200800567 (1) 九、發明說明 【發明所屬之技術領域】 本發明，是有關具備加壓膜體的真空積層裝置。 【先前技術】 ^ 防止具備加壓膜體的真空積層裝置的加壓膜體的劣化 * 技術例如專利文獻1。專利文獻1，是關於真空積層裝 Φ 置，具備：相面對且可接離的的上板及下板、及被設置於 該上板或是下板的任一方的相對面的加壓膜體、及形成當 該上板及/或是下板相互接近時藉由被挾持於其任一另一 方的相對面及前述加壓膜體之間使成形材被收容的成形空 間的框體、及加熱成形材的加熱手段、及使前述成形空間 被抽真空的減壓手段、及供將被容於前述成形空間內的成 形材由任意時間點加壓而操作前述加壓膜體用的加壓膜體 操作手段，且成形空間內減壓用的前述減壓手段是被設成 Φ 當形成成形空間時在前述框體被抵接的前述上板或是下板 的任一另一方的相對面沿著前述框體的內周緣橫跨全周開 口，且可撓性構件是被設成使位在吸引手段的開口及加壓 膜體之間的方式比前述減壓手段的開口更突出於內側。 但是，依據專利文獻1的技術，雖可以防止加壓膜體 的劣化，但是真空積層裝置的加壓膜體的安裝構造複雜， 成本高且加壓膜體的交換作業困難。 [專利文獻1]日本特開平1 0-1 75229號公報 200800567 (2) 【發明內容】 (本發明所欲解決的課題） 本發明，是爲了解決上述問題，其目的爲提供一種真 空積層裝置，具備劣化少的加壓膜體的簡易的結構。 ^ (用以解決課題的手段） • 本發明的真空積層裝置，是具備相面對且可接離的上 φ 盤及下盤，前述上盤及/或是下盤相互接近時，在被設置 於前述上盤或是下盤的任一方的相對面的加壓膜體及形成 於任一另一方的相對面之間的真空室內，藉由前述加壓膜 體加壓成形材並將前述成形材加熱·積層成形，其特徵 爲：前述加壓膜體，是由彈性體所構成，其中央部的硬度 是比周邊部的硬度低。 (發明之效果） φ 依據本發明的真空積層裝置，因爲簡易的結構且具備 劣化少的加壓膜體，所以真空積層裝置可以長期間穩定運 轉。 【實施方式】 依據圖面詳細說明本發明的實施例。第1圖，本發明 的真空積層裝置的積層成形時的部分縱剖面圖。第2圖， 是加壓膜體的平面圖。第3圖，是第2圖的A-A線擴大 剖面圖。第4圖，是別的加壓膜體的擴大剖面圖。 -5- 200800567 (3) 真空積層裝置25，是具備上盤6及下盤17，可上昇 及下降自如的下盤1 7可對於固定的上盤6相互接離。但 是，不固定上盤6，而固定下盤17也可以’兩者皆可動 ° 也可以。 上盤6，是由：在中心部具有凹部的上板1、及依序 ‘ 被積層·固定於上板1的凹部底面的絕熱板2、加熱器 ^ 3、保持板4及膜體5所構成。膜體5的表面的高度，是 φ 成爲與上板1的凹部外周緣的高度略同一。上板1的凹部 內壁面及絕熱板2、加熱器3、保持板4及膜體5的各端 面之間的空間也就是吸引室1 8，是通過開閉閥與真空泵 (皆無圖示）連通。 下盤1 7，是由：在中心部具有凹部的下板1 2、及依 序被積層·固定於下板1 2的凹部底面的絕熱板1 1、加熱 器1 〇及表板9、及接合於安裝板1 6的加壓膜體8、及通 過安裝板1 6將加壓膜體8緊貼於下板1 2的外周緣表面的 • 框體15、及密封與框體15的上板1之間的抵接面的Ο形 環1 3、及密封下板1 2的外周緣表面及安裝板1 6之間的 _ 緊貼面的〇形環14所構成。下板12的凹部內壁面及絕 熱板11的端面之間的空間也就是吸引·加壓室19，是通 過開閉閥與真空泵及氣壓源（皆無圖示）連通。又，加壓膜 體8雖例示設置於下盤1 7，但是下盤及上盤相反配設， 將加壓膜體設置於上盤的結構也可以。 成形材7的代表例如重疊配線基板等、及絕緣材料或 是感光耐鈾膜等的樹脂材料，上盤6及下盤1 7相互分離 -6 - (4) (4)200800567 時，通過無圖示搬運薄膜等供給至加壓膜體8的上面。這 時，加壓膜體8是藉由吸引·加壓室19的真空吸引，密 合於鋁合金製的刻設有表板9的複數溝的上面。上盤6及 下盤1 7相互接近並使框體1 5抵接於上板1的話，會形成 由加壓膜體8的上面、及膜體5的表面、及框體15的內 壁面所畫設成的空間也就是真空室。真空室因爲是通過間 隙20與吸引室18連通，所以真空吸引吸引室18的話， 真空室內也成爲真空狀態。 接著，解除吸引·加壓室19的真空，進一^步使吸 引·加壓室1 9與氣壓源連接的話，加壓膜體8會離開表 板9朝上方膨出，將成形材7按壓於上盤6的膜體5。成 形材7，是被加熱器3、1 0加熱且被加壓膜體8加壓使成 形材7的樹脂材料被積層成形於配線基板。 加壓膜體8，如第2圖及第3圖所不，是厚度3 m m 的彈性體也就是矽橡膠膜。加壓膜體8，是將其外周端部 燒接在厚度1.6mm的額緣狀的不銹鋼板也就是安裝板16 的內周端部，但除了安裝板1 6的內周端面開始的數mm 的寬度部分。 但是，加壓膜體8，是如第1圖所示，成形材7的加 壓時框體1 5的高度部分會延伸，進一步被間隙20部分吸 引而極度彎曲。因此，在抵接於框體1 5的高度部分的面 的加壓膜體8的部分及其附近部，加壓膜體8的素材的劣 化激烈，加壓膜體8的破損多於此處發生。被覆加壓膜體 8的成形材7的部分雖也延伸，但是成形材7的厚度相較 200800567 (5) 於加壓膜體8的厚度或框體1 5的高度因爲很薄，所以沒 有產生劣化的問題。 在此，彈性體也就是加壓膜體8的硬度，在加壓膜體 8的中央部23比較低，在加壓膜體8的周邊部21比較 高。具體上，加壓膜體8的中央部23，是加壓膜體8接 ' 觸於上盤6的成形面也就是膜體5的部分。加壓膜體8的 β 中央部23，是在真空下被覆加壓成形材7，爲了使樹脂材 Φ 料充分分布於成形材7的配線基板表面所存在的凹凸，而 要求硬度低且埋入性良好。較佳硬度是3 0度以下，最佳 是20度。β卩，加壓膜體8的中央部23的大小，是在上盤 6的膜體5表面上可被覆成形材7的狀態的成形材7的形 狀領域爲最小，膜體5表面及框體1 5的角部之間的間隙 20的作爲入口的相當於從真空室的立起部分的領域爲最 大。另一方面，加壓膜體8的周邊部21，是中央部23的 外方，如前述包含加壓膜體8延伸·彎曲處的部分。加壓 • 膜體8的周邊部21，是與中央部23同樣的低硬度的情況 時，對於彎曲的影響比對於延伸的影響大，加壓膜體8會 . 進入間隙20使加壓膜體8極度劣化。因此，在延伸無問 題的範圍內提高加壓膜體8的周邊部2 1的硬度來減輕彎 曲的程度防止劣化。加壓膜體8的周邊部21的較佳硬 度，雖是依存於加壓膜體8的厚度或框體15的高度，但 是在40度乃至60度之間，在此實施例爲50度。又，在 周邊部21及中央部23之間或在周邊部21的外方，設置 與周邊部21或是中央部23的硬度不同硬度的構件也可 -8 - 200800567 ⑹ 以。 如第4圖所示的擴大剖面圖，是顯示別的實施例的加 壓膜體26。加壓膜體8，雖使中央部23鄰接設在周邊部 2 1的內側，但加壓膜體26，是使朝安裝板1 6的接合面側 的全面爲周邊部22、及被設在加壓膜體26的成形材7側 (周邊部22)中央部的凹部爲中央部24。藉由如此結構， 可讓只要求積層成形的埋入性的部分成爲低硬度。 對於習知的真空積層裝置，加壓的膜體的破損只有數 萬成形周期，但是依據上述實施例的真空積層裝置，可超 過十萬成形周期以上。 此發明不限定於以上說明的實施例，在未脫離發明的 宗旨的範圍內可以進行各種的變更。 【圖式簡單說明】 [第1圖]本發明的真空積層裝置的積層成形時的部分 縱剖面圖。 [第2圖]加壓膜體的平面圖。 [第3圖]第2圖的A-A線擴大剖面圖。 [第4圖]別的加壓膜體的擴大剖面圖。 【主要元件符號說明】 1 :上板 2 :絕熱板 3 :加熱器 -9 - 200800567 保持板 膜體 上盤 成形材 加壓膜體 表板 :加熱器 :絕熱板 =下板 :〇形環 :〇形環 :框體 =安裝板 :下盤 :吸引室 :吸引·加壓室 =間隙 :周邊部 :周邊部 :中央部 :中央部 =積層裝置 :加壓膜體 -10-200800567 (1) Description of the Invention [Technical Field] The present invention relates to a vacuum laminating apparatus including a pressurized film body. [Prior Art] ^ Deterioration of a pressurized film body of a vacuum lamination device having a pressurized film body is prevented. * For example, Patent Document 1 is known. Patent Document 1 relates to a vacuum laminated device, comprising: an upper plate and a lower plate that face each other and are detachable, and a pressurizing film that is provided on the opposite surface of either the upper plate or the lower plate And a frame that forms a molding space in which the molding material is accommodated between the opposing surface of the other of the upper surface and the pressing film body when the upper plate and/or the lower plate are close to each other, And a heating means for heating the molded material, a pressure reducing means for evacuating the molding space, and a molding material for allowing the molding material accommodated in the molding space to be pressurized at an arbitrary timing to operate the pressurized film body. The pressure-reducing means for the pressure-receiving body and the pressure-reducing means for reducing the pressure in the molding space are set to be Φ when the forming space is formed, and the other of the upper or lower plates that are in contact with the frame body is opposed to each other. The surface is opened across the entire circumference along the inner circumference of the frame, and the flexible member is disposed so as to be positioned between the opening of the suction means and the pressurized film body so as to protrude more than the opening of the pressure reducing means. Inside. However, according to the technique of Patent Document 1, deterioration of the pressurized film body can be prevented, but the mounting structure of the pressurized film body of the vacuum lamination device is complicated, the cost is high, and the exchange work of the pressurized film body is difficult. [Problem to be Solved by the Invention] The present invention has been made to solve the above problems, and an object of the invention is to provide a vacuum laminating apparatus. It has a simple structure of a pressurized film body with less deterioration. ^ (Means for Solving the Problem) The vacuum laminating apparatus of the present invention is provided with an upper φ disc and a lower disc which are facing each other and are detachable, and are provided when the upper disc and/or the lower disc are close to each other Forming and forming the press-formed material by the pressurizing film body in a vacuum chamber between the opposing surface of either the upper or lower disk and the vacuum chamber formed between the other opposing faces In the heating and laminating molding, the pressurizing film body is made of an elastic body, and the hardness of the central portion is lower than the hardness of the peripheral portion. (Effect of the Invention) φ According to the vacuum laminating apparatus of the present invention, since the pressurized film body having little deterioration is provided in a simple configuration, the vacuum laminating apparatus can stably operate for a long period of time. [Embodiment] An embodiment of the present invention will be described in detail based on the drawings. Fig. 1 is a partial longitudinal sectional view showing the laminated layer of the vacuum laminating apparatus of the present invention. Fig. 2 is a plan view of a pressurized film body. Fig. 3 is an enlarged cross-sectional view taken along line A-A of Fig. 2. Fig. 4 is an enlarged cross-sectional view of another pressurized film body. -5- 200800567 (3) The vacuum laminating device 25 is provided with an upper tray 6 and a lower tray 17, and the lower trays 7 which can be raised and lowered can be separated from each other by the fixed upper tray 6. However, the upper tray 6 is not fixed, and the fixed lower tray 17 can also be "both movable". The upper tray 6 is composed of an upper plate 1 having a concave portion at the center portion, and a heat insulating plate 2, a heater 3, a holding plate 4, and a film body 5 which are sequentially laminated and fixed to the bottom surface of the concave portion of the upper plate 1. Composition. The height of the surface of the film body 5 is such that φ is slightly the same as the height of the outer periphery of the concave portion of the upper plate 1. The space between the inner wall surface of the concave portion of the upper plate 1 and the heat insulating plate 2, the heater 3, the holding plate 4, and the respective end faces of the film body 5, that is, the suction chamber 18, communicates with the vacuum pump (both not shown) through the opening and closing valve. The lower plate 17 is composed of a lower plate 1 2 having a concave portion at the center portion, a heat insulating plate 1 1 which is laminated and fixed to the bottom surface of the concave portion of the lower plate 1 2, a heater 1 and a front plate 9, and The pressurizing film body 8 joined to the mounting plate 16 and the frame body 15 which adheres the pressurizing film body 8 to the outer peripheral surface of the lower plate 1 2 by the mounting plate 16 and the seal and the frame 15 The Ο-shaped ring 13 of the abutting surface between the plates 1 and the outer peripheral surface of the sealing lower plate 12 and the 〇-shaped ring 14 of the affixing surface between the mounting plates 16 are formed. The space between the inner wall surface of the recessed portion of the lower plate 12 and the end surface of the heat insulating plate 11 is the suction/pressurization chamber 19, and is connected to the vacuum pump and the air pressure source (both not shown) through the opening and closing valve. Further, the pressurizing film body 8 is exemplified as being provided on the lower tray 17 but having the lower tray and the upper tray disposed oppositely, and the pressurized film body may be provided on the upper tray. The representative of the molded material 7 is, for example, a printed wiring board or the like, and an insulating material or a resin material such as a photosensitive uranium-resistant film. When the upper tray 6 and the lower tray 17 are separated from each other -6 - (4) (4) 200800567, The conveyance film or the like is supplied to the upper surface of the pressurized film body 8. At this time, the pressurized film body 8 is vacuum-sucked by the suction/pressurization chamber 19, and is adhered to the upper surface of the plurality of grooves in which the surface plate 9 is formed by the aluminum alloy. When the upper tray 6 and the lower tray 17 are close to each other and the frame 15 is brought into contact with the upper plate 1, the upper surface of the pressurized film body 8, the surface of the film body 5, and the inner wall surface of the frame 15 are formed. The space that is drawn is also the vacuum chamber. Since the vacuum chamber communicates with the suction chamber 18 through the gap 20, when the vacuum suction chamber 18 is sucked, the vacuum chamber is also in a vacuum state. Then, the vacuum of the suction/pressurization chamber 19 is released, and when the suction/pressurization chamber 19 is connected to the air pressure source in a stepwise manner, the pressurized film body 8 is swelled upward from the front surface plate 9, and the molded material 7 is pressed against The film body 5 of the upper tray 6. The molding material 7 is heated by the heaters 3 and 10 and pressurized by the pressurized film body 8 to form a resin material of the molding material 7 on the wiring board. The pressurized film body 8, as shown in Figs. 2 and 3, is an elastic body having a thickness of 3 m, that is, a ruthenium rubber film. The pressurizing film body 8 is a stainless steel plate having a peripheral edge portion having a thickness of 1.6 mm, that is, an inner peripheral end portion of the mounting plate 16, but a few mm apart from the inner peripheral end surface of the mounting plate 16 The width part. However, as shown in Fig. 1, the pressurizing film body 8 has a height portion of the frame body 15 extending when the molded material 7 is pressed, and is further attracted by the gap 20 to be extremely curved. Therefore, in the portion of the pressurized film body 8 that is in contact with the surface of the height portion of the frame body 15 and the vicinity thereof, the deterioration of the material of the pressurized film body 8 is intense, and the damage of the pressurized film body 8 is more than here. occur. The portion of the molded material 7 covering the pressurized film body 8 is also extended, but the thickness of the molded material 7 is not thinner than the thickness of the pressurized film body 8 or the height of the frame body 15 as compared with 200800567 (5). The problem of deterioration. Here, the hardness of the elastic body, that is, the pressure film body 8, is relatively low in the central portion 23 of the pressurized film body 8, and is relatively high in the peripheral portion 21 of the pressurized film body 8. Specifically, the central portion 23 of the pressurized film body 8 is a portion where the pressurized film body 8 is brought into contact with the forming surface of the upper tray 6, that is, the film body 5. In the β-center portion 23 of the pressurizing film body 8, the press-molded material 7 is covered under vacuum, and the resin material is sufficiently distributed on the surface of the wiring board of the molded material 7 to have irregularities, and the hardness is required to be low and buried. Good sex. The preferred hardness is 30 degrees or less, and most preferably 20 degrees. The size of the central portion 23 of the pressurized film body 8 is such that the shape of the molded material 7 in the state in which the molded material 7 can be coated on the surface of the film body 5 of the upper tray 6 is the smallest, and the surface of the film body 5 and the frame body are the smallest. The area of the gap 20 between the corners of the 15 is equivalent to the field from the rising portion of the vacuum chamber as the inlet. On the other hand, the peripheral portion 21 of the pressurized film body 8 is outside the central portion 23, and includes a portion where the pressurized film body 8 is extended and bent as described above. Pressurization • When the peripheral portion 21 of the film body 8 has the same low hardness as the center portion 23, the influence on the bending is greater than the influence on the extension, and the pressurized film body 8 enters the gap 20 to pressurize the film body. 8 is extremely degraded. Therefore, the hardness of the peripheral portion 2 1 of the pressurizing film body 8 is increased within the range where the problem is not extended to reduce the degree of bending and prevent deterioration. The preferred hardness of the peripheral portion 21 of the pressurized film body 8 depends on the thickness of the pressurized film body 8 or the height of the frame 15, but is between 40 degrees and 60 degrees, and is 50 degrees in this embodiment. Further, a member having a hardness different from that of the peripheral portion 21 or the central portion 23 between the peripheral portion 21 and the central portion 23 or outside the peripheral portion 21 may be -8 - 200800567 (6). The enlarged cross-sectional view shown in Fig. 4 shows the pressurized film body 26 of another embodiment. In the pressurizing film body 8, the center portion 23 is provided adjacent to the inner side of the peripheral portion 21, but the pressurizing film body 26 is provided on the joint surface side of the mounting plate 16 as the peripheral portion 22 and is provided The concave portion at the center portion of the molded material 7 side (peripheral portion 22) of the pressurized film body 26 is the central portion 24. With such a configuration, it is possible to make the buried portion requiring only the formation of the laminate to have a low hardness. In the conventional vacuum laminating apparatus, the damage of the pressurized film body is only tens of thousands of forming cycles, but the vacuum laminating apparatus according to the above embodiment can exceed 100,000 forming cycles. The invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit and scope of the invention. [Brief Description of the Drawings] [Fig. 1] A partial longitudinal sectional view of a vacuum lamination device of the present invention at the time of lamination molding. [Fig. 2] A plan view of a pressurized film body. [Fig. 3] An enlarged cross-sectional view taken along line A-A of Fig. 2. [Fig. 4] An enlarged cross-sectional view of another pressurized film body. [Main component symbol description] 1 : Upper plate 2 : Insulation plate 3 : Heater -9 - 200800567 Holding plate film upper plate forming material Pressurized film body surface plate: Heater: Insulation plate = Lower plate: 〇 ring: 〇-shaped ring: frame = mounting plate: lower plate: suction chamber: suction and pressing chamber = gap: peripheral portion: peripheral portion: central portion: central portion = laminated device: pressurized membrane body -10-