TW200628536A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
TW200628536A
TW200628536A TW094141311A TW94141311A TW200628536A TW 200628536 A TW200628536 A TW 200628536A TW 094141311 A TW094141311 A TW 094141311A TW 94141311 A TW94141311 A TW 94141311A TW 200628536 A TW200628536 A TW 200628536A
Authority
TW
Taiwan
Prior art keywords
curable resin
resin composition
groups
composition
cured product
Prior art date
Application number
TW094141311A
Other languages
English (en)
Other versions
TWI378962B (zh
Inventor
Motoyuki Takada
Eiichi Hayashi
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW200628536A publication Critical patent/TW200628536A/zh
Application granted granted Critical
Publication of TWI378962B publication Critical patent/TWI378962B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F287/00—Macromolecular compounds obtained by polymerising monomers on to block polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/006—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to block copolymers containing at least one sequence of polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D153/00—Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D153/02—Vinyl aromatic monomers and conjugated dienes
    • C09D153/025—Vinyl aromatic monomers and conjugated dienes modified
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
TW094141311A 2004-11-30 2005-11-24 Curable resin composition TW200628536A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004346792 2004-11-30
JP2004346793 2004-11-30

Publications (2)

Publication Number Publication Date
TW200628536A true TW200628536A (en) 2006-08-16
TWI378962B TWI378962B (zh) 2012-12-11

Family

ID=36565179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141311A TW200628536A (en) 2004-11-30 2005-11-24 Curable resin composition

Country Status (5)

Country Link
US (1) US20080004367A1 (zh)
JP (1) JP5098335B2 (zh)
KR (1) KR101021048B1 (zh)
TW (1) TW200628536A (zh)
WO (1) WO2006059750A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450666B (zh) * 2007-11-22 2014-08-21 Ajinomoto Kk 多層印刷配線板之製造方法及多層印刷配線板
KR101694138B1 (ko) 2009-01-19 2017-01-09 아지노모토 가부시키가이샤 수지 조성물
CN101698896B (zh) * 2009-09-28 2013-01-30 南京理工大学 炉口辐射信息融合用于炼钢在线终点控制的方法
KR101746270B1 (ko) * 2011-10-31 2017-06-12 도오꾜오까고오교 가부시끼가이샤 웨이퍼와 당해 웨이퍼의 지지체를 접착하기 위한 접착제 조성물, 및 그 이용
CN106519740B (zh) * 2012-10-26 2019-01-11 比亚迪股份有限公司 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品
JP5854062B2 (ja) 2014-02-03 2016-02-09 住友ベークライト株式会社 熱伝導性シートおよび半導体装置
CN105093828B (zh) * 2014-05-09 2019-11-05 太阳油墨制造株式会社 固化性树脂组合物、干膜以及印刷电路板
JP6502733B2 (ja) * 2014-05-09 2019-04-17 太陽インキ製造株式会社 ソルダーレジスト形成用硬化性樹脂組成物、ドライフィルムおよびプリント配線板
JP6742785B2 (ja) * 2015-08-13 2020-08-19 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板
JP6651760B2 (ja) * 2015-09-18 2020-02-19 味の素株式会社 プリント配線板の製造方法
JP7427455B2 (ja) * 2015-09-18 2024-02-05 味の素株式会社 接着フィルム、プリント配線板及び半導体装置
WO2018111337A1 (en) 2016-12-16 2018-06-21 Novoset, Llc Resin compositions
JP7452560B2 (ja) * 2020-01-22 2024-03-19 味の素株式会社 プリント配線板の製造方法
WO2022207741A1 (en) * 2021-03-31 2022-10-06 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Low dielectric resin composition and an article of manufacture prepared therefrom
CN117377707A (zh) * 2021-05-17 2024-01-09 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
WO2024041995A1 (en) * 2022-08-26 2024-02-29 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Ultra-low loss hydrocarbon resin composition
WO2024048727A1 (ja) * 2022-08-31 2024-03-07 富士フイルム株式会社 積層体、フィルム、熱硬化性フィルム、及び、配線基板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2848131B2 (ja) * 1992-06-17 1999-01-20 日立電線株式会社 キャリアテープ
JP3652338B2 (ja) 1998-02-27 2005-05-25 株式会社オプトウエア 光情報記録装置
US6627704B2 (en) * 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
JP3618290B2 (ja) * 2000-10-20 2005-02-09 Ｔｄｋ株式会社 硬化性ポリビニルベンジルエーテル樹脂組成物
WO2002054420A1 (fr) * 2000-12-28 2002-07-11 Tdk Corporation Carte de circuit imprime laminee, procede de production d'une piece electronique et piece electronique laminee
JP4467816B2 (ja) * 2001-02-27 2010-05-26 株式会社日立製作所 低誘電正接樹脂組成物、硬化性フィルム、硬化物およびそれを用いた電気部品とその製法
US20040106758A1 (en) * 2001-04-09 2004-06-03 Shouji Nishiguchi Curable polyvinylbenzyl compound and process for producing the same
JP3615742B2 (ja) 2002-03-25 2005-02-02 昭和高分子株式会社 硬化性ビニルベンジル化合物およびその製造方法
US20050129895A1 (en) * 2002-05-27 2005-06-16 Ajinomoto Co., Inc. Adhesive film and prepreg
JP2004059741A (ja) 2002-07-29 2004-02-26 Asahi Kasei Chemicals Corp 共重合体及びその組成物
JP3985633B2 (ja) * 2002-08-26 2007-10-03 株式会社日立製作所 低誘電正接絶縁材料を用いた高周波用電子部品
JP2005041914A (ja) * 2003-07-23 2005-02-17 Hitachi Ltd ゴム成分を含む樹脂組成物及びそれを用いたフィルムと電気部品

Also Published As

Publication number Publication date
WO2006059750A1 (ja) 2006-06-08
KR20070100263A (ko) 2007-10-10
TWI378962B (zh) 2012-12-11
KR101021048B1 (ko) 2011-03-15
US20080004367A1 (en) 2008-01-03
JPWO2006059750A1 (ja) 2008-06-05
JP5098335B2 (ja) 2012-12-12

Similar Documents

Publication Publication Date Title
TW200628536A (en) Curable resin composition
TW200600562A (en) An anisotropic conductive adhesive and an adhesive film using the same
TW200621896A (en) Anisotropic conductive film forming composition
EP3369297B1 (en) A conductive composition for low frequency emi shielding
WO2010144792A9 (en) Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
WO2008133253A1 (ja) 異方導電性フィルム及び接続構造体
ATE551380T1 (de) Beschichtungszusammensetzung für dielektrisch isolierenden film, daraus hergestellter dielektrisch isolierender film und davon gebrauch machende elektrische oder elektronische vorrichtung
TWI370058B (en) Hardener composition for epoxy resins
AU2003301714A1 (en) Conductive thermoplastic composites and methods of making
TW200624503A (en) Thermosetting resin composition, thermosetting film, cured product thereof, and electronic parts
TW200706593A (en) Molding composition and method, and molded article
TW200719359A (en) Anisotropic conductive adhesive
TW200702374A (en) Electrically conducting curable resin composition, cured product thereof and molded article of the same
TW201708482A (en) Conductive adhesive composition, conductive adhesive film, bonding method, and circuit board
WO2009034966A1 (ja) 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物
MY132559A (en) Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
TW200740922A (en) Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
TW200631240A (en) Insulation-coated electroconductive particles
TW200602420A (en) Thermosetting resin compositions
WO2008133211A1 (ja) 熱伝導性コンパウンドおよびその製造方法
JPWO2018173945A1 (ja) 回路基板用樹脂組成物とそれを用いた金属ベース回路基板
PL350766A1 (en) Coating composition for metallic conductors and coating method using same
KR101385032B1 (ko) 이방 전도성 필름 조성물 및 이로부터 제조된 이방 전도성 필름
KR100894401B1 (ko) 우수한 유변특성 및 소수성을 갖는 이방 전도성 필름　및그 조성물

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees