TW200627066A - Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and semiconductor device - Google Patents

Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and semiconductor device

Info

Publication number
TW200627066A
TW200627066A TW094141918A TW94141918A TW200627066A TW 200627066 A TW200627066 A TW 200627066A TW 094141918 A TW094141918 A TW 094141918A TW 94141918 A TW94141918 A TW 94141918A TW 200627066 A TW200627066 A TW 200627066A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
semiconductor device
wiring board
printed wiring
Prior art date
Application number
TW094141918A
Other languages
Chinese (zh)
Inventor
Toshimasa Nagoshi
Yasuharu Murakami
Katsunori Tsuchiya
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200627066A publication Critical patent/TW200627066A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)

Abstract

Disclosed is a photosensitive resin composition containing a polymer (A) having a carboxyl group, a hexaarylbiimidazole compound (B) having no halogen atom, a hydrogen-donating compound (C), and a photopolymerizable compound (D) having an acryl group or a methacryl group. The photosensitive resin composition is able to satisfy sufficiently high photosensitivity and sufficiently high resolution at the same time even though the components such as the photopolymerization initiator do not contain a halogen atom. In addition, the photosensitive resin composition enables to obtain a cured product having sufficiently excellent solder heat resistance.
TW094141918A 2004-11-29 2005-11-29 Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and semiconductor device TW200627066A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004344708 2004-11-29

Publications (1)

Publication Number Publication Date
TW200627066A true TW200627066A (en) 2006-08-01

Family

ID=36498118

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141918A TW200627066A (en) 2004-11-29 2005-11-29 Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and semiconductor device

Country Status (3)

Country Link
JP (1) JPWO2006057385A1 (en)
TW (1) TW200627066A (en)
WO (1) WO2006057385A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101107565A (en) * 2005-01-17 2008-01-16 富士胶片株式会社 Pattern forming material, pattern forming apparatus and permanent pattern forming method
JP2007334324A (en) * 2006-05-18 2007-12-27 Mitsubishi Chemicals Corp Curable composition, cured product, color filter and liquid crystal display device
JP5050707B2 (en) * 2006-10-18 2012-10-17 日立化成工業株式会社 Photosensitive resin composition and photosensitive film
US7833692B2 (en) 2007-03-12 2010-11-16 Brewer Science Inc. Amine-arresting additives for materials used in photolithographic processes
JP5050683B2 (en) * 2007-06-25 2012-10-17 日立化成工業株式会社 Photosensitive resin composition and photosensitive element using the same
JP4924241B2 (en) * 2007-06-28 2012-04-25 日立化成工業株式会社 Photosensitive resin composition and photosensitive element using the same
JP4998293B2 (en) * 2008-01-31 2012-08-15 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display element
JP5615512B2 (en) * 2009-04-27 2014-10-29 日東電工株式会社 Photosensitive resin composition, flexible circuit board using the same, and method for producing the circuit board
JP5556990B2 (en) * 2009-06-04 2014-07-23 日立化成株式会社 Photosensitive resin composition and photosensitive element
JP2011043565A (en) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd Photosetting resin composition
JP5625721B2 (en) * 2010-10-15 2014-11-19 日立化成株式会社 Photosensitive resin composition and photosensitive element using the same
JP5731961B2 (en) * 2011-12-05 2015-06-10 三菱製紙株式会社 Etching method
JP5768745B2 (en) * 2012-03-08 2015-08-26 日立化成株式会社 Adhesive comprising photosensitive resin composition
KR101611836B1 (en) * 2015-01-13 2016-04-12 동우 화인켐 주식회사 Photosensitive resin comopsition, photocurable pattern formed from the same and image display comprising the pattern
JP5951820B2 (en) * 2015-02-18 2016-07-13 太陽ホールディングス株式会社 Photocurable resin composition
CN117369212A (en) * 2015-04-03 2024-01-09 三菱制纸株式会社 Photosensitive resin composition and etching method
JP6785551B2 (en) 2015-04-03 2020-11-18 三菱製紙株式会社 Etching method
JP6062583B2 (en) * 2016-01-25 2017-01-18 旭化成株式会社 Photopolymerizable resin composition
JP6958189B2 (en) * 2017-09-28 2021-11-02 昭和電工マテリアルズ株式会社 A photosensitive resin composition, a photosensitive element using the same, a method for forming a resist pattern, a solder resist, an interlayer insulating film, a method for forming an interlayer insulating film, a method for manufacturing a printed wiring board, and a printed wiring board.
JP6958188B2 (en) * 2017-09-28 2021-11-02 昭和電工マテリアルズ株式会社 A photosensitive resin composition, a photosensitive element using the same, a method for forming a resist pattern, a solder resist, an interlayer insulating film, a method for forming an interlayer insulating film, a method for manufacturing a printed wiring board, and a printed wiring board.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2033821A1 (en) * 1990-01-12 1991-07-13 Evan D. Laganis Photopolymerizable compositions sensitive to longer wavelength visible actinic radiation
JPH08157744A (en) * 1994-12-12 1996-06-18 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element produced therefrom
JP4058656B2 (en) * 1998-09-17 2008-03-12 日立化成デュポンマイクロシステムズ株式会社 Photosensitive polyimide precursor composition and pattern production method using the same
JP4348763B2 (en) * 1999-02-26 2009-10-21 日立化成デュポンマイクロシステムズ株式会社 Hexaarylbiimidazole compound, photosensitive composition using the same, method for producing pattern, and electronic component
JP2002202597A (en) * 2000-12-28 2002-07-19 Showa Denko Kk Photosensitive resin composition and wiring substrate
JP2004317850A (en) * 2003-04-17 2004-11-11 Hitachi Chem Co Ltd Photosensitive resin composition, and photosensitive element, method for manufacturing resist pattern and method for manufacturing printed wiring board using the same

Also Published As

Publication number Publication date
JPWO2006057385A1 (en) 2008-06-05
WO2006057385A1 (en) 2006-06-01

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