TW200702352A - Curing aid agent used for epoxy resin - Google Patents
Curing aid agent used for epoxy resinInfo
- Publication number
- TW200702352A TW200702352A TW095121237A TW95121237A TW200702352A TW 200702352 A TW200702352 A TW 200702352A TW 095121237 A TW095121237 A TW 095121237A TW 95121237 A TW95121237 A TW 95121237A TW 200702352 A TW200702352 A TW 200702352A
- Authority
- TW
- Taiwan
- Prior art keywords
- aid agent
- curing aid
- epoxy resin
- integer
- optionally substituted
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
This invention discloses a curing aid agent with lower hygroscopicity used fur epoxy resin, the said curing aid agent comprises: diazabicycle compound (A) of general formula (1), (hydrogen atom of methylene is optionally substituted by organic group, m is a integer of 2 to 6), and biphenylene type phenol resin (B) of general formula (2), (hydroxyphenyl and biphenylene are optionally substituted by organic group or halogen atom, n is a integer of 0 to 10) and/or dicyclopentandiene type phenol resin (C) of general formula (3), (hydroxyphenyl is optionally substituted by organic group or halogen atom, n is a integer of 0 to 10).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005176066 | 2005-06-16 | ||
JP2005189624 | 2005-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200702352A true TW200702352A (en) | 2007-01-16 |
Family
ID=37532227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121237A TW200702352A (en) | 2005-06-16 | 2006-06-14 | Curing aid agent used for epoxy resin |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2006134865A1 (en) |
KR (1) | KR20080017101A (en) |
TW (1) | TW200702352A (en) |
WO (1) | WO2006134865A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6579367B2 (en) * | 2015-07-02 | 2019-09-25 | Dic株式会社 | Epoxy resin composition, cured product, fiber reinforced composite material, fiber reinforced resin molded product, and method for producing fiber reinforced resin molded product |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01105562A (en) * | 1987-10-19 | 1989-04-24 | Sumitomo Bakelite Co Ltd | Resin-sealed semiconductor device |
JP3543853B2 (en) * | 1994-12-06 | 2004-07-21 | 住友ベークライト株式会社 | Epoxy resin curing accelerator and method for producing cured epoxy resin |
JP3850111B2 (en) * | 1996-09-13 | 2006-11-29 | 住友ベークライト株式会社 | Semiconductor sealing resin composition, method for producing the same, and semiconductor device |
JP2003292583A (en) * | 2002-03-29 | 2003-10-15 | Hitachi Chem Co Ltd | Epoxy resin molding material and electronic part device |
-
2006
- 2006-06-12 JP JP2007521272A patent/JPWO2006134865A1/en active Pending
- 2006-06-12 WO PCT/JP2006/311740 patent/WO2006134865A1/en active Application Filing
- 2006-06-12 KR KR1020087001171A patent/KR20080017101A/en not_active Application Discontinuation
- 2006-06-14 TW TW095121237A patent/TW200702352A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20080017101A (en) | 2008-02-25 |
JPWO2006134865A1 (en) | 2009-01-08 |
WO2006134865A1 (en) | 2006-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602006021055D1 (en) | HARDENING COMPOSITIONS | |
ATE458764T1 (en) | MODIFIED HYDROCARBYLPHENOL-ALDEHYDE RESINS AS TACKAGERS AND RUBBER COMPOSITIONS CONTAINING SAME | |
ATE509053T1 (en) | DIMETHYLFORMAMIDE-FREE FORMULATIONS WITH DICYANADIAMIDE AS HARDENING AGENT FOR HEAT-CURING EPOXY RESINS | |
TW200732362A (en) | Phenol resin composition, cured article, resin composition for copper-clad laminate, copper-clad laminate, and novel phenol resin | |
NO20082877L (en) | Precursor compound for radioactive halogen-labeled organic compound | |
TW200710160A (en) | Hardenable epoxy resin composition | |
GB0521508D0 (en) | Organic compounds | |
EP2145880A4 (en) | Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition | |
DK1831239T5 (en) | Process for the preparation of 17-hydroxy-6 beta, 7 beta, 15 beta, 16 beta -bismethylene-17alpha-pregn-4-ene-3-one-21-carboxylic acid gamma-lactone and key intermediates for this process | |
TW200610773A (en) | Epoxy resin, epoxy resin composition and cured object thereof | |
TW200732366A (en) | Thermosetting resin composition | |
MX2009003713A (en) | An alzheimer's disease progression inhibitor containing heterocyclic compound having specific structure. | |
WO2008035212A3 (en) | Processes for preparing intermediate compounds useful for the preparation of cinacalcet | |
CO5601045A2 (en) | PROCEDURE FOR THE MANUFACTURE OF ORGANIC COMPOUNDS | |
TW200720328A (en) | A phenol novolac resin having low softing point, method for producing the same and an epoxy resin composition using the phenol novolac resin | |
WO2008152011A9 (en) | Catalyst for curing epoxides | |
TW200738776A (en) | Phenol resin, process for producing thereof, epoxy resin and use thereof | |
WO2009005135A1 (en) | Curing agent for epoxy resin and curing agent composition for epoxy resin | |
TW200619258A (en) | Epoxy resin composition for optical semiconductor encapsulation | |
GT200300167A (en) | DERIVATIVES OF TIAZOL | |
DE602006005349D1 (en) | PROCESS FOR PREPARING HYDRAZONE DERIVATIVES | |
TW200643629A (en) | Positive photosensitive resin composition | |
GT200600102A (en) | PROCEDURE FOR THE PREPARATION OF SUBSTITUTED BENZOXAZOL COMPOUNDS | |
ATE272662T1 (en) | CURABLE COMPOSITIONS OF GLYCIDYL COMPOUNDS, AMINIC HARDENERS AND LOW VISCOSE CURING ACCELERATORS | |
TW200702352A (en) | Curing aid agent used for epoxy resin |