TW200801216A - Sputtering target/backing plate conjunction element - Google Patents
Sputtering target/backing plate conjunction elementInfo
- Publication number
- TW200801216A TW200801216A TW096116790A TW96116790A TW200801216A TW 200801216 A TW200801216 A TW 200801216A TW 096116790 A TW096116790 A TW 096116790A TW 96116790 A TW96116790 A TW 96116790A TW 200801216 A TW200801216 A TW 200801216A
- Authority
- TW
- Taiwan
- Prior art keywords
- backing plate
- sputtering target
- copper
- plate conjunction
- conjunction element
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006179930 | 2006-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200801216A true TW200801216A (en) | 2008-01-01 |
TWI353390B TWI353390B (zh) | 2011-12-01 |
Family
ID=38845319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096116790A TW200801216A (en) | 2006-06-29 | 2007-05-11 | Sputtering target/backing plate conjunction element |
Country Status (7)
Country | Link |
---|---|
US (1) | US8157973B2 (zh) |
EP (1) | EP2039797B1 (zh) |
JP (1) | JP4879986B2 (zh) |
KR (1) | KR101040076B1 (zh) |
CN (1) | CN101479400B (zh) |
TW (1) | TW200801216A (zh) |
WO (1) | WO2008001547A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102230158B (zh) * | 2004-11-17 | 2014-04-30 | Jx日矿日石金属株式会社 | 溅射靶、溅射靶-背衬板组装体以及成膜装置 |
JP5676429B2 (ja) * | 2008-04-21 | 2015-02-25 | ハネウェル・インターナショナル・インコーポレーテッド | Dcマグネトロンスパッタリングシステムの設計および使用 |
WO2011062002A1 (ja) | 2009-11-20 | 2011-05-26 | Jx日鉱日石金属株式会社 | スパッタリングターゲット-バッキングプレート接合体及びその製造方法 |
EP2518179B1 (en) | 2009-12-24 | 2016-11-16 | JX Nippon Mining & Metals Corporation | Gadolinium sputtering target and method for manufacturing the target |
SG189977A1 (en) | 2010-10-27 | 2013-06-28 | Jx Nippon Mining & Metals Corp | Sputtering target backing plate assembly and method for producing same |
US8968537B2 (en) * | 2011-02-09 | 2015-03-03 | Applied Materials, Inc. | PVD sputtering target with a protected backing plate |
US10138544B2 (en) | 2011-06-27 | 2018-11-27 | Soleras, LTd. | Sputtering target |
KR20150130553A (ko) * | 2013-11-06 | 2015-11-23 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 스퍼터링 타깃/배킹 플레이트 조립체 |
KR101923292B1 (ko) | 2014-07-31 | 2018-11-28 | 제이엑스금속주식회사 | 방식성의 금속과 Mo 또는 Mo 합금을 확산 접합한 백킹 플레이트, 및 그 백킹 플레이트를 구비한 스퍼터링 타깃-백킹 플레이트 조립체 |
JP6021861B2 (ja) * | 2014-08-06 | 2016-11-09 | Jx金属株式会社 | スパッタリングターゲット−バッキングプレート接合体 |
KR101649794B1 (ko) | 2014-08-20 | 2016-08-19 | 김정욱 | 타워램프 상태 모니터링용 무선 타워램프 정보 관리 시스템 |
JP6546953B2 (ja) | 2017-03-31 | 2019-07-17 | Jx金属株式会社 | スパッタリングターゲット−バッキングプレート接合体及びその製造方法 |
US11244815B2 (en) | 2017-04-20 | 2022-02-08 | Honeywell International Inc. | Profiled sputtering target and method of making the same |
KR102263414B1 (ko) | 2020-02-19 | 2021-06-10 | 주식회사 엘에이티 | 스퍼터 전극체 |
CN113173284B (zh) * | 2021-04-26 | 2022-07-15 | 宁波江丰电子材料股份有限公司 | 一种半成品靶材背板的管理方法 |
KR20230072292A (ko) | 2021-11-17 | 2023-05-24 | 바짐테크놀로지 주식회사 | 스퍼터링 타겟 접합체 |
KR20240072544A (ko) | 2022-11-17 | 2024-05-24 | 바짐테크놀로지 주식회사 | 스퍼터링 타겟 접합방법 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6345368A (ja) | 1986-08-13 | 1988-02-26 | Toshiba Corp | スパツタ装置 |
JPH01222047A (ja) | 1988-03-01 | 1989-09-05 | Nippon Mining Co Ltd | 銅又は銅合金製バッキングプレート |
JPH0774436B2 (ja) * | 1990-09-20 | 1995-08-09 | 富士通株式会社 | 薄膜形成方法 |
US5693203A (en) * | 1992-09-29 | 1997-12-02 | Japan Energy Corporation | Sputtering target assembly having solid-phase bonded interface |
JP3660014B2 (ja) | 1995-03-31 | 2005-06-15 | 株式会社テクノファイン | スパッタ用ターゲット |
JPH11189870A (ja) | 1997-12-25 | 1999-07-13 | Nisshin Steel Co Ltd | スパッタリング用ターゲットおよびその冷却方法 |
JP2001329362A (ja) | 2000-05-17 | 2001-11-27 | Nikko Materials Co Ltd | バッキングプレート及びスパッタリングターゲット−バッキングプレート組立体 |
JP3791829B2 (ja) * | 2000-08-25 | 2006-06-28 | 株式会社日鉱マテリアルズ | パーティクル発生の少ないスパッタリングターゲット |
JP3905295B2 (ja) * | 2000-10-02 | 2007-04-18 | 日鉱金属株式会社 | 高純度コバルトターゲットと銅合金製バッキングプレートとの拡散接合ターゲット組立体及びその製造方法 |
JP3905301B2 (ja) | 2000-10-31 | 2007-04-18 | 日鉱金属株式会社 | タンタル又はタングステンターゲット−銅合金製バッキングプレート組立体及びその製造方法 |
US6858116B2 (en) * | 2000-11-17 | 2005-02-22 | Nikko Materials Company, Limited | Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles |
WO2002072911A1 (fr) * | 2001-03-14 | 2002-09-19 | Nikko Materials Company, Limited | Cible de pulverisation, plaque d'appui ou appareil dans un dispositif de pulverisation produisant tres peu de particules et procede de rugosification par usinage a decharge electrique |
JP4204978B2 (ja) * | 2001-12-19 | 2009-01-07 | 日鉱金属株式会社 | 磁性体ターゲットとバッキングプレートとの接合方法及び磁性体ターゲット |
US6709557B1 (en) * | 2002-02-28 | 2004-03-23 | Novellus Systems, Inc. | Sputter apparatus for producing multi-component metal alloy films and method for making the same |
TWI269815B (en) * | 2002-05-20 | 2007-01-01 | Tosoh Smd Inc | Replaceable target sidewall insert with texturing |
US20040016635A1 (en) * | 2002-07-19 | 2004-01-29 | Ford Robert B. | Monolithic sputtering target assembly |
KR20060033013A (ko) * | 2003-07-14 | 2006-04-18 | 토소우 에스엠디, 인크 | 저 전도 백킹 플레이트를 갖는 스퍼터링 타겟 조립체 및 그제조 방법 |
EP1715077A4 (en) * | 2003-12-25 | 2010-09-29 | Nippon Mining Co | ARRANGEMENT OF COPPER OR COPPER ALLOY STARGET AND COPPER ALLOY CARRIER PLATE |
CN102230158B (zh) * | 2004-11-17 | 2014-04-30 | Jx日矿日石金属株式会社 | 溅射靶、溅射靶-背衬板组装体以及成膜装置 |
JP5126742B2 (ja) * | 2005-04-28 | 2013-01-23 | Jx日鉱日石金属株式会社 | スパッタリングターゲット |
WO2007040014A1 (ja) * | 2005-10-04 | 2007-04-12 | Nippon Mining & Metals Co., Ltd. | スパッタリングターゲット |
US8790499B2 (en) * | 2005-11-25 | 2014-07-29 | Applied Materials, Inc. | Process kit components for titanium sputtering chamber |
US20080236738A1 (en) * | 2007-03-30 | 2008-10-02 | Chi-Fung Lo | Bonded sputtering target and methods of manufacture |
-
2007
- 2007-05-02 EP EP07742794A patent/EP2039797B1/en active Active
- 2007-05-02 CN CN2007800243834A patent/CN101479400B/zh active Active
- 2007-05-02 KR KR1020087031070A patent/KR101040076B1/ko active IP Right Grant
- 2007-05-02 JP JP2008522336A patent/JP4879986B2/ja active Active
- 2007-05-02 US US12/306,734 patent/US8157973B2/en active Active
- 2007-05-02 WO PCT/JP2007/059359 patent/WO2008001547A1/ja active Application Filing
- 2007-05-11 TW TW096116790A patent/TW200801216A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TWI353390B (zh) | 2011-12-01 |
US8157973B2 (en) | 2012-04-17 |
JPWO2008001547A1 (ja) | 2009-11-26 |
WO2008001547A1 (fr) | 2008-01-03 |
CN101479400B (zh) | 2011-06-22 |
JP4879986B2 (ja) | 2012-02-22 |
KR20090016599A (ko) | 2009-02-16 |
US20090277788A1 (en) | 2009-11-12 |
EP2039797B1 (en) | 2012-08-29 |
EP2039797A4 (en) | 2010-04-28 |
EP2039797A1 (en) | 2009-03-25 |
CN101479400A (zh) | 2009-07-08 |
KR101040076B1 (ko) | 2011-06-09 |
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