TW200633050A - Manufacturing method for semiconductor chips - Google Patents

Manufacturing method for semiconductor chips

Info

Publication number
TW200633050A
TW200633050A TW094145619A TW94145619A TW200633050A TW 200633050 A TW200633050 A TW 200633050A TW 094145619 A TW094145619 A TW 094145619A TW 94145619 A TW94145619 A TW 94145619A TW 200633050 A TW200633050 A TW 200633050A
Authority
TW
Taiwan
Prior art keywords
protective sheet
teg
regions
plasma etching
sticking
Prior art date
Application number
TW094145619A
Other languages
English (en)
Inventor
Kiyoshi Arita
Akira Nakagawa
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200633050A publication Critical patent/TW200633050A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW094145619A 2004-12-24 2005-12-21 Manufacturing method for semiconductor chips TW200633050A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004373022A JP4288229B2 (ja) 2004-12-24 2004-12-24 半導体チップの製造方法

Publications (1)

Publication Number Publication Date
TW200633050A true TW200633050A (en) 2006-09-16

Family

ID=36128239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145619A TW200633050A (en) 2004-12-24 2005-12-21 Manufacturing method for semiconductor chips

Country Status (9)

Country Link
US (1) US7678670B2 (zh)
EP (1) EP1831924B1 (zh)
JP (1) JP4288229B2 (zh)
KR (1) KR101153637B1 (zh)
CN (1) CN100499073C (zh)
AT (1) ATE432532T1 (zh)
DE (1) DE602005009026D1 (zh)
TW (1) TW200633050A (zh)
WO (1) WO2006068284A1 (zh)

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US9299664B2 (en) * 2010-01-18 2016-03-29 Semiconductor Components Industries, Llc Method of forming an EM protected semiconductor die
US20110175209A1 (en) * 2010-01-18 2011-07-21 Seddon Michael J Method of forming an em protected semiconductor die
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Also Published As

Publication number Publication date
KR101153637B1 (ko) 2012-06-18
JP2006179768A (ja) 2006-07-06
WO2006068284A1 (en) 2006-06-29
US20070264832A1 (en) 2007-11-15
US7678670B2 (en) 2010-03-16
ATE432532T1 (de) 2009-06-15
CN100499073C (zh) 2009-06-10
CN101040376A (zh) 2007-09-19
DE602005009026D1 (de) 2011-03-17
JP4288229B2 (ja) 2009-07-01
KR20070089122A (ko) 2007-08-30
EP1831924B1 (en) 2009-05-27
EP1831924A1 (en) 2007-09-12

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