TW200702352A - Curing aid agent used for epoxy resin - Google Patents

Curing aid agent used for epoxy resin

Info

Publication number
TW200702352A
TW200702352A TW095121237A TW95121237A TW200702352A TW 200702352 A TW200702352 A TW 200702352A TW 095121237 A TW095121237 A TW 095121237A TW 95121237 A TW95121237 A TW 95121237A TW 200702352 A TW200702352 A TW 200702352A
Authority
TW
Taiwan
Prior art keywords
aid agent
curing aid
epoxy resin
integer
optionally substituted
Prior art date
Application number
TW095121237A
Other languages
Chinese (zh)
Inventor
Michiharu Okubo
Shinji Yamashita
Original Assignee
San Apro Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Apro Ltd filed Critical San Apro Ltd
Publication of TW200702352A publication Critical patent/TW200702352A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

This invention discloses a curing aid agent with lower hygroscopicity used fur epoxy resin, the said curing aid agent comprises: diazabicycle compound (A) of general formula (1), (hydrogen atom of methylene is optionally substituted by organic group, m is a integer of 2 to 6), and biphenylene type phenol resin (B) of general formula (2), (hydroxyphenyl and biphenylene are optionally substituted by organic group or halogen atom, n is a integer of 0 to 10) and/or dicyclopentandiene type phenol resin (C) of general formula (3), (hydroxyphenyl is optionally substituted by organic group or halogen atom, n is a integer of 0 to 10).
TW095121237A 2005-06-16 2006-06-14 Curing aid agent used for epoxy resin TW200702352A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005176066 2005-06-16
JP2005189624 2005-06-29

Publications (1)

Publication Number Publication Date
TW200702352A true TW200702352A (en) 2007-01-16

Family

ID=37532227

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121237A TW200702352A (en) 2005-06-16 2006-06-14 Curing aid agent used for epoxy resin

Country Status (4)

Country Link
JP (1) JPWO2006134865A1 (en)
KR (1) KR20080017101A (en)
TW (1) TW200702352A (en)
WO (1) WO2006134865A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6579367B2 (en) * 2015-07-02 2019-09-25 Dic株式会社 Epoxy resin composition, cured product, fiber reinforced composite material, fiber reinforced resin molded product, and method for producing fiber reinforced resin molded product

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105562A (en) * 1987-10-19 1989-04-24 Sumitomo Bakelite Co Ltd Resin-sealed semiconductor device
JP3543853B2 (en) * 1994-12-06 2004-07-21 住友ベークライト株式会社 Epoxy resin curing accelerator and method for producing cured epoxy resin
JP3850111B2 (en) * 1996-09-13 2006-11-29 住友ベークライト株式会社 Semiconductor sealing resin composition, method for producing the same, and semiconductor device
JP2003292583A (en) * 2002-03-29 2003-10-15 Hitachi Chem Co Ltd Epoxy resin molding material and electronic part device

Also Published As

Publication number Publication date
KR20080017101A (en) 2008-02-25
JPWO2006134865A1 (en) 2009-01-08
WO2006134865A1 (en) 2006-12-21

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