TW200620477A - Thermal treatment apparatus and tuning technology for thermal treatment process - Google Patents

Thermal treatment apparatus and tuning technology for thermal treatment process

Info

Publication number
TW200620477A
TW200620477A TW093137726A TW93137726A TW200620477A TW 200620477 A TW200620477 A TW 200620477A TW 093137726 A TW093137726 A TW 093137726A TW 93137726 A TW93137726 A TW 93137726A TW 200620477 A TW200620477 A TW 200620477A
Authority
TW
Taiwan
Prior art keywords
wafer
heat
thermal treatment
heat lamp
lamp group
Prior art date
Application number
TW093137726A
Other languages
Chinese (zh)
Other versions
TWI240333B (en
Inventor
Chiung-Chieh Su
Meng-Chiuan Yu
Jen-Chieh Tsao
Ming-June Lin
Yong-Sen Su
Yi Hsiang Lai
Original Assignee
Chung Shan Inst Of Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chung Shan Inst Of Science filed Critical Chung Shan Inst Of Science
Priority to TW93137726A priority Critical patent/TWI240333B/en
Application granted granted Critical
Publication of TWI240333B publication Critical patent/TWI240333B/en
Publication of TW200620477A publication Critical patent/TW200620477A/en

Links

Abstract

A tuning technology for thermal treatment process is disclosed. It includes the following steps. First, a heat lamp and a reflective mask thereof are installed on a wafer to measure and adjust the heat flux distribution from the single heat lamp towards the wafer. Next, a heat lamp group composed of a plurality of the heat lamps is installed on the wafer, wherein the heat lamps are arranged in an array including a plurality of axially asymmetric circles. And then, a location between the heat lamp group and the wafer is adjusted, so a horizontal offset vector is between an array center axis of the heat lamp group and a center axis of the wafer. Next, heating powers of these heat lamps are adjusted. Afterwards, the wafer and the heat lamp group are relatively rotated parallely along the center axis of the wafer to receive the uniform heat flux from the heat lamp group.
TW93137726A 2004-12-07 2004-12-07 Thermal treatment apparatus and tuning technology for thermal treatment process TWI240333B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93137726A TWI240333B (en) 2004-12-07 2004-12-07 Thermal treatment apparatus and tuning technology for thermal treatment process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93137726A TWI240333B (en) 2004-12-07 2004-12-07 Thermal treatment apparatus and tuning technology for thermal treatment process

Publications (2)

Publication Number Publication Date
TWI240333B TWI240333B (en) 2005-09-21
TW200620477A true TW200620477A (en) 2006-06-16

Family

ID=37007723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93137726A TWI240333B (en) 2004-12-07 2004-12-07 Thermal treatment apparatus and tuning technology for thermal treatment process

Country Status (1)

Country Link
TW (1) TWI240333B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567857B (en) * 2014-10-10 2017-01-21 杰宜斯科技有限公司 Heater apparatus for substrate processing and liquid processing apparatus for substrate comprising the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111785667B (en) * 2020-07-31 2022-10-21 上海华力集成电路制造有限公司 Wafer position monitoring device and method of laser annealing equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567857B (en) * 2014-10-10 2017-01-21 杰宜斯科技有限公司 Heater apparatus for substrate processing and liquid processing apparatus for substrate comprising the same
CN106575618A (en) * 2014-10-10 2017-04-19 杰宜斯科技有限公司 Substrate processing heater device and substrate solution processing device having same

Also Published As

Publication number Publication date
TWI240333B (en) 2005-09-21

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