JPH08157744A - Photosensitive resin composition and photosensitive element produced therefrom - Google Patents
Photosensitive resin composition and photosensitive element produced therefromInfo
- Publication number
- JPH08157744A JPH08157744A JP6306762A JP30676294A JPH08157744A JP H08157744 A JPH08157744 A JP H08157744A JP 6306762 A JP6306762 A JP 6306762A JP 30676294 A JP30676294 A JP 30676294A JP H08157744 A JPH08157744 A JP H08157744A
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- Japan
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- weight
- meth
- resin composition
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- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、感光性樹脂組成物及び
これを用いた感光性エレメントに関する。FIELD OF THE INVENTION The present invention relates to a photosensitive resin composition and a photosensitive element using the same.
【０００２】[0002]
【従来の技術】従来、印刷配線板の製造、金属の精密加
工等の分野において、エッチング、めっきなどに用いら
れるレジスト材料としては、感光性樹脂組成物及び感光
性フィルムが広く用いられている。また、印刷配線板の
製造法としては、近年印刷配線板が高密度化し、パター
ンが細線化しているため、めっき法が主流になりつつあ
る。2. Description of the Related Art Conventionally, photosensitive resin compositions and photosensitive films have been widely used as resist materials used for etching, plating and the like in the fields of manufacturing printed wiring boards and precision processing of metals. In addition, as a method of manufacturing a printed wiring board, the plating method is becoming the mainstream because the density of the printed wiring board has been increasing and the pattern has been thinned in recent years.
【０００３】このめっき法は、チップ搭載のためのスル
ーホール及び電気回路を除いてレジストを被覆し、電気
めっきによりスルーホール及び電気回路を作成し、その
後、レジスト剥離、エッチングによって電気回路の作製
を行う方法である。めっき法におけるめっき液として
は、ピロリン酸銅、硫酸銅、はんだ、ニッケル、パラジ
ウム、金などが用いられるが、電気回路の作製に硫酸銅
を用い、その保護のためはんだを用いることが一般的で
ある。In this plating method, the resist is covered except for the through holes and the electric circuits for mounting the chips, the through holes and the electric circuits are formed by electroplating, and then the electric circuits are prepared by removing the resist and etching. Is the way to do it. As the plating solution in the plating method, copper pyrophosphate, copper sulfate, solder, nickel, palladium, gold, etc. are used, but it is common to use copper sulfate for the production of electric circuits and use solder for its protection. is there.
【０００４】これらのめっきの際、感光性樹脂組成物及
び感光性エレメントからめっき液中へ溶け出す光開始剤
の種類によっては、硫酸銅めっきの析出が充分でなかっ
たり、保護層のはんだめっきの錫／鉛比率が目的比率か
ら大きく偏倚してくることが知られている。この合金比
率の偏倚によりレジスト剥離の際の半田溶解、エッチン
グ時の下地銅の線細りなどの問題が発生する。During these platings, depending on the type of photoinitiator that dissolves from the photosensitive resin composition and the photosensitive element into the plating solution, the copper sulfate plating may not be sufficiently deposited, or the solder plating of the protective layer may be difficult. It is known that the tin / lead ratio deviates greatly from the target ratio. Due to this deviation of the alloy ratio, problems such as solder melting at the time of resist stripping and line thinning of the underlying copper during etching occur.
【０００５】従来のめっき法で用いていた感光性樹脂組
成物及び感光性エレメントは、めっき液中へ溶出する光
開始剤の量を少なくするために、感光性樹脂組成物に含
有させる光開始剤の量を少なくしたものであり、光感度
が低いものであった。The photosensitive resin composition and the photosensitive element used in the conventional plating method are contained in the photosensitive resin composition in order to reduce the amount of the photoinitiator eluted into the plating solution. The light sensitivity was low.
【０００６】これらの問題を改善させるため、特公平６
−２９２８５号公報にはヘキサアリールイミダゾールと
下記一般式（II）To improve these problems, Japanese Patent Publication No.
-29285 discloses hexaarylimidazole and the following general formula (II)
【化２】 （式中、Ｒ2及びＲ3はアルキル基を示し、ｎは１、２又
は３であり、環Ａは含窒素芳香環を示す）で表される化
合物の使用が提案されているが、現像後のレジストのパ
ターン幅が太り、めっきで形成される回路幅が細くなる
という問題が発生する。また、露光量を低下させれば、
線幅は細くなるが、硬化が不充分なため、めっきもぐり
の問題が発生する。Embedded image (Wherein R 2 and R 3 represent an alkyl group, n is 1, 2 or 3, and ring A represents a nitrogen-containing aromatic ring), it is proposed to use a compound represented by There arises a problem that the pattern width of the subsequent resist becomes thick and the circuit width formed by plating becomes thin. Also, if the exposure amount is reduced,
Although the line width becomes narrower, the problem of plating chipping occurs due to insufficient curing.
【０００７】[0007]
【発明が解決しようとする課題】本発明は、前記した従
来の技術の問題点を解決し、レジストの線幅が太らず光
感度が高く、しかも光開始剤のめっき液への溶出がほと
んどないため、めっき液の汚染が少ない感光性樹脂組成
物及び感光性エレメントを提供するものである。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, the resist line width is not thick, the photosensitivity is high, and the photoinitiator is hardly eluted into the plating solution. Therefore, the present invention provides a photosensitive resin composition and a photosensitive element in which the plating solution is less contaminated.
【０００８】[0008]
【課題を解決するための手段】本発明は、（Ａ）カルボ
キシル基を有するポリマー４０〜８０重量部、（Ｂ）少
なくとも１つの不飽和結合を有し、重合可能な化合物２
０〜６０重量部（(Ａ)と(Ｂ)との総量が１００重量部と
なるようにする）、（Ｃ）一般式（Ｉ）DISCLOSURE OF THE INVENTION The present invention provides a polymerizable compound (A) 40 to 80 parts by weight of a polymer having a carboxyl group, and (B) a polymerizable compound 2 having at least one unsaturated bond.
0 to 60 parts by weight (so that the total amount of (A) and (B) is 100 parts by weight), (C) general formula (I)
【化３】 （式中、Ｒ1は炭素原子数６〜１２のアルキレン基を示
す）で表される光開始剤を０．０５〜１重量部（前記
(Ａ)と(Ｂ)との総量１００重量部に対して）及び（Ｄ）
ヘキサアリールビイミダゾールを０．１〜３．０重量部
（前記(Ａ)と(Ｂ)との総量１００重量部に対して）を含
有する感光性樹脂組成物並びに支持体フィルム上に前記
感光性樹脂組成物の層を積層してなる感光性エレメント
に関する。Embedded image (Wherein R 1 represents an alkylene group having 6 to 12 carbon atoms) in an amount of 0.05 to 1 part by weight (as described above).
(Based on 100 parts by weight of (A) and (B)) and (D)
A photosensitive resin composition containing 0.1 to 3.0 parts by weight of hexaarylbiimidazole (based on the total amount of 100 parts by weight of (A) and (B)) and the above-mentioned photosensitive material on a support film. The present invention relates to a photosensitive element formed by laminating layers of a resin composition.
【０００９】次に本発明の感光性樹脂組成物に含まれる
成分について詳述する。本発明に（Ａ）成分として用い
られるカルボキシル基を有するポリマーとしては、例え
ば、（メタ）アクリル酸アルキルエステル〔（メタ）ア
クリル酸とはメタクリル酸及びアクリル酸を意味する。
以下同じ〕と（メタ）アクリル酸とこれらと共重合しう
るビニルモノマーとの共重合体等が挙げられる。これら
の共重合体は、単独で又は２種類以上を組み合わせて使
用される。Next, the components contained in the photosensitive resin composition of the present invention will be described in detail. Examples of the polymer having a carboxyl group used as the component (A) in the present invention include (meth) acrylic acid alkyl ester [(meth) acrylic acid means methacrylic acid and acrylic acid.
The same shall apply hereinafter] and a copolymer of (meth) acrylic acid and a vinyl monomer copolymerizable therewith, and the like. These copolymers are used alone or in combination of two or more.
【００１０】（メタ）アクリル酸アルキルエステルとし
ては、例えば、（メタ）アクリル酸メチルエステル、
（メタ）アクリル酸エチルエステル、（メタ）アクリル
酸ブチルエステル、（メタ）アクリル酸２−エチルヘキ
シルエステル等が挙げられる。また、（メタ）アクリル
酸アルキルエステルや（メタ）アクリル酸と共重合しう
るビニルモノマーとしては、例えば、（メタ）アクリル
酸テトラヒドロフルフリルエステル、（メタ）アクリル
酸ジメチルアミノエチルエステル、（メタ）アクリル酸
ジエチルアミノエチルエステル、メタクリル酸グリシジ
ルエステル、２，２，２−トリフルオロエチル（メタ）
アクリレート、２，２，３，３−テトラフルオロプロピ
ル（メタ）アクリレートアクリルアミド、ジアセトンア
クリルアミド、スチレン、ビニルトルエン等が挙げられ
る。Examples of the (meth) acrylic acid alkyl ester include (meth) acrylic acid methyl ester,
(Meth) acrylic acid ethyl ester, (meth) acrylic acid butyl ester, (meth) acrylic acid 2-ethylhexyl ester and the like can be mentioned. Examples of vinyl monomers copolymerizable with (meth) acrylic acid alkyl ester and (meth) acrylic acid include (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) Acrylic acid diethylaminoethyl ester, methacrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth)
Acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate acrylamide, diacetone acrylamide, styrene, vinyltoluene and the like can be mentioned.
【００１１】本発明に（Ｂ）成分として用いられる少な
くとも１個の不飽和結合を有し、重合可能な化合物とし
ては、例えば、多価アルコール（ポリエチレングリコー
ルジ（メタ）アクリレート（エチレン基の数が２〜１４
のもの）、トリメチロールプロパンジ（メタ）アクリレ
ート、トリメチロールプロパントリ（メタ）アクリレー
ト、トリメチロールプロパンエトキシトリ（メタ）アク
リレート、トリメチロールプロパンプロポキシトリ（メ
タ）アクリレート、テトラメチロールメタントリ（メ
タ）アクリレート、テトラメチロールメタンテトラ（メ
タ）アクリレート、ポリプロピレングリコールジ（メ
タ）アクリレート（プロピレン基の数が２〜１４のも
の）、ジペンタエリスリトールペンタ（メタ）アクリレ
ート、ジペンタエリスリトールヘキサ（メタ）アクリレ
ート等）にα、β−不飽和カルボン酸を反応させて得ら
れる化合物、グリシジル基含有化合物（ビスフェノール
Ａジオキシエチレンジ（メタ）アクリレート、ビスフェ
ノールＡトリオキシエチレンジ（メタ）アクリレート、
ビスフェノールＡデカオキシエチレンジ（メタ）アクリ
レート等のビスフェノールＡジオキシエチレンジ（メ
タ）アクリレート、トリメチロールプロパントリグリシ
ジルエーテルトリアクリルレート、ビスフェノールＡジ
グリシジルエーテルアクリレート等）にα、β−不飽和
カルボン酸を付加して得られる化合物、多価カルボン酸
（無水フタル酸等）と水酸基及びエチレン性不飽和基を
有する物質（β−ヒドロキシエチル（メタ）アクリレー
ト等）とのエステル化物、（メタ）アクリル酸のアルキ
ルエステル（（メタ）アクリル酸メチルエステル、（メ
タ）アクリル酸エチルエステル、（メタ）アクリル酸ブ
チルエステル、（メタ）アクリル酸２−エチルヘキシル
エステル等）、ウレタン（メタ）アクリレート（トリレ
ンジイソシアネートと２−ヒドロキシエチル（メタ）ア
クリル酸エステルとの反応物、トリメチルヘキサメチレ
ンジイソシアネートとシクロヘキサンジメタノールと２
−ヒドロキシエチル（メタ）アクリル酸エステルとの反
応物等）などが挙げられる。The polymerizable compound having at least one unsaturated bond used as the component (B) in the present invention is, for example, a polyhydric alcohol (polyethylene glycol di (meth) acrylate (having a number of ethylene groups). 2-14
), Trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate, trimethylolpropane propoxytri (meth) acrylate, tetramethylolmethane tri (meth) acrylate , Tetramethylolmethane tetra (meth) acrylate, polypropylene glycol di (meth) acrylate (having 2 to 14 propylene groups), dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc. Compounds obtained by reacting α, β-unsaturated carboxylic acids, glycidyl group-containing compounds (bisphenol A dioxyethylene di (meth) acrylate, bisphenol A trioxyethylene (Meth) acrylate,
Bisphenol A decaoxyethylene di (meth) acrylate and other bisphenol A dioxyethylene di (meth) acrylate, trimethylolpropane triglycidyl ether triacrylate, bisphenol A diglycidyl ether acrylate, etc.) and α, β-unsaturated carboxylic acid , A compound obtained by adding a polycarboxylic acid (phthalic anhydride, etc.) and an esterified product of a substance having a hydroxyl group and an ethylenically unsaturated group (β-hydroxyethyl (meth) acrylate, etc.), (meth) acrylic acid Alkyl ester ((meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid butyl ester, (meth) acrylic acid 2-ethylhexyl ester, etc.), urethane (meth) acrylate (tolylene diisocyanate and - hydroxyethyl (meth) reaction product of an acrylic acid ester, trimethylhexamethylene diisocyanate and cyclohexanedimethanol and 2
-Hydroxyethyl (meth) acrylic acid ester and the like) and the like.
【００１２】本発明における（Ａ）成分の配合量は、４
０〜８０重量部（(Ａ)成分と(Ｂ)成分との総量が１００
重量部となるようにする）とされ、５５〜６５重量部と
することが好ましい。この配合量が４０重量部未満で
は、光硬化物が脆くなり、感光性フィルムとして用いた
場合に塗膜性が劣る。また、この配合量が８０重量部を
超えると、充分な感度が得られない。The compounding amount of the component (A) in the present invention is 4
0 to 80 parts by weight (total amount of component (A) and component (B) is 100)
It should be set to be 5 parts by weight). If the blending amount is less than 40 parts by weight, the photocured product becomes brittle and the coating property is poor when used as a photosensitive film. Further, if the blending amount exceeds 80 parts by weight, sufficient sensitivity cannot be obtained.
【００１３】また、本発明における（Ｂ）成分の配合量
は、２０〜６０重量部（(Ａ)成分と(Ｂ)成分との総量が
１００重量部となるようにする）とされ、３５〜４５重
量部とすることが好ましい。この配合量が２０重量部未
満では、充分な感度が得られず、６０重量部を超える
と、光硬化物が脆くなる。The blending amount of the component (B) in the present invention is 20 to 60 parts by weight (so that the total amount of the components (A) and (B) is 100 parts by weight). It is preferably 45 parts by weight. If this amount is less than 20 parts by weight, sufficient sensitivity cannot be obtained, and if it exceeds 60 parts by weight, the photocured product becomes brittle.
【００１４】また、（Ｂ）成分として、二個以上の不飽
和結合を有する化合物を用いることが、感度の向上の面
から好ましい。Further, as the component (B), it is preferable to use a compound having two or more unsaturated bonds from the viewpoint of improving the sensitivity.
【００１５】本発明に（Ｃ）成分として用いられる一般
式（Ｉ）The general formula (I) used as the component (C) in the present invention
【化４】 （式中、Ｒ1は炭素原子数６〜１２のアルキレン基を示
す）で表される光開始剤としては、例えば、１，６−ビ
ス（９−アクリジニル）ヘキサン、１，７−ビス（９−
アクリジニル）ヘプタン、１，８−ビス（９−アクリジ
ニル）オクタン、１，９−ビス（９−アクリジニル）ノ
ナン、１，１０−ビス（９−アクリジニル）デカン、
１，１１−ビス（９−アクリジニル）ウンデカン、１，
１２−ビス（９−アクリジニル）ドデカン等が挙げられ
る。[Chemical 4] Examples of the photoinitiator represented by (wherein R 1 represents an alkylene group having 6 to 12 carbon atoms) include 1,6-bis (9-acridinyl) hexane and 1,7-bis (9 −
Acridinyl) heptane, 1,8-bis (9-acridinyl) octane, 1,9-bis (9-acridinyl) nonane, 1,10-bis (9-acridinyl) decane,
1,11-bis (9-acridinyl) undecane, 1,
12-bis (9-acridinyl) dodecane and the like can be mentioned.
【００１６】（Ｃ）成分である前記一般式（Ｉ）で表さ
れる光開始剤（アクリジン化合物）は、例えば、ジフェ
ニルアミンと二価カルボン酸を金属酸化物の存在下に反
応させることによって容易に製造することができる。The photoinitiator (acridine compound) represented by the general formula (I) which is the component (C) can be easily prepared by reacting diphenylamine and a divalent carboxylic acid in the presence of a metal oxide. It can be manufactured.
【００１７】本発明における（Ｃ）成分の配合量は、
０．０５〜１重量部（前記(Ａ)成分と(Ｂ)成分との総量
１００重量部に対して）とされ、０．１〜０．５重量部
とすることが好ましい。この配合量が０．０５重量部未
満では、充分な光感度が得られず、１重量部を超える
と、それ以上感度は向上しないばかりか、めっき浴に対
する溶解量が増大し、めっき浴の汚染が著しくなる。The blending amount of the component (C) in the present invention is
The amount is 0.05 to 1 part by weight (relative to 100 parts by weight of the total amount of the components (A) and (B)), and preferably 0.1 to 0.5 parts by weight. If the content is less than 0.05 parts by weight, sufficient photosensitivity cannot be obtained, and if it exceeds 1 part by weight, the sensitivity is not further improved and the amount of dissolution in the plating bath increases, resulting in contamination of the plating bath. Becomes noticeable.
【００１８】また、本発明に（Ｄ）成分として用いられ
るヘキサアリールビイミダゾールとしては、例えば、
２，２′−ビス（ｏ−クロロフェニル）−４，４′，
５，５′−テトラフェニルビイミダゾール、２，２′−
ビス（ｏ−ブロモフェニル）−４，４′，５，５′−テ
トラフェニルビイミダゾール、２，２′−ビス（ｏ，ｐ
−ジクロロフェニル）−４，４′，５，５′−テトラフ
ェニルビイミダゾール、２，２′−ビス（ｏ−クロロフ
ェニル）−４，４′，５，５′−テトラ（ｍ−メトキシ
フェニル）ビイミダゾール、２，２′−ビス（ｏ，ｏ′
−ジクロロフェニル）−４，４′，５，５′−テトラフ
ェニルビイミダゾール、２，２′−ビス（ｏ−ニトロフ
ェニル）−４，４′，５，５′−テトラフェニルビイミ
ダゾール、２，２′−ビス（ｏ−メチルフェニル）−
４，４′，５，５′−テトラフェニルビイミダゾール等
が挙げられる。これらのヘキサアリールビイミダゾール
は、例えば、Bull.Chem.Soc.Japan,33,565(1960)、J.or
g.Chem.,36〔16〕2262(1971)等に開示されている方法に
より容易に合成することができる。Examples of the hexaarylbiimidazole used as the component (D) in the present invention include:
2,2'-bis (o-chlorophenyl) -4,4 ',
5,5'-tetraphenylbiimidazole, 2,2'-
Bis (o-bromophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o, p
-Dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetra (m-methoxyphenyl) biimidazole , 2,2'-bis (o, o '
-Dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (o-nitrophenyl) -4,4', 5,5'-tetraphenylbiimidazole, 2,2 ′ -Bis (o-methylphenyl)-
4,4 ', 5,5'-tetraphenylbiimidazole and the like can be mentioned. These hexaarylbiimidazoles, for example, Bull.Chem.Soc.Japan, 33, 565 (1960 ), J.or
It can be easily synthesized by the method disclosed in g. Chem., 36 [16] 2262 (1971) and the like.
【００１９】本発明における（Ｄ）成分の配合量は、
０．１〜３．０重量部（前記(Ａ)成分と(Ｂ)成分との総
量１００重量部に対して）とされ、０．５〜２．５重量
部とされることが好ましい。この配合量が０．１重量部
未満では、充分な光感度が得られず、３．０重量部を超
えると、レジストの線幅が太くなる。The blending amount of the component (D) in the present invention is
0.1 to 3.0 parts by weight (based on 100 parts by weight of the total amount of the components (A) and (B)), and preferably 0.5 to 2.5 parts by weight. If the blending amount is less than 0.1 parts by weight, sufficient photosensitivity cannot be obtained, and if it exceeds 3.0 parts by weight, the resist line width becomes thick.
【００２０】本発明の感光性樹脂組成物は、必要に応じ
て前記以外のビニル化合物、光開始剤、可塑剤、染料、
顔料、イメージング剤、充填剤、密着性付与剤等を配合
して使用することができる。The photosensitive resin composition of the present invention contains a vinyl compound other than the above, a photoinitiator, a plasticizer, a dye, if necessary.
A pigment, an imaging agent, a filler, an adhesion-imparting agent, etc. can be blended and used.
【００２１】本発明の感光性樹脂組成物は、金属面、例
えば、銅、ニッケル、クロム等の表面、好ましくは銅表
面上に、液状レジストとして塗布して乾燥後、保護フィ
ルムを被覆して用いるか、感光性エレメントとして用い
られる。感光性樹脂組成物層の厚さは、用途により異な
るが、乾燥後の厚みで１０〜１００μｍであることが好
ましい。また、液状レジストとしての場合は、保護フィ
ルムとして、ポリエチレン、ポリプロピレン等の不活性
なポリオレフィンフィルムなどが用いられる。The photosensitive resin composition of the present invention is applied on a metal surface, for example, a surface of copper, nickel, chromium or the like, preferably a copper surface, as a liquid resist and dried, and then coated with a protective film. Or used as a photosensitive element. The thickness of the photosensitive resin composition layer varies depending on the application, but it is preferably 10 to 100 μm after drying. In the case of a liquid resist, an inert polyolefin film such as polyethylene or polypropylene is used as the protective film.
【００２２】感光性エレメントは、ポリエステル等の支
持体フィルム上に感光性樹脂組成物を塗布乾燥すること
により積層し、必要に応じてポリオレフィン等の保護フ
ィルムを積層して得られる。感光性樹脂組成物は、必要
に応じて、アセトン、メチルエチルケトン、塩化メチレ
ン、トルエン、メタノール、エタノール、プロパノー
ル、ブタノール、メチルグリコール、エチルグリコー
ル、プロピレングリコール、モノメチルエーテル等の溶
剤又はこれらの混合溶剤と混合して溶液として塗布して
もよい。The photosensitive element can be obtained by applying a photosensitive resin composition on a support film such as polyester and drying the composition, and optionally laminating a protective film such as polyolefin. The photosensitive resin composition is mixed with a solvent such as acetone, methyl ethyl ketone, methylene chloride, toluene, methanol, ethanol, propanol, butanol, methyl glycol, ethyl glycol, propylene glycol, monomethyl ether, or a mixed solvent thereof, if necessary. It may be applied as a solution.
【００２３】前記の感光性樹脂組成物層は、アートワー
クと呼ばれるネガ又はポジマスクパターンを通して活性
光線がパターン状に照射された後、現像液で現像され、
レジストパターンとされる。この際用いられる活性光線
の光源としては、例えば、カーボンアーク灯、超高圧水
銀灯、高圧水銀灯、キセノンランプ等の紫外線を有効に
放射するものが用いられる。The above-mentioned photosensitive resin composition layer is irradiated with actinic rays in a pattern through a negative or positive mask pattern called artwork, and then developed with a developing solution,
It is used as a resist pattern. As the active light source used at this time, for example, a carbon arc lamp, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a xenon lamp or the like that effectively radiates ultraviolet rays is used.
【００２４】現像液としては、安全かつ安定であり、操
作性が良好なものが用いられ、アルカリ現像型のフォト
レジストでは炭酸ナトリウムの希薄溶液等が用いられ
る。現像の方式には、ディップ方式、スプレー方式等が
あり、高圧スプレー方式が解像度向上のためには最も適
している。As the developing solution, a developing solution which is safe and stable and has good operability is used, and a dilute solution of sodium carbonate or the like is used for an alkali developing type photoresist. Development methods include a dip method and a spray method, and the high pressure spray method is most suitable for improving the resolution.
【００２５】現像後に行われる電気めっきには、銅めっ
き（硫酸銅めっき、ピロリン酸銅めっき等）、はんだめ
っき（ハイスローはんだめっき等）、ワット浴（硫酸ニ
ッケル−塩化ニッケル）めっき、ニッケルめっき（スル
ファミン酸ニッケルめっき等）、金めっき（ハード金め
っき、ソフト金めっき等）などがある。Electroplating performed after development includes copper plating (copper sulfate plating, copper pyrophosphate plating, etc.), solder plating (high-throw solder plating, etc.), Watts bath (nickel sulfate-nickel chloride) plating, nickel plating (sulfamine). Nickel acid plating, etc.), gold plating (hard gold plating, soft gold plating, etc.).
【００２６】[0026]
【実施例】次に、本発明を実施例により説明する。 実施例１〜２及び比較例１〜３ 表１及び表２に示す材料を配合し、溶液を得た。EXAMPLES The present invention will now be described with reference to examples. Examples 1-2 and Comparative Examples 1-3 The materials shown in Table 1 and Table 2 were blended to obtain solutions.
【表１】 [Table 1]
【表２】 [Table 2]
【００２７】この溶液に表３に示す（Ｃ）成分及び
（Ｄ）成分を溶解させて感光性樹脂組成物の溶液を得
た。The components (C) and (D) shown in Table 3 were dissolved in this solution to obtain a solution of a photosensitive resin composition.
【表３】 [Table 3]
【００２８】次いで、この感光性樹脂組成物の溶液を２
５μｍ厚のポリエチレンテレフタレートフィルム上に均
一に塗布し、１００℃の熱風対流式乾燥機で１０分間乾
燥して感光性エレメントを得た。感光性樹脂組成物層の
乾燥後の膜厚は、５０μｍであった。一方、銅箔（厚さ
３５μｍ）を両面に積層したガラスエポキシ材である銅
張り積層板（日立化成工業社製、商品名ＭＣＬ−Ｅ−６
１）の銅表面を＃６００相当のブラシを持つ研磨機（三
啓社製）を用いて研磨し、水洗後、空気流で乾燥し、得
られた銅張り積層板を８０℃に加温し、その銅表面上に
前記感光性樹脂組成物層を１２０℃に加熱しながらラミ
ネートした。Then, a solution of this photosensitive resin composition is added to 2
It was uniformly coated on a polyethylene terephthalate film having a thickness of 5 μm, and dried for 10 minutes by a hot air convection dryer at 100 ° C. to obtain a photosensitive element. The film thickness of the photosensitive resin composition layer after drying was 50 μm. On the other hand, a copper-clad laminate which is a glass epoxy material in which copper foil (thickness 35 μm) is laminated on both sides (manufactured by Hitachi Chemical Co., Ltd., trade name MCL-E-6)
The copper surface of 1) was polished using a polishing machine (manufactured by Sankei Co., Ltd.) having a brush equivalent to # 600, washed with water, and dried with an air stream, and the obtained copper-clad laminate was heated to 80 ° C. Then, the photosensitive resin composition layer was laminated on the copper surface while heating at 120 ° C.
【００２９】次いで、このようにして得られた基板に、
ネガフィルムを使用し、３kW高圧水銀灯（オーク製作所
社製、ＨＭＷ−２０１Ｂ）で６０mJ/cm2の露光を行っ
た。この際、光感度及び線幅を評価できるように、光透
過量が段階的に少なくなるように作られたネガフィルム
（光学密度０．０５を１段目とし、１段ごとに光学密度
０．１５ずつ増加する２１段ステップタブレット）を用
いた。また、線幅については、２１段ステップタブレッ
トで８段を示す露光量をライン／スペース＝１００μｍ
／１００μｍのネガフィルムを用い露光した。Then, on the substrate thus obtained,
Using a negative film, exposure was performed at 60 mJ / cm 2 with a 3 kW high pressure mercury lamp (HMW-201B, manufactured by Oak Manufacturing Co., Ltd.). At this time, in order to evaluate the photosensitivity and the line width, a negative film (optical density 0.05 is set as the first step and the optical density is set to 0. A 21-step tablet increasing in 15 steps was used. Regarding the line width, the exposure amount showing 8 steps with a 21-step tablet is line / space = 100 μm.
It was exposed using a negative film of / 100 μm.
【００３０】次いで、ポリエチレンテレフタレートフィ
ルムを除去し、３０℃で１重量％炭酸ナトリウム水溶液
を５０〜１５０秒間スプレーすることにより、未露光部
分を現像し、銅張り積層板上に形成された光硬化膜のス
テップタブレットの段数を測定することにより、感光性
樹脂組成物の光感度を評価した。その結果を表４として
示した。光感度は、ステップタブレットの段数で示さ
れ、このステップタブレットの段数が高いほど、光感度
が高いことを示す。また、線幅については、ネガフィル
ムのパターン幅との差を示す。＋側で大きい程レジスト
の線幅が太いことを示す。Then, the polyethylene terephthalate film was removed, and an unexposed portion was developed by spraying a 1% by weight aqueous sodium carbonate solution at 30 ° C. for 50 to 150 seconds to form a photo-cured film formed on the copper-clad laminate. The photosensitivity of the photosensitive resin composition was evaluated by measuring the number of steps of the step tablet. The results are shown in Table 4. The light sensitivity is indicated by the number of steps of the step tablet, and the higher the number of steps of this step tablet, the higher the light sensitivity. The line width indicates the difference from the pattern width of the negative film. The larger the plus side, the thicker the resist line width.
【００３１】次に、別に作った感光性エレメントを各エ
レメントを使用し、２１段ステップタブレットで８段の
値を示す露光量を露光後、ポリエチレンフィルムとポリ
エチレンテレフタレートフィルムを除去し、露光されて
光硬化した感光性樹脂組成物層（フィルム硬化物）を得
た。続いてフィルム硬化物を半田めっき液〔４５重量％
ホウフッ化錫６４ml/リットル、４５重量％ホウフッ化鉛２
２ml/リットル、４２重量％ホウフッ化水素酸２００ml/リット
ル、プルテインＬＡコンダクティビティソルト（メルテ
ックス社製、商品名）２０g/リットル、プルテインＬＡスタ
ーター（メルテックス社製商品名）４０ml/リットル〕に
０．１m2/リットルの割合で浸漬した。フィルム硬化物を浸
漬したまま室温下で７日間放置した後、フィルム硬化物
を取り除いた半田めっき液を、ハルセルめっき装置に投
入し、同装置で１Ａで５分間めっきした。Next, using a separately prepared photosensitive element, each element was exposed using a 21-step step tablet at an exposure amount showing a value of 8 steps, and then the polyethylene film and the polyethylene terephthalate film were removed and exposed to light. A cured photosensitive resin composition layer (cured film) was obtained. Then, the cured film is treated with a solder plating solution [45 wt%
Tin borofluoride 64 ml / liter, 45% by weight lead borofluoride 2
2 ml / liter, 42 wt% borohydrofluoric acid 200 ml / liter, Plutein LA Conductivity Salt (Meltex, trade name) 20 g / L, Plutein LA Starter (Meltex, trade name) 40 ml / L] 0 It was immersed at a rate of 1 m 2 / liter. After leaving the film-cured product immersed at room temperature for 7 days, the solder plating solution from which the film-cured product had been removed was put into a Hull cell plating apparatus, and plating was performed at 1 A for 5 minutes in the same apparatus.
【００３２】めっき後、蛍光Ｘ線膜厚計（セイコー電子
社製、商品名ＳＴＦ−１５８Ｖ）を用いて、電流密度３
A/dm2の部分のめっき膜の錫／鉛比率（Ａ1）を測定し
た。その際、フィルム硬化物を浸漬しなかったものの錫
／鉛比率（Ａ2）をブランクとし、Ａ1／Ａ2を合金比率
とした。この値が１に近いほどめっき浴汚染性は少ない
ことになる。After plating, a current density of 3 was obtained using a fluorescent X-ray film thickness meter (manufactured by Seiko Denshi KK, trade name STF-158V).
The tin / lead ratio (A 1 ) of the plating film at the A / dm 2 portion was measured. At that time, the tin / lead ratio (A 2 ) of the product in which the cured film was not dipped was used as a blank, and A 1 / A 2 was used as the alloy ratio. The closer this value is to 1, the less the contamination of the plating bath.
【００３３】[0033]
【表４】 [Table 4]
【００３４】表４から成分（Ｃ）と成分（Ｄ）を所定量
配合した実施例１及び実施例２では、レジストの線幅が
太らず光感度が高く、めっき浴汚染のほとんどないこと
が確認された。From Table 4, it was confirmed that in Examples 1 and 2 in which the components (C) and (D) were blended in a predetermined amount, the resist line width was not thick and the photosensitivity was high, and there was almost no plating bath contamination. Was done.
【００３５】[0035]
【発明の効果】本発明の感光性樹脂組成物及びこれを用
いた感光性エレメントは、レジストの線幅が太らず、め
っき浴汚染がほとんどなく、光感度が高い優れたもので
ある。EFFECT OF THE INVENTION The photosensitive resin composition of the present invention and the photosensitive element using the same are excellent in that the resist line width is not thick, there is almost no plating bath contamination, and the photosensitivity is high.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０３Ｆ 7/031 Ｈ０５Ｋ 3/06 Ｈ N2-3 (72)発明者 鎌倉 祐一 茨城県日立市東町四丁目13番１号 日立化 成工業株式会社山崎工場内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI Technical indication location G03F 7/031 H05K 3/06 H N2-3 (72) Inventor Yuichi Kamakura 4 Higashimachi, Hitachi City, Ibaraki Prefecture No. 13-1 Hitachi Chemical Co., Ltd. Yamazaki Factory
Claims (2)
４０〜８０重量部、（Ｂ）少なくとも１つの不飽和結合
を有し、重合可能な化合物２０〜６０重量部（(Ａ)と
(Ｂ)との総量が１００重量部となるようにする）、
（Ｃ）一般式（Ｉ） 【化１】 （式中、Ｒ1は炭素原子数６〜１２のアルキレン基を示
す）で表される光開始剤を０．０５〜１重量部（前記
(Ａ)と(Ｂ)との総量１００重量部に対して）及び（Ｄ）
ヘキサアリールビイミダゾールを０．１〜３．０重量部
（前記(Ａ)と(Ｂ)との総量１００重量部に対して）を含
有する感光性樹脂組成物。1. (A) 40 to 80 parts by weight of a polymer having a carboxyl group, (B) 20 to 60 parts by weight of a polymerizable compound having at least one unsaturated bond ((A) and
(The total amount with (B) is 100 parts by weight),
(C) General formula (I) (Wherein R 1 represents an alkylene group having 6 to 12 carbon atoms) in an amount of 0.05 to 1 part by weight (as described above).
(Based on 100 parts by weight of (A) and (B)) and (D)
A photosensitive resin composition containing 0.1 to 3.0 parts by weight of hexaarylbiimidazole (based on 100 parts by weight of the total of (A) and (B)).
性樹脂組成物の層を積層してなる感光性エレメント。2. A photosensitive element formed by laminating a layer of the photosensitive resin composition according to claim 1 on a support film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6306762A JPH08157744A (en) | 1994-12-12 | 1994-12-12 | Photosensitive resin composition and photosensitive element produced therefrom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6306762A JPH08157744A (en) | 1994-12-12 | 1994-12-12 | Photosensitive resin composition and photosensitive element produced therefrom |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001322638A Division JP2002182387A (en) | 2001-10-19 | 2001-10-19 | Photosensitive resin composition and photosensitive element using the same |
| JP2001322626A Division JP2002148797A (en) | 2001-10-19 | 2001-10-19 | Photosensitive resin composition, photosensitive element which uses the same, method for laminating photosensitive resin composition layer, photosensitive resin composition laminated substrate and method for hardening photosensitive resin composition layer |
| JP2001322619A Division JP2002182385A (en) | 2001-10-19 | 2001-10-19 | Photosensitive resin composition, photosensitive element using the same, method for stacking photosensitive resin composition layer, photosensitive resin composition layer stacked substrate and method for curing photosensitive resin composition layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08157744A true JPH08157744A (en) | 1996-06-18 |
Family
ID=17960990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6306762A Pending JPH08157744A (en) | 1994-12-12 | 1994-12-12 | Photosensitive resin composition and photosensitive element produced therefrom |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08157744A (en) |
Cited By (9)
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|---|---|---|---|---|
| WO2001092958A1 (en) * | 2000-05-29 | 2001-12-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board |
| JP2002082434A (en) * | 2000-09-07 | 2002-03-22 | Hodogaya Chem Co Ltd | Photosensitive resin composition and photosensitive material using the same |
| JP2002148797A (en) * | 2001-10-19 | 2002-05-22 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element which uses the same, method for laminating photosensitive resin composition layer, photosensitive resin composition laminated substrate and method for hardening photosensitive resin composition layer |
| JP2002182385A (en) * | 2001-10-19 | 2002-06-26 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using the same, method for stacking photosensitive resin composition layer, photosensitive resin composition layer stacked substrate and method for curing photosensitive resin composition layer |
| WO2006057385A1 (en) * | 2004-11-29 | 2006-06-01 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board, and semiconductor device |
| WO2008015754A1 (en) * | 2006-08-04 | 2008-02-07 | Chiyoda Chemical Co., Ltd. | Photosensitive resin composition |
| US7645561B1 (en) | 1997-09-19 | 2010-01-12 | Hitachi Chemical Company, Ltd. | Photosensitive film |
| JP2011028165A (en) * | 2009-07-29 | 2011-02-10 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
| JP2013117581A (en) * | 2011-12-01 | 2013-06-13 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
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| US7645561B1 (en) | 1997-09-19 | 2010-01-12 | Hitachi Chemical Company, Ltd. | Photosensitive film |
| US7687224B2 (en) | 1997-09-19 | 2010-03-30 | Hitachi Chemical Company, Ltd. | Photosensitive film |
| WO2001092958A1 (en) * | 2000-05-29 | 2001-12-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, production method for resist pattern and production method for printed circuit board |
| US7517636B2 (en) | 2000-05-29 | 2009-04-14 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board |
| JP2002082434A (en) * | 2000-09-07 | 2002-03-22 | Hodogaya Chem Co Ltd | Photosensitive resin composition and photosensitive material using the same |
| JP4489918B2 (en) * | 2000-09-07 | 2010-06-23 | 保土谷化学工業株式会社 | Photosensitive resin composition and photosensitive material using the same |
| JP2002148797A (en) * | 2001-10-19 | 2002-05-22 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element which uses the same, method for laminating photosensitive resin composition layer, photosensitive resin composition laminated substrate and method for hardening photosensitive resin composition layer |
| JP2002182385A (en) * | 2001-10-19 | 2002-06-26 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using the same, method for stacking photosensitive resin composition layer, photosensitive resin composition layer stacked substrate and method for curing photosensitive resin composition layer |
| WO2006057385A1 (en) * | 2004-11-29 | 2006-06-01 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board, and semiconductor device |
| WO2008015754A1 (en) * | 2006-08-04 | 2008-02-07 | Chiyoda Chemical Co., Ltd. | Photosensitive resin composition |
| JP2011028165A (en) * | 2009-07-29 | 2011-02-10 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
| JP2013117581A (en) * | 2011-12-01 | 2013-06-13 | Asahi Kasei E-Materials Corp | Photosensitive resin composition |
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