TW200740922A - Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film - Google Patents

Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film

Info

Publication number
TW200740922A
TW200740922A TW096109193A TW96109193A TW200740922A TW 200740922 A TW200740922 A TW 200740922A TW 096109193 A TW096109193 A TW 096109193A TW 96109193 A TW96109193 A TW 96109193A TW 200740922 A TW200740922 A TW 200740922A
Authority
TW
Taiwan
Prior art keywords
resin composition
curable resin
heat curable
protective film
circuit board
Prior art date
Application number
TW096109193A
Other languages
English (en)
Other versions
TWI448510B (zh
Inventor
Yoshimitsu Ishihara
Hirofumi Inoue
Mina Onishi
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200740922A publication Critical patent/TW200740922A/zh
Application granted granted Critical
Publication of TWI448510B publication Critical patent/TWI448510B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/348—Hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW096109193A 2006-03-16 2007-03-16 A thermosetting resin composition, a protective film for a flexible circuit substrate, and a surface protective film TWI448510B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006072732 2006-03-16

Publications (2)

Publication Number Publication Date
TW200740922A true TW200740922A (en) 2007-11-01
TWI448510B TWI448510B (zh) 2014-08-11

Family

ID=38509533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109193A TWI448510B (zh) 2006-03-16 2007-03-16 A thermosetting resin composition, a protective film for a flexible circuit substrate, and a surface protective film

Country Status (7)

Country Link
US (1) US20090099283A1 (zh)
EP (1) EP1997843A4 (zh)
JP (2) JP5237790B2 (zh)
KR (1) KR100984592B1 (zh)
CN (1) CN101400716B (zh)
TW (1) TWI448510B (zh)
WO (1) WO2007105713A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635104B (zh) * 2016-03-31 2018-09-11 橫浜橡膠股份有限公司 光硬化性樹脂、混合物及光硬化性樹脂組成物

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5265854B2 (ja) * 2005-12-08 2013-08-14 昭和電工株式会社 熱硬化性樹脂組成物、熱可塑性樹脂溶液および皮膜形成材料ならびにこれらの硬化物
WO2007105713A1 (ja) * 2006-03-16 2007-09-20 Showa Denko K.K. 熱硬化性樹脂組成物、フレキシブル回路基板用オーバーコート剤および表面保護膜
JP5506010B2 (ja) * 2006-03-17 2014-05-28 昭和電工株式会社 樹脂組成物
US20110007490A1 (en) * 2008-03-21 2011-01-13 Showa Denko K.K. Resin composition and cured film thereof
US8669306B2 (en) 2008-12-26 2014-03-11 Showa Denko K.K. Curable composition
CN102549074B (zh) * 2009-10-07 2015-11-25 日立化成株式会社 热固性树脂组合物、形成柔性配线板的保护膜的方法以及柔性配线板
DE102010013196B4 (de) * 2010-03-29 2015-10-29 Hilti Aktiengesellschaft Chemische Zweikomponenten-Mörtelmasse mit verbesserter Haftung an der Oberfläche von halbgereinigten und/oder feuchten Bohrlöchern in mineralischem Untergrund und ihre Verwendung
JP5901141B2 (ja) * 2010-05-17 2016-04-06 昭和電工株式会社 発光素子用実装基板、発光素子用実装基板の製造方法、発光装置及び発光装置の製造方法並びに白色樹脂組成物
WO2011161996A1 (ja) * 2010-06-21 2011-12-29 シャープ株式会社 液晶表示装置
JP5610301B2 (ja) * 2011-03-16 2014-10-22 東洋紡株式会社 熱硬化性樹脂組成物
WO2012141124A1 (ja) * 2011-04-13 2012-10-18 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板
CN103140019B (zh) * 2011-12-05 2016-06-08 昆山雅森电子材料科技有限公司 软性电路板的黑色覆盖膜、软性印刷电路板结构及其制法
DE102014200492A1 (de) 2014-01-14 2015-07-16 Robert Bosch Gmbh Schaltungsträger mit einer Silikonpolymer-Beschichtung
WO2016129565A1 (ja) * 2015-02-09 2016-08-18 株式会社有沢製作所 低誘電樹脂組成物
CN108368336B (zh) 2015-12-25 2021-09-10 日保丽公司 固化性组合物、固化物、外涂膜、覆盖柔性配线板及其制造方法
KR102070736B1 (ko) 2015-12-25 2020-01-29 쇼와 덴코 가부시키가이샤 신규 폴리우레탄, 경화성 조성물, 오버코트막, 플렉시블 배선판 및 그 제조 방법
US10919281B2 (en) * 2017-03-17 2021-02-16 Lockheed Martin Corporation Nanoparticle application with adhesives for printable electronics
JP7192353B2 (ja) * 2017-10-30 2022-12-20 Dic株式会社 ウレタン樹脂組成物、皮膜、及び合成皮革
CN113166618B (zh) * 2018-11-29 2022-08-23 Dic株式会社 粘合剂组合物及表面保护膜
JP2020152808A (ja) * 2019-03-20 2020-09-24 株式会社カネカ 熱硬化性樹脂組成物
JP2021020982A (ja) * 2019-07-24 2021-02-18 味の素株式会社 樹脂組成物
CN111793348A (zh) * 2020-07-21 2020-10-20 明光瑞智电子科技有限公司 一种高频高速电路基板用的高性能无卤树脂组合物

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5248889B2 (zh) * 1973-10-29 1977-12-13
JPS5986045A (ja) * 1982-11-05 1984-05-18 Nippon Soda Co Ltd 永久レジスト用光硬化性樹脂組成物
JPH10279652A (ja) * 1997-04-01 1998-10-20 Toyobo Co Ltd 硬化性樹脂組成物
KR100515218B1 (ko) * 2000-09-11 2005-09-16 쇼와 덴코 가부시키가이샤 감광성 조성물, 그것의 경화물, 및 그것을 사용한프린트회로기판
AU2002255353A1 (en) * 2001-05-15 2002-11-25 Showa Denko K. K. Photosensitive coloring compositon, color filter using the compositon and method of producing the same
JP2003183401A (ja) * 2001-12-20 2003-07-03 Showa Denko Kk 硬化性樹脂組成物およびその硬化物
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
JP2004198542A (ja) * 2002-12-16 2004-07-15 Showa Denko Kk カラーフィルターブラックマトリックスレジスト組成物及びその組成物に用いる感光性組成物
JP2004198717A (ja) * 2002-12-18 2004-07-15 Showa Denko Kk カラーフィルターブラックマトリックスレジスト組成物及びその組成物に用いるカーボンブラック分散液組成物
EP1600812A1 (en) * 2003-03-06 2005-11-30 Nippon Kayaku Kabushiki Kaisha Photosensitive resin composition and curing product thereof
US7476484B2 (en) * 2003-08-07 2009-01-13 Huntsman Advanced Materials Americas Inc. Photocrosslinkable polyurethanes
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板
JP2005173577A (ja) * 2003-11-17 2005-06-30 Showa Denko Kk 難燃感光性組成物およびその硬化物
JP4587865B2 (ja) * 2004-04-22 2010-11-24 昭和電工株式会社 感光性樹脂組成物及びその硬化物並びにそれらを使用するプリント配線基板の製造方法
WO2005111674A1 (ja) * 2004-05-13 2005-11-24 Showa Denko K.K. カラーフィルター用黒色レジスト組成物
JP2006036801A (ja) 2004-07-22 2006-02-09 Japan Epoxy Resin Kk 高分子量エポキシ樹脂組成物、その組成物を用いたフィルム、及びその硬化物
JP5190976B2 (ja) * 2004-09-21 2013-04-24 昭和電工株式会社 ウレタン樹脂を用いた熱硬化性樹脂組成物
TWI389975B (zh) * 2004-09-21 2013-03-21 Showa Denko Kk Thermosetting ethylcarbamate resin composition
JP4716416B2 (ja) * 2004-09-30 2011-07-06 昭和電工株式会社 末端カルボキシウレタン樹脂を用いる熱硬化性樹脂組成物
JP4994679B2 (ja) * 2005-03-04 2012-08-08 昭和電工株式会社 皮膜材料形成用ペースト
TWI388584B (zh) * 2005-03-04 2013-03-11 Showa Denko Kk The film is formed with a paste
WO2007105713A1 (ja) * 2006-03-16 2007-09-20 Showa Denko K.K. 熱硬化性樹脂組成物、フレキシブル回路基板用オーバーコート剤および表面保護膜

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635104B (zh) * 2016-03-31 2018-09-11 橫浜橡膠股份有限公司 光硬化性樹脂、混合物及光硬化性樹脂組成物
US11248079B2 (en) 2016-03-31 2022-02-15 Sika Hamatite Co., Ltd. Photocurable resin, mixture, and photocurable resin composition

Also Published As

Publication number Publication date
CN101400716B (zh) 2012-06-06
JP5237790B2 (ja) 2013-07-17
EP1997843A1 (en) 2008-12-03
KR100984592B1 (ko) 2010-09-30
KR20080100492A (ko) 2008-11-18
JPWO2007105713A1 (ja) 2009-07-30
US20090099283A1 (en) 2009-04-16
CN101400716A (zh) 2009-04-01
EP1997843A4 (en) 2009-06-17
TWI448510B (zh) 2014-08-11
WO2007105713A1 (ja) 2007-09-20
JP2013117031A (ja) 2013-06-13

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