TW200728910A - Radiation sensitive resin composition, interlayer-insulated film, microlens, and the method for forming them - Google Patents

Radiation sensitive resin composition, interlayer-insulated film, microlens, and the method for forming them

Info

Publication number
TW200728910A
TW200728910A TW095147776A TW95147776A TW200728910A TW 200728910 A TW200728910 A TW 200728910A TW 095147776 A TW095147776 A TW 095147776A TW 95147776 A TW95147776 A TW 95147776A TW 200728910 A TW200728910 A TW 200728910A
Authority
TW
Taiwan
Prior art keywords
resin composition
sensitive resin
radiation sensitive
microlens
interlayer
Prior art date
Application number
TW095147776A
Other languages
Chinese (zh)
Inventor
Masaaki Hanamura
Eiji Takamoto
Takaki Minowa
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200728910A publication Critical patent/TW200728910A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28—Azides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)
  • Epoxy Resins (AREA)

Abstract

This invention provides a radiation sensitive resin composition, interlayer-insulated layer made from it and microlens. The said composition is high radiation-sensitive, which has development margin capable of forming good pattern shape, even exceeding the best development time in development step, and is capable of easily forming patterned film with excellent adherence. This invention provides a radiation sensitive resin composition, which comprises unsaturated carboxylic acid and /or unsaturated carboxylic acid anhydride, epoxy-containing unsaturated compound, phenol skeleton-containing unsaturated compounds, copolymer containing unsaturated compounds other than the above mentioned compounds, and 1,2-quinodiazide compound.
TW095147776A 2005-12-22 2006-12-20 Radiation sensitive resin composition, interlayer-insulated film, microlens, and the method for forming them TW200728910A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005369301A JP4656316B2 (en) 2005-12-22 2005-12-22 Interlayer insulating film, microlens, and manufacturing method thereof

Publications (1)

Publication Number Publication Date
TW200728910A true TW200728910A (en) 2007-08-01

Family

ID=38298216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147776A TW200728910A (en) 2005-12-22 2006-12-20 Radiation sensitive resin composition, interlayer-insulated film, microlens, and the method for forming them

Country Status (4)

Country Link
JP (1) JP4656316B2 (en)
KR (1) KR100858446B1 (en)
CN (1) CN101206401A (en)
TW (1) TW200728910A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI848898B (en) 2016-05-12 2024-07-21 南韓商三星顯示器有限公司 Photosensitive resin composition, method for forming organic film with pattern, and display device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5045064B2 (en) 2006-11-02 2012-10-10 Ｊｎｃ株式会社 Alkali-soluble polymer and positive photosensitive resin composition using the same
JP4637209B2 (en) * 2007-06-05 2011-02-23 富士フイルム株式会社 Positive photosensitive resin composition and cured film forming method using the same
US8409783B2 (en) 2007-09-28 2013-04-02 Tokyo Ohka Kogyo Co., Ltd. Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer
JP5240459B2 (en) * 2008-02-19 2013-07-17 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film, microlens and method for forming them
TWI452444B (en) * 2008-07-14 2014-09-11 Jsr Corp Formed resist patterns-insolubilization resin composition and method for forming resist pattern using the same
JP5343664B2 (en) * 2009-03-30 2013-11-13 Ｊｓｒ株式会社 Radiation-sensitive resin composition, organic EL display element partition and insulating film, and method for forming the same
US9823391B2 (en) 2012-10-23 2017-11-21 Nissan Chemical Industries, Ltd. Non-photosensitive resin composition
KR102239543B1 (en) * 2013-08-28 2021-04-13 롬엔드하스전자재료코리아유한회사 Positive-type photosensitive resin composition and cured film prepared therefrom
JP6700020B2 (en) * 2015-10-21 2020-05-27 昭和電工株式会社 Positive photosensitive resin composition
KR102414942B1 (en) 2015-12-21 2022-06-30 닛산 가가쿠 가부시키가이샤 resin composition
KR102411927B1 (en) 2016-07-28 2022-06-22 닛산 가가쿠 가부시키가이샤 resin composition
TW202124470A (en) 2019-11-06 2021-07-01 日商日產化學股份有限公司 Non-photosensitive resin composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08292574A (en) * 1995-04-20 1996-11-05 Japan Synthetic Rubber Co Ltd Radiation sensitive resin composition
JP4269115B2 (en) * 1999-05-10 2009-05-27 Ｊｓｒ株式会社 Radiation sensitive resin composition, interlayer insulating film and spacer
JP2000327877A (en) 1999-05-17 2000-11-28 Jsr Corp Radiation-sensitive resin composition, use thereof for interlayer insulation film and microlens, and interlayer insulation film and microlens
JP2000327875A (en) 1999-05-21 2000-11-28 Jsr Corp Radiation-sensitive resin composition for spacer united with color filter protection film or tft interlayer insulation film
JP2002182380A (en) * 2000-12-14 2002-06-26 Jsr Corp Radiation sensitive resin composition for forming insulation film of organic el display element, insulation film formed from the same and organic el display element
JP4650639B2 (en) * 2004-04-08 2011-03-16 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof
JP4742662B2 (en) * 2005-04-26 2011-08-10 Ｊｓｒ株式会社 Radiation-sensitive resin composition, protrusions and spacers formed therefrom, and liquid crystal display device comprising the same
JP4644857B2 (en) * 2005-07-22 2011-03-09 昭和電工株式会社 Photosensitive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI848898B (en) 2016-05-12 2024-07-21 南韓商三星顯示器有限公司 Photosensitive resin composition, method for forming organic film with pattern, and display device

Also Published As

Publication number Publication date
JP4656316B2 (en) 2011-03-23
KR20070066852A (en) 2007-06-27
KR100858446B1 (en) 2008-09-12
CN101206401A (en) 2008-06-25
JP2007171572A (en) 2007-07-05

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