TW200706704A - Mask and method for electrokinetic deposition and patterning process on substrates - Google Patents
Mask and method for electrokinetic deposition and patterning process on substratesInfo
- Publication number
- TW200706704A TW200706704A TW095117708A TW95117708A TW200706704A TW 200706704 A TW200706704 A TW 200706704A TW 095117708 A TW095117708 A TW 095117708A TW 95117708 A TW95117708 A TW 95117708A TW 200706704 A TW200706704 A TW 200706704A
- Authority
- TW
- Taiwan
- Prior art keywords
- mask
- substrate
- charged particles
- substrates
- conducting layer
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68213005P | 2005-05-18 | 2005-05-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200706704A true TW200706704A (en) | 2007-02-16 |
TWI388697B TWI388697B (zh) | 2013-03-11 |
Family
ID=37432143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW095117708A TWI388697B (zh) | 2005-05-18 | 2006-05-18 | 基體上之電動沉積及圖案化程序的遮罩和方法 |
Country Status (6)
Country | Link |
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US (1) | US7678255B2 (zh) |
EP (1) | EP1882056A2 (zh) |
JP (1) | JP5301269B2 (zh) |
KR (1) | KR20080022111A (zh) |
TW (1) | TWI388697B (zh) |
WO (1) | WO2006125089A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107723753A (zh) * | 2017-09-27 | 2018-02-23 | 上海瑞尔实业有限公司 | 高强度高韧性镍金属遮蔽工装制备方法 |
Families Citing this family (7)
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US7538429B2 (en) * | 2006-08-21 | 2009-05-26 | Intel Corporation | Method of enabling solder deposition on a substrate and electronic package formed thereby |
US8216441B2 (en) * | 2007-12-10 | 2012-07-10 | Applied Materials, Inc. | Electrophoretic solar cell metallization process and apparatus |
US8247248B2 (en) * | 2009-05-15 | 2012-08-21 | Achrolux Inc. | Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure |
KR101104681B1 (ko) * | 2010-01-08 | 2012-01-16 | 서울대학교산학협력단 | 비전도성 기판 상에 하전 입자를 부착하는 방법 |
CN103030097B (zh) * | 2012-12-12 | 2015-06-17 | 中北大学 | 基于静电场自聚焦的圆片级低维纳米结构的制备方法 |
US20170301434A1 (en) * | 2016-04-18 | 2017-10-19 | Littelfuse, Inc. | Methods for manufacturing an insulated busbar |
US10685766B2 (en) | 2016-04-18 | 2020-06-16 | Littelfuse, Inc. | Methods for manufacturing an insulated busbar |
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US3431887A (en) | 1963-11-13 | 1969-03-11 | Polymer Corp | Apparatus for coating articles in a fluidized bed |
JPH04211193A (ja) * | 1990-03-22 | 1992-08-03 | Canon Inc | 導電回路部材、導電回路部材の製造方法、導電性ペースト及び電子機器 |
US5981043A (en) | 1996-04-25 | 1999-11-09 | Tatsuta Electric Wire And Cable Co., Ltd | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield |
US5817374A (en) * | 1996-05-31 | 1998-10-06 | Electrox Corporation | Process for patterning powders into thick layers |
EP1015669B1 (en) | 1997-04-04 | 2010-11-17 | University Of Southern California | Electroplating method for forming a multilayer structure |
TWI231293B (en) | 1997-11-12 | 2005-04-21 | Jsr Corp | Transfer film |
US6153348A (en) | 1998-08-07 | 2000-11-28 | Parelec Llc | Electrostatic printing of conductors on photoresists and liquid metallic toners therefor |
US6781612B1 (en) | 1998-10-13 | 2004-08-24 | Electrox Corporation | Electrostatic printing of functional toner materials for electronic manufacturing applications |
AU1799401A (en) | 1999-11-23 | 2001-06-04 | Electrox Corporation | A durable electrostatic printing plate and method of making the same |
US6524758B2 (en) | 1999-12-20 | 2003-02-25 | Electrox Corporation | Method of manufacture of printed wiring boards and flexible circuitry |
TW495809B (en) * | 2000-02-28 | 2002-07-21 | Semiconductor Energy Lab | Thin film forming device, thin film forming method, and self-light emitting device |
AU2002226093A1 (en) | 2000-12-15 | 2002-06-24 | Electrox Corp. | Process for the manufacture of novel, inexpensive radio frequency identificationdevices |
JP2002223059A (ja) * | 2001-01-24 | 2002-08-09 | Sharp Corp | 微細パターン形成方法 |
EP1384119A4 (en) | 2001-02-08 | 2005-06-01 | Electrox Corp | IMPROVED ELECTROSTATIC PRINTING PLATE HAVING A HEATED SURFACE |
WO2002071465A1 (en) | 2001-03-02 | 2002-09-12 | Electrox Corp. | Process for the manufacture of large area arrays of discrete components |
US6803092B2 (en) * | 2001-06-26 | 2004-10-12 | 3M Innovative Properties Company | Selective deposition of circuit-protective polymers |
US6790483B2 (en) | 2002-12-06 | 2004-09-14 | Eastman Kodak Company | Method for producing patterned deposition from compressed fluid |
US6780249B2 (en) | 2002-12-06 | 2004-08-24 | Eastman Kodak Company | System for producing patterned deposition from compressed fluid in a partially opened deposition chamber |
TWI395256B (zh) | 2003-07-09 | 2013-05-01 | Fry Metals Inc | 沉積及形成圖形之方法 |
CN100542692C (zh) | 2003-07-09 | 2009-09-23 | 福莱金属公司 | 包覆金属颗粒 |
JP2007277619A (ja) * | 2006-04-05 | 2007-10-25 | Electroplating Eng Of Japan Co | 電気泳動による粒子堆積方法 |
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2006
- 2006-05-18 US US11/419,128 patent/US7678255B2/en active Active
- 2006-05-18 WO PCT/US2006/019250 patent/WO2006125089A2/en active Application Filing
- 2006-05-18 TW TW095117708A patent/TWI388697B/zh not_active IP Right Cessation
- 2006-05-18 KR KR1020077029468A patent/KR20080022111A/ko not_active Application Discontinuation
- 2006-05-18 EP EP06760104A patent/EP1882056A2/en not_active Withdrawn
- 2006-05-18 JP JP2008512507A patent/JP5301269B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107723753A (zh) * | 2017-09-27 | 2018-02-23 | 上海瑞尔实业有限公司 | 高强度高韧性镍金属遮蔽工装制备方法 |
CN107723753B (zh) * | 2017-09-27 | 2021-04-27 | 上海瑞尔实业有限公司 | 高强度高韧性镍金属遮蔽工装制备方法 |
Also Published As
Publication number | Publication date |
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EP1882056A2 (en) | 2008-01-30 |
KR20080022111A (ko) | 2008-03-10 |
TWI388697B (zh) | 2013-03-11 |
JP2008546182A (ja) | 2008-12-18 |
WO2006125089A3 (en) | 2007-11-22 |
WO2006125089A2 (en) | 2006-11-23 |
JP5301269B2 (ja) | 2013-09-25 |
US7678255B2 (en) | 2010-03-16 |
US20060260943A1 (en) | 2006-11-23 |
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