TW200638527A - Method for wafer level package of sensor chip - Google Patents
Method for wafer level package of sensor chipInfo
- Publication number
- TW200638527A TW200638527A TW094112261A TW94112261A TW200638527A TW 200638527 A TW200638527 A TW 200638527A TW 094112261 A TW094112261 A TW 094112261A TW 94112261 A TW94112261 A TW 94112261A TW 200638527 A TW200638527 A TW 200638527A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- level package
- stress
- forming
- weld pad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Method for wafer-level package of sensor chip includes following procedures: providing a wafer comprising multiple dies areas, which includes an active area and a weld pad located around the active area; surface mounting a transparent protection layer onto the first surface of the wafer; forming a stress bumper layer on the second surface of the wafer; forming a through hole penetrating the stress bumper layer and the wafer at a preset position between two dies areas via etching or laser drilling in order to expose the weld pad or a leading wire preset between two neighboring weld pads; forming multiple bump electrodes on the stress bumper layer to be electrically connected the weld pad by way of the through hole. The present invention has following advantages: assembling convenience, low assembly cost, high reliability of wafer-level package structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094112261A TWI258210B (en) | 2005-04-18 | 2005-04-18 | Method for wafer level package of sensor chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094112261A TWI258210B (en) | 2005-04-18 | 2005-04-18 | Method for wafer level package of sensor chip |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI258210B TWI258210B (en) | 2006-07-11 |
TW200638527A true TW200638527A (en) | 2006-11-01 |
Family
ID=37765195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094112261A TWI258210B (en) | 2005-04-18 | 2005-04-18 | Method for wafer level package of sensor chip |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI258210B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9397137B2 (en) | 2012-07-11 | 2016-07-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structure for CIS flip-chip bonding and methods for forming the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111200410B (en) * | 2018-11-16 | 2023-03-21 | 开元通信技术(厦门)有限公司 | Wafer-level packaging structure of acoustic wave device and preparation method thereof |
-
2005
- 2005-04-18 TW TW094112261A patent/TWI258210B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9397137B2 (en) | 2012-07-11 | 2016-07-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structure for CIS flip-chip bonding and methods for forming the same |
US10090345B2 (en) | 2012-07-11 | 2018-10-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structure for CIS flip-chip bonding and methods for forming the same |
Also Published As
Publication number | Publication date |
---|---|
TWI258210B (en) | 2006-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |