TW200644211A - Semiconductor device and method of manufacturing the same - Google Patents

Semiconductor device and method of manufacturing the same

Info

Publication number
TW200644211A
TW200644211A TW095104752A TW95104752A TW200644211A TW 200644211 A TW200644211 A TW 200644211A TW 095104752 A TW095104752 A TW 095104752A TW 95104752 A TW95104752 A TW 95104752A TW 200644211 A TW200644211 A TW 200644211A
Authority
TW
Taiwan
Prior art keywords
power supply
wiring
round
pad
semiconductor device
Prior art date
Application number
TW095104752A
Other languages
English (en)
Inventor
Hiroyuki Masuko
Yutaka Sato
Original Assignee
Seiko Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instr Inc filed Critical Seiko Instr Inc
Publication of TW200644211A publication Critical patent/TW200644211A/zh

Links

Classifications

    • H—ELECTRICITY
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
TW095104752A 2005-02-14 2006-02-13 Semiconductor device and method of manufacturing the same TW200644211A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005035880A JP2006222351A (ja) 2005-02-14 2005-02-14 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW200644211A true TW200644211A (en) 2006-12-16

Family

ID=36814847

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Application Number Title Priority Date Filing Date
TW095104752A TW200644211A (en) 2005-02-14 2006-02-13 Semiconductor device and method of manufacturing the same

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Country Link
US (1) US7577931B2 (zh)
JP (1) JP2006222351A (zh)
KR (1) KR20060091263A (zh)
CN (1) CN100527409C (zh)
TW (1) TW200644211A (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101241894A (zh) * 2007-09-20 2008-08-13 三星电子株式会社 智能卡金属载带及其制造方法和包括该载带的封装模块
EP2498460A1 (en) * 2009-11-05 2012-09-12 Rohm Co., Ltd. Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61218153A (ja) * 1985-03-25 1986-09-27 Hitachi Ltd 半導体集積回路装置
JPH01316948A (ja) * 1988-06-17 1989-12-21 Nec Ic Microcomput Syst Ltd 半導体集積回路
JPH0230176A (ja) * 1988-07-19 1990-01-31 Nec Corp 半導体集積回路
JPH11163032A (ja) * 1997-11-28 1999-06-18 Toshiba Microelectronics Corp 半導体装置
US6161215A (en) * 1998-08-31 2000-12-12 Hewlett-Packard Company Package routing of integrated circuit signals
JP3236583B2 (ja) * 1999-06-24 2001-12-10 ローム株式会社 半導体集積回路装置
JP2003332448A (ja) * 2002-05-14 2003-11-21 Mitsubishi Electric Corp 半導体装置
JP2004111796A (ja) * 2002-09-20 2004-04-08 Hitachi Ltd 半導体装置

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JP2006222351A (ja) 2006-08-24
CN100527409C (zh) 2009-08-12
US7577931B2 (en) 2009-08-18
US20060180918A1 (en) 2006-08-17
KR20060091263A (ko) 2006-08-18
CN1822363A (zh) 2006-08-23

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