TW200746319A - Bonding head for chip bonding machine - Google Patents

Bonding head for chip bonding machine

Info

Publication number
TW200746319A
TW200746319A TW095141948A TW95141948A TW200746319A TW 200746319 A TW200746319 A TW 200746319A TW 095141948 A TW095141948 A TW 095141948A TW 95141948 A TW95141948 A TW 95141948A TW 200746319 A TW200746319 A TW 200746319A
Authority
TW
Taiwan
Prior art keywords
moving block
head
bonding
unit
driving unit
Prior art date
Application number
TW095141948A
Other languages
Chinese (zh)
Other versions
TWI313900B (en
Inventor
Han-Hyoun Choi
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200746319A publication Critical patent/TW200746319A/en
Application granted granted Critical
Publication of TWI313900B publication Critical patent/TWI313900B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

A bonding head for a chip bonding machine includes a linear motor (LM) guide mounted at a back frame, a first moving block movably coupled to the LM guide, a first driving unit linearly moving the first moving block, a first linear motor mounted at the first moving block, a second moving block coupled to the first moving block so as to be movable in a direction perpendicular to a motion direction of the first moving block, a force transmitting unit transmitting a linear driving force of the first linear motor to the second moving block, a head unit having a tool for picking-up driver chips and rotatably coupled to the second moving block, and a rotation driving unit rotating the head unit. Since the force transmitting unit is not connected to the driving unit and thus a force applied to the first driving unit is not transmitted to the head, an operation error of the bonding head is reduced. Also, since the bonding head is stably operated, the reliability and precision of the bonding process is enhanced. Furthermore, since an entire structure of the bonding head is compact, the entire size thereof is reduced.
TW095141948A 2006-02-16 2006-11-13 Bonding head for chip bonding machine TWI313900B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060015320A KR100609634B1 (en) 2006-02-16 2006-02-16 Bonding head for bonding machine

Publications (2)

Publication Number Publication Date
TW200746319A true TW200746319A (en) 2007-12-16
TWI313900B TWI313900B (en) 2009-08-21

Family

ID=37185075

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141948A TWI313900B (en) 2006-02-16 2006-11-13 Bonding head for chip bonding machine

Country Status (4)

Country Link
JP (1) JP4981426B2 (en)
KR (1) KR100609634B1 (en)
CN (1) CN100440470C (en)
TW (1) TWI313900B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110003020A (en) * 2009-07-03 2011-01-11 주식회사 탑 엔지니어링 Head apparatus for lc dispenser
KR100945004B1 (en) 2009-07-27 2010-03-05 안동규 Pressing tool of bonding apparatus
KR100978792B1 (en) 2010-01-11 2010-08-30 (주)에이에스티 Collet of die bonding apparatus
JP5755361B1 (en) * 2014-07-02 2015-07-29 株式会社新川 Mounting device
JP6185955B2 (en) * 2015-04-14 2017-08-23 株式会社新川 Mounting device
CN105710580A (en) * 2016-05-04 2016-06-29 马怡鑫 Welding tooling

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2618279B2 (en) * 1990-03-19 1997-06-11 株式会社カイジョー Wire bonding equipment
JPH04243144A (en) * 1991-01-18 1992-08-31 Fujitsu Ltd Bonding head-holding mechanism
JPH07114224B2 (en) * 1991-04-25 1995-12-06 松下電器産業株式会社 Bonding head for thermocompression bonding
JP2949891B2 (en) * 1991-04-25 1999-09-20 松下電器産業株式会社 Wire bonding method
JP3067563B2 (en) * 1995-01-05 2000-07-17 松下電器産業株式会社 Wire bonding equipment
JP3246282B2 (en) * 1995-07-28 2002-01-15 松下電器産業株式会社 Display panel module manufacturing apparatus and display panel module manufacturing method
JP2930093B2 (en) * 1995-08-18 1999-08-03 澁谷工業株式会社 Bonding method
KR100221652B1 (en) * 1996-10-18 1999-09-15 윤종용 Bonder head for the die bonding system
JPH11297764A (en) * 1998-04-14 1999-10-29 Ricoh Co Ltd Bonding tool and bonding method for semiconductor chip using the same
JP2001102395A (en) 1999-09-29 2001-04-13 Nidec Tosok Corp Multiple head for die bonding device
KR20030046306A (en) * 2001-12-05 2003-06-12 에섹 트레이딩 에스에이 Apparatus for mounting semiconductor chips
JP3727616B2 (en) 2002-07-11 2005-12-14 株式会社新川 Wire bonding equipment
JP2004063868A (en) 2002-07-30 2004-02-26 Renesas Technology Corp Manufacture of semiconductor device
JP4294451B2 (en) * 2003-11-21 2009-07-15 オリンパス株式会社 Semiconductor bonding equipment
JP4197171B2 (en) * 2004-05-18 2008-12-17 パナソニック株式会社 Electronic component mounting machine

Also Published As

Publication number Publication date
CN101022086A (en) 2007-08-22
JP2007221098A (en) 2007-08-30
JP4981426B2 (en) 2012-07-18
CN100440470C (en) 2008-12-03
TWI313900B (en) 2009-08-21
KR100609634B1 (en) 2006-08-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees