TW200711775A - Method for cutting plate-shaped body, and laser beam machining device - Google Patents

Method for cutting plate-shaped body, and laser beam machining device

Info

Publication number
TW200711775A
TW200711775A TW095115089A TW95115089A TW200711775A TW 200711775 A TW200711775 A TW 200711775A TW 095115089 A TW095115089 A TW 095115089A TW 95115089 A TW95115089 A TW 95115089A TW 200711775 A TW200711775 A TW 200711775A
Authority
TW
Taiwan
Prior art keywords
laser beam
shaped body
plate
wave length
reforming
Prior art date
Application number
TW095115089A
Other languages
Chinese (zh)
Other versions
TWI387503B (en
Inventor
Tetsumi Sumiyoshi
Tomohiro Imahoko
Original Assignee
Cyber Laser Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyber Laser Inc filed Critical Cyber Laser Inc
Publication of TW200711775A publication Critical patent/TW200711775A/en
Application granted granted Critical
Publication of TWI387503B publication Critical patent/TWI387503B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

To provide a method for cutting a plate-shaped body, such as a semiconductor wafer, by irradiating the body with a laser beam, in which the throughput of electronic parts manufactured by dividing the body is improved by raising the cutting speed. The laser beam of a first wave length having absorbability with respect to a plate-shaped body 1, and the laser beam of a second wave length having permeability with respect to the plate-shaped body 1, are simultaneously condensed, and the condensed beams are irradiated to the plate-shaped body 1. A condensing point 7 of the laser beam of the first wave length is formed on the surface part of the plate-shaped body, and a condensing point 8 of the laser beam of the second wave length is formed in the inside part of the plate-shaped body, by controlling a condensing optical system. Cracking or reforming of the composition of the surface part is caused by linear absorption, reforming of the composition of the inside part is caused by multiphoton absorption, and stress-generating regions are formed in the parts respectively. The plate-shaped body 1 is irradiated with the laser beam along a dividing line, and is thereafter divided along the scanning loci of the laser beam by exerting mechanical impact force.
TW095115089A 2005-04-27 2006-04-27 Plate cutting method and laser processing device TWI387503B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005129396A JP4838531B2 (en) 2005-04-27 2005-04-27 Plate cutting method and laser processing apparatus

Publications (2)

Publication Number Publication Date
TW200711775A true TW200711775A (en) 2007-04-01
TWI387503B TWI387503B (en) 2013-03-01

Family

ID=37194459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115089A TWI387503B (en) 2005-04-27 2006-04-27 Plate cutting method and laser processing device

Country Status (4)

Country Link
JP (1) JP4838531B2 (en)
KR (1) KR101325200B1 (en)
CN (1) CN100553853C (en)
TW (1) TWI387503B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413561B (en) * 2007-04-27 2013-11-01 Cyber Laser Inc Method for processing with laser and laser processing device
TWI419757B (en) * 2010-07-23 2013-12-21 Mitsuboshi Diamond Ind Co Ltd Lasor processing apparatus, method of processing products to be processed, and method of dividing products to be processed
TWI505891B (en) * 2009-01-09 2015-11-01 Hamamatsu Photonics Kk Laser processing device
TWI505892B (en) * 2009-01-09 2015-11-01 Hamamatsu Photonics Kk Laser processing device
TWI615228B (en) * 2016-11-29 2018-02-21 財團法人金屬工業研究發展中心 Method for manufacturing metal strip
US10124439B2 (en) 2013-03-27 2018-11-13 Hamamatsu Photonics K.K. Laser machining device and laser machining method

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US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
KR20070097189A (en) * 2006-03-28 2007-10-04 삼성전자주식회사 Method for dividing substrate and substrate dividing apparatus for using it
JP4954653B2 (en) 2006-09-19 2012-06-20 浜松ホトニクス株式会社 Laser processing method
KR100969946B1 (en) * 2007-07-24 2010-07-14 주식회사 이오테크닉스 Laser Processing Apparatus and Method Using Beam Split
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
JP5199789B2 (en) * 2008-08-25 2013-05-15 株式会社ディスコ Laser processing apparatus and laser processing method
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method
US8728914B2 (en) 2009-02-09 2014-05-20 Hamamatsu Photonics K.K. Workpiece cutting method
WO2011018989A1 (en) 2009-08-11 2011-02-17 浜松ホトニクス株式会社 Laser machining device and laser machining method
JP5677033B2 (en) * 2009-11-05 2015-02-25 株式会社東芝 Laser processing apparatus and method
KR101149594B1 (en) * 2010-06-01 2012-05-29 한국과학기술원 Method for cutting processing side using femtosecond pulse laser applied PZT element
JP5770436B2 (en) * 2010-07-08 2015-08-26 株式会社ディスコ Laser processing apparatus and laser processing method
KR101217698B1 (en) * 2010-08-16 2013-01-02 주식회사 이오테크닉스 Laser processing method and laser processing apparatus using sequential multi-focusing
KR101232008B1 (en) * 2010-11-29 2013-02-08 한국과학기술원 The depth of the modified cutting device through a combination of characteristics
US8933367B2 (en) * 2011-02-09 2015-01-13 Sumitomo Electric Industries, Ltd. Laser processing method
JP2012173246A (en) * 2011-02-24 2012-09-10 Fujifilm Corp Photoacoustic imaging apparatus
CN102990227A (en) * 2011-09-08 2013-03-27 技鼎股份有限公司 Single-wavelength multilayer laser machining method
FR2989294B1 (en) 2012-04-13 2022-10-14 Centre Nat Rech Scient DEVICE AND METHOD FOR NANO-MACHINING BY LASER
CN102699526A (en) * 2012-06-01 2012-10-03 苏州德龙激光有限公司 Method and device for cutting machined object by using laser
JP2014079794A (en) * 2012-10-18 2014-05-08 Sumitomo Electric Ind Ltd Laser processing method
CN103193381A (en) * 2013-04-07 2013-07-10 北京工业大学 Method for removing laser selection area of glass
JP6270520B2 (en) * 2014-02-07 2018-01-31 株式会社ディスコ Wafer processing method
LT6240B (en) * 2014-05-16 2016-01-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Method and apparatus for laser cutting of transparent media
TWI574767B (en) * 2014-07-29 2017-03-21 Improved laser structure
JP6395633B2 (en) * 2015-02-09 2018-09-26 株式会社ディスコ Wafer generation method
JP6395632B2 (en) * 2015-02-09 2018-09-26 株式会社ディスコ Wafer generation method
CN107511596A (en) * 2016-06-16 2017-12-26 南京魔迪多维数码科技有限公司 The laser machining device and method of multilayer material
KR20180027179A (en) * 2016-09-06 2018-03-14 주식회사 이오테크닉스 Laser processing apparatus and laser processing method using the same
HUE064074T2 (en) * 2016-11-18 2024-02-28 Ipg Photonics Corp System and method for laser processing of materials.
KR20180060827A (en) * 2016-11-29 2018-06-07 주식회사 이오테크닉스 Laser processing apparatus and laser processing method
JP7188886B2 (en) * 2018-01-29 2022-12-13 浜松ホトニクス株式会社 processing equipment
KR102191666B1 (en) * 2018-11-09 2020-12-17 한국과학기술원 Method for processing transparent materials using spatio-temporally shaped pulsed-laser beam and Apparatus for the same
CN114083150B (en) * 2021-11-29 2023-11-17 中国工程物理研究院激光聚变研究中心 Method and system for cutting pipe body by laser combination

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JP3421633B2 (en) * 2000-04-11 2003-06-30 ファナック株式会社 Laser processing equipment
JP4286488B2 (en) * 2001-02-21 2009-07-01 キヤノンマシナリー株式会社 Substrate cutting method
JP4263865B2 (en) * 2002-01-22 2009-05-13 独立行政法人科学技術振興機構 Fine processing method using ultra-short pulse laser and processed product
JP4509719B2 (en) * 2002-03-12 2010-07-21 浜松ホトニクス株式会社 Laser processing method
JP2003290961A (en) * 2002-03-28 2003-10-14 Sumitomo Heavy Ind Ltd Laser beam machining device
KR100495329B1 (en) * 2002-09-19 2005-06-13 주식회사 서울레이저발형시스템 Laser Machine for processing slits
JP2004160483A (en) * 2002-11-12 2004-06-10 Disco Abrasive Syst Ltd Laser beam machining method, and laser beam machining apparatus
US8685838B2 (en) * 2003-03-12 2014-04-01 Hamamatsu Photonics K.K. Laser beam machining method
JP2004351466A (en) * 2003-05-29 2004-12-16 Aisin Seiki Co Ltd Laser beam machining method and laser beam machining apparatus
JP2005007427A (en) * 2003-06-19 2005-01-13 Y E Data Inc Laser marking method
JP4253621B2 (en) * 2003-08-25 2009-04-15 富士フイルム株式会社 Photon mode recording method and three-dimensional optical recording method
JP2005077606A (en) * 2003-08-29 2005-03-24 Toshiba Corp Laser oscillation device and air pollutant monitoring device
JP2005088068A (en) * 2003-09-19 2005-04-07 Matsushita Electric Ind Co Ltd Laser beam machining apparatus and laser beam machining method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413561B (en) * 2007-04-27 2013-11-01 Cyber Laser Inc Method for processing with laser and laser processing device
TWI505891B (en) * 2009-01-09 2015-11-01 Hamamatsu Photonics Kk Laser processing device
TWI505892B (en) * 2009-01-09 2015-11-01 Hamamatsu Photonics Kk Laser processing device
TWI419757B (en) * 2010-07-23 2013-12-21 Mitsuboshi Diamond Ind Co Ltd Lasor processing apparatus, method of processing products to be processed, and method of dividing products to be processed
US10124439B2 (en) 2013-03-27 2018-11-13 Hamamatsu Photonics K.K. Laser machining device and laser machining method
US10124440B2 (en) 2013-03-27 2018-11-13 Hamamatsu Photonics K.K. Laser machining device and laser machining method
TWI647043B (en) * 2013-03-27 2019-01-11 日商濱松赫德尼古斯股份有限公司 Laser processing device and laser processing method
TWI648116B (en) * 2013-03-27 2019-01-21 日商濱松赫德尼古斯股份有限公司 Laser processing device and laser processing method
TWI615228B (en) * 2016-11-29 2018-02-21 財團法人金屬工業研究發展中心 Method for manufacturing metal strip

Also Published As

Publication number Publication date
CN100553853C (en) 2009-10-28
CN1853840A (en) 2006-11-01
JP2006305586A (en) 2006-11-09
KR20060113454A (en) 2006-11-02
TWI387503B (en) 2013-03-01
KR101325200B1 (en) 2013-11-04
JP4838531B2 (en) 2011-12-14

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees