TW200746232A - Substrate measuring instrument - Google Patents
Substrate measuring instrumentInfo
- Publication number
- TW200746232A TW200746232A TW095133294A TW95133294A TW200746232A TW 200746232 A TW200746232 A TW 200746232A TW 095133294 A TW095133294 A TW 095133294A TW 95133294 A TW95133294 A TW 95133294A TW 200746232 A TW200746232 A TW 200746232A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- measuring instrument
- objective lens
- stage
- incident pupil
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/255—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring radius of curvature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
To provide a substrate measuring instrument capable of accurately measuring the curvature of a substrate, regardless of the kind of substrate. This substrate measuring instrument is provided with a measuring means that is provided with a multi-wavelength light source 12, an objective lens 15, a stage 10 for supporting the substrate W, a stage moving mechanism 11 for moving the stage, a pattern plate 17 arranged at a position conjugated with an incident pupil of the objective lens 15, and a CCD camera arranged at a position conjugate with the incident pupil of the objective lens 15, and for imaging the pattern plate 17 projected at a position E of the incident pupil after being reflected on a surface of the substrate W, by the CCD camera, so as to measure the positional shift amount from the reference of a pattern image, and a computing means for computing the angle of the surface of the substrate W, based on the positional shift amount.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005321764A JP2007127566A (en) | 2005-11-07 | 2005-11-07 | Substrate measuring instrument |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200746232A true TW200746232A (en) | 2007-12-16 |
Family
ID=38150339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095133294A TW200746232A (en) | 2005-11-07 | 2006-09-08 | Substrate measuring instrument |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007127566A (en) |
KR (1) | KR20070049061A (en) |
TW (1) | TW200746232A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5459944B2 (en) * | 2006-11-13 | 2014-04-02 | 大日本スクリーン製造株式会社 | Surface shape measuring device, stress measuring device, surface shape measuring method and stress measuring method |
KR102491575B1 (en) | 2017-09-28 | 2023-01-25 | 삼성전자주식회사 | Method for inspecting a semiconductor substrate and method for manufacturing a semiconductor device |
CN114858053B (en) * | 2021-01-20 | 2023-03-10 | 四川大学 | Method for determining spatial coordinates of center of entrance pupil of industrial camera |
-
2005
- 2005-11-07 JP JP2005321764A patent/JP2007127566A/en active Pending
-
2006
- 2006-09-08 TW TW095133294A patent/TW200746232A/en unknown
- 2006-10-17 KR KR1020060100768A patent/KR20070049061A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2007127566A (en) | 2007-05-24 |
KR20070049061A (en) | 2007-05-10 |
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