TW200630623A - Electrical inspection device for flexible printed board - Google Patents

Electrical inspection device for flexible printed board

Info

Publication number
TW200630623A
TW200630623A TW094141163A TW94141163A TW200630623A TW 200630623 A TW200630623 A TW 200630623A TW 094141163 A TW094141163 A TW 094141163A TW 94141163 A TW94141163 A TW 94141163A TW 200630623 A TW200630623 A TW 200630623A
Authority
TW
Taiwan
Prior art keywords
flexible printed
printed board
resistance
inspection device
electrical inspection
Prior art date
Application number
TW094141163A
Other languages
Chinese (zh)
Other versions
TWI279560B (en
Inventor
Kazuo Inoue
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200630623A publication Critical patent/TW200630623A/en
Application granted granted Critical
Publication of TWI279560B publication Critical patent/TWI279560B/en

Links

Landscapes

  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The tint crack on the bottom of assembling the part can be detected without damaging the flexible printed board. The solution method provides the electrical inspection device (10) for the flexible printed board (30) which includes the top (11) and bottom (12) bases. Between them, the concave window (13) which set up the pressure modified structure (14) on the top base (11). The resistance inspection apparatus (19) can be used to measure the resistance of conductor pattern on the above flexible printed board (30). The absorbed pump (17) of the pressure modified structure (14) can generate the deformation condition in the flexible printed board (30) protrusion to concave window (13). The tint cracks can be available due to the resistance increasing used from the resistance inspection apparatus (19) while the gap of the cracks can be widen and deformed due to pressure.
TW94141163A 2005-02-14 2005-11-23 Electrical inspection device for flexible printed board TWI279560B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005035776A JP4659479B2 (en) 2005-02-14 2005-02-14 Electrical inspection device for flexible printed circuit board

Publications (2)

Publication Number Publication Date
TW200630623A true TW200630623A (en) 2006-09-01
TWI279560B TWI279560B (en) 2007-04-21

Family

ID=36923241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94141163A TWI279560B (en) 2005-02-14 2005-11-23 Electrical inspection device for flexible printed board

Country Status (3)

Country Link
JP (1) JP4659479B2 (en)
CN (1) CN1821766B (en)
TW (1) TWI279560B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5839986B2 (en) * 2011-12-26 2016-01-06 日産自動車株式会社 Inspection method and inspection system
CN104076235A (en) * 2013-03-27 2014-10-01 深圳市海洋王照明工程有限公司 Method of detecting open circuit of printed line of PCB
WO2016076671A1 (en) * 2014-11-13 2016-05-19 세종대학교산학협력단 Method and apparatus for testing flexible element

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211568A (en) * 1986-03-12 1987-09-17 Hitachi Ltd Conduction testing device for wiring circuit board
JP2542685B2 (en) * 1988-09-09 1996-10-09 凸版印刷株式会社 Printed wiring board loading device
JPH03262980A (en) * 1990-03-13 1991-11-22 Fujitsu Ltd Defective position detecting device for printed board
JPH0720187A (en) * 1993-06-30 1995-01-24 Matsukueito:Kk Substrate inspection instrument
US5442299A (en) * 1994-01-06 1995-08-15 International Business Machines Corporation Printed circuit board test fixture and method
JP3717578B2 (en) * 1996-01-25 2005-11-16 日置電機株式会社 Method of determining the presence or absence of poor connection leads by the four-terminal measurement method
DE10108050C1 (en) * 2001-02-20 2002-10-10 Siemens Ag Test arrangement for electronic units has mechanical drive for moving first plate towards second to bring contact points in contact with needles, vacuum chamber, seal and vacuum pump
CN100356183C (en) * 2002-07-23 2007-12-19 井上商事株式会社 Checking tool for printed circuit-board
CN2590006Y (en) * 2002-12-05 2003-12-03 曾家棠 Environment protective printed circuit board testing equipment
JP4067991B2 (en) * 2003-03-07 2008-03-26 日本メクトロン株式会社 Printed circuit board continuity testing device with surface mount components
CN2629046Y (en) * 2003-05-26 2004-07-28 系新科技股份有限公司 Element tester for printed circuit board

Also Published As

Publication number Publication date
TWI279560B (en) 2007-04-21
CN1821766B (en) 2010-11-17
JP4659479B2 (en) 2011-03-30
CN1821766A (en) 2006-08-23
JP2006220590A (en) 2006-08-24

Similar Documents

Publication Publication Date Title
ATE371196T1 (en) DEVICE FOR AN INTERFACE BETWEEN ELECTRONIC HOUSINGS AND TEST DEVICES
IL159009A0 (en) Methods and apparatus for semiconductor testing
EP1553621A4 (en) Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method
SG126025A1 (en) Method and apparatus for a twisting fixture probe for probing test access point structures
EP1965422A4 (en) Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
TW200642027A (en) Probe assembly, method of producing it and electrical connecting apparatus
WO2007079006A3 (en) Connection verification technique
TW200606444A (en) Electronic test device
SG158795A1 (en) Electrical testing apparatus for testing an electrical test sample and electrical testing method
TW200702665A (en) Socket for inspection apparatus
EP1608040A4 (en) Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
WO2004040324A3 (en) A method of and apparatus for testing for integrated circuit contact defects
EP1637893A4 (en) Method and apparatus for testing electrical characteristics of object under test
WO2008071541A3 (en) Module for a test device for testing circuit boards
TW200724945A (en) Aparatus and methods for testing integrated circuit and methods for making tester
TW200617410A (en) Semiconductor wafer and inspection method thereof
WO2008139579A1 (en) Electronic part testing apparatus, electronic part testing system and method of testing electronic part
EP2743708A3 (en) Testing device and testing method thereof
ATE521221T1 (en) DEVICE AND METHOD FOR MOUNTING ELECTRIC CIRCUIT BOARDS USING CONTACT PINS
DK1369958T3 (en) Must be for surface mounted, electrical connector and connector with same
TW200630623A (en) Electrical inspection device for flexible printed board
ATE551883T1 (en) ELECTRONIC APPARATUS AND METHOD FOR INSPECTING A CIRCUIT BOARD
DE602006008173D1 (en) COMPONENT DESIGNED FOR MOUNTING ON A SUBSTRATE AND METHOD FOR ATTACHING A SURFACE APPLIED ARRANGEMENT
TW200508615A (en) Electronic component test apparatus
TW200709316A (en) Substrate and testing method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees