CN111477563B - Alignment tool for fusing and sealing semiconductor device - Google Patents
Alignment tool for fusing and sealing semiconductor device Download PDFInfo
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- CN111477563B CN111477563B CN201910069284.2A CN201910069284A CN111477563B CN 111477563 B CN111477563 B CN 111477563B CN 201910069284 A CN201910069284 A CN 201910069284A CN 111477563 B CN111477563 B CN 111477563B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention provides a contraposition tool for fusing and sealing a semiconductor device, which comprises a tool body, a first groove, a second groove and a yielding groove, wherein the first groove is formed in the tool body; the second groove is used for accommodating the covering piece in a matched mode, and the first groove and the second groove jointly form a stepped groove with a stepped surface; the receding groove is used for providing a moving-forward and retreating space of a clamp, the clamp is used for clamping the device main body and the covering piece which are laminated in the stepped groove, and the device main body and the covering piece are driven to exit the tool body. The alignment tool for the semiconductor device melt sealing can realize the rapid alignment of the device tool body and the covering part in the semiconductor device, and the alignment precision is greatly improved.
Description
Technical Field
The invention relates to the field of semiconductor device packaging, in particular to an alignment tool for fusion sealing of a semiconductor device.
Background
The fusion sealing is a common sealing technology in the semiconductor device packaging process, and a semiconductor device packaged by the fusion sealing technology comprises a device main body (also called a housing base) and a covering part (such as a fusion sealing cover plate) attached on the device main body, wherein in order to realize the fusion sealing of the device main body and the covering part, a circle of fusion material ring (also called a solder ring) is arranged on the covering part, and the outline size of the outer edge of the covering part is smaller than that of the outer edge of the device main body. At present, to the small batch semiconductor device that needs to carry out the melt-sealing, wear behind dactylotheca or the gloves usually through the manual work and do not with the help of other instruments, bare-handed realization is counterpointed, and the relative position of covering and device main part takes place the skew easily, can't guarantee the accuracy of counterpointing, can lead to the same batch semiconductor device outward appearance of same kind of model inconsistent often, when serious, can influence the gas tightness of product even.
Disclosure of Invention
The invention mainly aims to provide a contraposition tool for fusing and sealing a semiconductor device, so as to improve the contraposition accuracy and the product quality.
In order to achieve the above objects and other related objects, the technical solution of the present invention is as follows:
the invention provides an alignment tool for sealing a semiconductor device by melting, wherein the semiconductor device comprises a device main body and a covering part, a melting ring is arranged on the covering part, and the alignment tool comprises:
comprises a tool body, a tool body and a tool body,
the first groove is formed in the tool body and used for accommodating the device main body in a matched mode;
the second groove is formed in the bottom surface of the first groove and used for accommodating the covering piece in a matched mode, and the first groove and the second groove jointly form a stepped groove with a stepped surface; and
the tool body is provided with a stepped groove, the stepped groove is arranged on the tool body and used for providing a driving and reversing space of a clamp, and the clamp is used for clamping the device main body and the covering piece which are stacked together in the stepped groove and driving the device main body and the covering piece to exit from the tool body.
Optionally, the device body includes an outer lead and a first surface for contacting the frit ring, and a depth of the first groove is smaller than or equal to a distance between the outer lead and the first surface.
Optionally, a barrier protection member is movably disposed in the second groove, the barrier protection member and the tool body are respectively and independently disposed, and the barrier protection member is disposed at the bottom of the second groove, so that the device body, the covering member and the barrier protection member are sequentially stacked and then clamped by the clamp.
Optionally, the groove of stepping down is the open slot, the groove of stepping down link up completely along the first direction the frock body, the first direction is the direction of depth of second recess, the groove of stepping down link up along second direction unilateral the frock body, the second direction orientation the inner wall in ladder groove.
Optionally, the clamp comprises a first clamping arm and a second clamping arm, an end of the first clamping arm pressing against the device body when clamped, and an end of the second clamping arm pressing against the barrier protector when clamped;
the width of the open slot is greater than the width of the second clamping arm in the clamp, and the width of the open slot is less than the width of the barrier protection.
Optionally, the depth of the second groove is greater than the thickness of the barrier protector and is less than or equal to the sum of the thicknesses of the barrier protector and the cover after overlapping.
Optionally, the depth of the second groove is greater than the sum of the thicknesses of the barrier protector and the cover after overlapping.
Optionally, the contour dimension of the inner wall of the first groove is larger than the contour dimension of the outer wall of the device body, so that when the device body is placed in the first groove, the outer wall of the device body is in clearance fit with the inner wall of the first groove,
the contour dimension of the inner wall of the second groove is larger than that of the outer wall of the covering piece, so that when the covering piece main body is placed into the second groove, the outer wall of the covering piece is in clearance fit with the inner wall of the second groove.
Optionally, the first groove is a rectangular groove or a circular groove.
Optionally, the device main body is a rectangular piece, and the size of each rectangular side of the first groove is 0.1-0.2 mm larger than the size of each rectangular side of the device main body.
Optionally, the device main body is a circular piece, and the diameter of the first groove is 0.05-0.15 mm larger than the outer diameter of the device main body.
Optionally, the second groove is a rectangular groove or a circular groove.
Optionally, the covering part is a rectangular part, and the size of each rectangular side on the second groove is correspondingly larger than the size of each rectangular side on the covering part by 0.1-0.2 mm.
Optionally, the barrier protection member is also a rectangular member, and the dimension of each rectangular side of the barrier protection member is correspondingly smaller than the dimension of each rectangular side of the covering member by 0.05-0.15 mm.
Optionally, the covering piece is a round piece, and the diameter of the second groove is 0.05-0.15 mm larger than that of the covering piece.
Optionally, the barrier protection member is also a circular member, and the diameter of the barrier protection member is 0.05-0.15 m smaller than that of the covering member.
Optionally, the cover is a cover plate and the barrier protector is a sheet metal part.
Optionally, the barrier protector is a silicon wafer.
The invention has at least the following beneficial effects:
the alignment tool for the semiconductor device melt sealing can realize the rapid alignment of the device main body and the covering part in the semiconductor device, and the alignment precision is greatly improved.
Drawings
FIG. 1 is a diagram showing a positional relationship between a sealing tool and a semiconductor device according to the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic partial cross-sectional view of FIG. 1 according to one embodiment;
FIG. 4 is a schematic partial cross-sectional view of FIG. 1 according to another exemplary embodiment;
FIG. 5 shows a top view of the tool body;
FIG. 6 is a schematic sectional view taken along line A-A of FIG. 5;
fig. 7 is a diagram showing the positional relationship between the jig and the sealing tool and the semiconductor device of the present invention.
Description of reference numerals in the examples: the fixture comprises a fixture body 1, a barrier protection piece 2, a clamp 3, a device main body 4, a covering piece 5, a first groove 11, a second groove 12, a relief groove 13, an outer pin 41, a first surface 42, a melt ring 51, a first clamping arm 31 and a second clamping arm 32.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements throughout.
The semiconductor devices suitable for the aligning tool in the following embodiments all include a device main body and a covering part, the outline dimension of the outer wall of the device main body of the semiconductor device is larger than that of the outer wall of the covering part, and the accessory is provided with a melting ring.
Referring to fig. 1, 2, 5 and 6, an alignment tool for sealing a semiconductor device includes:
comprises a tool body 1, a tool body and a tool body,
the first groove 11 is formed in the tool body 1, and the first groove 11 is used for accommodating the device main body 4 in a matching manner;
a second groove 12, which is opened at the bottom surface of the first groove 11, wherein the second groove 12 is used for accommodating the covering part 5 in a matching way, and the first groove 11 and the second groove 12 together form a stepped groove with a stepped surface; and
the tool body 1 is provided with a yielding groove 13, the yielding groove 13 is used for providing a moving space of a clamp 3, the clamp 3 is used for clamping the device main body 4 and the covering piece 5 which are stacked together in the stepped groove, and the device main body 4 and the covering piece 5 are driven to exit from the tool body 1.
During the counterpoint, place covering 5 in second recess 12, place device main part 4 in first recess 11 again, see fig. 7, utilize 3 device main parts 4 and the covering 5 of range upon range of in the ladder groove of anchor clamps to press as an organic whole, grasp anchor clamps 3 at last and press device main part 4 and covering 5 of as an organic whole from frock main part 1 and press, and put into the fusion sealing stove together, wherein, anchor clamps 3 realize centre gripping and withdraw from through the space that groove 13 of stepping down or groove 13 and ladder groove formed jointly.
According to the alignment tool for the semiconductor device melt sealing, the first groove 11 is matched with the device main body 4, and the second groove 12 is matched with the covering piece 5, so that the device tool body 1 and the covering piece 5 in the semiconductor device can be quickly aligned, and the alignment precision is greatly improved.
In some embodiments, referring to fig. 1, 2, and 7, a barrier protector 2 is movably disposed in the second groove 12, the barrier protector 2 and the tool body 1 are separately disposed, and the barrier protector 2 is configured to be disposed at the bottom of the second groove 12, so that the tool body 4, the cover 5, and the barrier protector 2 are sequentially stacked and then clamped by the clamp 3. In order to achieve lamination of cover 5 and barrier protector 2 in a particular real-time process, the surface profile of said barrier protector 2 in contact with said cover 5 needs to match the surface profile of the face of cover 5 facing second groove 12.
When in alignment, the barrier protection piece 2 is firstly placed into the second groove 12, then the covering piece 5 is placed into the second groove 12, then the device main body 4 is placed into the first groove 11, then the clamp 3 is used for clamping and pressing the device main body 4, the covering piece 5 and the barrier protection piece 2 which are sequentially stacked in the stepped groove into a whole, and the clamp 3 is used for clamping the device main body 4, the covering piece 5 and the barrier protection piece 23 out of the tool body 1 together, wherein the device main body 4, the covering piece 5 and the barrier protection piece 2 are all taken out from the opening direction of the stepped groove, and the clamp 3 is taken out through the stepped groove and the abdicating space. The barrier protection piece 2 and the tool body 1 are arranged independently, so that the barrier protection piece 2 can be taken out along with a semiconductor device to be sealed in a melting mode after alignment is completed, the covering piece 5 can be isolated from the clamp 3, the clamp 3 can be prevented from damaging the surface of the covering piece 5 in clamping, and the covering piece 5 can be protected in sealing in the melting mode.
In some embodiments, referring to fig. 1, 5 and 6, the abdicating groove 13 is an open groove, the abdicating groove 13 completely penetrates through the tool body 1 along the first direction, the first direction is the depth direction of the second groove 12, the abdicating groove 13 penetrates through the tool body 1 along the second direction unilateral, and the second direction faces the inner wall of the stepped groove.
In some embodiments, referring to fig. 2, 7, the clamp 3 may be a clamp 3 including a first clamp arm 31 and a second clamp arm 32, an end of the first clamp arm 31 pressing against the device body 4 when clamped, an end of the second clamp arm 32 pressing against the barrier protector 2 when clamped; the width of the open slot is greater than that of the second clamping arm 32 in the clamp 3, and the width of the open slot is less than that of the barrier protection member 2, so that the second clamping arm 32 can be more reliably clamped on the barrier protection member 2, and the second clamping arm 32 can be ensured to exit from the tool body 1 along the direction from the second groove 12 to the first groove 11.
In some embodiments, referring to fig. 3 and 4, the device body 4 includes an outer pin 41 and a first surface 42 for contacting the melt ring 51, and the depth of the first groove 11 is less than or equal to the distance between the outer pin 41 and the first surface 42, so as to prevent the outer pin 41 from interfering with the surface of the tool body 1 to cause deformation or damage.
In some embodiments, referring to fig. 3, the depth of the second groove 12 is greater than the sum of the thicknesses of the overlapped barrier protector 2 and the cover 5, in such a way that the device body 4 and the cover 5 do not contact each other in the stepped groove, and when the laminated device body 4, cover 5 and barrier protector 2 are clamped out by the clamp 3, the barrier protector 2 and cover 5 need to move a certain distance to overlap the device body 4 under the driving of the clamp 3. In other embodiments, referring to fig. 4, the depth of the second groove 12 is greater than the thickness of the barrier protector 2 and less than or equal to the sum of the thicknesses of the overlapped barrier protector 2 and the covering part 5, in such a way that the device body 4 and the covering part 5 are already in contact in the stepped groove, and when the clip 3 clips the overlapped device body 4, the covering part 5 and the barrier protector 2, the distance that the covering part 5 and the barrier layer pass through the second groove 12 is smaller and smoother.
In some embodiments, the inner wall of the first recess 11 has a profile dimension greater than the profile dimension of the outer wall of the device body 4, such that when the device body 4 is placed in the first recess 11, the outer wall of the device body 4 is in clearance fit with the inner wall of the first recess 11; the contour dimension of the inner wall of the second groove 12 is larger than that of the outer wall of the covering part 5, so that when the main body of the covering part 5 is placed into the second groove 12, the outer wall of the covering part 5 is in clearance fit with the inner wall of the second groove 12. When first recess 11 and device main part 4 clearance fit, when second recess 12 and covering 5 clearance fit, not only can guarantee the counterpoint precision, and more be favorable to device main part 4 and covering 5 more smoothly when being taken out, just also be favorable to keeping the counterpoint precision.
In some embodiments, the first groove 11 may be a rectangular groove, a circular groove, or a groove with other shapes, and the specific shape is determined according to the shape of the device body 4; likewise, the second groove 12 may be a rectangular groove, a circular groove, or other shaped groove. The shape of the first groove 11 is determined according to the outer shape of the device body 4, and the shape of the second groove 12 is determined by the shape of the cover 5. Referring to fig. 1, in the present embodiment, the first groove 11 is a rectangular groove, and the second groove 12 is also a rectangular groove, that is, the device body 4 and the cover 5 are both rectangular pieces.
In some embodiments, the device body 4 is a rectangular piece, and the size of each rectangular side on the first groove 11 is correspondingly 0.1-0.2 mm larger than that of each rectangular side on the device body 4; in other embodiments, the device body 4 is a circular member, and the diameter of the first groove 11 is 0.05-0.15 mm larger than the outer diameter of the device body 4. The device body 4 can smoothly enter and exit the first groove 11, and the alignment precision can be accurately controlled.
In some embodiments, the covering member 5 is a rectangular member, and the size of each rectangular side of the second groove 12 is 0.1-0.2 mm larger than the size of each rectangular side of the covering member 5, in other embodiments, the covering member 5 is a circular member, and the diameter of the second groove 12 is 0.05-0.15 mm larger than the diameter of the covering member 5. The cover part 5 can smoothly enter and exit the second groove 12, and the alignment precision can be accurately controlled.
When the covering piece 5 is a rectangular piece, the barrier protection piece 2 is also a rectangular piece, the size of each rectangular edge on the barrier protection piece 2 is correspondingly smaller than that of each rectangular edge on the covering piece 5 by 0.05-0.15 mm, and under the size, the barrier protection piece 2 can prevent the covering piece 5 from discoloring under the action of high temperature and pressure, can effectively avoid the molten material (solder) from climbing onto the covering piece in the melting process, and is favorable for ensuring that the appearance of a finished product is consistent regardless of color or detail structure.
When the single covering piece 5 is a circular piece, the barrier protecting piece 2 is also a circular piece, the diameter of the barrier protecting piece 2 is 0.05-0.15 m smaller than that of the covering piece 5, and the effects of preventing the covering piece from discoloring and preventing the melting material (welding flux) from climbing onto the covering piece when being melted can also be achieved.
In some embodiments, when the covering member 5 is a cover plate, the barrier protection member 2 is a silicon wafer, so that the barrier protection member can be obtained by scribing waste silicon wafers on a production line, the materials are convenient to obtain, the preparation is easy, the cost of the whole alignment tool is reduced, and the absorption of heat energy in the process of sealing the semiconductor device by melting the silicon wafer can be effectively reduced.
Specifically, when the barrier protection member is a silicon wafer, the thickness of the barrier protection member is 200-800 um, and the existing 4-12 inch waste silicon wafer can be used for preparing the barrier protection member.
Optionally, the tool body 1 is made of a rustproof metal material. In this embodiment, the material of this frock body 1 is duralumin, not only easily obtains, easily processes, and is difficult for rustting, is favorable to keeping the workshop clean, and other granule entering possibility in the device when also can reducing the semiconductor device assembly simultaneously prevents that PIND from becoming invalid in the concrete implementation process, also can adopt through ten steel, nevertheless need electroplate the processing to it.
In some embodiments, the tool body 1 is provided with a plurality of stepped grooves in an array manner, so that alignment of a plurality of semiconductor devices can be simultaneously achieved.
In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between.
In the description of the invention, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, components, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, and/or groups thereof.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (17)
1. The utility model provides a counterpoint frock for semiconductor device seals, semiconductor device includes device main part, covering, be provided with the melting ring on the covering, its characterized in that includes:
a tool body is arranged on the upper portion of the tool body,
the first groove is formed in the tool body and used for accommodating the device main body in a matched mode;
the second groove is formed in the bottom surface of the first groove and used for accommodating the covering piece in a matched mode, and the first groove and the second groove jointly form a stepped groove with a stepped surface; and
the tool body is provided with a stepped groove, the stepped groove is arranged on the tool body and used for providing a driving and reversing space of a clamp, and the clamp is used for clamping the device main body and the covering piece which are stacked together in the stepped groove and driving the device main body and the covering piece to exit from the tool body.
2. The aligning tool for the melt sealing of the semiconductor device according to claim 1, wherein: the device body comprises an outer pin and a first surface used for being in contact with the melt ring, and the depth of the first groove is smaller than or equal to the distance between the outer pin and the first surface.
3. The aligning tool for the melt sealing of the semiconductor device according to claim 1, wherein: and a barrier protection piece is movably arranged in the second groove, the barrier protection piece and the tool body are respectively and independently arranged, and the barrier protection piece is arranged at the bottom of the second groove, so that the device main body, the covering piece and the barrier protection piece are sequentially stacked and then clamped by the clamp.
4. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the tool body is provided with a notch, the notch is an open groove, the notch is completely penetrated through along a first direction, the first direction is the depth direction of the second groove, the notch penetrates through the tool body along a second direction on one side, and the second direction faces towards the inner wall of the stepped groove.
5. The aligning tool for the melt-sealing of the semiconductor device according to claim 4, wherein:
the clamp includes a first clamp arm whose end portion is pressed against the device body when clamped, and a second clamp arm whose end portion is pressed against the barrier protector when clamped,
the width of the open slot is greater than the width of the second clamping arm in the clamp, and the width of the open slot is less than the width of the barrier protection.
6. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the depth of the second groove is larger than the thickness of the barrier protection piece and is smaller than or equal to the sum of the thicknesses of the barrier protection piece and the covering piece after overlapping.
7. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the depth of the second groove is greater than the sum of the thicknesses of the barrier protector and the cover after overlapping.
8. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein:
the contour dimension of the inner wall of the first groove is larger than that of the outer wall of the device main body, so that when the device main body is placed in the first groove, the outer wall of the device main body is in clearance fit with the inner wall of the first groove,
the contour dimension of the inner wall of the second groove is larger than that of the outer wall of the covering piece, so that when the covering piece main body is placed into the second groove, the outer wall of the covering piece is in clearance fit with the inner wall of the second groove.
9. The aligning tool for the melt-sealing of the semiconductor device according to claim 8, wherein: the first groove includes one of a rectangular groove or a circular groove, and the second groove includes one of a rectangular groove or a circular groove.
10. The aligning tool for the melt-sealing of the semiconductor device according to claim 9, wherein: the device main part is a rectangular part, and the size of each rectangular side on the first groove is 0.1-0.2 mm larger than that of each rectangular side on the device main part correspondingly.
11. The aligning tool for the melt-sealing of the semiconductor device according to claim 9, wherein: the device main part is circular, the diameter ratio of first recess is 0.05~0.15mm more than the external diameter of device main part.
12. The aligning tool for the melt-sealing of the semiconductor device according to claim 9, wherein: the covering piece is a rectangular piece, and the size of each rectangular side on the second groove is correspondingly larger than that of each rectangular side on the covering piece by 0.1-0.2 mm.
13. The alignment tool for the melt-sealing of the semiconductor device according to claim 12, wherein: the barrier protection member is also a rectangular member, and the dimension of each rectangular side on the barrier protection member is correspondingly smaller than the dimension of each rectangular side on the covering member by 0.05-0.15 mm.
14. The alignment tool for the melt-sealing of the semiconductor device according to claim 11, wherein: the covering piece is a round piece, and the diameter of the second groove is 0.05-0.15 mm larger than that of the covering piece.
15. The aligning tool for the melt-sealing of the semiconductor device according to claim 14, wherein: the barrier protector is also a circular piece, and the diameter of the barrier protector is 0.05-0.15 m smaller than that of the covering piece.
16. The aligning tool for the melt sealing of the semiconductor device according to claim 3, wherein: the cover is a cover plate and the barrier protector is a sheet.
17. The alignment tool for the melt-sealing of the semiconductor device according to claim 16, wherein: the barrier protector is a silicon wafer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910069284.2A CN111477563B (en) | 2019-01-24 | 2019-01-24 | Alignment tool for fusing and sealing semiconductor device |
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| CN201910069284.2A CN111477563B (en) | 2019-01-24 | 2019-01-24 | Alignment tool for fusing and sealing semiconductor device |
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