TW200728008A - Surface processing method using electron beam and surface processing apparatus using electron beam - Google Patents
Surface processing method using electron beam and surface processing apparatus using electron beamInfo
- Publication number
- TW200728008A TW200728008A TW095102774A TW95102774A TW200728008A TW 200728008 A TW200728008 A TW 200728008A TW 095102774 A TW095102774 A TW 095102774A TW 95102774 A TW95102774 A TW 95102774A TW 200728008 A TW200728008 A TW 200728008A
- Authority
- TW
- Taiwan
- Prior art keywords
- electron beam
- surface processing
- processed
- area
- processing apparatus
- Prior art date
Links
Landscapes
- Welding Or Cutting Using Electron Beams (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Provided is a surface processing method using electron beam and surface processing apparatus using electron beam capable of finishing a surface of an object to be processed to attain a surface roughness of about 1 μm within relatively short time, as well as capable of uniformly finishing whole objective area to be processed required for surface processing. In a case that surface processing is performed by irradiating an electron beam on a surface of an object (W) to be processed so as to melt and solidify a surface layer of the object, area information, which regulates an objective area to be processed where surface processing of the object (W) is performed, is in advance registered in a processed object information memory. Then, the electron beam is two-dimensionally scanned based on this area information so that the electron beam is traced along a winding line within the objective area to be processed of the object (W).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004218401A JP4177300B2 (en) | 2004-07-27 | 2004-07-27 | Electron beam surface treatment method and electron beam surface treatment apparatus |
PCT/JP2006/300601 WO2007083363A1 (en) | 2006-01-18 | 2006-01-18 | Method for surface treatment with electron beam and apparatus for surface treatment with electron beam |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI277475B TWI277475B (en) | 2007-04-01 |
TW200728008A true TW200728008A (en) | 2007-08-01 |
Family
ID=35900805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102774A TWI277475B (en) | 2004-07-27 | 2006-01-25 | Surface processing method using electron beam and surface processing apparatus using electron beam |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4177300B2 (en) |
TW (1) | TWI277475B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69401959T2 (en) | 1993-07-16 | 1997-07-31 | Dolby Lab Licensing Corp | COMPUTATIONALLY EFFICIENT ADAPTIVE BIT ALLOCATION FOR ENCODING METHODS AND SETUP WITH TOLERANCE FOR DECODER SPECTRAL DISTORTION |
WO2007083363A1 (en) * | 2006-01-18 | 2007-07-26 | Mitsubishi Denki Kabushiki Kaisha | Method for surface treatment with electron beam and apparatus for surface treatment with electron beam |
WO2008062655A1 (en) * | 2006-11-21 | 2008-05-29 | Konica Minolta Opto, Inc. | Mold fabrication method and projection optical system reflection mirror |
JP5242936B2 (en) * | 2007-04-09 | 2013-07-24 | 三菱電機株式会社 | Surface treatment method and surface treatment apparatus |
JP2013121623A (en) * | 2013-01-22 | 2013-06-20 | Mitsubishi Electric Corp | Device and method for surface treatment with electron beam |
KR101425410B1 (en) * | 2013-01-29 | 2014-08-04 | 한국기계연구원 | Laser Processing Device for Avoiding Oxidation Layer using Bellows |
CN114103185A (en) * | 2020-08-31 | 2022-03-01 | 陈惠美 | Medical grade mouth and nose wearing device and skin-friendly surface modification method thereof |
-
2004
- 2004-07-27 JP JP2004218401A patent/JP4177300B2/en active Active
-
2006
- 2006-01-25 TW TW095102774A patent/TWI277475B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4177300B2 (en) | 2008-11-05 |
TWI277475B (en) | 2007-04-01 |
JP2006035263A (en) | 2006-02-09 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |