TW200707469A - Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components - Google Patents

Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components

Info

Publication number
TW200707469A
TW200707469A TW095117585A TW95117585A TW200707469A TW 200707469 A TW200707469 A TW 200707469A TW 095117585 A TW095117585 A TW 095117585A TW 95117585 A TW95117585 A TW 95117585A TW 200707469 A TW200707469 A TW 200707469A
Authority
TW
Taiwan
Prior art keywords
electrically conducting
powder
ceramic electronic
laminated ceramic
production
Prior art date
Application number
TW095117585A
Other languages
Chinese (zh)
Other versions
TWI368232B (en
Inventor
Naoaki Ogata
Kiyoshi Nakano
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW200707469A publication Critical patent/TW200707469A/en
Application granted granted Critical
Publication of TWI368232B publication Critical patent/TWI368232B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Abstract

According to the invention, an organic binder constituting an electrically conducting paste is protected from rapid decomposition caused by the action of metal powder as a catalyst in the degreasing step, whereby a sintered ceramic constituting a baked laminated ceramic electronic component is protected from structural failures such as cracking and delamination. An electrically conducting powder (11) to be contained in electrically conducting pastes which has a structure constituted of a metal powder (12) and a coat of an organic compound (13) formed on the surface of the powder (12), wherein the compound (13) is an organic compound which has three or more carbon atoms and contains sulfur in the molecule and the sulfur is covalently bonded to the metal constituting the powder (12), with the proportion of the compound (13) being 50ppm by weight or above in terms of S based on the metal powder (12).
TW095117585A 2005-07-08 2006-05-18 Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components TW200707469A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005200551 2005-07-08

Publications (2)

Publication Number Publication Date
TW200707469A true TW200707469A (en) 2007-02-16
TWI368232B TWI368232B (en) 2012-07-11

Family

ID=37636916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117585A TW200707469A (en) 2005-07-08 2006-05-18 Electrically conducting powder, electrically conducting paste and process for production of laminated ceramic electronic components

Country Status (3)

Country Link
JP (1) JPWO2007007518A1 (en)
TW (1) TW200707469A (en)
WO (1) WO2007007518A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102266939A (en) * 2010-06-01 2011-12-07 株式会社村田制作所 Metal powder and manufacturing method thereof, and conductive paste using metal powder and laminated ceramic electronic component using conductive paste
TWI400721B (en) * 2007-03-19 2013-07-01 Asahi Glass Co Ltd The manufacturing method of the conductor
TWI505293B (en) * 2012-02-08 2015-10-21 Jx Nippon Mining & Metals Corp The treated copper powder

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623500B2 (en) 2007-08-16 2014-01-07 Empire Technology Development Llc Conductive paste and method for manufacturing the same, wiring using the conductive paste and method for manufacturing the same
JP5067312B2 (en) * 2008-08-18 2012-11-07 住友金属鉱山株式会社 Nickel powder and its manufacturing method
GB0917988D0 (en) * 2009-10-14 2009-12-02 Johnson Matthey Plc Method
JP5718167B2 (en) * 2011-06-13 2015-05-13 日本特殊陶業株式会社 Electronic components
JP5966370B2 (en) * 2012-01-16 2016-08-10 株式会社村田製作所 Metal powder, manufacturing method thereof, conductive paste, and electronic component
JP6083295B2 (en) * 2013-03-29 2017-02-22 住友金属鉱山株式会社 Method for producing nickel powder
JP2016115448A (en) * 2014-12-11 2016-06-23 株式会社村田製作所 Conductive paste and ceramic electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133165A (en) * 2001-10-25 2003-05-09 Matsushita Electric Ind Co Ltd Laminated ceramic electronic component and its manufacturing method
JP4168773B2 (en) * 2003-02-12 2008-10-22 住友金属鉱山株式会社 Method for producing nickel powder with excellent sinterability
JP4252349B2 (en) * 2003-04-11 2009-04-08 石原産業株式会社 Copper powder, method for producing the same, copper paste using the copper powder, copper paint, electrode
JP4149353B2 (en) * 2003-10-28 2008-09-10 三井金属鉱業株式会社 Two-layer coated metal powder, method for producing the two-layer coated metal powder, and conductive paste using the two-layer coated metal powder
CA2570216C (en) * 2004-06-16 2012-10-23 Toho Titanium Co., Ltd. Nickel powder and production method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400721B (en) * 2007-03-19 2013-07-01 Asahi Glass Co Ltd The manufacturing method of the conductor
CN102266939A (en) * 2010-06-01 2011-12-07 株式会社村田制作所 Metal powder and manufacturing method thereof, and conductive paste using metal powder and laminated ceramic electronic component using conductive paste
TWI505293B (en) * 2012-02-08 2015-10-21 Jx Nippon Mining & Metals Corp The treated copper powder

Also Published As

Publication number Publication date
JPWO2007007518A1 (en) 2009-01-29
WO2007007518A1 (en) 2007-01-18
TWI368232B (en) 2012-07-11

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