TW200717729A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- TW200717729A TW200717729A TW095138819A TW95138819A TW200717729A TW 200717729 A TW200717729 A TW 200717729A TW 095138819 A TW095138819 A TW 095138819A TW 95138819 A TW95138819 A TW 95138819A TW 200717729 A TW200717729 A TW 200717729A
- Authority
- TW
- Taiwan
- Prior art keywords
- plating
- lead frame
- layer
- coated
- underlayer
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/85464—Palladium (Pd) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005306379A JP4820616B2 (ja) | 2005-10-20 | 2005-10-20 | リードフレーム |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200717729A true TW200717729A (en) | 2007-05-01 |
Family
ID=37719312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095138819A TW200717729A (en) | 2005-10-20 | 2006-10-20 | Lead frame |
Country Status (5)
Country | Link |
---|---|
US (1) | US8283759B2 (zh) |
EP (1) | EP1777743A3 (zh) |
JP (1) | JP4820616B2 (zh) |
CN (1) | CN1953168B (zh) |
TW (1) | TW200717729A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006032074B3 (de) * | 2006-07-11 | 2007-12-27 | Infineon Technologies Ag | Bauelement und zugehöriger Anschlussdraht |
JP5215305B2 (ja) | 2007-07-06 | 2013-06-19 | 第一電子工業株式会社 | 電子部品の製造方法及び該方法により製造する電子部品 |
JP5762081B2 (ja) * | 2011-03-29 | 2015-08-12 | 新光電気工業株式会社 | リードフレーム及び半導体装置 |
CN105018995A (zh) * | 2015-07-10 | 2015-11-04 | 陈圳浩 | 银饰品表面光亮五层电镀工艺 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0335608B1 (en) * | 1988-03-28 | 1995-06-14 | Texas Instruments Incorporated | Lead frame with reduced corrosion |
US5014113A (en) * | 1989-12-27 | 1991-05-07 | Motorola, Inc. | Multiple layer lead frame |
JP2543619B2 (ja) | 1990-09-05 | 1996-10-16 | 新光電気工業株式会社 | 半導体装置用リ―ドフレ―ム |
JPH04337657A (ja) | 1991-05-14 | 1992-11-25 | Hitachi Cable Ltd | 半導体装置用リードフレーム |
US5360991A (en) * | 1993-07-29 | 1994-11-01 | At&T Bell Laboratories | Integrated circuit devices with solderable lead frame |
US5650661A (en) * | 1993-12-27 | 1997-07-22 | National Semiconductor Corporation | Protective coating combination for lead frames |
US5436082A (en) * | 1993-12-27 | 1995-07-25 | National Semiconductor Corporation | Protective coating combination for lead frames |
JP3550875B2 (ja) | 1996-05-14 | 2004-08-04 | ソニー株式会社 | リードフレームとこれを用いた半導体装置 |
JPH1074879A (ja) | 1996-08-30 | 1998-03-17 | Mitsui High Tec Inc | 半導体装置用リードフレーム |
KR100231828B1 (ko) * | 1997-02-20 | 1999-12-01 | 유무성 | 다층 도금 리드프레임 |
US5994767A (en) * | 1997-04-09 | 1999-11-30 | Sitron Precision Co., Ltd. | Leadframe for integrated circuit package and method of manufacturing the same |
DE19850526C2 (de) * | 1998-11-03 | 2002-11-28 | Heraeus Gmbh W C | Substrat mit metallischer Beschichtung und seine Verwendung |
ES2171088T3 (es) * | 1998-06-10 | 2002-08-16 | Heraeus Gmbh W C | Procedimiento para producir un sustrato exento de plomo. |
US20030011048A1 (en) | 1999-03-19 | 2003-01-16 | Abbott Donald C. | Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
JP2001230360A (ja) | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
JP2002076229A (ja) | 2000-07-13 | 2002-03-15 | Texas Instruments Inc | 銀めっきを含む半導体のリードフレームおよびその製造方法 |
KR100371567B1 (ko) * | 2000-12-08 | 2003-02-07 | 삼성테크윈 주식회사 | Ag 선도금을 이용한 반도체 패키지용 리드프레임 |
JP2003198117A (ja) | 2001-12-28 | 2003-07-11 | Matsushita Electric Ind Co Ltd | はんだ付け方法および接合構造体 |
JP3519726B1 (ja) * | 2002-11-26 | 2004-04-19 | Fcm株式会社 | 端子およびそれを有する部品 |
CN101546803B (zh) * | 2003-01-16 | 2010-12-08 | 松下电器产业株式会社 | 光学半导体器件 |
JP2004241542A (ja) | 2003-02-05 | 2004-08-26 | Matsushita Electric Ind Co Ltd | はんだ付け方法およびこのはんだ付け方法により接合される部品および接合された接合構造体 |
JP2005019922A (ja) * | 2003-06-30 | 2005-01-20 | Shinko Electric Ind Co Ltd | 半導体パッケージ用リードフレーム |
KR100998042B1 (ko) * | 2004-02-23 | 2010-12-03 | 삼성테크윈 주식회사 | 리드 프레임 및 이를 구비한 반도체 패키지의 제조방법 |
CN100483707C (zh) * | 2004-05-27 | 2009-04-29 | 新光电气工业株式会社 | 用于半导体器件的引线框架 |
JP2006269903A (ja) * | 2005-03-25 | 2006-10-05 | Shinko Electric Ind Co Ltd | 半導体装置用リードフレーム |
-
2005
- 2005-10-20 JP JP2005306379A patent/JP4820616B2/ja active Active
-
2006
- 2006-10-18 EP EP06122491A patent/EP1777743A3/en not_active Ceased
- 2006-10-18 CN CN2006101356292A patent/CN1953168B/zh active Active
- 2006-10-19 US US11/582,972 patent/US8283759B2/en active Active
- 2006-10-20 TW TW095138819A patent/TW200717729A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP1777743A3 (en) | 2008-11-19 |
JP4820616B2 (ja) | 2011-11-24 |
US8283759B2 (en) | 2012-10-09 |
EP1777743A2 (en) | 2007-04-25 |
US20070090501A1 (en) | 2007-04-26 |
CN1953168A (zh) | 2007-04-25 |
CN1953168B (zh) | 2010-07-28 |
JP2007115925A (ja) | 2007-05-10 |
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