TW200643232A - Copper clad laminate - Google Patents

Copper clad laminate

Info

Publication number
TW200643232A
TW200643232A TW095108094A TW95108094A TW200643232A TW 200643232 A TW200643232 A TW 200643232A TW 095108094 A TW095108094 A TW 095108094A TW 95108094 A TW95108094 A TW 95108094A TW 200643232 A TW200643232 A TW 200643232A
Authority
TW
Taiwan
Prior art keywords
copper foil
insulating layer
clad laminate
copper clad
treatment
Prior art date
Application number
TW095108094A
Other languages
Chinese (zh)
Other versions
TWI406977B (en
Inventor
Koichi Hattori
Ryuzo Shinta
Yasufumi Matsumura
Tomoyuki Suzuki
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200643232A publication Critical patent/TW200643232A/en
Application granted granted Critical
Publication of TWI406977B publication Critical patent/TWI406977B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a copper clad laminate exhibiting excellent heat-resistance, noncombustibility, and dimension stability as well as capable of high density packaging, and having excellent adhesion and adhesive strength preservation ability. The copper clad laminate includes an insulating layer formed on a copper foil, wherein a surface of the copper foil contacting with the insulating layer has a Rz of 0.3 to 1.0 μm. The surface of the copper foil contains metal elements of 1 to 15 μg/cm<SP>2</SP> of Ni, 0.1 to 10 μg/cm<SP>2</SP> of Zn, and 1.5-30 μg/cm<SP>2</SP> of Co, when measured with a high frequency induced coupled plasma (ICP) spectroscopy. Furthermore, the surface of the copper foil is performed with a metal extracting treatment, and a treatment using a coupling agent, the metal extracting treatment being used to extract the metals such that a ratio of Co which is indicated by Co/(Ni+Zn+Co) is greater than 0.4. The insulating layer is formed of an aromatic polyimide resin having 205 to 390 equivalent of methyl group, the aromatic polyimide resin being obtained by polymerizing a methyl group containing monomer of one of a diamine or an anhydride.
TW095108094A 2005-03-14 2006-03-10 Copper clad laminate TWI406977B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005070642 2005-03-14

Publications (2)

Publication Number Publication Date
TW200643232A true TW200643232A (en) 2006-12-16
TWI406977B TWI406977B (en) 2013-09-01

Family

ID=37631251

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108094A TWI406977B (en) 2005-03-14 2006-03-10 Copper clad laminate

Country Status (2)

Country Link
KR (1) KR101195090B1 (en)
TW (1) TWI406977B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3906347B2 (en) * 1998-06-11 2007-04-18 三井金属鉱業株式会社 Copper foil for printed circuit
JP2001270036A (en) * 2000-03-28 2001-10-02 Ube Ind Ltd Flexible metal foil laminate
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
JP2005041049A (en) * 2003-07-25 2005-02-17 Ube Ind Ltd Wide copper clad laminated board
JP4172704B2 (en) 2003-07-31 2008-10-29 日鉱金属株式会社 Surface-treated copper foil and substrate using the same

Also Published As

Publication number Publication date
TWI406977B (en) 2013-09-01
KR101195090B1 (en) 2012-10-29
KR20060100203A (en) 2006-09-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees