TW200537610A

TW200537610A - Apparatus and method for treating a panel

Info

Publication number: TW200537610A
Application number: TW094109329A
Authority: TW
Inventors: Yong-Seok Park
Original assignee: Dms Co Ltd
Priority date: 2004-04-28
Filing date: 2005-03-25
Publication date: 2005-11-16
Also published as: CN1690866B; TWI290737B; JP2005313169A; CN1690866A; KR20050104203A; KR100591476B1

Abstract

A panel treatment system including: a loader for loading a panel from a cassette to a process line; an I-type panel process line for (a) performing a stripping process for the panel, (b) cleaning the panel by spraying de-ionized water onto the stripped panel, and removing the water, and (c) drying the cleaning panel; and an unloader for unloading the panel from the panel process line.

Description

200537610 九、發明說明：【發明所屬之技術領域】本發明係有關於_絲、種用&加工平板的系統和方法，特別疋有關於一種用於^ / 、、加工平板的系統和方法，直一 a 光阻設備具有改良的括八^口的設備，從而縮短生產二午減少用於移除藥劑生產線長度以及改良空間效率。【先前技術】 > 塊平板（例如詩平板顯半導體晶圓、 :曰=示器、光罩玻璃等等的平面板子）係經過—連串的 i知生產線加工過，諸，製程、… 覆製程、曝光製程、顯影』“、去光阻製程、清潔製程、乾燥製程等等。圖上係顯示一個用於執行去光阻製程之先前技術的平 : 圖中所顯示，-塊平板係從-個卡H1令卸得移至個裝載盗2。裝載器2係饋送平板至去阻浴槽3。 Τ攸王云尤該饋送至去光阻_3的平㈣經歷去光去光阻製程之後該平板被饋送至一個去光阻料和單： (’二：該去光阻劑能夠藉由一種有機溶劑（例如異丙醇 )、二f亞礙（DMSO)等等）中和光阻劑沒有被令和，丰φ 制π &人被尹和去先阻劑可能會與隨後清潔製程中的去離子水起化學反應而損壞平板之一薄膜表面 β 去光阻劑的令和作用係防止平板的薄膜表面被損壞。疋在中和製程之後’該平板係經由一個旋轉器5轉移至 200537610 一個第一清潔單元6，以便使得殘留在平溶劑能夠藉由去離子水移除。 &面上的有機亦即是，清潔單元6，行清潔製程。衣直轉移至一個以及去離子水係被噴灑到双的表面上以執而轉移至一兩個與第一200537610 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a system and method for processing flat plates, and particularly to a system and method for processing flat plates. Zhi-a photoresistance equipment has improved equipment including eight mouths, which shortens the production time, reduces the length of the production line for removing pharmaceuticals, and improves space efficiency. [Prior technology] > Flat plates (such as poetic flat display semiconductor wafers, flat panels such as displays, photomasks, etc.) are processed through a series of production lines, processes, processes, ... Process, exposure process, development process ", photoresist removal process, cleaning process, drying process, etc. The figure shows a prior art flat panel used to perform the photoresist removal process: as shown in the figure,-a flat plate is from -A card H1 can be unloaded and moved to a load robber 2. The loader 2 is to feed the plate to the de-blocking bath 3. Toyo Wangyun should feed the plate to the de-blocking_3 after the plate has undergone the de-blocking and de-blocking process Is fed to a photoresist material and sheet: ('two: the photoresist can be neutralized by an organic solvent (such as isopropyl alcohol), di-f-blocker (DMSO), etc.) And, Phi & Phi & Phi deblocking agent may chemically react with deionized water in the subsequent cleaning process to damage one of the film surface of the film. The film surface is damaged. 该 After the neutralization process, the plate Transfer to 200537610 a first cleaning unit 6 via a spinner 5 so that the residual solvent can be removed by deionized water. The organic on the surface, that is, the cleaning unit 6, performs the cleaning process. Transfer to one and deionized water system is sprayed on the double surface to transfer to one or two and the first

接著，該平板係進一步經由一個旋轉器？個第二清潔單元8。該第二清潔單元8係I/ /月 >糸早元6相同的淋浴槽。 ::::成，形㈣…二：= 已經經歷第二清潔單元8的平柘孫户、s 卞板係在通過一個水刀9 及一個氣刀1 〇時被乾燥。隨後，該平板係被轉移至_個# 邱戰态1 1並且藉由一個機械手臂轉移至卡匣以被堆疊於其中。然而，使用中和劑的中和作用係增加製造成本。此外，雖然去光阻製程生產線深係形成為一種匸形狀，考置到大尺寸平板的趨勢，對於對於降低設備空間仍存有限發明内容因此，本發明已經致力於解. 鮮决以上所描述之先前技術的問題。Then, the plate is further passed through a spinner? Of the second cleaning unit 8. This second cleaning unit 8 is the same shower trough as I // month > Hayamoto 6. :::: 成, 形㈣ ... 二: = The sundial, slabs that have passed through the second cleaning unit 8 are dried while passing through a water knife 9 and an air knife 100. Subsequently, the tablet system was transferred to # Qiu Zhan State 1 1 and transferred to a cassette by a robotic arm to be stacked therein. However, the neutralizing effect of using a neutralizing agent increases manufacturing costs. In addition, although the photoresist removal process production line is deeply formed into a puppet shape, considering the trend of placing large-size flat plates, there is still limited content for reducing equipment space. Therefore, the present invention has been devoted to the solution. Problems with prior art.

因此，本發明之一個目的A 馬提供一種用於加工平板的 6 200537610 系統及方法，其係能夠有效地移除去光阻劑的需要，從降低製造成本。故而本發明之另—個目的為提供一種用於加工平板的系統及方法，其係能夠藉由將一個去光阻製程排列成一種線性形狀而使空間效率最大化。為了達到上述之目的，本發明係提供一種平板加工系統，包含：一裝载器用於從一卡Ε裝載一平板到一製程生產線；一 I型平板製程生產線用於（a)對該平板執行— 去光阻製程，“）藉由喷濃去離子水至該去光阻的平板上及移除去離子水來清潔該平板，以& ( c )乾燥該清潔的平板：以及-卸載器用於從該平板製程生產線中卸載該平板G。【實施方式】現在將詳細地參照本發明之較佳實施例，這些例子係說明在伴隨的圖式中。只要有可能的話，才目同的參考符號將被使用在所有的圖式中以參照相同或是相似之部件。圖2係顯示-個根據本發明一實施例之平板加工系統的視圖。如圖所示，本發明之平板加工系統係形成在一個旦有縮小長度的獨立型式生產線上〇卩，15〇，其係被設計成足以在一個縮小的長度中加工該平板。該平板加工系統係包含：一個卸載器用於從一個卡匠 20處裂載-塊平板（圖3中之G)i一個製程生產線； 7 200537610 一個1型平板製程生產線21用於（〇在平板G上執行 -個去光阻製程，（b)藉由噴灑去離子水至該去光阻之，板G及移除該去離子水來清潔該平板，以及（〇乾燥该清潔的平板；以及一個釦哉 1反以及卸栽盜用於從該平板製程生產線 2 1卸載該平板〇。 v 在以上所描述的平板加工系統之中，平板g係被在設置於製程生產線之-侧上的卡g2〇中。一個例如是機械手臂的轉移裝置係從卡g 轉移至裝載器22。中將千板0一個-個地Therefore, one objective of the present invention is to provide a 200520051010 system and method for processing flat plates, which can effectively remove the need for photoresist removing agents, thereby reducing manufacturing costs. Therefore, another object of the present invention is to provide a system and method for processing flat plates, which can maximize space efficiency by arranging a photoresist removal process into a linear shape. In order to achieve the above object, the present invention provides a flat plate processing system, including: a loader for loading a flat plate from a card E to a process production line; a type I flat plate production line for (a) performing the flat plate- The photoresist removing process, ") clean the plate by spraying concentrated deionized water onto the plate and removing the deionized water, and & (c) drying the clean plate: and-the unloader is used for The flat plate G is unloaded from the flat plate production line. [Embodiment] Reference will now be made in detail to the preferred embodiments of the present invention. These examples are illustrated in the accompanying drawings. Wherever possible, the same reference characters are used. It will be used in all drawings to refer to the same or similar parts. Figure 2 is a view showing a flat processing system according to an embodiment of the present invention. As shown, the flat processing system of the present invention is formed On a stand-alone production line with a reduced length of 0 °, 15 °, the system is designed to process the flat plate in a reduced length. The flat plate processing system includes: Unloaders are used to split load-block plates (G in Figure 3) from a cardmaker 20; a process production line; 7 200537610 A type 1 plate process production line 21 is used to perform a photoresist removal on plate G Process, (b) cleaning the plate by spraying deionized water to the photoresist, plate G and removing the deionized water, and (drying the clean plate; and a buckle 1 and removing The pirate is used to unload the flat plate 0 from the flat plate production line 21. v In the flat plate processing system described above, the flat plate g is placed in a card g20 provided on the-side of the production line. One is, for example, a robot arm The transfer device is transferred from card g to loader 22. Lieutenant general board 0-one

該平板製程生產線2 1係包含：一個去光阻單元以用於藉由塗敷一去光阻劑至由裝載器2 2轉移來之平板G 2行—個去光阻製程：-個抽吸單元28用於噴;麗去離子水至该去光阻平板G之一表面上以及吸離該去離子水. 一個清潔單元30用於在該平板G通過抽吸單元以壶 =平板G;以及一個乾燥單元3“於乾燥該清潔的平更詳細而言，該去光阻單元2 4是藉由塗敷一去光阻 d至β亥^裝載器2 2轉移來的平板來執行去光阻製程。該去光，單元2 4係較佳地由兩個浴槽2 5及2 6構成，以便使得複數個高功率的噴嘴能夠被提供來移除通過浴仍殘留在平板G之表面上的光阻。如以上所描述，當該平板通過抽吸單元2 8時，使用單元24中及殘留在平板〇之表面上的去光阻劑壬何外來物質，能夠藉由以去離子水噴灑平板以及在 200537610 抽吸單元2 8吸離去離子水而被移除。如圖3中所顯示，該抽吸單元2 8係較佳地包含有一個水噴灑部分以及一個去光阻劑抽吸部分。亦即是，該抽吸單元2 8係包含：一個浴槽4 〇 ; 一個氣簾4 8提供在浴槽4 Q中以防止清潔劑從浴槽* 〇汽漏出去；—對喷霧嘴5 〇和5 2用於噴壤清潔劑至平板〇上以移除附著在平板G上的任何外來物質：以及_抽吸模The flat panel production line 21 includes: a photoresist removing unit for applying a photoresist to the plate G 2 transferred from the loader 22-a photoresist removing process: a suction Unit 28 is used to spray; deionized water onto one of the surfaces of the de-photoresist plate G and to suck the de-ionized water. A cleaning unit 30 is used to pass the plate G through the suction unit to the pot = plate G; and A drying unit 3 is used to dry the cleaned surface. In more detail, the photoresist removal unit 24 performs photoresist removal by coating a flat plate transferred from the photoresist removal d to the βH2 loader 22. The de-lighting unit 24 is preferably composed of two baths 25 and 26, so that a plurality of high-power nozzles can be provided to remove the light remaining on the surface of the plate G through the bath. As described above, when the plate passes through the suction unit 28, the photoresist or any foreign matter remaining on the surface of the plate 0 in the unit 24 can be used to spray the plate with deionized water and The 200537610 suction unit 2 8 was removed by deionizing water. As shown in FIG. 3, the The suction unit 28 series preferably includes a water spraying section and a photoresist suction section. That is, the suction unit 28 series includes: a bath 4; an air curtain 4 8 is provided in the bath 4 Q to prevent the detergent from leaking from the bath * 〇 steam;-spray nozzles 5 0 and 5 2 for spraying detergent on the plate 0 to remove any foreign substances attached to the plate G: and _ pumping Suction

組5 4設置在噴霧嘴5 〇與5 2之間以運用吸離清潔劑。 π差；及在該抽吸單元中，平板G係被裝載於運送裝置46上並且經由—個形成在浴槽4 ◦中的人口 4 2而被導引入浴槽4 0中。在抽吸單元中清潔過的平μ係經由—個形成在浴槽4 0中的出口 4 4而被排出浴槽4 〇。噴霧嘴5 〇和5 2係設計成一種習知結構並且設置在平板2上方以噴灑清潔劑至該平板的一個頂部表面上。藉由噴灑清潔劑所產生的衝擊能量，附著在平板g上的外來物質及/或去総劑係從平板G移除以及由抽吸模組5 4排出。 ' ^ $ 5 〇和5 2係設置成面對彼此並且是傾斜的朝 :彼此目此’從喷霧嘴5 〇和5 2喷灑出的清潔劑係局集中在平板上，以便使得在平板上的流體能夠藉由抽吸模組5 4有效地移除。 • 1 #吸模、、且5 4係較佳地設置成橫過該通過浴槽4 〇之運乙虞置4 6 ’以便使得清潔劑能夠從平板G的整個地 9 200537610 區被抽吸。亦即是’如圖4中所顯示，該抽吸模組5 4係包含：一個本體5 9 ; 一個流體通道6 0藉由容許流體被壓縮及机動而形成低壓·以及一個抽吸開口 6 2形成通過該本體 5 9之一底部以與流體通道6 〇連通以及使用由流體通道 6 0與抽吸開口 6 2之間的壓力差所產生之吸力來從平板 G抽吸清潔劑。Group 54 is set between spray nozzles 50 and 52 to apply a suction cleaner. π difference; and in this suction unit, the plate G is loaded on the conveying device 46 and guided into the bath 40 via a population 4 2 formed in the bath 4 ◦. The flat μ cleaned in the suction unit is discharged from the bath 40 through an outlet 44 formed in the bath 40. The spray nozzles 50 and 52 are designed in a conventional structure and are disposed above the plate 2 to spray a cleaning agent onto a top surface of the plate. By the impact energy generated by spraying the cleaning agent, the foreign substances and / or detergents adhering to the plate g are removed from the plate G and discharged by the suction module 54. '^ $ 50 and 5 2 series are set to face each other and are inclined towards each other: this is what each other sees' The cleaning agent sprayed from the spray nozzles 5 0 and 5 2 are concentrated on the flat plate so that the The fluid can be effectively removed by the suction module 54. • The 1 # suction mold and the 5 4 series are preferably arranged across the passage 4 ′ through the bath 4 ′ 4 6 ′ so that the cleaning agent can be sucked from the entire area of the plate G 9 200537610. That is, as shown in FIG. 4, the suction module 5 4 series includes: a body 5 9; a fluid passage 60 forming a low pressure by allowing fluid to be compressed and maneuvered; and a suction opening 6 2 A cleaning agent is drawn from the plate G through a bottom of one of the bodies 59 to communicate with the fluid passage 60 and using a suction force generated by a pressure difference between the fluid passage 60 and the suction opening 62.

忒本體5 9係形成如一個矩形的六面體，其中該流體通道6 0係例如藉由一壓模製程而形成縱向。形成在本體5 9之底部上的抽吸開口 6 2係形成縱向。该抽吸開口 6 2係具有一個與流體通道6 〇相連通的上部分以及一個開放至本體5 9之一外側的下部分。 …因此’當流體通過該流體通道6 ◦時，—個低壓狀態係經由該流體流動而形成在流體通道6 〇的内部，以及抽 =開口 6 2係具有一個相對地高壓，藉此產生一個吸力以從平板G抽吸清潔劑。就此點而言，從喷霧嘴5 〇和5 2到抽吸模組5彳之間的一段距離係能夠被適當地調整以便不會經由與去光且劑及清潔劑的化學反應而損壞平板的薄膜。再度參照圖2，被轉移到清潔單元3 該已經通過抽吸單元2 8的平板（^係 0。 … 成 ^ 〜^ ^q分僧3 2和3 z 每一個浴槽係具有一個高功率的噴霧嘴（未顯示）因此，清潔製程能夠只使用兩個清潔浴槽及具"~有^ 200537610 機械功率的噴霧嘴來處理。乾燥單元3 6係可以包含一氣刀。亦即是，該氣刀係以南麼喷出I縮空氣來移除殘留在平板上的水滴及/或外來物質。 “如以上所描述，在乾燥單元36中被乾燥的平板以系藉由卸载器3 8被排出至一外側。平板G係經歷一連串的制劣磲甲π裒％，例如去光阻 '抽吸、清潔、以及乾燥製程。 °亥平板加工製程將描述於在下文中。亦即是，如圖2至4以及圖β % -.,. S 8所不，該平板加工製程係包含以下步驟··提供一個 η η、 μ ’盾/專膜的平板G ( S 1 0 0)，猎由轉移平板G到一個去# pn # Γ ^ ^ 1U紊光阻冷槽以及容許平板 G與殘留光阻起化學反應而執 … 個去先阻製程（S 2 0 〇 )，藉由喷灑去離子水至平板〇卜级Ύ 十板G上以及吸離去離子水而移除殘留在平板G上的去光阻劑（ r r ς 9 ^ π λ ^ 2 2 0 );清潔平板 G (S 2 4 0 );以及乾燥和卸載平板g (s3〇⑹。 “ί提：平板的步驟中（S 1 〇〇 )，平板係從設置在、/之一側上的卡E 2 0中出來。該從卡£ 2 〇中出來的平板係藉由例如-個機械手臂被轉移至裝載器2 2。在執行去光阻製程的步驟中（乙u (J )，含女祿©尤平板之表面上的光阻係藉由去光阻製程而移除。亦即是，該從輯ϋ22轉移至去^ 板係通過在浴槽25和2Θ中的第一芬结_ ^ 4 ^ >,、，及苐一去光阻製程。就此點而言，去光阻劑係從专先阻早凡中噴灑出以與 11 200537610 殘留在平板G上的光離開平板G，並且容，：二應。結果’光阻係被脫層合5午一個預定圖案被保留在平板G上。乂：S 2 2 〇中’去光阻劑係從平板中被移除。於運Si 4:在去光阻單元2 4中加工的平板係被裝載、 " 上並且經由形成在浴槽40上的入口42 而被導引入浴槽4 〇中。接著°亥平板G係通過該對喷霧嘴5 0和5 2所設置 =個部分。就此點而言，該清潔劑係從喷霧嘴5 0和5 中喷獲至平板G的頂部表面上。該去光阻劑及任何外來勿質係藉由噴壤清潔劑所產生的衝擊能量而被移離該平板 G。就此點而言，該抽吸模組5 4係設置在該喷霧嘴5 〇和5 2之間以快速地從平板G抽吸流體。更詳細的描述，當流體通過形成在抽吸模組5 4之本體5 9中的流體通道6 Q時，低壓係被形成在該抽吸開口的周圍。就此點而言，該抽吸開口 6 2係具有一個與流體通道〇相連通的上部分以及以及-個開放至本體5 9之外側的下部分。 —^ 田/爪體通過流體通道6 0時，一個低壓狀態係精由流體流動而形成在該流體通道6 Q的内部，並且該抽开 J係具有一個相對地高壓，藉此產生一個吸力以從平板G抽吸清潔劑。六、匕而a，由於去離子水與去光阻劑的化學反應可 12 200537610 能會破壞平板之薄膜，從該噴粉角b 〇和5 2到該抽吸槎組5 4之間的一段距離係能夠、 ^ ^ ^ ^ η , 、田地5周整以使得該流體此夠快速地被吸起’從而提供一個穩定的平板加工。然後，平板G係被轉移至清、、_ _ 9 Λ η ^ 月4早几3 0以經歷步驟s 240 ’之後再執行步驟丁 3 〇〇以用於乾燥即是，在清潔步驟中被清潔過兀 J十板G係通過乾燥單元3 6的氣刀。就此點而言，任何 j夕戈邊在平板上的水及質係藉由氣刀戶斤噴出的壓縮空氣而移除。同時’圖5係顯示本發明的另一個較佳實施例。實二二T這個實施例的平板加工系統係與先前的同’…個轉移單元7 1被額外地提供在平板製程生產線上。 /、P疋個執道7 2係被設置在該平板製程生產線上。該轉移單元7 、以使得平板能夠被裝載於轉移單元 :1上之狀態而可滑動地設置在軌道7 2Λ。藉由轉移單疋7 1的往復滑移運動，該等平板係能夠被移動至一個預，亦即是，該轉移單元7 i與該f平板係到達設置在平板衣私生產線2 1之側邊的#載器7 3上方並且把平板取帶至卸載器7 3。 4鏟載至卸載器7 3上的平板G係被轉移至平板製程產線2 1的去光阻單元7 4以經歷去光阻製程，藉此該殘留在平板G上的光阻係可被移除。已經經歷去光阻單元7 4的平板G係通過該抽吸單元 13 200537610 7 5以便使得去光阻劑能夠被主要地移除。接著，平板g 最後是在清潔單元7 6中被清潔。已經經歷清潔單元7 6的平板G係在通過乾燥單元γ 7的氣刀時被乾燥。然後，該平板係被轉移到卸載器7 9並且係藉由例如一個機械手臂被堆疊在卡匣7 0内。一以上所描述的平板加工系統可以被排列成如圖6中所 Λ亦即是，卡匣8 〇係被排列在平板製程生產線8 2的側部分或是排列在其上設置有轉移單元8 6的執道8 4 圖7係顯示本發明的另一個實施例。該具有改良抽吸效率的平板加工系統係具有一個降低其安裝面積的優點。使用此優點，該系統係能夠被安装在一種直列型式中。亦即是，平板製程生產線2工係能夠被排列在一檢查線"或是另外具有其他製程裝置之製程生產線的一側鲁上，以便使得平板能夠在一個直列型式製程生產線上被加工〇如同在前述的實施例中， ^ ^ 4十板製程生產線2 1係包 έ有一個去光阻單亓q 9、_ μ & 。個抽吸皁元9 3、一個清潔早兀9 4、以及一個乾燥單元9 5。該平板係藉由設置在—人 ^ ^ 在入口側上的裝載器9 1來轉移The gadolinium body 59 is formed as a rectangular hexahedron, wherein the fluid passage 60 is formed in a longitudinal direction by, for example, a compression molding process. The suction opening 6 2 formed in the bottom of the body 59 is formed in the longitudinal direction. The suction opening 62 has an upper portion in communication with the fluid passage 60 and a lower portion opened to the outside of one of the bodies 59. … So when a fluid passes through the fluid channel 6 a low pressure state is formed inside the fluid channel 60 through the fluid flow, and the pumping = opening 6 2 system has a relatively high pressure, thereby generating a suction force To suck the cleaner from the plate G. In this regard, a distance from the spray nozzles 50 and 52 to the suction module 5 彳 can be appropriately adjusted so as not to damage the plate through a chemical reaction with the delustering agent and detergent. Thin film. Referring to FIG. 2 again, the plate transferred to the cleaning unit 3 which has passed through the suction unit 28 (（系 0.… 成 ^ ～ ^ ^ q 分僧 3 2 and 3 z each bath has a high-power spray Nozzle (not shown) Therefore, the cleaning process can be processed using only two cleaning baths and spray nozzles with a mechanical power of 20057510. The drying unit 3 and 6 can include an air knife. That is, the air knife system The air is sprayed from the south to remove the water droplets and / or foreign matter remaining on the plate. "As described above, the plate that has been dried in the drying unit 36 is discharged to a place by the unloader 38. Outside. The flat plate G undergoes a series of manufacturing processes, such as photoresist removal, suction, cleaning, and drying. The flat plate processing process will be described below. That is, as shown in Figures 2 to 4 And the figure β%-.,. S 8 does not. The flat plate processing process includes the following steps: · Provide a plate G (S 1 0 0) of η, μ 'shield / special film, and hunt by transferring the plate G to One go # pn # Γ ^ ^ 1U turbulent light-blocking cold tank and allow plate G with residual light A chemical reaction is carried out ... A de-blocking process (S 2 0 〇) is performed by spraying deionized water onto the plate 〇b class Ύ ten plate G and removing the deionized water to remove the remaining on the plate G Remove photoresist (rr 9 ^ π λ ^ 2 2 0); clean plate G (S 2 4 0); and dry and unload plate g (s3〇⑹. "Li: in the step of the plate (S 1 〇〇), the tablet system comes out of the card E 2 0 provided on the / one side. The tablet system coming out of the card £ 2 0 is transferred to the loader 22 by, for example, a robot arm. During execution In the step of removing the photoresistance process (uu (J), the photoresist on the surface of the plate containing the female luoyouyou is removed by the photoresist removal process. That is, the transfer from the series 22 to the removal plate The first photo-resistance removal process in the baths 25 and 2Θ is ^^^^, and the first photoresist removal process. In this regard, the photoresist removal agent is sprayed from the pre-existing resist With 11 200537610, the light remaining on the plate G leaves the plate G, and the content is: Er should. As a result, the photoresist system is delaminated and a predetermined pattern is retained on the plate G. 乂: S 2 2 〇 The photoresist remover is removed from the flat plate. Yu Yun Si 4: The flat plate processed in the photoresist remover unit 24 is loaded, " and guided through the inlet 42 formed in the bath 40. Introduced into the bath 4 0. Then, the flat plate G is set through the pair of spray nozzles 50 and 52 = parts. In this regard, the cleaning agent is sprayed from the spray nozzles 50 and 5 Onto the top surface of the plate G. The photoresist and any foreign matter are removed from the plate G by the impact energy generated by spraying the cleaning agent. In this regard, the suction module 54 is disposed between the spray nozzles 50 and 52 to quickly suck fluid from the plate G. To describe in more detail, when the fluid passes through the fluid passage 6 Q formed in the body 59 of the suction module 54, a low-pressure system is formed around the suction opening. In this regard, the suction opening 62 has an upper portion that communicates with the fluid passage 0 and a lower portion that opens to the outside of the body 59. — ^ When the field / claw body passes through the fluid passage 60, a low-pressure state system is formed inside the fluid passage 6 Q by fluid flow, and the pull-out J system has a relatively high pressure, thereby generating a suction force to Aspirate the cleaner from the plate G. 6. A and D, due to the chemical reaction between deionized water and photoresist, 12 200537610 can damage the film of the flat plate, the section from the dusting angle b 0 and 5 2 to the pumping group 5 4 The distance can be ^ ^ ^ ^ η, and the field can be adjusted for 5 weeks so that the fluid can be sucked up quickly enough to provide a stable flat processing. Then, the plate G system was transferred to Qing, _ _ 9 Λ η ^ ^ 4 a few months early 30 to go through step s 240 'and then perform step D 3 00 for drying, that is, cleaned in the cleaning step The crossover J ten plate G is an air knife that passes through the drying unit 36. In this regard, any water and quality on the plate by the Xi Ge side is removed by the compressed air sprayed from the air knife. Meanwhile, FIG. 5 shows another preferred embodiment of the present invention. The plate processing system of the embodiment of the second and second T is the same as the previous' ... transfer unit 71 is additionally provided on the plate production line. / 、 P 疋一道 7 2 系 is set on the flat plate production line. The transfer unit 7 is slidably provided on the rail 7 2Λ in a state where the tablet can be loaded on the transfer unit: 1. By means of the reciprocating sliding movement of the transfer unit 1 71, the plate systems can be moved to a pre, that is, the transfer unit 7 i and the f plate system reach the side provided on the flat clothing production line 21 Take the #carrier 7 above and take the plate to the unloader 73. 4 The plate G system loaded on the unloader 7 3 is transferred to the photoresist removal unit 7 1 of the plate production line 21 to undergo the photoresist removal process, whereby the photoresist system remaining on the plate G can be removed. Removed. The plate G that has undergone the photoresist removing unit 74 passes through the suction unit 13 200537610 7 5 so that the photoresist removing agent can be mainly removed. Then, the plate g is finally cleaned in the cleaning unit 76. The plate G that has undergone the cleaning unit 76 is dried while passing through the air knife of the drying unit γ7. Then, the tablet system is transferred to the unloader 79, and is stacked in the cassette 70 by, for example, a robot arm. One of the flat processing systems described above can be arranged as shown in FIG. 6, that is, the cassette 80 is arranged on the side of the flat production line 8 2 or the transfer unit 8 6 is arranged thereon. 8 8 FIG. 7 shows another embodiment of the present invention. The flat processing system with improved suction efficiency has the advantage of reducing its mounting area. With this advantage, the system can be installed in an inline version. That is, the two processes of the flat plate production line can be arranged on one side of an inspection line " or another production line with other process devices, so that the flat plate can be processed on an in-line production line. In the foregoing embodiment, the ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ & Aspirating soap element 9 3, a cleaning early 9 4 and a drying unit 9 5. The plate is transferred by a loader 9 1 provided on the person ^ ^ on the entrance side

並且係進一步的藉由#署A 。置在一出口側的卸載器9 6來轉移檢查線9 8的一個裝載器9 γ。 5亥平板係被轉移到另一個掣 11生產線或是檢查線以通 14 200537610 過一個預定製程並且藉由卸載器9 9排出及堆疊於卡厘9 〇中。根據本發明之實施例，該平板加工系統及方法係具有以下優點： 1 ·去光阻劑能夠僅藉由使用去離子水而不需使用中和劑來移除，從而降低加工成本。 2 ·由於去光阻線係被排列在一直列型式中，空間效鲁率係能夠相應於大尺寸平板而被最大化。 3 ·平板生產線能夠被排列成不同的型式，例如一種獨立型式或是一種直列型式，因此能夠改善設計自由度。熟悉此項技術之人士應明瞭，可對本發明作各種修改及變化。因此，本發明係意欲包含在隨附申請專利範圍及其均等物之範圍内所提供之本發明的修改及變化。【圖式簡單說明】隨附圖式係說明本發明之實施例，並且與本說明書一 φ起用來解釋本發明的原理，這些圖式係被含括以供進一步理解本發明而且被併入及構成本申請案之一部分。其中：圖1為一個先前技術之平板加工系統的示意圖；圖2為根據本發明一個實施例之平板加工系統的視圖3為圖2中所描繪之抽吸單元的一内部結構之側剖面圖；圖4為圖3中所描繪之抽吸模組的立體圖；圖5為根據本發明另一個實施例之平板加工系統的示 15 200537610 意圖；圖意圖；為根據本發明又一個實施例之平板加工系統的圖7為根據本發明再一個實施例之平板加工系統的示思圖，以及圖8為說明根據本發明一個實施例之平板加工製程的流程圖。And it is further by # 局 A. An unloader 9 6 on an exit side is provided to transfer a loader 9 γ of the inspection line 9 8. The Hai Hai plate system was transferred to another switch 11 production line or inspection line to pass 14 200537610 through a predetermined process and discharged through the unloader 9 9 and stacked in caliper 9 0. According to the embodiment of the present invention, the flat plate processing system and method have the following advantages: 1. The photoresist can be removed by using only deionized water without using a neutralizer, thereby reducing processing costs. 2 · Since the photoresist line is arranged in the in-line type, the space efficiency rate can be maximized corresponding to the large size flat plate. 3 · The flat plate production line can be arranged into different types, such as an independent type or an in-line type, thus improving the design freedom. Those skilled in the art should understand that various modifications and changes can be made to the present invention. Accordingly, the invention is intended to cover modifications and variations of the invention provided within the scope of the appended patent applications and their equivalents. [Brief description of the drawings] The accompanying drawings are used to explain the embodiments of the present invention and are used to explain the principles of the present invention together with this specification. These drawings are included for further understanding of the present invention and are incorporated into Forms part of this application. Among them: FIG. 1 is a schematic view of a prior art flat plate processing system; FIG. 2 is a view of a flat plate processing system according to an embodiment of the present invention; 3 is a side sectional view of an internal structure of a suction unit depicted in FIG. 2; FIG. 4 is a perspective view of the suction module depicted in FIG. 3; FIG. 5 is a schematic view of a flat plate processing system according to another embodiment of the present invention; FIG. 7 of the system is a schematic diagram of a flat plate processing system according to yet another embodiment of the present invention, and FIG. 8 is a flowchart illustrating a flat plate processing process according to an embodiment of the present invention.

【主要元件符號說明】 1 卡匣 2 裝載器 3 去光阻浴槽 4 去光阻劑中和單元 5 旋轉器 6 第一清潔單元 7 旋轉器 8 第二清潔單元 9 水刀 10 氣刀 11 卸載器 2 0 卡匣 2 1 平板製程生產線 2 2 裝載器 2 4 去光阻單元 2 5、2 6 浴槽 200537610[Description of main component symbols] 1 Cassette 2 Loader 3 Photoresist removing bath 4 Photoresist neutralizing unit 5 Rotator 6 First cleaning unit 7 Rotator 8 Second cleaning unit 9 Water knife 10 Air knife 11 Unloader 2 0 Cassette 2 1 Flat plate production line 2 2 Loader 2 4 Photoresist removal unit 2 5, 2 6 Bath 2005200510

2 8 抽吸單元 3 0 清潔單元 3 2， ‘3 4 清潔浴槽 3 6 乾燥單元 3 8 卸載器 4 0 浴槽 4 2 入口 4 6 運送裝置 4 8 氣簾 5 0、 * 5 2 喷霧嘴 5 4 抽吸模組 5 9 本體 6 0 流體通道 6 2 抽吸開口 7 0 卡匣 7 1 轉移單元 7 2 執道 7 3 卸載器 7 4 去光阻單元 7 5 抽吸單元 7 6 清潔單元 7 7 乾燥單元 7 9 卸載器 8 0 卡匣 17 2005376102 8 Suction unit 3 0 Cleaning unit 3 2, '3 4 Cleaning bath 3 6 Drying unit 3 8 Unloader 4 0 Bath 4 4 Inlet 4 6 Conveyor 4 8 Air curtain 5 0, * 5 2 Spray nozzle 5 4 Pump Suction module 5 9 Body 6 0 Fluid channel 6 2 Suction opening 7 0 Cassette 7 1 Transfer unit 7 2 Holder 7 3 Unloader 7 4 Photoresist unit 7 5 Suction unit 7 6 Cleaning unit 7 7 Drying unit 7 9 Unloader 8 0 Cassette 17 200537610

8 2 平板製程生產線 8 4 執道 8 6 轉移單元 9 0 卡匣 9 1 裝載器 9 2 去光阻〇〇一早兀 9 3 抽吸單元 9 4 清潔單元 9 5 乾燥單元 9 6 卸載器 9 7 裝載器 9 8 檢查線 9 9 卸載器 G 平板 S 1 0 0 步驟 S 2 0 0 步驟 S 2 2 0 步驟 S 2 4 0 步驟 S 3 0 0 步驟 188 2 Flat plate production line 8 4 Execution road 8 6 Transfer unit 9 0 Cassette 9 1 Loader 9 2 Photoreduction 〇00 Early morning 9 3 Suction unit 9 4 Cleaning unit 9 5 Drying unit 9 6 Unloader 9 7 Loader 9 8 Inspection line 9 9 Unloader G Flat S 1 0 0 Step S 2 0 0 Step S 2 2 0 Step S 2 4 0 Step S 3 0 0 Step 18

Claims

200537610 十、申請專利範圍： 1 · 一種平板加工系統，係包含·· 一裝载器，用於從一卡匣梦都 T/ ^ 下展栽一平板到一製程生產 ?型平板製程生產線用於（a)對該平板執行二去先阻i程，（b)藉由喷去離子水至該去光阻上及移除存留在該平板上之殘留物來清潔該平板，以及 (C )乾燥該清潔的平板··以及一卸裁器，用於從該平板製程生產❹卸載該平板。 2.根據中請專利範圍第1項所述之平板加工***，其中該I型平板製程生產線能约被排列成一直列型式二於，其中一檢查線或是其他製程生產線係被 3.根據中請專利範圍第1項所述之平板加工系統，更包含-轉移單元用於接收來自該卡匿的該平板以及轉移该平板至該裝載器，該轉移單元被設置在該I型平板製程生產線上。 4 ·根據申請專利範圍第3項所述之平板加工系統，〃中4卡S係排列平行或是垂直於該平板轉移方向。 1 5根據申晴專利範圍第1項所述之平板加工系統，二中b 4抽吸單凡係包含一對將清潔劑噴灑至該平板上的噴霧背以及抽吸模組設置在該對喷霧嘴之間以從該吸流體。袖提供-具有_薄膜之平板； 6 · —種平板加工方法，係包含以下步驟： 19 200537610 執行-去光阻製程，其板上以容绊兮土止 ^ ^去先阻劑至該平反應； 4千板上之任何殘留光阻起化學其係藉由噴灑去上的殘留物； ★ ’殘留在該平板上的該去光阻劑離子X至4平板上以及吸離存留在該平灰清潔該平板；以及乾燥和卸載平板。200537610 X. The scope of patent application: 1 · A flat processing system, including a loader, used to develop a flat plate from a cassette to T / ^ to a process production? Flat plate production line for (A) performing a two-step first blocking process on the plate, (b) cleaning the plate by spraying deionized water onto the plate and removing residue remaining on the plate, and (C) drying The clean slab ... and an unloader for unloading the slab from the slab manufacturing process. 2. The flat plate processing system described in item 1 of the patent scope, wherein the I-type flat plate production line can be arranged in line with two or more, and one of the inspection lines or other process production lines is covered by 3. The flat plate processing system described in item 1 of the patent scope further includes a transfer unit for receiving the flat plate from the card and transferring the flat plate to the loader. The transfer unit is set on the type I flat plate production line. . 4 · According to the flat plate processing system described in item 3 of the scope of the patent application, the 4 card S series in Langzhong are arranged parallel or perpendicular to the flat plate transfer direction. 1 5 According to the flat plate processing system described in item 1 of Shen Qing's patent scope, the second and b 4 suction single fan series includes a pair of spray back spraying the cleaning agent on the plate and a suction module is arranged on the pair of sprays. Mist the mouth to suck fluid from this. The sleeve provides a flat plate with a thin film; 6 A flat plate processing method, which includes the following steps: 19 200537610 Performs a photoresist removal process, and the plate is filled with a stumbling block to remove the first resist to the flat reaction ; Any residual photoresistance chemistry on the 4K plate is the residue that is removed by spraying; ★ 'The photoresist ion X remaining on the plate 4 to the 4 plate and is absorbed and left in the flat ash Clean the plate; and dry and unload the plate.

'•根據巾請專利範圍第6項所述之平板加工方法，八々X執行去光阻製程之步驟中，該平板係通過第一及第二去光阻浴槽。苴8根據申請專利範圍第6項所述之平板加工方法，其：該移除去光阻劑的步驟係藉由-對喷霧嘴噴灑清潔劑至忒平板上以及一抽吸模組設置在該對喷霧嘴之間以從該平板抽吸流體而執行。 ^ y·根據申請專利範圍第8項所述之平板加工方法， •其中從該對噴霧嘴到該抽吸模組之間的該距離係能夠被適當地調整以便不會經由與該去光阻劑及該清潔劑的化學反應而損壞該平板的薄膜。十一、圖式：如次頁 20'• According to the flat plate processing method described in item 6 of the patent scope of the towel, in the step of performing the photoresist removal process by the Xuan X, the plate passes through the first and second photoresist removal baths.苴 8 According to the flat plate processing method described in item 6 of the scope of the patent application, the step of removing the photoresist remover is-spraying the cleaning agent on the spray nozzle onto the 忒 plate and a suction module is disposed on the Performed between the pair of spray nozzles to draw fluid from the plate. ^ y · According to the flat plate processing method described in item 8 of the scope of patent application, wherein the distance from the pair of spray nozzles to the suction module can be appropriately adjusted so as not to pass through the photoresist The chemical reaction of the cleaning agent and the cleaning agent damages the film of the flat plate. XI. Schematic: as next page 20