TW200611303A - Semiconductor manufacturing equipment and semiconductor manufacturing method - Google Patents

Semiconductor manufacturing equipment and semiconductor manufacturing method

Info

Publication number
TW200611303A
TW200611303A TW093136870A TW93136870A TW200611303A TW 200611303 A TW200611303 A TW 200611303A TW 093136870 A TW093136870 A TW 093136870A TW 93136870 A TW93136870 A TW 93136870A TW 200611303 A TW200611303 A TW 200611303A
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
semiconductor substrate
semiconductor
cassette
manufacturing apparatus
Prior art date
Application number
TW093136870A
Other languages
Chinese (zh)
Other versions
TWI272645B (en
Inventor
Norifumi Tokuda
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200611303A publication Critical patent/TW200611303A/en
Application granted granted Critical
Publication of TWI272645B publication Critical patent/TWI272645B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)

Abstract

The present invention relates to a semiconductor manufacturing apparatus and a semiconductor manufacturing method, and has for its object to process a wafer easily and stably irrespective of thickness. To achieve the above object, a semiconductor manufacturing apparatus includes: an open-topped cassette (100) that encases a semiconductor substrate (300); a plurality of processing means for performing a predetermined processing of the semiconductor substrate (300); and transporting means that transports the cassette (100) encasing the semiconductor substrate (300) between the plurality of processing means.
TW093136870A 2004-09-27 2004-11-30 Semiconductor manufacturing equipment and semiconductor manufacturing method TWI272645B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/014092 WO2006035484A1 (en) 2004-09-27 2004-09-27 Semiconductor manufacturing equipment and semiconductor manufacturing method

Publications (2)

Publication Number Publication Date
TW200611303A true TW200611303A (en) 2006-04-01
TWI272645B TWI272645B (en) 2007-02-01

Family

ID=36118636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136870A TWI272645B (en) 2004-09-27 2004-11-30 Semiconductor manufacturing equipment and semiconductor manufacturing method

Country Status (6)

Country Link
US (1) US7994067B2 (en)
EP (1) EP1691406B1 (en)
JP (1) JP4597137B2 (en)
CN (1) CN100405569C (en)
TW (1) TWI272645B (en)
WO (1) WO2006035484A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6058360B2 (en) * 2012-11-15 2017-01-11 東京エレクトロン株式会社 Substrate delivery mechanism, substrate transport apparatus, and substrate delivery method
JP6054213B2 (en) * 2013-03-11 2016-12-27 東京エレクトロン株式会社 Support member and semiconductor manufacturing apparatus
JP2017022343A (en) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 Method of manufacturing semiconductor device, semiconductor manufacturing device, and wafer lift pin hole cleaning jig
CN107121892B (en) * 2017-04-26 2018-12-28 武汉华星光电技术有限公司 A kind of substrate exposure edge equipment
CN111477563B (en) * 2019-01-24 2022-04-22 中国电子科技集团公司第二十四研究所 Alignment tool for fusing and sealing semiconductor device
JP7374591B2 (en) * 2019-02-13 2023-11-07 株式会社東京精密 Wafer presence detection device
KR20220115676A (en) * 2021-02-09 2022-08-18 삼성디스플레이 주식회사 Jig for fabricating window and fabricating method of window using the same

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736418B2 (en) * 1986-05-19 1995-04-19 富士通株式会社 Wafer carrier
JPH01262639A (en) 1988-04-13 1989-10-19 Mitsubishi Electric Corp Jig for semiconductor wafer
US4901011A (en) * 1988-11-04 1990-02-13 Tokyo Electron Limited Carrier for transferring plate-like objects one by one, a handling apparatus for loading or unloading the carrier, and a wafer probing machine fitted with the handling apparatus for the wafer carrier
JPH0727628Y2 (en) * 1989-11-20 1995-06-21 日本電信電話株式会社 Wafer holding jig
JPH04113611A (en) * 1990-09-03 1992-04-15 Fujitsu Ltd Method and apparatus for dissolving thin film
JP2657342B2 (en) * 1992-02-07 1997-09-24 株式会社荏原製作所 Semiconductor wafer sealing jig
JP2970183B2 (en) 1992-03-03 1999-11-02 松下電器産業株式会社 Wafer transfer and storage method and wafer carrier
JPH05343378A (en) * 1992-06-12 1993-12-24 Mitsubishi Electric Corp Wafer carrying holder
JPH07201948A (en) * 1993-12-29 1995-08-04 Dainippon Screen Mfg Co Ltd Substrate transferring jig
JPH07335616A (en) * 1994-06-06 1995-12-22 Hitachi Ltd Wafer treatment device
JP3099183B2 (en) * 1997-05-14 2000-10-16 株式会社東京精密 Wafer probing machine
JP4044191B2 (en) 1997-12-26 2008-02-06 株式会社荏原製作所 Wafer plating equipment
KR20000005870A (en) * 1998-06-11 2000-01-25 히로시 오우라 Method of fabricating deflection aperture array for electron beam exposure apparatus, wet etching method and apparatus for fabricating the aperture array, and electron beam exposure apparatus having the aperture array
WO2001018856A1 (en) * 1999-09-03 2001-03-15 Mitsubishi Materials Silicon Corporation Wafer holder
JP2001176808A (en) * 1999-12-21 2001-06-29 Toshiba Ceramics Co Ltd Method for wafer conveyance of vapor-phase thin-film growth device and wafer support member used therefor
JP2001185528A (en) * 1999-12-27 2001-07-06 Minolta Co Ltd Jig for etching, and apparatus and method for etching
US7204887B2 (en) * 2000-10-16 2007-04-17 Nippon Steel Corporation Wafer holding, wafer support member, wafer boat and heat treatment furnace
JP2002237516A (en) 2001-02-07 2002-08-23 Seiko Epson Corp Wafer protective case
JP2002237517A (en) * 2001-02-07 2002-08-23 Seiko Epson Corp Wafer holder
JP2001326189A (en) 2001-03-29 2001-11-22 Hitachi Kokusai Electric Inc Apparatus for producing semiconductor
US7189647B2 (en) * 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
JP2003031647A (en) * 2001-07-19 2003-01-31 Hitachi Kokusai Electric Inc Substrate processor and method for manufacturing semiconductor device
JP4096636B2 (en) * 2002-06-12 2008-06-04 トヨタ自動車株式会社 Wafer support jig and semiconductor element manufacturing method using the same
US6964928B2 (en) * 2002-08-29 2005-11-15 Chentsau Ying Method for removing residue from a magneto-resistive random access memory (MRAM) film stack using a dual mask
JP4270434B2 (en) * 2002-11-29 2009-06-03 シャープ株式会社 Substrate transfer device, substrate removal method, and substrate storage method

Also Published As

Publication number Publication date
JP4597137B2 (en) 2010-12-15
EP1691406B1 (en) 2013-11-13
EP1691406A4 (en) 2007-12-26
US7994067B2 (en) 2011-08-09
WO2006035484A1 (en) 2006-04-06
CN1886830A (en) 2006-12-27
JPWO2006035484A1 (en) 2008-05-15
EP1691406A1 (en) 2006-08-16
TWI272645B (en) 2007-02-01
CN100405569C (en) 2008-07-23
US20070041812A1 (en) 2007-02-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees