TW200713440A - Chemical mechanical polishing device and polishing pad thereof and method for planarization - Google Patents

Chemical mechanical polishing device and polishing pad thereof and method for planarization

Info

Publication number
TW200713440A
TW200713440A TW094133314A TW94133314A TW200713440A TW 200713440 A TW200713440 A TW 200713440A TW 094133314 A TW094133314 A TW 094133314A TW 94133314 A TW94133314 A TW 94133314A TW 200713440 A TW200713440 A TW 200713440A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
chemical mechanical
wafer
planarization
Prior art date
Application number
TW094133314A
Other languages
Chinese (zh)
Other versions
TWI294143B (en
Inventor
Chih-Chiang Yang
Peng-Yih Peng
Chin-Yung Liu
Chien-Fu Chu
Wen-Shan Lin
Chia Yuan Hsieh
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW94133314A priority Critical patent/TWI294143B/en
Publication of TW200713440A publication Critical patent/TW200713440A/en
Application granted granted Critical
Publication of TWI294143B publication Critical patent/TWI294143B/en

Links

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A chemical mechanical polishing device used to polish a wafer is provided. The chemical mechanical polishing device includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishing table to polish the wafer. The slurry supply device is disposed on the polishing table to supply the slurry. The wafer carrier is disposed on the polishing pad to carry the wafer and make the wafer to be touch with the polishing pad. The high-pressure liquid cleaning device is disposed on the polishing table. The high-pressure liquid cleaning device is used to remove the impurities on the polishing pad by high-pressure liquid.
TW94133314A 2005-09-26 2005-09-26 Chemical mechanical polishing device and polishing pad thereof and method for planarization TWI294143B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94133314A TWI294143B (en) 2005-09-26 2005-09-26 Chemical mechanical polishing device and polishing pad thereof and method for planarization

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94133314A TWI294143B (en) 2005-09-26 2005-09-26 Chemical mechanical polishing device and polishing pad thereof and method for planarization

Publications (2)

Publication Number Publication Date
TW200713440A true TW200713440A (en) 2007-04-01
TWI294143B TWI294143B (en) 2008-03-01

Family

ID=45068072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133314A TWI294143B (en) 2005-09-26 2005-09-26 Chemical mechanical polishing device and polishing pad thereof and method for planarization

Country Status (1)

Country Link
TW (1) TWI294143B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548483B (en) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 Polishing device and method
CN114833716A (en) * 2022-05-20 2022-08-02 北京烁科精微电子装备有限公司 Chemical mechanical polishing equipment and polishing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548483B (en) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 Polishing device and method
CN114833716A (en) * 2022-05-20 2022-08-02 北京烁科精微电子装备有限公司 Chemical mechanical polishing equipment and polishing method

Also Published As

Publication number Publication date
TWI294143B (en) 2008-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees