TW200637475A - Thermal interface material and method of making the same - Google Patents

Thermal interface material and method of making the same

Info

Publication number
TW200637475A
TW200637475A TW094112036A TW94112036A TW200637475A TW 200637475 A TW200637475 A TW 200637475A TW 094112036 A TW094112036 A TW 094112036A TW 94112036 A TW94112036 A TW 94112036A TW 200637475 A TW200637475 A TW 200637475A
Authority
TW
Taiwan
Prior art keywords
thermal interface
tips
interface material
carbon nanotubes
matrix
Prior art date
Application number
TW094112036A
Other languages
Chinese (zh)
Other versions
TWI256877B (en
Inventor
Hua Huang
Chang-Hong Liu
Shou-Shan Fan
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94112036A priority Critical patent/TWI256877B/en
Application granted granted Critical
Publication of TWI256877B publication Critical patent/TWI256877B/en
Publication of TW200637475A publication Critical patent/TW200637475A/en

Links

Abstract

The present invention discloses a thermal interface material and a method of making the same. The thermal interface material includes a matrix and numbers of carbon nanotubes embedded in the matrix. The matrix includes a first surface and an opposite second surface. The carbon nanotubes extend from the first surface to the second surface, and their tips protrude out of at least one of the two surfaces which has a phase change material layer formed thereon. The tips elastically bend in the phase change material layer. In operation, the elastic tips of carbon nanotubes happen spring so as to form a pressure on surfaces contacting with the tips. This results in a preferable contact between the thermal interfaces and a lower heat resistance. Thus, the thermal interface material can achieve lower heat resistance and high heat-conducting efficiency even though it is subjected to a lower packing pressure.
TW94112036A 2005-04-15 2005-04-15 Thermal interface material and method of making the same TWI256877B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112036A TWI256877B (en) 2005-04-15 2005-04-15 Thermal interface material and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112036A TWI256877B (en) 2005-04-15 2005-04-15 Thermal interface material and method of making the same

Publications (2)

Publication Number Publication Date
TWI256877B TWI256877B (en) 2006-06-11
TW200637475A true TW200637475A (en) 2006-10-16

Family

ID=37614813

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112036A TWI256877B (en) 2005-04-15 2005-04-15 Thermal interface material and method of making the same

Country Status (1)

Country Link
TW (1) TWI256877B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419274B (en) * 2008-09-05 2013-12-11 Zhen Ding Technology Co Ltd Packaging substrate and packaging structure
TWI447064B (en) * 2009-08-10 2014-08-01 Hon Hai Prec Ind Co Ltd Heat sink structure and system for using the same
US10182514B2 (en) 2016-06-27 2019-01-15 International Business Machines Corporation Thermal interface material structures
US10589998B2 (en) 2013-11-05 2020-03-17 Neograf Solutions, Llc Graphite article
US11037860B2 (en) 2019-06-27 2021-06-15 International Business Machines Corporation Multi layer thermal interface material
US11774190B2 (en) 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080002755A1 (en) 2006-06-29 2008-01-03 Raravikar Nachiket R Integrated microelectronic package temperature sensor
CN102292114A (en) 2009-01-27 2011-12-21 加州理工学院 Drug delivery and substance transfer facilitated by nano-enhanced device having aligned carbon nanotubes protruding from device surface
WO2011127207A2 (en) 2010-04-07 2011-10-13 California Institute Of Technology Simple method for producing superhydrophobic carbon nanotube array
US8976507B2 (en) 2011-03-29 2015-03-10 California Institute Of Technology Method to increase the capacitance of electrochemical carbon nanotube capacitors by conformal deposition of nanoparticles
US8764681B2 (en) 2011-12-14 2014-07-01 California Institute Of Technology Sharp tip carbon nanotube microneedle devices and their fabrication

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419274B (en) * 2008-09-05 2013-12-11 Zhen Ding Technology Co Ltd Packaging substrate and packaging structure
TWI447064B (en) * 2009-08-10 2014-08-01 Hon Hai Prec Ind Co Ltd Heat sink structure and system for using the same
US10589998B2 (en) 2013-11-05 2020-03-17 Neograf Solutions, Llc Graphite article
US10182514B2 (en) 2016-06-27 2019-01-15 International Business Machines Corporation Thermal interface material structures
US10653037B2 (en) 2016-06-27 2020-05-12 International Business Machines Corporation Thermal interface material structures
US11013147B2 (en) 2016-06-27 2021-05-18 International Business Machines Corporation Thermal interface material structures
US11037860B2 (en) 2019-06-27 2021-06-15 International Business Machines Corporation Multi layer thermal interface material
US11774190B2 (en) 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions

Also Published As

Publication number Publication date
TWI256877B (en) 2006-06-11

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