TW200707531A - Pad conditioner for conditioning a CMP pad and method of making the same - Google Patents

Pad conditioner for conditioning a CMP pad and method of making the same

Info

Publication number
TW200707531A
TW200707531A TW094126964A TW94126964A TW200707531A TW 200707531 A TW200707531 A TW 200707531A TW 094126964 A TW094126964 A TW 094126964A TW 94126964 A TW94126964 A TW 94126964A TW 200707531 A TW200707531 A TW 200707531A
Authority
TW
Taiwan
Prior art keywords
pad
cavities
conditioning
making
pad conditioner
Prior art date
Application number
TW094126964A
Other languages
Chinese (zh)
Other versions
TWI290337B (en
Inventor
Ying-Che Shih
Original Assignee
Princo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Princo Corp filed Critical Princo Corp
Priority to TW094126964A priority Critical patent/TWI290337B/en
Priority to US11/163,548 priority patent/US20070037493A1/en
Priority to JP2006038891A priority patent/JP2007044863A/en
Publication of TW200707531A publication Critical patent/TW200707531A/en
Application granted granted Critical
Publication of TWI290337B publication Critical patent/TWI290337B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention provides a pad conditioner for conditioning a CMP pad. The pad conditioner comprises a substrate, a plurality of cavities exist thereon, a bonding agent filled in the cavities, and abrasive particles securely placed and fixed in the cavities. The cavities are arranged in a regular manner and each of their sizes can accommodate only one abrasive particle. The cavities may be bowl-shaped or other shaped. A method of making such a pad conditioner is also disclosed.
TW094126964A 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same TWI290337B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094126964A TWI290337B (en) 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same
US11/163,548 US20070037493A1 (en) 2005-08-09 2005-10-21 Pad conditioner for conditioning a cmp pad and method of making such a pad conditioner
JP2006038891A JP2007044863A (en) 2005-08-09 2006-02-16 Conditioner for wafer polishing pad and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094126964A TWI290337B (en) 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same

Publications (2)

Publication Number Publication Date
TW200707531A true TW200707531A (en) 2007-02-16
TWI290337B TWI290337B (en) 2007-11-21

Family

ID=37743129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126964A TWI290337B (en) 2005-08-09 2005-08-09 Pad conditioner for conditioning a CMP pad and method of making the same

Country Status (3)

Country Link
US (1) US20070037493A1 (en)
JP (1) JP2007044863A (en)
TW (1) TWI290337B (en)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN110091265A (en) * 2018-01-29 2019-08-06 谢索尔钻石工业株式会社 The anti-plating manufacturing method of grinder pad finisher and the grinder pad finisher thus manufactured
CN116065217A (en) * 2022-12-26 2023-05-05 吉姆西半导体科技（无锡）有限公司 Preparation method of polishing pad finisher for CMP and polishing pad modulator

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US9254548B2 (en) * 2012-04-25 2016-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming diamond conditioners for CMP process
CN203390712U (en) * 2013-04-08 2014-01-15 宋健民 Chemical mechanical polishing dresser
EP2835220B1 (en) * 2013-08-07 2019-09-11 Reishauer AG Trimming tool, and method for manufacturing the same
TW201600242A (en) * 2014-06-18 2016-01-01 Kinik Co Polishing pad conditioner
EP3209461A4 (en) * 2014-10-21 2018-08-22 3M Innovative Properties Company Abrasive preforms, method of making an abrasive article, and bonded abrasive article
JP6453666B2 (en) * 2015-02-20 2019-01-16 東芝メモリ株式会社 Manufacturing method of polishing pad dresser
EP3774180A4 (en) * 2018-03-30 2021-12-29 Saint-gobain Abrasives, Inc Abrasive article including a coating
JP2020199598A (en) * 2019-06-11 2020-12-17 島根県 Manufacturing method for tool for cutting or grinding

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110091265A (en) * 2018-01-29 2019-08-06 谢索尔钻石工业株式会社 The anti-plating manufacturing method of grinder pad finisher and the grinder pad finisher thus manufactured
TWI692022B (en) * 2018-01-29 2020-04-21 韓商謝索爾鑽石工業股份有限公司 Manufacturing method of pad conditioner by reverse plating and pad conditioner manufactured thereof
CN116065217A (en) * 2022-12-26 2023-05-05 吉姆西半导体科技（无锡）有限公司 Preparation method of polishing pad finisher for CMP and polishing pad modulator

Also Published As

Publication number Publication date
JP2007044863A (en) 2007-02-22
US20070037493A1 (en) 2007-02-15
TWI290337B (en) 2007-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees