no-cut Iz〇d impact strength is substantially and unexpectedly improved, and significant improvements are seen in glass transition temperatures, heat deflection temperatures, notched Izod impact strength, and dielectric constant. In addition, the increasing content of difunctional poly(aryl ether) is related to glass transition temperature (Tg), heat deflection temperature (HDT), no-cut and slit Izod impact strength, dielectric constant (Dk) and dissipation. The improvement in the factor (Df) is related. _ Use of poly(extended aryl ether) intrinsic viscosity, 0 (〇 aryl ether) type, poly( aryl ether) type (non-functional to monofunctional twin to bifunctional) and amount (The effect of 1 〇, 2 〇, 3 〇 and 40 parts by weight of all epoxy groups per 100 parts by weight of the poly(alkylene ether)) was compared from the comparison between the example '7 and the comparative example 542. . At the equivalent poly(aryl ether) content, the data shows that the epoxy resin composition containing 〇〇6 bifunctional poly(arylene ether) (Example 4-7) is more than the soap functional poly(aryl ether) Epoxy resin compositions (Comparative Examples 5, 7, 9 and 11) exhibit preferred properties, and ratios greater than ι 〇 百分 匕 匕The epoxy resin, composition (Comparative Examples 匕 10 and 12) of Yan (Shenzhen Jijun) has significantly better properties. Specifically, in Examples 4-7 containing bifunctional poly(aryl ether), the non-notched Iz〇d impact strength was substantially and surprisingly improved, and significantly improved in the glass transfer temperature. Degree and incision in the tree. For containing 10, 2. Or a sample of 3:= poly(extended aryl), the dielectric constant is improved (reduced). In addition, the increasing amount of difunctional poly(arylene bond) is accompanied by improvements in glass transition temperature, heat deflection temperature, no-notch and incision impact strength, dielectric constant, and dissipation factor. In contrast, the increasing content of non-functional 123165 -41 - 200821355 sex = (strandyl ether) is accompanied by a reduced heat deflection temperature. </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The increasing content of bifunctional poly(n-terrestrial ether) is accompanied by improvements in glass transition temperature, heat deflection temperature and slit _ impact strength, dielectric constant and dissipation factor. This writing says (4) that (4) is used to disclose the invention, including the best mode, and also to make anyone skilled in the art (4) manufacture and (4) the invention, the patentable scope is defined by the claim, and may include other familiar An example of the existence of this artist. The basin a ^ 笳 笳 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Constructor % ' or if it includes an equivalent structural element that has a difference in the meaning of the language from the wording of the request. ..., all patents and patent applications quoted by Baye ▲ are provided for the purpose of this article. However, if the application materials are all based on the terminology of the old ancestor, the terminology in the case of Liben Shen in May When the term touches or conflicts, it is preferred to precede the conflicting term from the reference material. ^All ranges disclosed herein are independently and can be combined with each other. U 'and this i terminus The terms &quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot;&quot; Obviously touched by the text. In addition, the point, or the term, the first "," "the second", and the second is "importance in this article, but to distinguish - Other requirements: No other order: any order, quantity or 仵 and another type. The modifier "'about" used in relation to the quantity used in the quantity of 123165 42-200821355 contains the stated value and has the meaning Meaning (eg, it contains an error path associated with a measure of a particular amount) degree).

123165 -43 -123165 -43 -

Claims (1)

200821355 十、申請專利範圍: 1· 一種可熟化組合物,其包含: ¥氧樹脂; 雙官能性聚(伸芳基醚),在氯仿中,於25°C下度量,具 有本性黏度為每克約〇·〇3至約0.2公合;及 有效使環氧樹脂熟化量之熟化促進劑; 其中熟化後之組合物係顯示無切口 jz〇d衝擊強度至少 5 A大於具有單官能性聚(伸芳基醚)之相應組合物, 益 切口 Izod衝擊強度係於25。〇下根據ASTM D4812度量。 2·如請求項1之可熟化組合物,其中熟化後之組合物係顯示 無切口 Izod衝擊強度5至約50%大於具有單官能性聚(伸芳 基醚)之相應組合物。 3·如請求項1之可熟化組合物,其中熟化後之組合物係顯示 切口 IZ〇d衝擊強度至少5%大於具有單官能性聚(伸芳基醚) 之相應組合物,其中切口 Izod衝擊強度係於25t:下根據 ASTM D256 度量。 4.如請求項3之可熟化組合物,其中熟化後之組合物係顯示 切口 Izod衝擊強度5至約30%大於具有單官能性聚(伸芳基 醚)之相應組合物。 如明求項1之可热化組合物,其中環氧樹脂係具有軟化點 為約25°C至約150°C。 6·如請求項1之可熟化組合物,其中環氧樹脂係具有軟化點 低於25°C。 7.如請求们之可熟化組合物’其中環氧樹脂係選自包括脂 123165 200821355 族環氡接f 基環氧樹脂、,“乳樹脂、甲酚酚醛環氧樹脂、聯苯 苯二氡化物、2夕:能性環氧樹脂、茶環氧樹脂、二乙烯基 環氧_、多水甘油基縮水甘油料、二環戊二稀型 如請求項!之Λ族樹月旨型環氧樹脂及其組合。 9 、 可热化組合物,1中g A 氧樹脂鱼窠/、中娘虱樹脂包括單體性環 曰/、养聚合環氧樹脂。 10·如請求項1之可熟化組合物 係具有以下結構 中%氧樹脂包括雙g分A二 其中雙官能性聚(伸芳基醚) Q\ /Q2一 Q2 Qi 一 H— -oJKl r L— • _ Q1^ q2_ X Q2 V 二 在之Q與Q係獨立為氫、鹵素、未經取代或經取 Cl%2烴基,其附帶條件是該烴基不 :請求項1之可熟化組合物 細水甘油基喊環氧樹脂。 CrCU烴基硫基、Cl-Cl2烴美Γ + 基 ± 12/暴虱基或C2'C12_基烴基氧基, …少兩個碳原子係使幽素與氧原子分隔;各存在之X 系獨立為1至約1〇〇 ;且L具有以下結構 ^3165 200821355200821355 X. Patent application scope: 1. A curable composition comprising: ¥oxy resin; bifunctional poly(aryl ether), measured in chloroform at 25 ° C, with a natural viscosity of gram per gram约〇·〇3 to about 0.2 metric; and a curing accelerator effective to make the epoxy resin mature; wherein the cured composition exhibits no nick jz〇d impact strength of at least 5 A greater than having monofunctional poly(stretch) The corresponding composition of the aryl ether) has a Izod impact strength of 25. Your arm is measured according to ASTM D4812. 2. The curable composition of claim 1, wherein the aged composition exhibits a non-cut Izod impact strength of from 5 to about 50% greater than a corresponding composition having a monofunctional poly((aryl ether)). 3. The curable composition of claim 1, wherein the aged composition exhibits an impact IZ〇d impact strength of at least 5% greater than a corresponding composition having a monofunctional poly(aryl ether), wherein the incision Izod impacts The strength is measured at 25t: according to ASTM D256. 4. The curable composition of claim 3, wherein the aged composition exhibits a cut Izod impact strength of from 5 to about 30% greater than a corresponding composition having a monofunctional poly(phenylene ether). The heatable composition of claim 1, wherein the epoxy resin has a softening point of from about 25 ° C to about 150 ° C. 6. The curable composition of claim 1, wherein the epoxy resin has a softening point of less than 25 °C. 7. The curable composition of the 'recommended' wherein the epoxy resin is selected from the group consisting of grease 123165 200821355 family of ring-bonded epoxy resins, "lact resin, cresol novolac epoxy resin, biphenyl benzene dithride" , 2 eve: energy epoxy resin, tea epoxy resin, divinyl epoxy _, polyglycidyl glycidyl material, dicyclopentadiene type, such as the request! And a combination thereof. 9. Heatable composition, 1 g g Oxygen resin surimi /, Zhong Niang resin includes monomeric cyclic oxime /, polymerized epoxy resin. 10 · The ripening combination of claim 1 The system has the following structure: % oxygen resin includes double g sub-A. Among them, bifunctional poly(arylene ether) Q\ /Q2 - Q2 Qi - H - -oJKl r L - • _ Q1^ q2_ X Q2 V II The Q and Q systems are independently hydrogen, halogen, unsubstituted or substituted with a Cl 2 hydrocarbyl group, with the proviso that the hydrocarbyl group is not: the curable composition of claim 1 is a glycerol-based epoxy resin. Sulfur-based, Cl-Cl2 hydrocarbon oxime + base ± 12 / thiol or C 2 'C12 yl hydrocarbyloxy, ... less two carbon atoms Separating the spectrin from the oxygen atom; each existing X system is independently from 1 to about 1 Å; and L has the following structure ^3165 200821355 代之C! C! 2烃基,其附帶條件是該烴基不為三級烴基、 1 12込基&amp;基q 2烴基氧基或c〗鹵基烴基氧基,其 中至少兩個石炭原子係使鹵素與氧原子分隔;Z為0或1·,且 Y具有一種結構,選自包括 R3I -N*-, Ο -I-. —c— 〇II -s- 0II -S-II 0 及——C-R5 Ο R5 其令各存在之R;係獨立選自包括氯與^2煙基,且各 在之R與R5係獨立選自包括氣、Mu煙基及^_^伸 基上,其中R4與R5係共同地形成c4-Cl2伸貌基。 --·如明求項1之可熟化組合物,其中雙官能性聚(伸芳基适 係具有以下結構Instead of C? 2 hydrocarbyl group, the condition is that the hydrocarbyl group is not a tertiary hydrocarbon group, a 1 12 fluorenyl group, a q 2 hydrocarbyloxy group or a c yl halohydrocarbyloxy group, at least two of which are The halogen is separated from the oxygen atom; Z is 0 or 1·, and Y has a structure selected from the group consisting of R3I - N*-, Ο -I-. -c - 〇II -s- 0II -S-II 0 and - C-R5 Ο R5 wherein each R is present; and is independently selected from the group consisting of chlorine and 2, and each of R and R5 is independently selected from the group consisting of a gas, a Mu smoki group, and a thiophene group. R4 and R5 together form a c4-Cl2 excipient. - The curable composition of claim 1, wherein the bifunctional poly(extension aryl system) has the following structure ·0· •H ^中各存在之Q4Q2係獨立為氫、㈣、未經取^或經 代之q-Cu烴基,其附帶條件是該烴基不為三級烴基 C】-C12烴基硫纟、Cl-C12烴基氧基或c2_Ci2南基烴基氧: 123165 200821355 其中至少兩個碳原子係使画素與氧原子分隔丨各存在之x 係獨立為1至約100;且A具有以下結構· Q·Q ^ Each Q4Q2 is independently hydrogen, (four), unsubstituted or substituted q-Cu hydrocarbon group, with the proviso that the hydrocarbon group is not a tertiary hydrocarbon group C]-C12 hydrocarbon thiopurine, Cl-C12 hydrocarbyloxy or c2_Ci2 south hydrocarbyl oxygen: 123165 200821355 wherein at least two carbon atoms separate the pixel from the oxygen atom and each x is independently from 1 to about 100; and A has the following structure 0- 以2齒基烴基;1中各存在之=為風Cl_Cl2煙基或 6·……中各存在之副糸獨立為〇,1,2,3,4,5或 一,且其中各存在 烴基、Ci-Cu烴基氧基或齒素;且並中至 1 12.如請求項Μ可熟化組合物,其在、广200。 中各存在之Q2為氫或甲基, 甲基’其 中各存在之Y2與Y3及Y4為氳,1 &quot;八 R9為甲基,苴中各存在之1 存在之於糾及118與 •如》月求項1之可熟化組合物, 係具有以下結構 又5此性忒(伸芳基醚)0- is a 2-dentate hydrocarbon group; each of the presence of = in the wind is Cl_Cl2, or each of the secondary enthalpy in the hexazone is 〇, 1, 2, 3, 4, 5 or one, and each of them exists a hydrocarbyl group, a Ci-Cu hydrocarbyloxy group or a dentate; and in the middle to 1 12. As claimed in the claims, the composition can be aged at 200. Q2 is hydrogen or methyl, and each of Y2 and Y3 and Y4 is 氲, 1 &quot; 八R9 is methyl, and each of the 苴 exists in the correction of 118 and The aging composition of the monthly claim 1 has the following structure and 5 properties (arylene ether) ’且其中η為約1()至_。 123165 2 200821355 原子係使鹵素與氧原子分隔;R^R5各獨立選自包括氫 Q -C6烴基及Cl _c6伸烴基,其中r4與r5係共同地形成Μ 伸烷基;且各存在之x係獨立為丨至約50。 M.如請求们之可熟化組合物,其中雙官能性聚(伸芳基鍵) 係具有以下結構And wherein η is from about 1 () to _. 123165 2 200821355 The atomic system separates a halogen from an oxygen atom; R^R5 are each independently selected from the group consisting of a hydrogen Q-C6 hydrocarbon group and a Cl_c6 hydrocarbon group, wherein r4 and the r5 system together form an alkylene group; and each x system is present. Independently, it is about 50. M. A compatibilizable composition as claimed, wherein the bifunctional poly(arylene bond) has the following structure 其中各存在之X係獨立為1至約2〇。Each of the X lines present independently is from 1 to about 2 Å. 15·如請求項1之可熟化纽人撕甘 、、且口物其中雙官能性聚(伸芳基醚 為單羥酚與二羥酚之氧化共聚合作用之產物。 .如請求項12之可熟化組合物,其中單歸係選自包㈣_ 二甲酚、2,3,6-三甲酚及其混合物;且其中二羥酚係選自包 括3,3,,5,5,-四f基_4,4,_雙紛、2,2_雙(3_甲基销苯基)丙烧、❻ 雙(3,5-二甲基-4-經苯基)丙烷、u_雙(4_經苯基)甲院、^-雙 (4-經苯基)乙烧、2,2_雙(4_經苯基)丙燒以雙&amp;經苯基)丁烧、 2,2-雙(4-經苯基)辛貌、㈣(4·經苯基)丙燒、以部-經苯基^ 正-丁烷、雙(4-經苯基)苯基甲烧、砂雙㈣基&amp;甲基苯基) 環己烧、1,1-雙(4-經基·3,5_二甲基苯基)環-雙㈣ 基_3,5_二甲基苯基)環己院、u^(4_經基_3·甲基苯基)環庚 烷1,1又(4_羥基-3,5-二甲基苯基)環庚烷、^-雙(4_羥基_3_ 甲基苯基)環辛燒、u部經基_3,5_二甲基苯基)環辛烧、砂 雙(4-經基-3-甲基苯基)環壬&amp;、^,[雙(4_經基_3,5_二甲基苯 123165 200821355 基)環壬烷、1,1-雙(4-羥基-3-甲基苯基)環癸烷、u-雙(4_羥基 -3,5-一甲基苯基)環癸烷、雙(冬羥基冰甲基苯基)環十一 烷、U-雙(4-羥基-3,5-二甲基苯基)環十一烷、^^雙(4•羥基各 甲基苯基)環十二烷、U—雙士羥基_3,5_二甲基苯基)環十二 烷、U-雙(4_羥基斗第三-丁基苯基)丙烷、2,2_雙(4_羥基_2,6_ 二甲基苯基)丙烷2,2_雙(4_羥基各溴苯基)丙烷、u•雙…羥苯 基)環戊烷、1,1-雙(4·羥苯基)環己烷及其混合物。 i7·如明求項12之可熟化組合物,其中單羥酚為^心二甲酚, 且其中二羥酚為2,2-雙(3,5_二甲基_4·羥苯基)丙烷。 8·如明求項12之可熟化組合物,其中單經盼為2,6_二甲紛, 且其中二羥酚係選自包括2,2_雙(3-甲基冰羥苯基)丙烷、 雙(4-經基各甲基苯基)環己烷、丨山雙(4_羥基-3,5•二甲基苯基) 環己烷及其混合物。 土 如明求項1之可熟化組合物,其包含約3〇至約卯重量份數 、S氧树知與約1至約70重量份數之雙官能性聚(伸芳基 齔)—其中所#重量份數係以1〇〇重量份數全部環氧樹脂與 雙官能性聚(伸芳基醚)為基準。 如明求項1之可熟化組合物,其包含約6〇至約卯重量份數 之環氧樹脂與約10至約4〇重量份數之雙官能 ^ 有重置伤數係以100重量份數全部環氧樹脂與 雙官能性聚(伸芳基醚)為基準。 既、^員1之可熟化組合物,其中熟化促進劑係選自包括 !㈣離子性熟化觸媒、酚性硬化劑、胺硬化劑、脂族或 #羧文頦之鋼(Π)鹽、脂族或芳族羧酸類之鋁(ΠΙ)鹽、尽 U3165 200821355 氟化 二酮酸銅(π)、尽二酮酸鋁(III)、環脂族羧酸酐類、 删-三甲胺複合物及其組合。 項!之可熟化組合物,其中熟化促進劑為潛伏陽離 子性熟化觸媒’選自包括二芳基鎭鹽、膦酸酿類、… 類、竣酸醋類、膦酸亞院基化合物、爷基疏鹽、爷基 鹽、爷基銨鹽、異崎銼鹽、三氟化爛_三甲胺複合物及: 組合。 ^ 23.如請求項}之可熟化組合物, /、T热化促進劑包括乙醯基 丙酮酸銘(III)。 •如:求項1之可熟化組合物,其係進_步包含約2至約% 重里百分比之填料,以組合物之總重量為基準。 25·如凊求们之可熟化組合物,其中組合物係不含無機微粒 子填料。 如明求項1之可熟化組合物,其係進一步包含添加劑,選 2包括染料、顏料、著色劑、抗氧化劑、熱安㈣、光安 疋劑、增塑劑、潤滑劑、流動改質劑、滴液阻滞劑、阻燃 劑、結塊防止劑、抗靜電劑、流動促進劑、加工助劑、基 材黏著劑、脫模劑、勃化劑、低分佈形態添加劑、應力緩 和添加劑及其組合。 27. —種可熟化組合物,其包含: 環氧樹脂; 雙官能性聚(伸芳基驗),在氯仿中,於坑下度量,且 有本性黏度為每克約0.03至約0.2公合; 八 有效使環氧樹脂熟化量之熟化促進劑; 123165 200821355 選用之約2至約50重量百分比之填料,以組合物之總重 量為基準;及 選用之添加劑,選自包括染料、顏料、著色劑、抗氣 化劑、熱安定劑、光安定劑、増塑劑、爛滑劑、流動改質 - 劑、滴液阻滯劑、阻燃劑、結塊防止劑、抗靜電劑、流= „ 促進劑、加工助劑、基材黏著劑、脫模劑、韌化劑、低分 佈形態添加劑、應力缓和添加劑及其組合; 刀 % 其中热化後之組合物係顯示無切口 Izod衝擊強度至少 -5%大於具有單官能性聚(伸芳基醚)之相應組合物,其中^ 切口 Izod衝擊強度係於25t下根據ASTMm812度量。…、 28. —種可熟化組合物,其包含: 雙酴A二縮水甘油基醚環氧樹脂; 雙g此性聚(伸芳基醚),在氯仿中,於25。〇下度量,具 有本性黏度為每克約〇·03至約〇·2公合,其中聚(伸芳基醚) 係具有以下結構15. The matured person of claim 1 is torn, and the bifunctional poly(poly(aryl ether) is a product of oxidative copolymerization of monohydric phenol and dihydric phenol. [Claim 12] a curable composition, wherein the single singly is selected from the group consisting of (tetra) xylenol, 2,3,6-trimethyl phenol, and mixtures thereof; and wherein the dihydric phenol is selected from the group consisting of 3, 3, 5, 5, - 4 f Base_4,4,_double, 2,2_bis(3_methylpinphenyl)propane, bis(3,5-dimethyl-4-phenyl)propane, u_double ( 4_Phenyl phenyl) Jiayuan, ^-bis(4-Phenyl) Ethylene, 2,2_Bis(4-Phenyl)propane, double &amp; phenyl) butyl, 2,2 - bis(4-phenylene) morphine, (iv) (4. phenyl) propane, phenyl-p-butane, bis(4-phenylphenyl) phenyl ketone, sand double (d) base &amp; methylphenyl) cyclohexene, 1,1-bis(4-trans)3,5-dimethylphenyl)cyclo-bis(tetra)yl-3,5-dimethylphenyl)环 院, u^(4_ 经基_3·methylphenyl)cycloheptane 1,1 again (4-hydroxy-3,5-dimethylphenyl)cycloheptane, ^-double (4 _hydroxy_3_methylphenyl)cyclooctane, u-group via _3,5-dimethylphenyl) cyclooctane, sand double 4-Phenyl-3-methylphenyl)cycloindole&amp;,^,[bis(4_carbyl_3,5-dimethylbenzene 123165 200821355)cyclodecane, 1,1-double (4 -hydroxy-3-methylphenyl)cyclodecane, u-bis(4-hydroxy-3,5-monomethylphenyl)cyclodecane, bis(winter hydroxy ice methylphenyl)cycloundecane , U-bis(4-hydroxy-3,5-dimethylphenyl)cycloundecane, ^^bis(4•hydroxymethylphenyl)cyclododecane, U-bis-hydroxyl_3, 5_Dimethylphenyl)cyclododecane, U-bis(4-hydroxyl tert-butylphenyl)propane, 2,2-bis(4-hydroxy-2,6-dimethylphenyl) Propane 2,2-bis(4-hydroxy(bromophenyl)propane, u•bis(hydroxyphenyl)cyclopentane, 1,1-bis(4-hydroxyphenyl)cyclohexane, and mixtures thereof. I7. The curable composition of claim 12, wherein the monohydric phenol is cresol, and wherein the dihydric phenol is 2,2-bis(3,5-dimethyl-4 hydroxyphenyl) Propane. 8. The curable composition of claim 12, wherein the single expectation is 2,6-dimethyl, and wherein the dihydric phenol is selected from the group consisting of 2,2-bis(3-methyl-glacial phenyl) Propane, bis(4-transmethylmethylphenyl)cyclohexane, bismuth (4-hydroxy-3,5•dimethylphenyl)cyclohexane and mixtures thereof. The curable composition of claim 1, comprising from about 3 Torr to about 卯 by weight, from about 1 to about 70 parts by weight of the difunctional poly(arylene). The # parts by weight is based on 1 part by weight of the total epoxy resin and the bifunctional poly(arylene ether). The curable composition according to claim 1, which comprises from about 6 〇 to about 卯 parts by weight of the epoxy resin and from about 10 to about 4 parts by weight of the bifunctional ^ with a residual number of damages of 100 parts by weight The total number of epoxy resins is based on the bifunctional poly(aryl ether). The curable composition of the member 1, wherein the curing accelerator is selected from the group consisting of: (4) ionic ripening catalyst, phenolic hardener, amine hardener, aliphatic or #carboxy 颏 颏 steel (Π) salt, Aluminum (ΠΙ) salt of aliphatic or aromatic carboxylic acid, as far as U3165 200821355 fluorinated copper diketone (π), aluminum (III) dicarboxylate, cycloaliphatic carboxylic anhydride, de-trimethylamine complex and Its combination. The curable composition, wherein the curing accelerator is a latent cationic ripening catalyst selected from the group consisting of diarylsulfonium salts, phosphonic acid brewings, ..., citric acid vinegars, phosphonic acid sub-system compounds, Based on salt, sulphate salt, sulphate, sulphate salt, trifluoromethane-trimethylamine complex and: combination. ^ 23. The curable composition of claim 1, wherein the T heating accelerator comprises acetylpyruvate (III). • A maturity composition of claim 1 which comprises from about 2 to about % by weight of the filler, based on the total weight of the composition. 25. A composition that can be cured, such as a composition, wherein the composition is free of inorganic particulate filler. The curable composition of claim 1, which further comprises an additive, and the dye comprises: a dye, a pigment, a colorant, an antioxidant, a heat (four), a light ampoule, a plasticizer, a lubricant, a flow modifier. , drip retarder, flame retardant, agglomeration inhibitor, antistatic agent, flow promoter, processing aid, substrate adhesive, mold release agent, boring agent, low distribution form additive, stress relieving additive and Its combination. 27. A curable composition comprising: an epoxy resin; a bifunctional poly(extension test) in chloroform, measured under the pit, and having a native viscosity of from about 0.03 to about 0.2 angstroms per gram. VIII effective curing accelerator for curing the epoxy resin; 123165 200821355 selected from about 2 to about 50 weight percent of the filler, based on the total weight of the composition; and selected additives selected from the group consisting of dyes, pigments, and coloring Agent, anti-gasification agent, heat stabilizer, light stabilizer, plasticizer, slip agent, flow modification agent, drip blocker, flame retardant, blocking inhibitor, antistatic agent, flow = „ Accelerators, processing aids, substrate adhesives, mold release agents, toughening agents, low-distribution form additives, stress relieving additives and combinations thereof; Knife% The composition after heating shows no impact Izod impact strength at least - 5% greater than the corresponding composition having a monofunctional poly(aryl ether), wherein the Izod impact strength is measured at 25 t according to ASTM m 812...., 28. A curable composition comprising: A diglycidyl Ether ether epoxy resin; double g of this poly(extended aryl ether), measured in chloroform at 25 〇, with a natural viscosity of about 〇·03 to about 〇·2 com, in which poly( Extended aryl ether) has the following structure 其中各存在之X係獨立為1至約2〇 ;及 有效使環氧樹脂熟化量之熟化促進劑; 其中熟化後之組合物係顯示無切口 12〇(1衝擊強度5至約 50%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25χ下根據ASTMD4812度量。 123165 200821355 29· —種可熟化組合物,其包括: 雙酚Α二縮水甘油基醚環氧樹脂; 雙S能性聚(伸芳基鍵),在氣仿中,於25°C下度量,具 有本性黏度為每克約0·03至約公合,其中聚(伸芳基醚) 係具有以下結構Each of the X-forms present independently is from 1 to about 2 Å; and a curing accelerator effective to make the epoxy resin mature; wherein the aged composition exhibits no nick 12 〇 (1 impact strength 5 to about 50% greater than A corresponding composition of a monofunctional poly(aryl ether) wherein the uncut Izod impact strength is measured at 25 Torr according to ASTM D 4812. 123165 200821355 29 - A curable composition comprising: bisphenol hydrazine diglycidyl Ether epoxy resin; double S energy poly(extension aryl bond), measured in gas imitation at 25 ° C, with a natural viscosity of about 0.03 to about gram per gram, of which poly(arylene) Ether) has the following structure 有效使環氧樹脂熟化量之熟化促進劑; 選用之約2至約50重量百分比之填料,以組合物之總重 量為基準;及 選用之添加劑,選自包括染料、顏料、著色劑、抗氧 化劑、熱安定劑、光安定劑、增塑劑、潤滑劑、流動改質 劑、滴液阻滯劑、阻燃劑、結塊防止劑、抗靜電劑、流動 促進劑、加工助劑、基材黏著劑、脫模劑、韌化劑、低分 佈形態添加劑、應力緩和添加劑及其組合; 其中沾化後之組合物係顯示無切口 Iz〇d衝擊強度5至約 50%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25°C下根據ASTMD4812度量。 30· —種可熟化組合物,其包含: 約60至約90重量份數之雙酚a二縮水甘油基醚環氧樹 脂; 123165 200821355 約10至約40重量份數之雙官能性聚(伸芳基醚),在氯仿 中於25 C下度畺,具有本性黏度為每克約〇 〇6至約 公合’其中聚(伸芳基醚)係具有以下結構a curing accelerator effective to make the epoxy resin mature; about 2 to about 50 weight percent of the filler is selected based on the total weight of the composition; and the additive selected is selected from the group consisting of a dye, a pigment, a colorant, and an antioxidant. , heat stabilizer, light stabilizer, plasticizer, lubricant, flow modifier, drip retarder, flame retardant, agglomeration inhibitor, antistatic agent, flow promoter, processing aid, substrate Adhesive, mold release agent, toughening agent, low distribution form additive, stress relieving additive and combinations thereof; wherein the composition after the application shows that the impact strength of the non-cut Iz〇d is from 5 to about 50% greater than that of the monofunctional poly A corresponding composition of (arylene ether) wherein the non-cut Izod impact strength is measured at 25 ° C according to ASTM D4812. 30. A curable composition comprising: from about 60 to about 90 parts by weight of a bisphenol a diglycidyl ether epoxy resin; 123165 200821355 from about 10 to about 40 parts by weight of a bifunctional poly(stretch) An aryl ether), which is enthalpy in chloroform at 25 C and has a natural viscosity of from about 6 to about 5 gram per gram. The poly((aryl ether) system has the following structure 其中各存在之X係獨立為1至約20 ;及 約0.5至約1〇重量份數之乙酸基丙酮酸銘(hi); 其中所有重量份數係以1〇〇重量份數全部環氧樹脂與雙 官能性聚(伸芳基醚)為基準; 其中雙齡A 一縮水甘油基醚環氧樹脂與雙官能性聚(伸 芳基醚)於25至65°C下係以單相存在; 其中可熟化組合物於25°C下具有黏度低於或等於ι〇,〇〇〇 厘泊; 其中热化後之組合物係顯示無切口 Iz〇d衝擊強度5至約 50%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25°C下根據ASTM D4812度量;且 其中熟化後之組合物係顯示切口 Iz〇d衝擊強度5至約 30%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 切口 Izod衝擊強度係於25°C下根據ASTM D256度量。 31. —種可熟化組合物,其包含: 約60至約90重量份數之雙酚A二縮水甘油基醚環氧樹 脂; 123165 -10- 200821355 約10至約40重量份數之雙官能性聚(伸芳基醚),在氯仿 中’於25°C下度量,具有本性黏度為每克約0 06至約〇12Each of the X groups present independently is from 1 to about 20; and from about 0.5 to about 1 part by weight of acetoxypyruvate (hi); wherein all parts by weight are in an amount of 1 part by weight of the total epoxy resin Based on the bifunctional poly(triaryl ether); wherein the two-year-old A-glycidyl ether epoxy resin and the bifunctional poly(arylene ether) are present in a single phase at 25 to 65 ° C; Wherein the curable composition has a viscosity lower than or equal to ι〇, 〇〇〇 centipoise at 25 ° C; wherein the composition after heating shows no impact Iz〇d impact strength 5 to about 50% greater than having monofunctional a corresponding composition of a poly(n-aryl ether) wherein the non-cut Izod impact strength is measured at 25 ° C according to ASTM D4812; and wherein the aged composition exhibits a notched Iz〇d impact strength of 5 to about 30% It is larger than the corresponding composition having a monofunctional poly(arylene ether) in which the notched Izod impact strength is measured at 25 ° C according to ASTM D256. 31. A curable composition comprising: from about 60 to about 90 parts by weight of a bisphenol A diglycidyl ether epoxy resin; 123165 -10- 200821355 from about 10 to about 40 parts by weight bifunctional Poly(strandyl ether), measured in chloroform at 25 ° C, with a natural viscosity of from about 0 06 to about 〇12 per gram 約〇·5至約1〇重量份數之乙醯基丙酮酸鋁(ΙΠ); 選用之約20至約100重量份數百分比之填料;及 選用之添加劑,選自包括染料、顏料、著色劑、抗氧 化劑、熱安定劑、光安定劑、增塑劑、潤滑劑、流動改質 劑、滴液阻滯劑、阻燃劑、結塊防止劑、抗靜電劑、流動 促進劑、加工助劑、基材黏著劑、脫模劑、韌化劑、低分 佈形態添加劑、應力緩和添加劑及其組合; _ '其中雙酴Α二縮水甘油基醚環氧樹脂與雙官能性聚(伸 芳基醚)於25至65°C下係以單相存在; 其中所有重量份數係以1〇〇重量份數全部環氧樹脂與雙 ‘ 官能性聚(伸芳基醚)為基準; 其中热化後之組合物係顯示無切口 Izod衝擊強度5至約 50/〇大於具有單官能性聚(伸芳基鱗)之相應組合物,其中 無切口 Izod衝擊強度係於25它下根據ASTMD4812度量;且 其中^化後之組合物係顯示切口 Iz〇d衝擊強度$至約 30%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 123165 -11 - 200821355 切口 Izod衝擊強度係於25T:下根據ASTM D256度量。 32_ —種可熟化組合物,其包含: 約60至約90重量份數之雙酚A二縮水甘油基醚環氧樹 脂; 約10至約40重量份數之雙官能性聚(伸芳基醚),在氯仿From about 5 to about 1 part by weight of aluminum acetylacetonate (ruthenium); from about 20 to about 100 parts by weight of the filler; and additives selected from the group consisting of dyes, pigments, colorants , antioxidants, thermal stabilizers, light stabilizers, plasticizers, lubricants, flow modifiers, drop retarders, flame retardants, caking inhibitors, antistatic agents, flow promoters, processing aids , substrate adhesive, mold release agent, toughening agent, low distribution form additive, stress relaxation additive and combination thereof; _ 'where bismuth diglycidyl ether epoxy resin and bifunctional poly(aryl ether) ) is present as a single phase at 25 to 65 ° C; wherein all parts by weight are based on 1 part by weight of all epoxy resin and bis-functional poly( extended aryl ether); The composition exhibits a non-cut Izod impact strength of 5 to about 50/〇 greater than a corresponding composition having a monofunctional poly(aryl aryl scale), wherein the uncut Izod impact strength is at 25 Measured according to ASTM D4812; The composition of the composition shows the incision Iz〇d $ Hitting intensity corresponding to about 30% greater than a composition having a monofunctional poly (arylene ether) of which 123 165 -11--200821355 notch Izod impact strength was based on the 25T: in accordance with ASTM D256 under the metric. 32_ a curable composition comprising: from about 60 to about 90 parts by weight of a bisphenol A diglycidyl ether epoxy resin; from about 10 to about 40 parts by weight of a difunctional poly(aryl ether) ), in chloroform 中’於25°C下度量,具有本性黏度為每克約〇·06公合,其 中聚(伸芳基醚)係具有以下結構The medium 'measured at 25 ° C has a natural viscosity of about 〇·06 com, per gram, and the poly(extended aryl ether) has the following structure 其中各存在之X係獨立為1至約20 ;及 約0.5至約10重量份數之乙醯基丙酮酸鋁(ΙΠ); 其中雙酚Α二縮水甘油基醚環氧樹脂與雙官能性聚(伸 芳基醚)於25至65°C下係以單相存在;Each of the X groups present independently is from 1 to about 20; and from about 0.5 to about 10 parts by weight of aluminum acetoxypyruvate (bismuth); wherein the bisphenol quinone diglycidyl ether epoxy resin and the bifunctional poly (streptyl ether) is present as a single phase at 25 to 65 ° C; 其中所有重量份數係以100重量份數全部環氧樹脂與雙 官能性聚(伸芳基醚)為基準; 其中熟化後之組合物係顯示無切口〗z〇(j衝擊強度5至約 50%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25°C下根據ASTM D4812度量;且 其中熟化後之組合物係顯示切口 Iz〇d衝擊強度5至約 30%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 切口 Izod衝擊強度係於25°C下根據ASTM D256度量。 33· —種可熟化組合物,其包含: 123165 -12- 200821355 約60至約90重量份數之雙酚A二縮水甘油基醚環氧樹 脂; 約10至約40重量份數之雙官能性聚(伸芳基醚),在氯仿 中’於25 C下度量,具有本性黏度為每克約〇 〇9公合,其 中聚(伸芳基醚)係具有以下結構Wherein all parts by weight are based on 100 parts by weight of all epoxy resin and bifunctional poly(arylene ether); wherein the aged composition exhibits no incision 〖z〇 (j impact strength 5 to about 50) % is greater than the corresponding composition having a monofunctional poly(aryl ether) wherein the non-cut Izod impact strength is measured at 25 ° C according to ASTM D4812; and wherein the aged composition exhibits incision Iz〇d impact strength 5 to about 30% greater than the corresponding composition having a monofunctional poly(arylene ether) wherein the notched Izod impact strength is measured at 25 ° C according to ASTM D256. 33. A curable composition comprising: 123165 -12- 200821355 from about 60 to about 90 parts by weight of bisphenol A diglycidyl ether epoxy resin; from about 10 to about 40 parts by weight of difunctional poly(alkylene ether) in chloroform Measured at 25 C, with a natural viscosity of about 9 angstroms per gram, of which poly(strandyl ether) has the following structure 其中各存在之X係獨立為1至約2〇 ;及 約〇_5至約1〇重量份數之乙醯基丙酮酸鋁(ΙΠ); 其中雙紛Α 一縮水甘油基醚環氧樹脂與雙官能性聚(伸 芳基醚)於25至65°C下係以單相存在; 其中所有重里伤數係以100重量份數全部環氧樹脂與雙 官能性聚(伸芳基醚)為基準; 其中熟化後之組合物係顯示無切口 Izod衝擊強度5至約 50/。大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25°C下根據ASTMD4812度量,·且 其中熟化後之組合物係顯示切口 Iz〇d衝擊強度$至約 30%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 切口 Izod衝擊強度係於25°C下根據ASTMD256度量。 34· —種可熟化組合物,其包含: 約60至約90重量份數之雙酚A二縮水甘油基醚環氧樹 脂; 123165 • 13 - 200821355 約10至約40重量份數之雙官能性聚(伸芳基醚),在氯仿 中’於25C下度量,具有本性黏度為每克約〇12公合,其Each of the X groups present independently is from 1 to about 2 Å; and from about 〇5 to about 1 part by weight of aluminum acetyl acetonate (ruthenium ruthenium); The bifunctional poly(arylene ether) is present as a single phase at 25 to 65 ° C; wherein all of the heavy wounds are 100 parts by weight of all epoxy resin and bifunctional poly(strandyl ether) Reference; wherein the aged composition exhibits an incision Izod impact strength of 5 to about 50/. Greater than a corresponding composition having a monofunctional poly(aryl ether) wherein the uncut Izod impact strength is measured at 25 ° C according to ASTM D4812, and wherein the aged composition exhibits an incision Iz〇d impact strength $ To about 30% greater than the corresponding composition having a monofunctional poly(arylene ether) wherein the notched Izod impact strength is measured at 25 ° C according to ASTM D256. 34. A curable composition comprising: from about 60 to about 90 parts by weight of a bisphenol A diglycidyl ether epoxy resin; 123165 • 13 - 200821355 from about 10 to about 40 parts by weight bifunctional Poly(arylene ether), measured in chloroform at 25C, has a natural viscosity of about 12 mils per gram, 約0.5至約1〇重量份數之乙醯基丙酮酸鋁(ΙΠ); 其中雙紛Α二縮水甘油基醚環氧樹脂與雙官能性聚(伸 芳基醚)於25至65°C下係以單相存在; 其中所有重量份數係以1〇〇重量份數全部環氧樹脂與雙 官能性聚(伸芳基_)為基準; 其中熟化後之組合物係顯示無切口 Iz〇d衝擊強度5至約 50%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 無切口 Izod衝擊強度係於25它下根據aSTMD4812度量;且 其中熟化後之組合物係顯示切口 Iz〇d衝擊強度5至約 30%大於具有單官能性聚(伸芳基醚)之相應組合物,其中 切口 Izod衝擊強度係於25t:下根據ASTM D256度量。 35· —種製備可熟化組合物之方法,其包括: 摻合以下物質 環氧樹脂 雙B月b性I (伸务基趟),在氯仿中,於下度量, 具有本性黏度為每克約0·03至約〇·2公合,及 123165 -14- 200821355 有效使環氧樹脂熟化量之熟化促進劑; 其中熟化後之組合物係顯示無切口 Iz〇d衝擊強度至少 5%大於具有單官能性聚(伸芳基喊)之相應組合物,其中無 切口 Iz〇d衝擊強度係於2rc下根據ASTm以幻2度量。 36.—種經熟化之組合物,其包含使如請求項丨_34中任一項之 可熟化組合物熟化時所獲得之反應產物。 P· 一種經部份熟化之組合物,其包含使如請求項卜34中任一 項之可熟化組合物熟化時所獲得之反應產物。 38· —種物件,其包含如請求項36之經熟化組合物。 39· —種物件,其包含如請求項37之經部份熟化組合物。From about 0.5 to about 1 part by weight of aluminum acetylacetonate (ruthenium); wherein the bis-indole diglycidyl ether epoxy resin and the bifunctional poly(aryl ether) are at 25 to 65 ° C Is present in a single phase; wherein all parts by weight are based on 1 part by weight of all epoxy resin and bifunctional poly(arylene); wherein the aged composition shows no incision Iz〇d An impact strength of from 5 to about 50% greater than a corresponding composition having a monofunctional poly(arylene ether) wherein the uncut Izod impact strength is at 25 Measured according to aSTMD4812; and wherein the aged composition exhibits a slit Iz The 冲击d impact strength is from 5 to about 30% greater than the corresponding composition having a monofunctional poly(arylene ether) wherein the notched Izod impact strength is measured at 25t: according to ASTM D256. 35. A method for preparing a curable composition, comprising: blending an epoxy resin with a double B month b I (extension base), in chloroform, measured underneath, having a viscosity of about gram per gram 0·03 to about 〇·2 commensurate, and 123165 -14- 200821355 aging accelerator for effectively curing the epoxy resin; wherein the matured composition shows no impact Iz〇d impact strength of at least 5% is greater than having a single A corresponding composition of functional poly(extension aryl) wherein the non-notched Iz〇d impact strength is measured at 2 rc according to ASTm in phantom 2. 36. A cured composition comprising the reaction product obtained by aging a ripeizable composition according to any one of claims 丨34. P. A partially cured composition comprising the reaction product obtained by aging a ripeizable composition according to any one of claims 34. 38. An article comprising the cured composition of claim 36. 39. An article comprising a partially cured composition as claimed in claim 37. 123165 15- 200821355 七、指定代表圖: (一) 本案指定代表圖為:(無) (二) 本代表圖之元件符號簡單說明: 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: (無)123165 15- 200821355 VII. Designation of the representative representative: (1) The representative representative of the case is: (none) (2) The symbol of the symbol of the representative figure is simple: 8. If there is a chemical formula in this case, please reveal the best indication of the characteristics of the invention. Chemical formula: (none) 123165123165
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JP5599612B2 (en) 2014-10-01
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WO2008033611A1 (en) 2008-03-20
EP2061836A1 (en) 2009-05-27
CN102702680A (en) 2012-10-03

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