WO2007016498A3 - Nonwoven polishing pads for chemical mechanical polishing - Google Patents

Nonwoven polishing pads for chemical mechanical polishing Download PDF

Info

Publication number
WO2007016498A3
WO2007016498A3 PCT/US2006/029770 US2006029770W WO2007016498A3 WO 2007016498 A3 WO2007016498 A3 WO 2007016498A3 US 2006029770 W US2006029770 W US 2006029770W WO 2007016498 A3 WO2007016498 A3 WO 2007016498A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
chemical mechanical
nonwoven
fibers
article
Prior art date
Application number
PCT/US2006/029770
Other languages
French (fr)
Other versions
WO2007016498A2 (en
Inventor
Neha P Vaidya
Angela L Petroski
James P Macey
Original Assignee
Raytech Composites Inc
Neha P Vaidya
Angela L Petroski
James P Macey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytech Composites Inc, Neha P Vaidya, Angela L Petroski, James P Macey filed Critical Raytech Composites Inc
Publication of WO2007016498A2 publication Critical patent/WO2007016498A2/en
Publication of WO2007016498A3 publication Critical patent/WO2007016498A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonwoven Fabrics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.
PCT/US2006/029770 2005-08-02 2006-08-01 Nonwoven polishing pads for chemical mechanical polishing WO2007016498A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70463805P 2005-08-02 2005-08-02
US60/704,638 2005-08-02

Publications (2)

Publication Number Publication Date
WO2007016498A2 WO2007016498A2 (en) 2007-02-08
WO2007016498A3 true WO2007016498A3 (en) 2009-05-28

Family

ID=37709283

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/029770 WO2007016498A2 (en) 2005-08-02 2006-08-01 Nonwoven polishing pads for chemical mechanical polishing

Country Status (2)

Country Link
US (1) US20070049169A1 (en)
WO (1) WO2007016498A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP5735777B2 (en) * 2010-10-13 2015-06-17 九重電気株式会社 Polishing pad
US20130146061A1 (en) * 2011-12-09 2013-06-13 3M Innovative Properties Company Respirator made from in-situ air-laid web(s)
US9394637B2 (en) 2012-12-13 2016-07-19 Jacob Holm & Sons Ag Method for production of a hydroentangled airlaid web and products obtained therefrom
US10435827B2 (en) 2014-02-17 2019-10-08 3M Innovative Properties Company Scouring article and methods of making and using
TWI548481B (en) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 Polishing pad and method for making the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6713413B2 (en) * 2000-01-03 2004-03-30 Freudenberg Nonwovens Limited Partnership Nonwoven buffing or polishing material having increased strength and dimensional stability
US6945846B1 (en) * 2002-03-18 2005-09-20 Raytech Innovative Solutions Llc Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making

Also Published As

Publication number Publication date
WO2007016498A2 (en) 2007-02-08
US20070049169A1 (en) 2007-03-01

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