TW200625568A - Solid cooling structure and formation thereof with integrated package - Google Patents

Solid cooling structure and formation thereof with integrated package

Info

Publication number
TW200625568A
TW200625568A TW094101165A TW94101165A TW200625568A TW 200625568 A TW200625568 A TW 200625568A TW 094101165 A TW094101165 A TW 094101165A TW 94101165 A TW94101165 A TW 94101165A TW 200625568 A TW200625568 A TW 200625568A
Authority
TW
Taiwan
Prior art keywords
cooling structure
formation
die
integrated package
solid cooling
Prior art date
Application number
TW094101165A
Other languages
Chinese (zh)
Other versions
TWI254432B (en
Inventor
Chun-Kai Liu
Jen-Hao Cheng
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094101165A priority Critical patent/TWI254432B/en
Priority to US11/221,791 priority patent/US20060156737A1/en
Application granted granted Critical
Publication of TWI254432B publication Critical patent/TWI254432B/en
Publication of TW200625568A publication Critical patent/TW200625568A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A solid cooling structure applied to a package with at least one die has a thermoelectric transfer module and a heat exchanger module. The heat exchanger module has two passive cooling devices thermally connecting and affixing the thermoelectric transfer module, respectively, in which one of them is in the proximity of the die. The heat generated by the die in operation flows from the closer passive cooling device into another passive cooling device, through the thermoelectric transfer module controlled under a power.
TW094101165A 2005-01-14 2005-01-14 Solid cooling structure and formation thereof with integrated package TWI254432B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094101165A TWI254432B (en) 2005-01-14 2005-01-14 Solid cooling structure and formation thereof with integrated package
US11/221,791 US20060156737A1 (en) 2005-01-14 2005-09-09 Cooling structure of solid state and formation thereof with integrated package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094101165A TWI254432B (en) 2005-01-14 2005-01-14 Solid cooling structure and formation thereof with integrated package

Publications (2)

Publication Number Publication Date
TWI254432B TWI254432B (en) 2006-05-01
TW200625568A true TW200625568A (en) 2006-07-16

Family

ID=36682427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101165A TWI254432B (en) 2005-01-14 2005-01-14 Solid cooling structure and formation thereof with integrated package

Country Status (2)

Country Link
US (1) US20060156737A1 (en)
TW (1) TWI254432B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354740B2 (en) * 2008-12-01 2013-01-15 Alpha & Omega Semiconductor, Inc. Top-side cooled semiconductor package with stacked interconnection plates and method
KR101589441B1 (en) * 2009-08-07 2016-01-28 삼성전자주식회사 Semiconductor module
KR20130009442A (en) * 2011-07-15 2013-01-23 삼성전기주식회사 Thermoelectric module
WO2013159040A1 (en) 2012-04-19 2013-10-24 Packet Photonics, Inc. Heat removal system for devices and subassemblies
US20150338283A1 (en) * 2014-05-20 2015-11-26 Hon Hai Precision Industry Co., Ltd. Device and method for temperature monitoring in multiple areas using one sensor
CN108572496A (en) * 2017-03-13 2018-09-25 台达电子工业股份有限公司 Radiating subassembly and projector
WO2020038554A1 (en) * 2018-08-20 2020-02-27 Huawei Technologies Co., Ltd. Forming a semiconductor device with heat conduction layers formed by laser direct structuring
US20220352055A1 (en) * 2021-04-30 2022-11-03 Texas Instruments Incorporated Heat-dissipating wirebonded members on package surfaces
CN115632028B (en) * 2022-12-08 2023-03-10 常州铭赛机器人科技股份有限公司 Lead frame conveying device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032897A (en) * 1990-02-28 1991-07-16 International Business Machines Corp. Integrated thermoelectric cooling
US5637921A (en) * 1995-04-21 1997-06-10 Sun Microsystems, Inc. Sub-ambient temperature electronic package
JP3286177B2 (en) * 1996-08-30 2002-05-27 矢崎総業株式会社 ID connector
US6023932A (en) * 1997-08-25 2000-02-15 Johnston; Robert Topical cooling device
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits
DE10165080B4 (en) * 2000-09-20 2015-05-13 Hitachi Metals, Ltd. Silicon nitride powder and sintered body and method of making the same and printed circuit board therewith
US6483706B2 (en) * 2000-12-22 2002-11-19 Vlt Corporation Heat dissipation for electronic components
US6826916B2 (en) * 2001-04-24 2004-12-07 The Furukawa Electric Co., Ltd. Laser module, Peltier module, and Peltier module integrated heat spreader
US6700783B1 (en) * 2003-01-15 2004-03-02 Industrial Technology Research Institute Three-dimensional stacked heat spreader assembly for electronic package and method for assembling
US6711904B1 (en) * 2003-03-06 2004-03-30 Texas Instruments Incorporated Active thermal management of semiconductor devices
US6880346B1 (en) * 2004-07-08 2005-04-19 Giga-Byte Technology Co., Ltd. Two stage radiation thermoelectric cooling apparatus

Also Published As

Publication number Publication date
US20060156737A1 (en) 2006-07-20
TWI254432B (en) 2006-05-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees