TW200718775A - Composition and method for removing thick film photoresist - Google Patents

Composition and method for removing thick film photoresist

Info

Publication number
TW200718775A
TW200718775A TW095131550A TW95131550A TW200718775A TW 200718775 A TW200718775 A TW 200718775A TW 095131550 A TW095131550 A TW 095131550A TW 95131550 A TW95131550 A TW 95131550A TW 200718775 A TW200718775 A TW 200718775A
Authority
TW
Taiwan
Prior art keywords
thick film
film photoresist
composition
assembly
residue
Prior art date
Application number
TW095131550A
Other languages
Chinese (zh)
Inventor
David D Bernhard
Melissa K Rath
Original Assignee
Advanced Tech Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials filed Critical Advanced Tech Materials
Publication of TW200718775A publication Critical patent/TW200718775A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2075Carboxylic acids-salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2075Carboxylic acids-salts thereof
    • C11D3/2082Polycarboxylic acids-salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2075Carboxylic acids-salts thereof
    • C11D3/2086Hydroxy carboxylic acids-salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43Solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/265Carboxylic acids or salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5013Organic solvents containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5022Organic solvents containing oxygen
    • C11D2111/22

Abstract

A thick film photoresist and/or residue removal composition and process for removing thick film photoresist and/or post-ash and post-etch residue from a microelectronic assembly having same thereon. The removal composition includes at least one organic acid, at least one organic solvent, and water. The composition achieves at least partial removal of thick film photoresist and residue from the surface of the microelectronic assembly with minimal etching of metal species on the assembly and without damage to low-k dielectric materials employed in the assembly architecture.
TW095131550A 2005-08-29 2006-08-28 Composition and method for removing thick film photoresist TW200718775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71214805P 2005-08-29 2005-08-29

Publications (1)

Publication Number Publication Date
TW200718775A true TW200718775A (en) 2007-05-16

Family

ID=37809383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131550A TW200718775A (en) 2005-08-29 2006-08-28 Composition and method for removing thick film photoresist

Country Status (2)

Country Link
TW (1) TW200718775A (en)
WO (1) WO2007027522A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464789B (en) * 2011-12-28 2014-12-11 Univ Nat Sun Yat Sen Method for adjusting work function of metal oxide film

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201505535VA (en) 2010-07-16 2015-09-29 Entegris Inc Aqueous cleaner for the removal of post-etch residues
TWI558818B (en) 2010-08-20 2016-11-21 恩特葛瑞斯股份有限公司 Sustainable process for reclaiming precious metals and base metals from e-waste
SG10201508015RA (en) 2010-10-06 2015-10-29 Entegris Inc Composition and process for selectively etching metal nitrides
KR101891363B1 (en) 2010-10-13 2018-08-24 엔테그리스, 아이엔씨. Composition for and method of suppressing titanium nitride corrosion
JP5933950B2 (en) 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ,インコーポレイテッド Etching solution for copper or copper alloy
US9546321B2 (en) 2011-12-28 2017-01-17 Advanced Technology Materials, Inc. Compositions and methods for selectively etching titanium nitride
JP2015512971A (en) 2012-02-15 2015-04-30 インテグリス,インコーポレイテッド Post-CMP removal using composition and method of use
SG10201610541UA (en) 2012-05-18 2017-01-27 Entegris Inc Composition and process for stripping photoresist from a surface including titanium nitride
US9765288B2 (en) 2012-12-05 2017-09-19 Entegris, Inc. Compositions for cleaning III-V semiconductor materials and methods of using same
SG11201507014RA (en) 2013-03-04 2015-10-29 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
CN105683336A (en) 2013-06-06 2016-06-15 高级技术材料公司 Compositions and methods for selectively etching titanium nitride
CN112442374A (en) 2013-07-31 2021-03-05 恩特格里斯公司 Aqueous formulations with Cu/W compatibility for removal of metal hardmask and post-etch residues
SG11201601158VA (en) 2013-08-30 2016-03-30 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
US9562211B2 (en) 2013-12-06 2017-02-07 Fujifilm Electronic Materials U.S.A., Inc. Cleaning formulation for removing residues on surfaces
US9926517B2 (en) 2013-12-09 2018-03-27 General Electric Company Cleaning solution and methods of cleaning a turbine engine
US20150159122A1 (en) * 2013-12-09 2015-06-11 General Electric Company Cleaning solution and methods of cleaning a turbine engine
TWI654340B (en) 2013-12-16 2019-03-21 美商恩特葛瑞斯股份有限公司 Ni:NiGe:Ge SELECTIVE ETCH FORMULATIONS AND METHOD OF USING SAME
EP3084809A4 (en) 2013-12-20 2017-08-23 Entegris, Inc. Use of non-oxidizing strong acids for the removal of ion-implanted resist
KR102290209B1 (en) 2013-12-31 2021-08-20 엔테그리스, 아이엔씨. Formulations to selectively etch silicon and germanium
US20160340620A1 (en) 2014-01-29 2016-11-24 Advanced Technology Materials, Inc. Post chemical mechanical polishing formulations and method of use
WO2015119925A1 (en) 2014-02-05 2015-08-13 Advanced Technology Materials, Inc. Non-amine post-cmp compositions and method of use
US9957066B2 (en) 2015-02-13 2018-05-01 General Electric Company Detergent delivery methods and systems for turbine engines
BR102016021259B1 (en) 2015-10-05 2022-06-14 General Electric Company METHOD AND SOLUTIONS FOR CLEANING A TURBINE ENGINE AND REAGENT COMPOSITION
US10752867B2 (en) 2018-03-28 2020-08-25 Fujifilm Electronic Materials U.S.A., Inc. Cleaning compositions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6899818B2 (en) * 2000-03-20 2005-05-31 Mallinckrodt Inc. Method and composition for removing sodium-containing material from microcircuit substrates
KR101017738B1 (en) * 2002-03-12 2011-02-28 미츠비시 가스 가가쿠 가부시키가이샤 Photoresist stripping composition and cleaning composition
KR20040098179A (en) * 2003-05-14 2004-11-20 리퀴드테크놀로지(주) Composition for removal residue of sensitive photoresist

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464789B (en) * 2011-12-28 2014-12-11 Univ Nat Sun Yat Sen Method for adjusting work function of metal oxide film

Also Published As

Publication number Publication date
WO2007027522A2 (en) 2007-03-08
WO2007027522A3 (en) 2007-05-03

Similar Documents

Publication Publication Date Title
TW200718775A (en) Composition and method for removing thick film photoresist
TW200708597A (en) Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition
TW200720862A (en) Metals compatible photoresist and/or sacrificial antireflective coating removal composition
WO2005057281A3 (en) Resist, barc and gap fill material stripping chemical and method
TW200801854A (en) Composition and method for photoresist removal
SG164385A1 (en) Composition useful for removal of post-etch photoresist and bottom anti- reflection coatings
TW200639595A (en) Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices
WO2007120259A3 (en) Formulations for removing copper-containing post-etch residue from microelectronic devices
TW200619872A (en) Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate
WO2012051380A3 (en) Composition for and method of suppressing titanium nitride corrosion
MY117049A (en) Composition for stripping photoresist and organic materials from substrate surfaces
EP1612858A3 (en) Composition for stripping and cleaning and use thereof
MY163132A (en) Cleaning formulations
TW200714707A (en) Aqueous cleaning composition for removing residues and method using same
WO2015187675A3 (en) Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility
TW200617623A (en) Composition for removing a photoresist residue and polymer residue, and residue removal process using same
TW200730621A (en) Oxidizing aqueous cleaner for the removal of post-etch residues
WO2006113621A3 (en) Formulations for cleaning ion-implanted photoresist layers from microelectronic devices
EP1752829A3 (en) Polymer-stripping composition
TW200745786A (en) Method for removing masking materials with reduced low-k dielectric material damage
CN101548242B (en) Cleaning compound for removing photoresist
WO2009008958A3 (en) Method of post etch polymer residue removal
TW200719099A (en) Photoresist stripper composition for semiconductor manufacturing
WO2016151645A1 (en) Resist stripping liquid
JP2022536971A (en) CLEANING COMPOSITION FOR SEMICONDUCTOR SUBSTRATES