TW200737555A - Light-emitting device and method for manufacturing the same - Google Patents

Light-emitting device and method for manufacturing the same

Info

Publication number
TW200737555A
TW200737555A TW096105656A TW96105656A TW200737555A TW 200737555 A TW200737555 A TW 200737555A TW 096105656 A TW096105656 A TW 096105656A TW 96105656 A TW96105656 A TW 96105656A TW 200737555 A TW200737555 A TW 200737555A
Authority
TW
Taiwan
Prior art keywords
light
emitting device
manufacturing
same
emitting element
Prior art date
Application number
TW096105656A
Other languages
English (en)
Inventor
Mitsutoshi Higashi
Masahiro Sunohara
Yuichi Taguchi
Akinori Shiraishi
Kei Murayama
Koizumi Naoyuki
Sakaguchi Hideaki
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200737555A publication Critical patent/TW200737555A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW096105656A 2006-02-16 2007-02-15 Light-emitting device and method for manufacturing the same TW200737555A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006038950A JP4828248B2 (ja) 2006-02-16 2006-02-16 発光装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW200737555A true TW200737555A (en) 2007-10-01

Family

ID=37909540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105656A TW200737555A (en) 2006-02-16 2007-02-15 Light-emitting device and method for manufacturing the same

Country Status (5)

Country Link
US (2) US7838897B2 (zh)
EP (2) EP3007241A1 (zh)
JP (1) JP4828248B2 (zh)
KR (1) KR20070082538A (zh)
TW (1) TW200737555A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9086213B2 (en) 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes

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US8044412B2 (en) * 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2008258530A (ja) * 2007-04-09 2008-10-23 Rohm Co Ltd 半導体発光装置
EP2017891A1 (en) * 2007-07-20 2009-01-21 ABB Technology AG Semiconductor module
JP5185683B2 (ja) * 2008-04-24 2013-04-17 パナソニック株式会社 Ｌｅｄモジュールの製造方法および照明器具の製造方法
US7851818B2 (en) * 2008-06-27 2010-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. Fabrication of compact opto-electronic component packages
KR101582522B1 (ko) * 2008-07-01 2016-01-06 코닌클리케 필립스 엔.브이. Ｌｅｄ를 위한 근접 시준기
KR20100094246A (ko) * 2009-02-18 2010-08-26 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
DE102009019412A1 (de) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
JP2011109010A (ja) * 2009-11-20 2011-06-02 Toshiba Lighting & Technology Corp 照明装置
JP2014026993A (ja) * 2010-11-08 2014-02-06 Panasonic Corp セラミック基板と発光ダイオードモジュール
CN102593302B (zh) * 2011-01-10 2014-10-15 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
US20130056773A1 (en) * 2011-09-02 2013-03-07 Wen Kun Yang Led package and method of the same
DE102012213178A1 (de) * 2012-04-30 2013-10-31 At & S Austria Technologie & Systemtechnik Aktiengesellschaft LED-Modul mit Leiterplatte
US9034672B2 (en) 2012-06-19 2015-05-19 Epistar Corporation Method for manufacturing light-emitting devices
CN104756267A (zh) * 2012-10-25 2015-07-01 松下知识产权经营株式会社 发光装置及其制造方法以及发光装置安装体
KR20140108172A (ko) * 2013-02-28 2014-09-05 서울반도체 주식회사 발광 모듈
KR102031967B1 (ko) * 2013-05-07 2019-10-14 엘지이노텍 주식회사 발광 소자 패키지
CN103775866A (zh) * 2013-06-20 2014-05-07 苏州恒荣节能科技安装工程有限公司 一种led灯珠
US20150176800A1 (en) * 2013-12-25 2015-06-25 I-Chiun Precision Industry Co., Ltd. Supporting base for semiconductor chip
DE102014105839A1 (de) * 2014-04-25 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
WO2015193807A1 (en) * 2014-06-17 2015-12-23 Koninklijke Philips N.V. A flash module containing an array of reflector cups for phosphor-converted leds
JP6755090B2 (ja) * 2014-12-11 2020-09-16 シチズン電子株式会社 発光装置及び発光装置の製造方法
JP6606331B2 (ja) * 2015-02-16 2019-11-13 ローム株式会社 電子装置
JP6533066B2 (ja) * 2015-02-18 2019-06-19 ローム株式会社 電子装置
WO2018043557A1 (ja) * 2016-08-31 2018-03-08 Hoya株式会社 内視鏡用光源装置、内視鏡、及び内視鏡システム
WO2018207055A1 (en) * 2017-05-10 2018-11-15 3M Innovative Properties Company Multilayer construction having electrically continuous conductor
KR102385940B1 (ko) * 2017-09-01 2022-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
JP2020533778A (ja) * 2017-09-12 2020-11-19 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
WO2019054760A1 (ko) * 2017-09-12 2019-03-21 엘지이노텍 주식회사 발광소자 패키지
KR102455086B1 (ko) 2017-09-12 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원장치
KR102392013B1 (ko) * 2017-09-15 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102413223B1 (ko) * 2017-12-19 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102550291B1 (ko) * 2018-01-16 2023-07-03 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102624113B1 (ko) * 2018-06-08 2024-01-12 서울바이오시스 주식회사 발광 소자 패키지 및 이의 제조 방법
US20220093829A1 (en) * 2018-12-27 2022-03-24 Sang Jeong An Semiconductor light-emitting device
KR102227215B1 (ko) * 2018-12-27 2021-03-12 안상정 반도체 발광소자

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JP3618534B2 (ja) 1997-11-28 2005-02-09 同和鉱業株式会社 光通信用ランプ装置とその製造方法
JPH11168172A (ja) * 1997-12-04 1999-06-22 Toshiba Tec Corp 半導体チップの製造方法及びその半導体チップによる３次元構造体、その製造方法及びその電気的接続方法
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JP4009097B2 (ja) 2001-12-07 2007-11-14 日立電線株式会社 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
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JP4164006B2 (ja) * 2003-02-17 2008-10-08 京セラ株式会社 発光素子収納用パッケージおよび発光装置
US20040188696A1 (en) * 2003-03-28 2004-09-30 Gelcore, Llc LED power package
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9086213B2 (en) 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes

Also Published As

Publication number Publication date
US8044429B2 (en) 2011-10-25
EP1821345B1 (en) 2016-07-13
JP2007220852A (ja) 2007-08-30
EP1821345A3 (en) 2010-10-20
KR20070082538A (ko) 2007-08-21
EP3007241A1 (en) 2016-04-13
US20110032710A1 (en) 2011-02-10
JP4828248B2 (ja) 2011-11-30
US20070187706A1 (en) 2007-08-16
US7838897B2 (en) 2010-11-23
EP1821345A2 (en) 2007-08-22

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