TW200707721A - Encapsulation device and method for encapsulation - Google Patents
Encapsulation device and method for encapsulationInfo
- Publication number
- TW200707721A TW200707721A TW095121270A TW95121270A TW200707721A TW 200707721 A TW200707721 A TW 200707721A TW 095121270 A TW095121270 A TW 095121270A TW 95121270 A TW95121270 A TW 95121270A TW 200707721 A TW200707721 A TW 200707721A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- chamber
- seal
- encapsulation
- irradiation
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000005538 encapsulation Methods 0.000 title 2
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 238000007789 sealing Methods 0.000 abstract 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 1
- 229910001873 dinitrogen Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
There are provided a sealing device and a sealing method capable of curing a resin in a short time and suppressing affect of heat to a seal object portion when performing sealing by using a ultraviolet cure resin. The sealing device includes an alignment bonding chamber (3) into which nitrogen gas can be introduced and an UV irradiation chamber (4) having a UV irradiation lamp (30). In the alignment bonding chamber (3), a seal glass substrate (7) and a substrate (9) are placed on a convey mechanism (15) and pressurized bonding is performed by using UV cure type seal resin (7a). After this, the convey mechanism (15) carries an organic EL panel (40) out of the alignment bonding chamber (3) into the UV irradiation chamber (4), where the seal resin (7a) is cured.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005175632 | 2005-06-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200707721A true TW200707721A (en) | 2007-02-16 |
TWI422027B TWI422027B (en) | 2014-01-01 |
Family
ID=37532225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121270A TWI422027B (en) | 2005-06-15 | 2006-06-14 | Encapsulation device and method for encapsulation |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4827842B2 (en) |
KR (1) | KR100882178B1 (en) |
CN (1) | CN100514707C (en) |
TW (1) | TWI422027B (en) |
WO (1) | WO2006134863A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102012581B (en) * | 2010-09-30 | 2012-08-22 | 深圳市华星光电技术有限公司 | Liquid crystal box forming device and method |
WO2012053532A1 (en) * | 2010-10-20 | 2012-04-26 | 株式会社アルバック | Apparatus for organic film formation and method for organic film formation |
CN102184935B (en) * | 2011-04-02 | 2012-08-08 | 东莞宏威数码机械有限公司 | OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method |
CN102270742B (en) * | 2011-08-29 | 2013-04-17 | 电子科技大学 | Organic optoelectronic device wrapper and device packaging method |
JP6066055B2 (en) * | 2012-12-06 | 2017-01-25 | Aiメカテック株式会社 | Organic EL sealing device |
JP6066054B2 (en) * | 2012-12-06 | 2017-01-25 | Aiメカテック株式会社 | Organic EL sealing device, sealing roll film manufacturing device, and organic EL sealing system |
CN104051495B (en) * | 2014-05-28 | 2017-02-15 | 京东方科技集团股份有限公司 | Packaging device and packaging equipment |
WO2016147533A1 (en) * | 2015-03-16 | 2016-09-22 | セイコーエプソン株式会社 | Electronic component transport device and electronic component inspection device |
CN108139441A (en) * | 2015-03-16 | 2018-06-08 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
CN104821377B (en) | 2015-05-05 | 2017-07-21 | 合肥京东方光电科技有限公司 | Paster packaging system and method |
CN106654061B (en) | 2016-12-26 | 2019-04-02 | 武汉华星光电技术有限公司 | A kind of ultraviolet lamp for LED package |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4785269B2 (en) * | 2000-05-02 | 2011-10-05 | 株式会社半導体エネルギー研究所 | Manufacturing method of light emitting device and cleaning method of film forming device |
JP2002203682A (en) * | 2000-10-26 | 2002-07-19 | Semiconductor Energy Lab Co Ltd | Light-emitting device and its manufacturing method |
JP2002322556A (en) * | 2001-02-21 | 2002-11-08 | Semiconductor Energy Lab Co Ltd | Film deposition method and film deposition apparatus |
KR100549100B1 (en) * | 2001-06-14 | 2006-02-02 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Production device for organic el display and production method for organic el display |
JP3811943B2 (en) * | 2001-07-06 | 2006-08-23 | 日本精機株式会社 | Manufacturing method of organic EL panel. |
JP2003086355A (en) * | 2001-09-05 | 2003-03-20 | Kiko Kenji Kagi Kofun Yugenkoshi | Sealing structure, sealing method, and sealing device for organic el element |
JP4450589B2 (en) * | 2003-09-09 | 2010-04-14 | 株式会社アルバック | Deposition equipment |
JP4327544B2 (en) * | 2003-09-24 | 2009-09-09 | 株式会社アルバック | Deposition equipment |
KR100558558B1 (en) * | 2004-01-26 | 2006-03-10 | 삼성전자주식회사 | Process equipment having multi chamber |
-
2006
- 2006-06-12 JP JP2007521270A patent/JP4827842B2/en active Active
- 2006-06-12 KR KR1020077011522A patent/KR100882178B1/en active IP Right Grant
- 2006-06-12 WO PCT/JP2006/311738 patent/WO2006134863A1/en active Application Filing
- 2006-06-12 CN CNB2006800013289A patent/CN100514707C/en not_active Expired - Fee Related
- 2006-06-14 TW TW095121270A patent/TWI422027B/en active
Also Published As
Publication number | Publication date |
---|---|
CN100514707C (en) | 2009-07-15 |
WO2006134863A1 (en) | 2006-12-21 |
JPWO2006134863A1 (en) | 2009-01-08 |
KR100882178B1 (en) | 2009-02-06 |
JP4827842B2 (en) | 2011-11-30 |
KR20070072602A (en) | 2007-07-04 |
CN101069453A (en) | 2007-11-07 |
TWI422027B (en) | 2014-01-01 |
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