TW200734594A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
TW200734594A
TW200734594A TW095107192A TW95107192A TW200734594A TW 200734594 A TW200734594 A TW 200734594A TW 095107192 A TW095107192 A TW 095107192A TW 95107192 A TW95107192 A TW 95107192A TW 200734594 A TW200734594 A TW 200734594A
Authority
TW
Taiwan
Prior art keywords
section
heat pipe
layer
condensating
wicking structure
Prior art date
Application number
TW095107192A
Other languages
Chinese (zh)
Other versions
TWI320093B (en
Inventor
Chuen-Shu Hou
Tay-Jian Liu
Chao-Nien Tung
Chih-Hsien Sun
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95107192A priority Critical patent/TWI320093B/en
Publication of TW200734594A publication Critical patent/TW200734594A/en
Application granted granted Critical
Publication of TWI320093B publication Critical patent/TWI320093B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A heat pipe includes a sealed metal duct, which is filled with a volatilizable working liquid when heated. The duct forms a layer of wicking structure in an inner wall thereof. The heat pipe includes a condensating section, an evaporating section and an adiabatic section between the condensating section and the evaporating section. The layer of wicking structure thickness at the condensating section is smaller than that of the layer of wicking structure at the adiabatic section. The layer of wicking structure thickness at the condensating section is thin, thus heat transfer resistance between the inner wall at the condensating section and the heated working liquid is small. Heat exchange between the working liquid and the inner wall of the heat pipe is increased and heat transfer efficiency of the heat pipe is improved.
TW95107192A 2006-03-03 2006-03-03 Heat pipe TWI320093B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95107192A TWI320093B (en) 2006-03-03 2006-03-03 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95107192A TWI320093B (en) 2006-03-03 2006-03-03 Heat pipe

Publications (2)

Publication Number Publication Date
TW200734594A true TW200734594A (en) 2007-09-16
TWI320093B TWI320093B (en) 2010-02-01

Family

ID=45073696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95107192A TWI320093B (en) 2006-03-03 2006-03-03 Heat pipe

Country Status (1)

Country Link
TW (1) TWI320093B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112030650A (en) * 2020-09-01 2020-12-04 中国科学院西北生态环境资源研究院 Heat pipe body, heat pipe roadbed system of yin-yang slope roadbed and construction method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608213B (en) * 2015-07-30 2017-12-11 Furukawa Electric Co Ltd Heat transfer device
JP6560425B1 (en) 2018-11-09 2019-08-14 古河電気工業株式会社 heat pipe
TWI766681B (en) * 2021-05-11 2022-06-01 大陸商深圳興奇宏科技有限公司 Heat pipe structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112030650A (en) * 2020-09-01 2020-12-04 中国科学院西北生态环境资源研究院 Heat pipe body, heat pipe roadbed system of yin-yang slope roadbed and construction method thereof
CN112030650B (en) * 2020-09-01 2021-09-24 中国科学院西北生态环境资源研究院 Heat pipe body, heat pipe roadbed system of yin-yang slope roadbed and construction method thereof

Also Published As

Publication number Publication date
TWI320093B (en) 2010-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees