TW200634937A - Method of packaging electronic components and electronic component made thereby - Google Patents
Method of packaging electronic components and electronic component made therebyInfo
- Publication number
- TW200634937A TW200634937A TW094108678A TW94108678A TW200634937A TW 200634937 A TW200634937 A TW 200634937A TW 094108678 A TW094108678 A TW 094108678A TW 94108678 A TW94108678 A TW 94108678A TW 200634937 A TW200634937 A TW 200634937A
- Authority
- TW
- Taiwan
- Prior art keywords
- packaging
- substrate
- electronic component
- electronic
- component made
- Prior art date
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A method of packaging an electronic component comprises: forming a slot in a substrate at a location adjacent to an electronic unit; positioning the substrate in a cavity of a mold where a wall of the mold cavity has a surface contour corresponding to the slot of the substrate; injecting packaging resin; and taking out and cutting the substrate to get a plurality of electronic components wherein each electronic component has a substrate on which the electronic unit is arranged and a packaging layer formed by curing of the packaging resin which has a predetermined shape defined by the surface contour.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94108678A TWI254999B (en) | 2005-03-21 | 2005-03-21 | Method of packaging electronic components and electronic component made thereby |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94108678A TWI254999B (en) | 2005-03-21 | 2005-03-21 | Method of packaging electronic components and electronic component made thereby |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI254999B TWI254999B (en) | 2006-05-11 |
TW200634937A true TW200634937A (en) | 2006-10-01 |
Family
ID=37607572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94108678A TWI254999B (en) | 2005-03-21 | 2005-03-21 | Method of packaging electronic components and electronic component made thereby |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI254999B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI451535B (en) * | 2012-02-22 | 2014-09-01 | Advanced Semiconductor Eng | Irregular-shaped semiconductor package and method for making the same |
CN112233986A (en) * | 2019-07-15 | 2021-01-15 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure and plastic packaging mold |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4861751B2 (en) * | 2006-06-07 | 2012-01-25 | 株式会社ディスコ | Memory card molding apparatus and molding method |
-
2005
- 2005-03-21 TW TW94108678A patent/TWI254999B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI451535B (en) * | 2012-02-22 | 2014-09-01 | Advanced Semiconductor Eng | Irregular-shaped semiconductor package and method for making the same |
CN112233986A (en) * | 2019-07-15 | 2021-01-15 | 矽磐微电子(重庆)有限公司 | Manufacturing method of chip packaging structure and plastic packaging mold |
Also Published As
Publication number | Publication date |
---|---|
TWI254999B (en) | 2006-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |