WO2009005135A1 - Curing agent for epoxy resin and curing agent composition for epoxy resin - Google Patents

Curing agent for epoxy resin and curing agent composition for epoxy resin Download PDF

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Publication number
WO2009005135A1
WO2009005135A1 PCT/JP2008/062113 JP2008062113W WO2009005135A1 WO 2009005135 A1 WO2009005135 A1 WO 2009005135A1 JP 2008062113 W JP2008062113 W JP 2008062113W WO 2009005135 A1 WO2009005135 A1 WO 2009005135A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curing agent
carbon atoms
optionally substituted
general formula
Prior art date
Application number
PCT/JP2008/062113
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshihiko Takada
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to JP2009521673A priority Critical patent/JP5138685B2/en
Publication of WO2009005135A1 publication Critical patent/WO2009005135A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/64—Amino alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Disclosed is a curing agent for epoxy resin which is represented by the following general formula (1) or (2). (1) (2) (In the formulae, R1 and R5 each represents a hydrogen atom, an optionally substituted alkyl group having 1-6 carbon atoms or an optionally substituted aryl group having 1-12 carbon atoms; R2 represents a hydrogen atom or an optionally substituted alkyl group having 1-6 carbon atoms; R3 and R4 independently represent a hydrogen atom or a group represented by the following general formula (3): (3) (wherein R1 and R2 are as define above) or the following general formula (4): (4) ; and n represents an integer of 1-3.)
PCT/JP2008/062113 2007-07-05 2008-07-03 Curing agent for epoxy resin and curing agent composition for epoxy resin WO2009005135A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009521673A JP5138685B2 (en) 2007-07-05 2008-07-03 Curing agent for epoxy resin and curing agent composition for epoxy resin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-177261 2007-07-05
JP2007177261 2007-07-05

Publications (1)

Publication Number Publication Date
WO2009005135A1 true WO2009005135A1 (en) 2009-01-08

Family

ID=40226176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062113 WO2009005135A1 (en) 2007-07-05 2008-07-03 Curing agent for epoxy resin and curing agent composition for epoxy resin

Country Status (3)

Country Link
JP (1) JP5138685B2 (en)
TW (1) TW200916496A (en)
WO (1) WO2009005135A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (en) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent
JP2013095876A (en) * 2011-11-02 2013-05-20 Asahi Kasei E-Materials Corp Curing agent, microcapsule-type curing agent, master batch-type curing agent composition, one-pack epoxy resin composition and processed goods
KR20140065420A (en) * 2011-09-20 2014-05-29 헨켈 아게 운트 코. 카게아아 Electrically conductive adhesives comprising silver-coated particles
KR20190016303A (en) * 2017-08-08 2019-02-18 주식회사 케이씨씨 Cationic urethane curing agent and electro-deposition paint composition comprising the same
CN112500821A (en) * 2020-12-29 2021-03-16 烟台信友新材料有限公司 Ultraviolet-curing single-component epoxy adhesive with variable operation time and preparation method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406925B (en) * 2010-09-14 2013-09-01 Zhen Ding Technology Co Ltd Printed circuit board subatrate and method for manufacturing the same
TWI582370B (en) * 2015-03-17 2017-05-11 Method for Making High Thermal Conductivity Elements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06207152A (en) * 1992-10-02 1994-07-26 W R Grace & Co Low-viscosity solventless one-pack epoxy resin adhesive composition
JPH09175848A (en) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd Composition for cement molded form
JP2000080146A (en) * 1998-09-03 2000-03-21 Asahi Chem Ind Co Ltd Epoxy resin composition
JP2002088137A (en) * 2000-09-14 2002-03-27 Sanwa Chemical Industry Co Ltd Low-temperature curing latent curable agent for epoxy resin
JP2004292737A (en) * 2003-03-28 2004-10-21 Asahi Denka Kogyo Kk Curing agent composition for epoxy resin
WO2007037378A1 (en) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
WO2007088889A1 (en) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041219A (en) * 1990-04-19 1992-01-06 Toyama Pref Gov One-pack thermosetting composition
JP3270775B2 (en) * 1992-01-24 2002-04-02 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション Improved latent curing agent for epoxy resin and method for producing the same
JPH06184274A (en) * 1992-12-16 1994-07-05 Fuji Kasei Kogyo Kk One component system thermoset epoxide composition
JP3562323B2 (en) * 1998-07-09 2004-09-08 株式会社スリーボンド Thermosetting conductive adhesive

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06207152A (en) * 1992-10-02 1994-07-26 W R Grace & Co Low-viscosity solventless one-pack epoxy resin adhesive composition
JPH09175848A (en) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd Composition for cement molded form
JP2000080146A (en) * 1998-09-03 2000-03-21 Asahi Chem Ind Co Ltd Epoxy resin composition
JP2002088137A (en) * 2000-09-14 2002-03-27 Sanwa Chemical Industry Co Ltd Low-temperature curing latent curable agent for epoxy resin
JP2004292737A (en) * 2003-03-28 2004-10-21 Asahi Denka Kogyo Kk Curing agent composition for epoxy resin
WO2007037378A1 (en) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation High-stability microencapsulated hardener for epoxy resin and epoxy resin composition
WO2007088889A1 (en) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (en) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent
JP5763527B2 (en) * 2009-04-24 2015-08-12 旭化成イーマテリアルズ株式会社 Imidazole compound-containing microencapsulated composition, curable composition using the same, and masterbatch type curing agent
KR20140065420A (en) * 2011-09-20 2014-05-29 헨켈 아게 운트 코. 카게아아 Electrically conductive adhesives comprising silver-coated particles
JP2014531495A (en) * 2011-09-20 2014-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ．ＫＧａＡ Conductive adhesive containing silver-coated particles
US9770886B2 (en) 2011-09-20 2017-09-26 Henkel Ag & Co. Kgaa Electrically conductive adhesives comprising silver-coated particles
KR102009534B1 (en) * 2011-09-20 2019-08-09 헨켈 아게 운트 코. 카게아아 Electrically conductive adhesives comprising silver-coated particles
JP2013095876A (en) * 2011-11-02 2013-05-20 Asahi Kasei E-Materials Corp Curing agent, microcapsule-type curing agent, master batch-type curing agent composition, one-pack epoxy resin composition and processed goods
KR20190016303A (en) * 2017-08-08 2019-02-18 주식회사 케이씨씨 Cationic urethane curing agent and electro-deposition paint composition comprising the same
KR102042239B1 (en) 2017-08-08 2019-11-08 주식회사 케이씨씨 Cationic urethane curing agent and electro-deposition paint composition comprising the same
CN112500821A (en) * 2020-12-29 2021-03-16 烟台信友新材料有限公司 Ultraviolet-curing single-component epoxy adhesive with variable operation time and preparation method thereof

Also Published As

Publication number Publication date
JPWO2009005135A1 (en) 2010-08-26
TWI370823B (en) 2012-08-21
TW200916496A (en) 2009-04-16
JP5138685B2 (en) 2013-02-06

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