TW200711074A - Packaging for high speed integrated circuits - Google Patents
Packaging for high speed integrated circuitsInfo
- Publication number
- TW200711074A TW200711074A TW095125824A TW95125824A TW200711074A TW 200711074 A TW200711074 A TW 200711074A TW 095125824 A TW095125824 A TW 095125824A TW 95125824 A TW95125824 A TW 95125824A TW 200711074 A TW200711074 A TW 200711074A
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- pad
- adjacent
- packaging
- high speed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70170105P | 2005-07-22 | 2005-07-22 | |
US72227205P | 2005-09-30 | 2005-09-30 | |
US11/248,985 US20070018292A1 (en) | 2005-07-22 | 2005-10-12 | Packaging for high speed integrated circuits |
US11/472,904 US7884451B2 (en) | 2005-07-22 | 2006-06-22 | Packaging for high speed integrated circuits |
US11/472,953 US20070018289A1 (en) | 2005-07-22 | 2006-06-22 | Packaging for high speed integrated circuits |
US11/472,697 US20070096277A1 (en) | 2005-07-22 | 2006-06-22 | Packaging for high speed integrated circuits |
US11/473,631 US20070018293A1 (en) | 2005-07-22 | 2006-06-23 | Packaging for high speed integrated circuits |
US11/473,702 US7638870B2 (en) | 2005-07-22 | 2006-06-23 | Packaging for high speed integrated circuits |
US11/474,198 US20070018294A1 (en) | 2005-07-22 | 2006-06-23 | Packaging for high speed integrated circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200711074A true TW200711074A (en) | 2007-03-16 |
Family
ID=50158248
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095125824A TW200711074A (en) | 2005-07-22 | 2006-07-14 | Packaging for high speed integrated circuits |
TW095125825A TWI418012B (zh) | 2005-07-22 | 2006-07-14 | 用於高速積體電路之封裝 |
TW095125822A TW200733827A (en) | 2005-07-22 | 2006-07-14 | Packaging for high speed integrated circuits |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095125825A TWI418012B (zh) | 2005-07-22 | 2006-07-14 | 用於高速積體電路之封裝 |
TW095125822A TW200733827A (en) | 2005-07-22 | 2006-07-14 | Packaging for high speed integrated circuits |
Country Status (1)
Country | Link |
---|---|
TW (3) | TW200711074A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI819960B (zh) * | 2023-02-03 | 2023-10-21 | 瑞昱半導體股份有限公司 | 能夠增加干擾源之間的隔離度的積體電路封裝結構 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI456939B (zh) * | 2012-02-24 | 2014-10-11 | Realtek Semiconductor Corp | 支援自動跳線功能的乙太網路通信電路 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5457340A (en) * | 1992-12-07 | 1995-10-10 | Integrated Device Technology, Inc. | Leadframe with power and ground planes |
US5646451A (en) * | 1995-06-07 | 1997-07-08 | Lucent Technologies Inc. | Multifunctional chip wire bonds |
US6567413B1 (en) * | 2001-05-18 | 2003-05-20 | Network Elements, Inc. | Optical networking module including protocol processing and unified software control |
-
2006
- 2006-07-14 TW TW095125824A patent/TW200711074A/zh unknown
- 2006-07-14 TW TW095125825A patent/TWI418012B/zh active
- 2006-07-14 TW TW095125822A patent/TW200733827A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI819960B (zh) * | 2023-02-03 | 2023-10-21 | 瑞昱半導體股份有限公司 | 能夠增加干擾源之間的隔離度的積體電路封裝結構 |
Also Published As
Publication number | Publication date |
---|---|
TW200742027A (en) | 2007-11-01 |
TWI418012B (zh) | 2013-12-01 |
TW200733827A (en) | 2007-09-01 |
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