TW200713440A - Chemical mechanical polishing device and polishing pad thereof and method for planarization - Google Patents
Chemical mechanical polishing device and polishing pad thereof and method for planarizationInfo
- Publication number
- TW200713440A TW200713440A TW094133314A TW94133314A TW200713440A TW 200713440 A TW200713440 A TW 200713440A TW 094133314 A TW094133314 A TW 094133314A TW 94133314 A TW94133314 A TW 94133314A TW 200713440 A TW200713440 A TW 200713440A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- polishing pad
- chemical mechanical
- wafer
- planarization
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A chemical mechanical polishing device used to polish a wafer is provided. The chemical mechanical polishing device includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishing table to polish the wafer. The slurry supply device is disposed on the polishing table to supply the slurry. The wafer carrier is disposed on the polishing pad to carry the wafer and make the wafer to be touch with the polishing pad. The high-pressure liquid cleaning device is disposed on the polishing table. The high-pressure liquid cleaning device is used to remove the impurities on the polishing pad by high-pressure liquid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94133314A TWI294143B (en) | 2005-09-26 | 2005-09-26 | Chemical mechanical polishing device and polishing pad thereof and method for planarization |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94133314A TWI294143B (en) | 2005-09-26 | 2005-09-26 | Chemical mechanical polishing device and polishing pad thereof and method for planarization |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200713440A true TW200713440A (en) | 2007-04-01 |
TWI294143B TWI294143B (en) | 2008-03-01 |
Family
ID=45068072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94133314A TWI294143B (en) | 2005-09-26 | 2005-09-26 | Chemical mechanical polishing device and polishing pad thereof and method for planarization |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI294143B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548483B (en) * | 2011-07-19 | 2016-09-11 | 荏原製作所股份有限公司 | Polishing device and method |
CN114833716A (en) * | 2022-05-20 | 2022-08-02 | 北京烁科精微电子装备有限公司 | Chemical mechanical polishing equipment and polishing method |
-
2005
- 2005-09-26 TW TW94133314A patent/TWI294143B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548483B (en) * | 2011-07-19 | 2016-09-11 | 荏原製作所股份有限公司 | Polishing device and method |
CN114833716A (en) * | 2022-05-20 | 2022-08-02 | 北京烁科精微电子装备有限公司 | Chemical mechanical polishing equipment and polishing method |
Also Published As
Publication number | Publication date |
---|---|
TWI294143B (en) | 2008-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |