TW200619340A - Anisotropic conductive adhesive having PTC characteristics - Google Patents

Anisotropic conductive adhesive having PTC characteristics

Info

Publication number
TW200619340A
TW200619340A TW094120202A TW94120202A TW200619340A TW 200619340 A TW200619340 A TW 200619340A TW 094120202 A TW094120202 A TW 094120202A TW 94120202 A TW94120202 A TW 94120202A TW 200619340 A TW200619340 A TW 200619340A
Authority
TW
Taiwan
Prior art keywords
ptc
conductive adhesive
adhesive
adhesive component
anisotropic conductive
Prior art date
Application number
TW094120202A
Other languages
English (en)
Other versions
TWI298739B (en
Inventor
Young-Mi Jeon
Yoon-Jae Chung
Jong-Yoon Jang
Woo-Young Ahn
Yong-Seok Han
Original Assignee
Lg Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Cable Ltd filed Critical Lg Cable Ltd
Publication of TW200619340A publication Critical patent/TW200619340A/zh
Application granted granted Critical
Publication of TWI298739B publication Critical patent/TWI298739B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Thermistors And Varistors (AREA)
TW094120202A 2004-12-08 2005-06-17 Anisotropic conductive adhesive having ptc characteristics TWI298739B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040102831A KR100622598B1 (ko) 2004-12-08 2004-12-08 피티씨 특성을 갖는 이방 도전성 접착제

Publications (2)

Publication Number Publication Date
TW200619340A true TW200619340A (en) 2006-06-16
TWI298739B TWI298739B (en) 2008-07-11

Family

ID=36573168

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120202A TWI298739B (en) 2004-12-08 2005-06-17 Anisotropic conductive adhesive having ptc characteristics

Country Status (5)

Country Link
US (1) US7438834B2 (zh)
JP (1) JP4482676B2 (zh)
KR (1) KR100622598B1 (zh)
CN (1) CN100365090C (zh)
TW (1) TWI298739B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464814B (zh) * 2010-12-31 2014-12-11 Cheil Ind Inc 各向異性導電膜（一）

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
JP5349316B2 (ja) * 2007-09-19 2013-11-20 日立化成株式会社 接着剤組成物及び接合体
KR20100073848A (ko) * 2008-12-23 2010-07-01 제일모직주식회사 전기전자용 접착필름 조성물 및 이를 이용한 전기전자용 접착필름
KR100973910B1 (ko) 2010-02-18 2010-08-03 (주)주원 엘이디조명 구동장치
EP2578624A1 (en) 2011-10-06 2013-04-10 Henkel Italia S.p.A. Polymeric PTC thermistors
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
CN102634286B (zh) * 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
KR101365107B1 (ko) * 2012-09-21 2014-02-20 제일모직주식회사 이방성 도전 필름 및 이를 포함하는 반도체 장치
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
CN103928077B (zh) 2013-01-10 2017-06-06 杜邦公司 含有共混弹性体的导电粘合剂
CN103923578A (zh) 2013-01-10 2014-07-16 杜邦公司 包括含氟弹性体的导电粘合剂
DE102014018638A1 (de) * 2014-12-13 2016-06-16 Audi Ag Elektrische Energiespeicherzelle, elektrischer Energiespeicher und Kraftfahrzeug
JP6352979B2 (ja) * 2016-06-29 2018-07-04 デクセリアルズ株式会社 異方性導電フィルム、接続方法、接合体、及び接合体の製造方法
JP6271048B2 (ja) * 2017-01-11 2018-01-31 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6542927B2 (ja) * 2018-02-14 2019-07-10 デクセリアルズ株式会社 異方性導電フィルム、並びに、接続方法及び接合体
CN108949089A (zh) * 2018-06-26 2018-12-07 合肥萃励新材料科技有限公司 一种ptc功能的聚氨酯胶粘剂的制备方法
CN108865040A (zh) * 2018-06-26 2018-11-23 合肥萃励新材料科技有限公司 一种过流保护导电压敏胶的合成方法
CN109207102A (zh) * 2018-06-26 2019-01-15 合肥萃励新材料科技有限公司 一种ptc功能水性胶的合成工艺
CN109135629A (zh) * 2018-06-26 2019-01-04 合肥萃励新材料科技有限公司 一种印制线路板用pptc胶粘剂的制备方法
CN109054724A (zh) * 2018-06-26 2018-12-21 合肥萃励新材料科技有限公司 一种ptc功能聚酰亚胺胶粘剂的合成方法
CN108841343B (zh) * 2018-06-26 2020-09-15 合肥萃励新材料科技有限公司 一种ptc功能丙烯酸酯胶粘剂的合成工艺

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JPH03131679A (ja) * 1989-10-17 1991-06-05 Fujikura Ltd 導電性接着剤
JP3408301B2 (ja) * 1993-12-16 2003-05-19 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
US5837164A (en) * 1996-10-08 1998-11-17 Therm-O-Disc, Incorporated High temperature PTC device comprising a conductive polymer composition
JP3257521B2 (ja) * 1997-10-07 2002-02-18 ソニーケミカル株式会社 Ｐｔｃ素子、保護装置および回路基板
TW459032B (en) * 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
US6074576A (en) * 1998-03-24 2000-06-13 Therm-O-Disc, Incorporated Conductive polymer materials for high voltage PTC devices
KR20000075344A (ko) * 1999-05-31 2000-12-15 이용인 피.티.시. 저항소자 제조용 수지 조성물
JP4357684B2 (ja) * 2000-01-25 2009-11-04 株式会社フジクラ 導電性インキ組成物およびそれを用いた面状発熱体
US6274852B1 (en) * 2000-10-11 2001-08-14 Therm-O-Disc, Incorporated Conductive polymer compositions containing N-N-M-phenylenedimaleimide and devices
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
TWI334880B (en) * 2000-12-28 2010-12-21 Hitachi Chemical Co Ltd Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive
KR100388797B1 (ko) * 2001-03-29 2003-06-25 신화인터텍 주식회사 도전성 고분자 조성물 및 이를 이용한 ｐｔｃ소자
KR100454732B1 (ko) * 2001-08-25 2004-11-05 엘지전선 주식회사 전도성 중합체 조성물. 이 조성물의 특성을 조절하는 방법및 이 조성물을 이용한 전기장치
US6620343B1 (en) * 2002-03-19 2003-09-16 Therm-O-Disc Incorporated PTC conductive composition containing a low molecular weight polyethylene processing aid
KR20040052126A (ko) * 2002-12-13 2004-06-19 엘지전선 주식회사 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464814B (zh) * 2010-12-31 2014-12-11 Cheil Ind Inc 各向異性導電膜（一）

Also Published As

Publication number Publication date
JP2006161016A (ja) 2006-06-22
US7438834B2 (en) 2008-10-21
KR20060064136A (ko) 2006-06-13
KR100622598B1 (ko) 2006-09-19
CN1786096A (zh) 2006-06-14
TWI298739B (en) 2008-07-11
CN100365090C (zh) 2008-01-30
US20060118767A1 (en) 2006-06-08
JP4482676B2 (ja) 2010-06-16

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees