TW200623358A - Hermetic sealing of image sensor chip - Google Patents

Hermetic sealing of image sensor chip

Info

Publication number
TW200623358A
TW200623358A TW093141422A TW93141422A TW200623358A TW 200623358 A TW200623358 A TW 200623358A TW 093141422 A TW093141422 A TW 093141422A TW 93141422 A TW93141422 A TW 93141422A TW 200623358 A TW200623358 A TW 200623358A
Authority
TW
Taiwan
Prior art keywords
image sensor
sensor chip
cavity
chip
hermetic sealing
Prior art date
Application number
TW093141422A
Other languages
Chinese (zh)
Other versions
TWI280648B (en
Inventor
Cheng-Ting Wu
Hui-Ping Liu
Ming-Te Hsia
Wu-Chang Tu
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW093141422A priority Critical patent/TWI280648B/en
Publication of TW200623358A publication Critical patent/TW200623358A/en
Application granted granted Critical
Publication of TWI280648B publication Critical patent/TWI280648B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

A hermetic sealing of image sensor chip includes a chip carrier with a cavity. A chip-attaching area and a plurality of connecting pads are formed inside the cavity. A transplant plate seals the cavity to form a close space. An image sensor chip and a cleaning material dispose in the cavity. The image sensor chip is attached to the chip-attaching area and electrically connecting with the connecting pads of the substrate. The cleaning material is used for absorbing moisture or dust inside the close space to maintain the sensing quality of the image sensor chip.
TW093141422A 2004-12-30 2004-12-30 Hermetic sealing of image sensor chip TWI280648B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093141422A TWI280648B (en) 2004-12-30 2004-12-30 Hermetic sealing of image sensor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093141422A TWI280648B (en) 2004-12-30 2004-12-30 Hermetic sealing of image sensor chip

Publications (2)

Publication Number Publication Date
TW200623358A true TW200623358A (en) 2006-07-01
TWI280648B TWI280648B (en) 2007-05-01

Family

ID=38742556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093141422A TWI280648B (en) 2004-12-30 2004-12-30 Hermetic sealing of image sensor chip

Country Status (1)

Country Link
TW (1) TWI280648B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI819452B (en) * 2021-12-30 2023-10-21 同欣電子工業股份有限公司 Sensor package structure

Also Published As

Publication number Publication date
TWI280648B (en) 2007-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees