TW200610079A - Die pickup device - Google Patents
Die pickup deviceInfo
- Publication number
- TW200610079A TW200610079A TW094112335A TW94112335A TW200610079A TW 200610079 A TW200610079 A TW 200610079A TW 094112335 A TW094112335 A TW 094112335A TW 94112335 A TW94112335 A TW 94112335A TW 200610079 A TW200610079 A TW 200610079A
- Authority
- TW
- Taiwan
- Prior art keywords
- die
- push
- pickup device
- picked
- raised
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004145837 | 2004-05-17 | ||
JP2004160407A JP4369298B2 (ja) | 2004-05-17 | 2004-05-31 | ダイピックアップ装置及びダイピックアップ方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200610079A true TW200610079A (en) | 2006-03-16 |
Family
ID=35773111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094112335A TW200610079A (en) | 2004-05-17 | 2005-04-19 | Die pickup device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4369298B2 (zh) |
KR (1) | KR100639553B1 (zh) |
TW (1) | TW200610079A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101046381B1 (ko) * | 2007-11-22 | 2011-07-05 | 주식회사 하이닉스반도체 | 다이 픽업 장치 및 이를 이용한 반도체 칩 분리 방법 |
JP2013034001A (ja) * | 2012-10-25 | 2013-02-14 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ並びにピックアップ方法及びピックアップ装置 |
JP6324857B2 (ja) * | 2014-09-18 | 2018-05-16 | ファスフォードテクノロジ株式会社 | ダイボンダ並びにボンディング方法及びピックアップ装置 |
KR101684802B1 (ko) * | 2015-10-12 | 2016-12-08 | 세메스 주식회사 | 반도체 패키지들을 진공 흡착하기 위한 진공 테이블 |
KR101684803B1 (ko) * | 2015-10-13 | 2016-12-08 | 세메스 주식회사 | 반도체 패키지들을 진공 흡착하기 위한 진공 테이블 |
JP7137306B2 (ja) * | 2017-12-11 | 2022-09-14 | 株式会社Fuji | 電子部品装着装置 |
JP7486264B2 (ja) * | 2019-11-06 | 2024-05-17 | 株式会社ディスコ | ピックアップ方法、及び、ピックアップ装置 |
-
2004
- 2004-05-31 JP JP2004160407A patent/JP4369298B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-19 TW TW094112335A patent/TW200610079A/zh unknown
- 2005-05-16 KR KR20050040444A patent/KR100639553B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4369298B2 (ja) | 2009-11-18 |
KR100639553B1 (ko) | 2006-10-30 |
KR20060047924A (ko) | 2006-05-18 |
JP2006004956A (ja) | 2006-01-05 |
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