TW200629008A - Liquid removing apparatus, exposure apparatus and device manufacturing method - Google Patents

Liquid removing apparatus, exposure apparatus and device manufacturing method

Info

Publication number
TW200629008A
TW200629008A TW095101859A TW95101859A TW200629008A TW 200629008 A TW200629008 A TW 200629008A TW 095101859 A TW095101859 A TW 095101859A TW 95101859 A TW95101859 A TW 95101859A TW 200629008 A TW200629008 A TW 200629008A
Authority
TW
Taiwan
Prior art keywords
liquid removing
device manufacturing
removing apparatus
exposure apparatus
substrate
Prior art date
Application number
TW095101859A
Other languages
English (en)
Inventor
Takeyuki Mizutani
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200629008A publication Critical patent/TW200629008A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW095101859A 2005-01-18 2006-01-18 Liquid removing apparatus, exposure apparatus and device manufacturing method TW200629008A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005010093 2005-01-18

Publications (1)

Publication Number Publication Date
TW200629008A true TW200629008A (en) 2006-08-16

Family

ID=36692248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101859A TW200629008A (en) 2005-01-18 2006-01-18 Liquid removing apparatus, exposure apparatus and device manufacturing method

Country Status (6)

Country Link
US (1) US20080165330A1 (zh)
EP (1) EP1843386A1 (zh)
JP (1) JPWO2006077859A1 (zh)
KR (1) KR20070095270A (zh)
TW (1) TW200629008A (zh)
WO (1) WO2006077859A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101539517B1 (ko) * 2005-12-08 2015-07-24 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR20080026499A (ko) * 2006-09-20 2008-03-25 캐논 가부시끼가이샤 기판보유장치
US8889042B2 (en) 2008-02-14 2014-11-18 Asml Netherlands B.V. Coatings
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
WO2010094802A1 (en) 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Preparation unit for lithogrpahy machine
KR20120108229A (ko) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 레이저 가공용 워크 테이블
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
WO2014097510A1 (ja) * 2012-12-20 2014-06-26 キヤノンアネルバ株式会社 磁気抵抗効果素子の製造方法
WO2015043890A1 (en) 2013-09-27 2015-04-02 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US9798253B2 (en) 2014-04-30 2017-10-24 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
CN110068991B (zh) 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
WO2017137129A1 (en) 2016-02-08 2017-08-17 Asml Netherlands B.V. Lithographic apparatus, method for unloading a substrate and method for loading a substrate
CN118098939A (zh) * 2016-03-22 2024-05-28 Ev 集团 E·索尔纳有限责任公司 用于衬底的接合的装置和方法
WO2019072504A1 (en) 2017-10-12 2019-04-18 Asml Netherlands B.V. SUBSTRATE CARRIER FOR USE IN A LITHOGRAPHIC APPARATUS
US11081383B2 (en) 2017-11-24 2021-08-03 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate table with vacuum channels grid

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JPH08316124A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
WO1998028665A1 (en) * 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
CN101424881B (zh) * 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
EP1571694A4 (en) * 2002-12-10 2008-10-15 Nikon Corp EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
KR101520591B1 (ko) * 2003-06-13 2015-05-14 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
KR101380989B1 (ko) * 2003-08-29 2014-04-04 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR20060126949A (ko) * 2003-10-08 2006-12-11 가부시키가이샤 니콘 기판 반송 장치와 기판 반송 방법, 노광 장치와 노광 방법,및 디바이스 제조 방법
JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
KR101771334B1 (ko) * 2004-12-15 2017-08-24 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조방법

Also Published As

Publication number Publication date
EP1843386A1 (en) 2007-10-10
US20080165330A1 (en) 2008-07-10
WO2006077859A1 (ja) 2006-07-27
KR20070095270A (ko) 2007-09-28
JPWO2006077859A1 (ja) 2008-06-19

Similar Documents

Publication Publication Date Title
TW200629008A (en) Liquid removing apparatus, exposure apparatus and device manufacturing method
SG148015A1 (en) Lithographic apparatus and device manufacturing method
TW200725727A (en) Substrate processing method and substrate processing apparatus
TW200613208A (en) Apparatus and method for carrying substrate and exposing apparatus
WO2006083928A3 (en) Apparatus and method for modifying an object
TW200615712A (en) Removing apparatus, protective film forming apparatus, substrate processing system and removing method
MY146842A (en) Supply mechanism for the chuck of an integrated circuit dicing device
HK1164543A1 (zh) 基板保持裝置、具備其之曝光裝置及方法、元件製造方法
WO2007120276A3 (en) An apparatus and a method for cleaning a dielectric film
TW200706307A (en) Semiconductor wafer peripheral edge polisher and method therefor
TW200740989A (en) Semiconductor wafer cleaning solution, method for cleaning a semiconductor wafer and method for forming an interconnect structure of an integrated circuit
GB2434687B (en) Thin film transistor array substrate system and method for manufacturing
SG143284A1 (en) Lithographic apparatus and device manufacturing method
TW200632590A (en) Immersion liquid, exposure apparatus, and exposure process
SG143125A1 (en) Chromium-free etching solution for si-substrates and sige-substrates, method for revealing defects using the etching solution and process for treating si-substrates and sige-substrates using the etching solution
TW200715461A (en) Method for thinning substrate and method for manufacturing circuit device
TW200631679A (en) Method and device for treating substrates and corresponding nozzle unit
TW200801857A (en) Photoresist stripping liquid and method for processing substrate using the liquid
AU2003228226A8 (en) An improved substrate holder for plasma processing
TW200705117A (en) Measuring apparatus, exposure apparatus, and device manufacturing method
TWI370504B (en) Electrostatic chuck, substrate processing apparatus having the same, and substrate processing method using the same
MY152144A (en) System and method for deposition of a material on a substrate
IL188297A0 (en) Exposure apparatus, substrate processing method and device producing method
TW200727351A (en) A system and method for removing particles in semiconductor manufacturing
EP1800330A4 (en) SYSTEM AND METHOD FOR LASER PROCESSING OF A SEMICONDUCTOR SUBSTRATE