TW200643587A - Solid-state image pick-up device - Google Patents

Solid-state image pick-up device

Info

Publication number
TW200643587A
TW200643587A TW095104297A TW95104297A TW200643587A TW 200643587 A TW200643587 A TW 200643587A TW 095104297 A TW095104297 A TW 095104297A TW 95104297 A TW95104297 A TW 95104297A TW 200643587 A TW200643587 A TW 200643587A
Authority
TW
Taiwan
Prior art keywords
color filters
solid
pattern
state image
image pick
Prior art date
Application number
TW095104297A
Other languages
English (en)
Other versions
TWI316636B (en
Inventor
Keisuke Ogata
Kenzo Fukuyoshi
Tadashi Ishimatsu
Mitsuhiro Nakao
Satoshi Kitamura
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005034620A external-priority patent/JP4857569B2/ja
Priority claimed from JP2005034621A external-priority patent/JP4984400B2/ja
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of TW200643587A publication Critical patent/TW200643587A/zh
Application granted granted Critical
Publication of TWI316636B publication Critical patent/TWI316636B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Multimedia (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
TW095104297A 2005-02-10 2006-02-09 Solid-state image pick-up device TWI316636B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005034620A JP4857569B2 (ja) 2005-02-10 2005-02-10 固体撮像素子及びその製造方法
JP2005034621A JP4984400B2 (ja) 2005-02-10 2005-02-10 固体撮像素子及びその製造方法

Publications (2)

Publication Number Publication Date
TW200643587A true TW200643587A (en) 2006-12-16
TWI316636B TWI316636B (en) 2009-11-01

Family

ID=36793100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104297A TWI316636B (en) 2005-02-10 2006-02-09 Solid-state image pick-up device

Country Status (5)

Country Link
US (2) US8097485B2 (zh)
EP (1) EP1855320B1 (zh)
KR (1) KR100934513B1 (zh)
TW (1) TWI316636B (zh)
WO (1) WO2006085528A1 (zh)

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US20090090850A1 (en) * 2006-08-31 2009-04-09 Aptina Imaging Corporation Deep Recess Color Filter Array and Process of Forming the Same
JP4637196B2 (ja) * 2007-03-16 2011-02-23 富士フイルム株式会社 固体撮像素子
JP4480740B2 (ja) * 2007-07-03 2010-06-16 シャープ株式会社 固体撮像素子およびその製造方法、電子情報機器
JP4576412B2 (ja) * 2007-09-05 2010-11-10 シャープ株式会社 着色マイクロレンズアレイの製造方法、カラー固体撮像素子およびその製造方法、カラー表示装置の製造方法、電子情報機器の製造方法
US8629916B2 (en) * 2008-08-19 2014-01-14 Rohm Co., Ltd. Camera with imaging unit and imaging unit for camera
JP5027081B2 (ja) * 2008-08-29 2012-09-19 パナソニック株式会社 カラー撮像デバイスおよびカラー撮像デバイスの製造方法
JP5532599B2 (ja) * 2008-12-17 2014-06-25 株式会社ニコン 固体撮像素子の製造方法及び撮像装置
US7897419B2 (en) * 2008-12-23 2011-03-01 Cree, Inc. Color correction for wafer level white LEDs
JP5644177B2 (ja) * 2010-05-07 2014-12-24 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
JP5941635B2 (ja) 2011-08-31 2016-06-29 富士フイルム株式会社 着色組成物、並びに、これを用いたカラーフィルタの製造方法、カラーフィルタ、及び、固体撮像素子
JP2013064993A (ja) 2011-08-31 2013-04-11 Fujifilm Corp カラーフィルタの製造方法、カラーフィルタ、及び固体撮像素子
JP5757925B2 (ja) 2011-08-31 2015-08-05 富士フイルム株式会社 着色組成物、並びに、これを用いたカラーフィルタの製造方法、カラーフィルタ、及び、固体撮像素子
JP5757924B2 (ja) 2011-08-31 2015-08-05 富士フイルム株式会社 着色組成物、並びに、これを用いたカラーフィルタの製造方法、カラーフィルタ、及び、固体撮像素子
JP5728336B2 (ja) 2011-08-31 2015-06-03 富士フイルム株式会社 カラーフィルタの製造方法、及び固体撮像素子の製造方法
US20130100324A1 (en) * 2011-10-21 2013-04-25 Sony Corporation Method of manufacturing solid-state image pickup element, solid-state image pickup element, image pickup device, electronic apparatus, solid-state image pickup device, and method of manufacturing solid-state image pickup device
US9564462B2 (en) * 2014-10-01 2017-02-07 Visera Technologies Company Limited Image-sensor structures
WO2017086321A1 (ja) 2015-11-16 2017-05-26 凸版印刷株式会社 固体撮像素子の製造方法及び固体撮像素子、並びにカラーフィルタの製造方法及びカラーフィルタ
JP2017139742A (ja) * 2016-02-02 2017-08-10 パナソニックＩｐマネジメント株式会社 撮像装置、撮像システム、撮像方法及びプログラム
EP3565000B1 (en) * 2016-12-27 2022-02-16 Toppan Printing Co., Ltd. Solid-state imaging element and method for manufacturing same
JP6838394B2 (ja) * 2016-12-27 2021-03-03 凸版印刷株式会社 固体撮像素子およびその製造方法
KR102395992B1 (ko) * 2017-04-07 2022-05-10 삼성전자주식회사 광대역 컬러 필터를 포함하는 이미지 센서
JP2019087545A (ja) * 2017-11-01 2019-06-06 凸版印刷株式会社 固体撮像素子及びその製造方法
US20190206912A1 (en) * 2018-01-03 2019-07-04 Himax Technologies Limited Image sensor, micro-lens array, and method for fabricating micro-lens array with different heights in image sensor

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JPH11284158A (ja) 1998-03-27 1999-10-15 Sony Corp 固体撮像素子と固体撮像素子の製造方法
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Also Published As

Publication number Publication date
KR100934513B1 (ko) 2009-12-29
US7932122B2 (en) 2011-04-26
TWI316636B (en) 2009-11-01
WO2006085528A1 (ja) 2006-08-17
US20100261303A1 (en) 2010-10-14
EP1855320A4 (en) 2012-03-21
US8097485B2 (en) 2012-01-17
EP1855320B1 (en) 2013-12-11
KR20070098894A (ko) 2007-10-05
US20070298164A1 (en) 2007-12-27
EP1855320A1 (en) 2007-11-14

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