TW200712480A - Unevenness inspecting apparatus and unevenness inspecting method - Google Patents

Unevenness inspecting apparatus and unevenness inspecting method

Info

Publication number
TW200712480A
TW200712480A TW095127465A TW95127465A TW200712480A TW 200712480 A TW200712480 A TW 200712480A TW 095127465 A TW095127465 A TW 095127465A TW 95127465 A TW95127465 A TW 95127465A TW 200712480 A TW200712480 A TW 200712480A
Authority
TW
Taiwan
Prior art keywords
film
unevenness
film thickness
wave length
original image
Prior art date
Application number
TW095127465A
Other languages
Chinese (zh)
Other versions
TWI311643B (en
Inventor
Kazutaka Taniguchi
Kazuhiro Yoshihara
Kunio Ueta
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200712480A publication Critical patent/TW200712480A/en
Application granted granted Critical
Publication of TWI311643B publication Critical patent/TWI311643B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

In an unevenness inspecting apparatus (1), a film (92) formed on a substrate (9) is irradiated with light emitted from a light irradiation part (3) at a predetermined incident angle, and an image pickup part (41) receives interference light with a specified wave length, which is reflected at the film (92) to obtain an original image representing the film (92). A memory (6) stores sensitivity information (61) indicating a relationship between a sensitivity, which is a ratio of change in intensity of interference light with the specified wave length relative to a variation of film thickness, and an intensity of interference light with the specified wave length. An effect of the change in sensitivity depending on the film thickness is corrected by refering the sensitivity information (61) and a pixel value of each pixel in the original image, and the amplitude within a predetermined spatial frequency band in an image derived from the original image is detected as an unevenness of film thickness. It is therefore possible to inspect an unevenness of film thickness of the film (92) formed on the substrate (9) with high accuracy.
TW095127465A 2005-07-29 2006-07-27 Unevenness inspecting apparatus and unevenness inspecting method TWI311643B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005220098 2005-07-29
JP2006139938A JP4799268B2 (en) 2005-07-29 2006-05-19 Unevenness inspection apparatus and unevenness inspection method

Publications (2)

Publication Number Publication Date
TW200712480A true TW200712480A (en) 2007-04-01
TWI311643B TWI311643B (en) 2009-07-01

Family

ID=37921137

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127465A TWI311643B (en) 2005-07-29 2006-07-27 Unevenness inspecting apparatus and unevenness inspecting method

Country Status (3)

Country Link
JP (1) JP4799268B2 (en)
KR (1) KR100896114B1 (en)
TW (1) TWI311643B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523516B2 (en) * 2005-08-08 2010-08-11 東京エレクトロン株式会社 Coating film unevenness detection method, coating film unevenness detection program, substrate processing method, and substrate processing apparatus
EP2128701A1 (en) 2008-05-30 2009-12-02 ASML Netherlands BV Method of determining defects in a substrate and apparatus for exposing a substrate in a lithographic process
JP5255342B2 (en) * 2008-06-25 2013-08-07 パナソニック株式会社 Defect detection device for light transmissive film
JP5305792B2 (en) * 2008-08-29 2013-10-02 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
JP5410212B2 (en) * 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus, substrate processing system, and inspection peripheral exposure apparatus
DE102012002174B4 (en) * 2012-02-07 2014-05-15 Schott Ag Apparatus and method for detecting defects within the volume of a transparent pane and using the apparatus
TWI477766B (en) 2012-12-18 2015-03-21 Ind Tech Res Inst Inspection device and inspection method
KR20140112230A (en) 2013-03-13 2014-09-23 삼성전자주식회사 Method of detecting inhomogeneity of a layer and apparatus for performing the same
JP6079697B2 (en) * 2013-07-11 2017-02-15 株式会社村田製作所 Method for measuring thickness of electronic component, method for manufacturing electronic component series using the same, electronic component series manufactured thereby, and electronic component inspection apparatus
CN114487046A (en) * 2022-01-29 2022-05-13 中国科学技术大学 Imaging method for determining surface charge density distribution of two-dimensional material

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2577960B2 (en) * 1988-06-17 1997-02-05 株式会社ニデック Specular surface inspection equipment
JP3322034B2 (en) * 1994-10-24 2002-09-09 日産自動車株式会社 Paint quality analyzer
JP2000055627A (en) * 1998-08-07 2000-02-25 Dainippon Screen Mfg Co Ltd Film thickness measuring method and device
JP3508589B2 (en) 1998-11-27 2004-03-22 Ｊｆｅスチール株式会社 Surface flaw inspection equipment
JP4162319B2 (en) * 1999-03-10 2008-10-08 株式会社ニデック Defect inspection equipment
JP3263931B2 (en) * 1999-09-22 2002-03-11 富士重工業株式会社 Stereo matching device
JP3520910B2 (en) * 1999-12-20 2004-04-19 株式会社ニコン Optical element thickness measurement method and optical element manufacturing method
JP4418078B2 (en) * 2000-04-03 2010-02-17 株式会社トプコン Surface inspection device
JP2001330566A (en) * 2000-05-23 2001-11-30 Kawasaki Steel Corp Surface flaw inspection method by ccd camera
JP4632564B2 (en) * 2001-03-08 2011-02-16 オリンパス株式会社 Surface defect inspection equipment
JP4474795B2 (en) * 2001-04-26 2010-06-09 株式会社デンソー Film thickness measuring method, measuring apparatus and semiconductor device manufacturing method
JP3928478B2 (en) * 2002-05-22 2007-06-13 株式会社島津製作所 Film thickness measuring method and film thickness measuring apparatus
JP3742801B2 (en) * 2003-03-18 2006-02-08 独立行政法人科学技術振興機構 Film thickness acquisition method

Also Published As

Publication number Publication date
KR100896114B1 (en) 2009-05-07
TWI311643B (en) 2009-07-01
JP2007057521A (en) 2007-03-08
KR20070015093A (en) 2007-02-01
JP4799268B2 (en) 2011-10-26

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