TW200746232A - Substrate measuring instrument - Google Patents

Substrate measuring instrument

Info

Publication number
TW200746232A
TW200746232A TW095133294A TW95133294A TW200746232A TW 200746232 A TW200746232 A TW 200746232A TW 095133294 A TW095133294 A TW 095133294A TW 95133294 A TW95133294 A TW 95133294A TW 200746232 A TW200746232 A TW 200746232A
Authority
TW
Taiwan
Prior art keywords
substrate
measuring instrument
objective lens
stage
incident pupil
Prior art date
Application number
TW095133294A
Other languages
Chinese (zh)
Inventor
Nariaki Fujiwara
Keiji Hatano
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200746232A publication Critical patent/TW200746232A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/255—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring radius of curvature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

To provide a substrate measuring instrument capable of accurately measuring the curvature of a substrate, regardless of the kind of substrate. This substrate measuring instrument is provided with a measuring means that is provided with a multi-wavelength light source 12, an objective lens 15, a stage 10 for supporting the substrate W, a stage moving mechanism 11 for moving the stage, a pattern plate 17 arranged at a position conjugated with an incident pupil of the objective lens 15, and a CCD camera arranged at a position conjugate with the incident pupil of the objective lens 15, and for imaging the pattern plate 17 projected at a position E of the incident pupil after being reflected on a surface of the substrate W, by the CCD camera, so as to measure the positional shift amount from the reference of a pattern image, and a computing means for computing the angle of the surface of the substrate W, based on the positional shift amount.
TW095133294A 2005-11-07 2006-09-08 Substrate measuring instrument TW200746232A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005321764A JP2007127566A (en) 2005-11-07 2005-11-07 Substrate measuring instrument

Publications (1)

Publication Number Publication Date
TW200746232A true TW200746232A (en) 2007-12-16

Family

ID=38150339

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133294A TW200746232A (en) 2005-11-07 2006-09-08 Substrate measuring instrument

Country Status (3)

Country Link
JP (1) JP2007127566A (en)
KR (1) KR20070049061A (en)
TW (1) TW200746232A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5459944B2 (en) * 2006-11-13 2014-04-02 大日本スクリーン製造株式会社 Surface shape measuring device, stress measuring device, surface shape measuring method and stress measuring method
KR102491575B1 (en) 2017-09-28 2023-01-25 삼성전자주식회사 Method for inspecting a semiconductor substrate and method for manufacturing a semiconductor device
CN114858053B (en) * 2021-01-20 2023-03-10 四川大学 Method for determining spatial coordinates of center of entrance pupil of industrial camera

Also Published As

Publication number Publication date
JP2007127566A (en) 2007-05-24
KR20070049061A (en) 2007-05-10

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