TW200621380A - Coating device - Google Patents

Coating device

Info

Publication number
TW200621380A
TW200621380A TW094135829A TW94135829A TW200621380A TW 200621380 A TW200621380 A TW 200621380A TW 094135829 A TW094135829 A TW 094135829A TW 94135829 A TW94135829 A TW 94135829A TW 200621380 A TW200621380 A TW 200621380A
Authority
TW
Taiwan
Prior art keywords
stage
nozzles
liquid
moving mechanism
nozzle moving
Prior art date
Application number
TW094135829A
Other languages
Chinese (zh)
Other versions
TWI295196B (en
Inventor
Yukihiro Takamura
Mikio Masuichi
Tsuyoshi Matsuka
Satoshi Suzuki
Hirofumi Nishimuta
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200621380A publication Critical patent/TW200621380A/en
Application granted granted Critical
Publication of TWI295196B publication Critical patent/TWI295196B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)

Abstract

The coating device of this invention comprises nozzles (521) to (523), a stage (21), a nozzle moving mechanism part (51), and a liquid receiving part (53). The nozzles (521) to (523) discharge coating liquid in a liquid column state to a substrate. The stage (21) loads the substrate on an upper surface thereof. The nozzle moving mechanism part (51) moves the nozzles (521) to (523) reciprocatingly in a direction crossing the stage surface in the space above the stage (21). The liquid receiving part (53) is formed with a slit-like opening in parallel with the crossing direction so as to recover the discharged coating liquid in a liquid column state through the opening when the nozzles (521) to (523) are moved to a position separate from the top of the stage by the nozzle moving mechanism part (51).
TW094135829A 2004-12-27 2005-10-14 Coating device TWI295196B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004375305A JP4573645B2 (en) 2004-12-27 2004-12-27 Coating device

Publications (2)

Publication Number Publication Date
TW200621380A true TW200621380A (en) 2006-07-01
TWI295196B TWI295196B (en) 2008-04-01

Family

ID=36734900

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135829A TWI295196B (en) 2004-12-27 2005-10-14 Coating device

Country Status (4)

Country Link
JP (1) JP4573645B2 (en)
KR (1) KR100725824B1 (en)
CN (1) CN100406139C (en)
TW (1) TWI295196B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4573655B2 (en) * 2005-01-26 2010-11-04 大日本スクリーン製造株式会社 Coating device
JP4922825B2 (en) * 2007-05-17 2012-04-25 大日本スクリーン製造株式会社 Coating device
JP4964023B2 (en) * 2007-05-22 2012-06-27 大日本スクリーン製造株式会社 Coating device
TW200911389A (en) * 2007-08-17 2009-03-16 Dainippon Screen Mfg Nozzle keeping device and coating device
JP5096106B2 (en) * 2007-10-30 2012-12-12 芝浦メカトロニクス株式会社 Droplet applicator
JP5342282B2 (en) * 2009-03-17 2013-11-13 大日本スクリーン製造株式会社 Coating device
JP5578377B2 (en) * 2011-07-29 2014-08-27 セメス株式会社 Substrate processing apparatus and method
CN102320753A (en) * 2011-08-09 2012-01-18 深圳市华星光电技术有限公司 The coating apparatus of glass substrate and coating process thereof
CN104941869B (en) * 2015-07-03 2018-03-02 深圳市华星光电技术有限公司 Apparatus for coating
CN105594781A (en) * 2015-11-26 2016-05-25 夏柳发 Oil brushing machine for cake

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0169228B1 (en) * 1995-12-29 1999-02-01 김광호 Collection apparatus of used photoresist in rotating coater
JP3656387B2 (en) * 1998-01-14 2005-06-08 松下電器産業株式会社 Fluorescent substance forming method and apparatus for color display PDP
JP2001166938A (en) * 1999-09-29 2001-06-22 Toshiba Corp Structuring method enterprise system
JP2001210757A (en) * 2000-01-25 2001-08-03 Toshiba Corp Resin sealed semiconductor element
JP3734154B2 (en) * 2001-07-11 2006-01-11 東京エレクトロン株式会社 Liquid processing apparatus and method
JP3992530B2 (en) * 2002-04-16 2007-10-17 大日本スクリーン製造株式会社 Substrate processing method and apparatus
JP3854166B2 (en) * 2001-07-23 2006-12-06 大日本スクリーン製造株式会社 Substrate processing equipment
JP3844670B2 (en) * 2001-09-14 2006-11-15 東京エレクトロン株式会社 Coating film forming device

Also Published As

Publication number Publication date
JP2006181410A (en) 2006-07-13
JP4573645B2 (en) 2010-11-04
CN100406139C (en) 2008-07-30
CN1796001A (en) 2006-07-05
KR20060074821A (en) 2006-07-03
TWI295196B (en) 2008-04-01
KR100725824B1 (en) 2007-06-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees